CN109343669A - Mainboard system and server - Google Patents
Mainboard system and server Download PDFInfo
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- CN109343669A CN109343669A CN201811168366.4A CN201811168366A CN109343669A CN 109343669 A CN109343669 A CN 109343669A CN 201811168366 A CN201811168366 A CN 201811168366A CN 109343669 A CN109343669 A CN 109343669A
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- child node
- air duct
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- isolation
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- 238000002955 isolation Methods 0.000 claims abstract description 56
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 description 9
- 238000010992 reflux Methods 0.000 description 9
- 238000013461 design Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
- F04D27/004—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids by varying driving speed
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a mainboard system and a server, wherein the mainboard system comprises a plurality of sub-nodes for independently calculating points, the sub-nodes are sequentially arranged along one direction, a power supply is arranged at the end part of the sub-node and positioned between two adjacent sub-nodes, an isolation air channel is arranged between the adjacent sub-nodes, an isolation cover is arranged on the power supply, the isolation cover is provided with an air inlet and an air outlet, and the air inlet faces to the port of the gap of the isolation air channel. Therefore, the spaces where the sub-nodes are located are separated through the isolation covers for isolating the air ducts and the power supply, and the hot air crosstalk between adjacent sub-nodes is greatly reduced, so that the hot air backflow between the adjacent sub-nodes is greatly reduced, and the heat dissipation performance of the system is improved.
Description
Technical field
The present invention relates to computer equipment field, in particular to a kind of main board system and server.
Background technique
With the continuous development of computer technology, server is sent out towards the direction of high density, low-power consumption and high throughput
Exhibition, binode server technology also exactly come into being thus.
Binodal point server is to place two calculate nodes in a cabinet, and each calculate node independent operating improves
The operational capability of server, realizes the efficiency of two-server, while also saving cabinet space.Heat dissipation design is binode
An emphasis in server design, undesirable heat dissipation will lead to the failure of the component on mainboard, electricity resulted even in when serious
Source shutdown, so that the performance and stability of server are affected.
Summary of the invention
In view of this, optimizing multi node server the purpose of the present invention is to provide a kind of main board system and server
Heat dissipation design.
To achieve the above object, the present invention has following technical solution:
A kind of main board system, comprising:
Multiple child nodes, each child node are independent calculate node, and multiple child nodes are successively arranged along first direction
Cloth；
It is set to the power supply of the child node end in a second direction, and the power supply is set to two adjacent child nodes
Between, the first direction is orthogonal with the second direction；
It is provided between the adjacent child node along the isolation air duct that the second direction extends, the isolation air duct packet
Include gap between the first divider wall, the second divider wall and first divider wall and second divider wall；
The isolation cover being set on the power supply, the isolation cover has the first port and second port of perforation, described
Port of the first port towards the gap that air duct is isolated.
It optionally, further include multiple heat-sink units, each heat-sink unit respectively corresponds along the second direction and is set to each son
The end side of node, the heat-sink unit include fan.
Optionally, the child node, the power supply and the heat-sink unit are successively arranged in a second direction.
Optionally, each heat-sink unit includes double motor fan.
Optionally, each child node further includes control unit, and each described control unit receives corresponding from each child node
Heat-sink unit tach signal, and according to tach signal to corresponding heat-sink unit carry out revolving speed control.
Optionally, the control signal is pwm signal, is turned by the duty ratio of the pwm signal to heat-sink unit
Speed control, and when the duty ratio is 0, corresponding revolving speed is controlled into the preset rotation speed value in non-zero.
It optionally, further include sealing device, the sealing device is set to the top in the isolation air duct, for described
The sealing between air duct and chassis cover is isolated.
Optionally, the sealing device from the one end in the isolation air duct extend to the isolated from power cover far from it is described every
One end from air duct.
Optionally, the sealing device is sealing strip.
A kind of server, including any of the above-described main board system and first divider wall and second divider wall
Adjacent child node is divided into mutually isolated space by the chassis cover and isolation air duct by the chassis cover at top.
Main board system and server provided in an embodiment of the present invention, main board system include multiple independent sons for calculating several points
Node, these child nodes are successively arranged in one direction, and power supply is set to the end of child node and is located at two adjacent son sections
Point between, be provided between adjacent child node isolation air duct and on power supply be provided with isolation cover, isolation cover have into
Air port and air outlet, and the port in the gap in air inlet direction isolation air duct.In this way, just passing through the isolation in isolation air duct and power supply
Cover separates space where child node, and hot wind crosstalk substantially reduces between adjacent child node so that adjacent child node it
Between hot air reflux substantially reduce, improve the heat dissipation performance of system.
It is possible to further which sealing device is arranged at the top of isolation air duct, the sealing device is for being isolated air duct and cabinet
Sealing between upper cover, in this way, chassis cover and the airtightness that air duct is isolated can be enhanced, further decrease adjacent child node it
Between hot wind crosstalk, improve the heat dissipation performance of system.
Further, heat-sink unit is configured for each child node, and is set to the end of child node, prevent hot air reflux,
The radiating efficiency of each child node is improved simultaneously.
Further, the heat-sink unit of each child node is by the way of independent control, according to the control signal of each child node
Revolving speed control is carried out, optimizes the control of each child node, so that the heat dissipation of each child node respectively reaches optimum control.
In addition, when the heat-sink unit of each child node is independently controlled, control signal uses pwm signal, and works as right
When the duty ratio of pwm signal is 0, corresponding revolving speed is controlled into the preset rotation speed value in non-zero.In this way, failure or pass can be made
The corresponding heat-sink unit of the child node of machine state avoids hot air reflux from entering cabinet and flows into normal work still in working condition
Child node, further increase the heat dissipation performance of system.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is the present invention
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 shows the schematic layout pattern of main board system according to embodiments of the present invention；
Fig. 2 shows main board system overlooking structure diagrams according to an embodiment of the present invention；
Fig. 3 shows the schematic diagram of the revolving speed control of heat-sink unit in main board system according to an embodiment of the present invention；
Fig. 4 shows pwm signal pass corresponding with revolving speed in the revolving speed control of main board system according to an embodiment of the present invention
It is schematic diagram.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, but the present invention can be with
Implemented using other than the one described here other way, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by the specific embodiments disclosed below.
As the description in background technique, two calculate nodes are placed in binodal point server, realize two-server
Efficiency, while also saving cabinet space, but heat dissipation design is an emphasis in binode server design, it is undesirable to dissipate
Heat will lead to the failure of the component on mainboard, power supply shutdown be resulted even in when serious, so that the performance and stabilization of server
Property is affected.
For this purpose, main board system includes the child node of multiple independent calculate nodes present applicant proposes a kind of main board system,
These child nodes are successively arranged in one direction, power supply be set to the end of child node and be located at two adjacent child nodes it
Between, it is provided with isolation air duct between adjacent child node and is provided with isolation cover on power supply, isolation cover has air inlet
And air outlet, and the port in the gap in air inlet direction isolation air duct.In this way, just will by the way that the isolation cover in air duct and power supply is isolated
Space where child node separates, and hot wind crosstalk substantially reduces between adjacent child node, so that between adjacent child node
Hot air reflux substantially reduces, and improves the heat dissipation performance of system.
The technical solution and technical effect of the embodiment of the present application in order to better understand, first to the master of the embodiment of the present application
The layout of plate system is described.Refering to what is shown in Fig. 1, main board system includes multiple child nodes 100,200, these child nodes are along
One direction X successively arranges, and Y is set to child node end 100,200 to power supply 300 in a second direction, and power supply 300 be set to it is adjacent
Two child nodes 100,200 between, first direction X is orthogonal with the second direction Y.
In the technical solution of the application, main board system includes multiple child nodes, and each child node is one independent
Calculate node a, that is to say, that child node is equivalent to a server, and normally, a child node includes at least mainboard, place
Manage device and storage unit.
In a typical embodiment, as shown in Figure 1, main board system includes the first child node 100 and the second child node
200, it is 2U bi-nodal system, includes the first mainboard in the first child node 100 and the first processor unit 110 that is arranged thereon
With the first storage unit 120, the first storage unit includes hard disk 121 and memory 122.Similarly, include in the second child node 200
Second mainboard and the second processor unit 210 being arranged thereon and the second storage unit 220, the second storage unit 220 include
Hard disk 221 and memory 222.In this embodiment, the quantity of processor, hard disk and memory can according to need to select to be arranged,
Wherein, the distal end of second direction Y is the rear end of cabinet, for the first child node 100 and the second child node 200, in a second direction
The direction of proximal end to distal end, processor, hard disk and memory can successively arrange.Power supply 300 is set to the first child node 100 and
The end of two child nodes 200 distal end Y in a second direction, between the first child node 100 and the second child node 200.
It, can also be further single in the setting heat dissipation of child node distal end for the arrangement mode of above-mentioned this multi-node system
Member 310,320, the quantity of heat-sink unit 310,320 and the quantity of child node match, that is, each child node is along second
A heat-sink unit is all arranged in the end side in direction, and heat-sink unit includes fan.Heat-sink unit is configured for each child node, and is set
It is placed in the end of child node, prevents hot air reflux, while improving the radiating efficiency of each child node.
The quantity and arrangement mode of fan can according to need to be arranged, it is preferable that heat-sink unit can be double motor wind
Fan, provides reliable heat dissipation for child node, avoids fan failure from leading to hot air reflux, and then influence the performance of system.At one
In typical embodiment, as shown in Figure 1, being provided with the first heat-sink unit 310, the first heat dissipation in the distal end of the first child node 100
Unit 310 includes double motor electric fan, that is, two electric fans, i.e. the first electric fan 311 and the second electric fan 312.Similarly, second
The distal end of child node 200 is provided with the second heat-sink unit 320, and the second heat-sink unit 320 includes double motor electric fan, that is, two
Electric fan, i.e. the first electric fan 321 and the second electric fan 322.
In multi-node system, each child node is an independent calculate node, and adjacent child node is led there are hot wind crosstalk
It causes this node radiating requirements to increase, will affect the heat dissipation performance of child node sometimes.Heat-sink unit is especially set to child node
When the end of distal end, heat-sink unit failure, hot wind but will be back to system by the heat-sink unit of failure if it exists.
Based on this, in the main board system, refering to what is shown in Fig. 2, it is provided with isolation air duct 400 and isolation cover 500,
In, isolation air duct 400 is set between the adjacent child node and extends along the second direction Y, and isolation air duct 400 includes
Gap between first divider wall 410, the second divider wall 420 and first divider wall 410 and second divider wall 420
430.Isolation cover 500 is set on the power supply 300, and the isolation cover 500 has perforation first port 510 and second port
520, port of the first port 510 towards the gap 430 that air duct 400 is isolated.
In the embodiment of the present application, the top that air duct 400 is isolated is equipped with chassis cover (not shown go out), organic when installing
After box cover, chassis cover with air duct 400 is isolated adjacent child node separation is independent space, isolation air duct 400 has
There is gap 430, gap 430 forms air duct.And 500 one side of isolation cover covers power supply 300, on the other hand has the of perforation
Single port 510 and second port 520, to also form air duct, the port in the air duct of the isolation cover is towards isolation air duct 400
Gap 430, so as to form the air duct of power supply 300, meanwhile, the divider wall by the way that air duct 400 is isolated divides adjacent child node
It is divided into independent space, so that not will receive between child node each other and the crosstalk of power supply bring hot wind, so that phase
Hot air reflux between adjacent child node substantially reduces, and improves the heat dissipation performance of system.
In specific application, the first divider wall 410, the second divider wall 420 can be arranged according to the shape of child node,
In one specific example, board area where child node is rectangle, and the first divider wall 410, the second divider wall 420 can be with
For the straight panel being parallel to each other, can be prepared using metal or plastics, between the first divider wall 410, the second divider wall 420
Gap 430 can be arranged according to specific needs.Isolation cover 500 may include top plate and side plate, first port 510 and second
Port 520 can be opening opposite on side plate, and the size of opening can be different, towards the first port 510 in isolation air duct 400
The compatible size in gap 430 that can have and air duct is isolated, second port 520 can have with size of power to being adapted to
Size.
It more preferably, can also be in the top setting sealing device (not shown go out) in isolation air duct 400, to be used for the isolation
Sealing between air duct 400 and chassis cover.That is, (not shown in the top installation chassis cover when isolation air duct 400
After out), by sealing device chassis cover is become smaller or with the gap at the top of air duct is isolated there is no gap.Sealing dress
The sealing for being isolated between air duct and chassis cover is set, in this way, chassis cover and the airtightness that air duct is isolated can be enhanced, into
One step reduces hot wind crosstalk between adjacent child node, improves the heat dissipation performance of system.
More preferably, sealing device extends to isolated from power cover 500 far from isolation air duct 400 from the one end in isolation air duct 400
One end, that is to say, that from isolation air duct 400 extend on isolated from power cover 500, preferably enhancing airtightness.Having
In the application of body, sealing device can be sealing strip, such as can be rubber weather strip.
In embodiments herein, independent revolving speed control can be provided for the corresponding heat-sink unit of each node.Specifically
, revolving speed control is provided for its corresponding heat-sink unit by each child node, refering to what is shown in Fig. 3, in each child node 100,200
It is provided with control unit, which can be set in the processor of child node, and the processor of child node is its corresponding
Heat-sink unit communication connection, control unit receive the tach signal from heat-sink unit corresponding with child node, and according to turn
Fast signal carries out revolving speed control to corresponding heat-sink unit.It, can be according to the control of each child node by the way of independent control
Signal carries out revolving speed control, optimizes the control of each child node, so that the heat dissipation of each child node respectively reaches optimum control.
Furthermore, it is possible to be that these electric fans mention by power distribution board (PDB, Power distribution Board) 600
Power supply source, power supply for example can be normal voltage 12V.
In a typical embodiment, refering to what is shown in Fig. 4, the first child node 100 distinguishes communication connection first radiates list
The first electric fan 311 and the second electric fan 312 of member, the second child node 200 distinguish the first electric fan of the second heat-sink unit of communication connection
321 and second electric fan 322, these electric fans 311,312,321,322 can provide the voltage of 12V by PDB600 plate.Specific
In, the control unit of the first child node 100 is received from the first electric fan 311 of the first heat-sink unit and the second electric fan
312 tach signal, such as TACH signal, according to the tach signal to the first electric fan 311 of the first heat-sink unit and the second electricity
The revolving speed of fan 312 is controlled, such as increases or reduce revolving speed.Similarly, the control unit of the second child node 200, which receives, comes
From in the first electric fan 321 of the second heat-sink unit and the tach signal of the second electric fan 322, such as TACH signal, according to the revolving speed
Signal is to the first electric fan 321 and the second electric fan 322 of the second heat-sink unit, such as increases or reduce revolving speed.
And in the control of specific revolving speed, the control signal of PWM (pulse width modulation), different PWM letters can be used
It number is the signal with different duty, different duty ratios correspond to different revolving speeds, and control unit feeds back a certain account for electric fan
The pwm signal of empty ratio, then electric fan is according to the corresponding rotation speed operation of the pwm signal.
In addition, also further being adjusted to pwm signal in the embodiment of the present application, when duty ratio is 0, will correspond to
Revolving speed control non-zero preset rotation speed value.Refering to what is shown in Fig. 4, the duty ratio of pwm signal and the preset relation of fan can be with
For linear relationship, with the increase of duty ratio, preset rotation speed of the fan value will increase, meanwhile, when duty ratio is 0, will preset
The preset value of a non-zero, such as 3000 turns are arranged in revolving speed, so that fan is constantly in working condition, in this way, can make
Failure or the corresponding heat-sink unit of the child node of off-mode avoid hot air reflux from entering cabinet and flow into still in working condition
The child node of normal work further increases the heat dissipation performance of system.
In specific application, pwm signal can be provided by pwm circuit, and PWM electricity is both provided in each child node
Road, the control signal for providing PWM for the child node can be set pull-down circuit in pwm circuit, enable pwm circuit defeated
The control signal that duty ratio is 0 out.
The embodiment of the present application is described in detail above, in addition, in order to further illustrate the embodiment of the present application
Effect, present invention also provides the experiment effect of an embodiment, for the system with binode, by increase isolation air duct and
Isolation cover is entered the first son of work by the second child node stopped transport after the second child node shuts down and stalls heat-sink unit
Node air quantity reduces 50%, and the cold wind of the first child node front accounts for the ratio of the total outlet air of the first child node and is increased to by 80%
90%, being greatly reduced for heat dissipation performance is avoided, meanwhile, corresponding hot air reflux reduces 57%.In addition, by increasing sealing
Item helps to further enhance isolation effect so that the gap between isolation air duct and chassis cover is reduced to 0.5mm by 1mm.
In addition, present invention also provides a kind of server, including above-mentioned main board system and the first divider wall and second
Adjacent child node is divided into mutually isolated space by chassis cover and isolation air duct by the chassis cover at the top of divider wall.
The above is only a preferred embodiment of the present invention, although the present invention has been disclosed in the preferred embodiments as above, so
And it is not intended to limit the invention.Anyone skilled in the art is not departing from technical solution of the present invention ambit
Under, many possible changes and modifications all are made to technical solution of the present invention using the methods and technical content of the disclosure above,
Or equivalent example modified to equivalent change.Therefore, anything that does not depart from the technical scheme of the invention, according to the present invention
Technical spirit any simple modification, equivalent variation and modification made to the above embodiment, still fall within the technology of the present invention side
In the range of case protection.
It should also be noted that, herein, such as first and second or the like term is used merely to an entity
Or operation is distinguished with another entity or operation, is existed without necessarily requiring or implying between these entities or operation
Any actual relationship or order.Moreover, the terms "include", "comprise" or its any other variant be intended to it is non-
It is exclusive to include, so that the process, method, article or equipment for including a series of elements not only includes those elements,
It but also including other elements that are not explicitly listed, or further include solid by this process, method, article or equipment
Some elements.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including
There is also other identical elements in the process, method, article or equipment of the element.
Claims (10)
1. a kind of main board system characterized by comprising
Multiple child nodes, each child node are independent calculate node, and multiple child nodes are successively arranged along first direction；
Be set to the power supply of the child node end in a second direction, and the power supply be set to two adjacent child nodes it
Between, the first direction is orthogonal with the second direction；
It is provided between the adjacent child node along the isolation air duct that the second direction extends, the isolation air duct includes the
Gap between one divider wall, the second divider wall and first divider wall and second divider wall；
The isolation cover being set on the power supply, first port and second port of the isolation cover with perforation, described first
Port of the port towards the gap that air duct is isolated.
2. main board system according to claim 1, which is characterized in that it further include multiple heat-sink units, each heat-sink unit edge
The second direction respectively corresponds the end side for being set to each child node, and the heat-sink unit includes fan.
3. main board system according to claim 2, which is characterized in that the child node, the power supply and the heat dissipation are single
Member is successively arranged in a second direction.
4. main board system according to claim 2, which is characterized in that each heat-sink unit includes double motor fan.
5. the main board system according to any one of claim 2-4, which is characterized in that each child node further includes that control is single
Member, each described control unit receive the tach signal from the corresponding heat-sink unit of each child node, and according to tach signal
Revolving speed control is carried out to corresponding heat-sink unit.
6. main board system according to claim 5, which is characterized in that the control signal is pwm signal, by described
The duty ratio of pwm signal carries out revolving speed control to heat-sink unit, and when the duty ratio is 0, the control of corresponding revolving speed is existed
The preset rotation speed value of non-zero.
7. main board system according to claim 1, which is characterized in that it further include sealing device, the sealing device setting
In the top in the isolation air duct, for the sealing between the isolation air duct and chassis cover.
8. main board system according to claim 7, which is characterized in that the one end of the sealing device from the isolation air duct
Extend to the one end of the isolated from power cover far from the isolation air duct.
9. main board system according to claim 7 or 8, which is characterized in that the sealing device is sealing strip.
10. a kind of server, which is characterized in that including main board system as claimed in any one of claims 1-9 wherein and described
Chassis cover at the top of first divider wall and second divider wall is saved adjacent son by the chassis cover and isolation air duct
Point is divided into mutually isolated space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811168366.4A CN109343669B (en) | 2018-10-08 | 2018-10-08 | Mainboard system and server |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811168366.4A CN109343669B (en) | 2018-10-08 | 2018-10-08 | Mainboard system and server |
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| CN109343669A true CN109343669A (en) | 2019-02-15 |
| CN109343669B CN109343669B (en) | 2021-05-07 |
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| CN201811168366.4A Active CN109343669B (en) | 2018-10-08 | 2018-10-08 | Mainboard system and server |
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| CN102609042A (en) * | 2012-01-19 | 2012-07-25 | 百度在线网络技术（北京）有限公司 | Whole cabinet and node server thereof |
| CN104675737A (en) * | 2014-12-29 | 2015-06-03 | 浪潮电子信息产业股份有限公司 | Speed regulation method for rack cabinet fan |
| CN204679923U (en) * | 2015-05-08 | 2015-09-30 | 深圳市国鑫恒宇科技有限公司 | A kind of 2U high density server cabinet |
| CN205644416U (en) * | 2016-04-01 | 2016-10-12 | 浙江宇视科技有限公司 | Heat radiation structure of module and quick -witted case that dispels heat generate heat |
| CN107420336A (en) * | 2017-06-29 | 2017-12-01 | 郑州云海信息技术有限公司 | A kind of high reliability fan control device and method based on server |
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