CN106067380A - Solid electrolytic capacitor packaging structure for improving electrical performance, capacitor unit and manufacturing method thereof - Google Patents
Solid electrolytic capacitor packaging structure for improving electrical performance, capacitor unit and manufacturing method thereof Download PDFInfo
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- CN106067380A CN106067380A CN201610676578.8A CN201610676578A CN106067380A CN 106067380 A CN106067380 A CN 106067380A CN 201610676578 A CN201610676578 A CN 201610676578A CN 106067380 A CN106067380 A CN 106067380A
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- 239000003990 capacitor Substances 0.000 title claims abstract description 187
- 239000007787 solid Substances 0.000 title claims abstract description 48
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 title abstract description 8
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 110
- 239000002131 composite material Substances 0.000 claims abstract description 97
- 239000002086 nanomaterial Substances 0.000 claims abstract description 69
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000011888 foil Substances 0.000 claims abstract description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 3
- 239000004332 silver Substances 0.000 claims abstract description 3
- 239000002322 conducting polymer Substances 0.000 claims description 60
- 239000000084 colloidal system Substances 0.000 claims description 44
- 238000012856 packing Methods 0.000 claims description 37
- 230000001737 promoting effect Effects 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 22
- 230000004888 barrier function Effects 0.000 claims description 15
- 239000002105 nanoparticle Substances 0.000 claims description 14
- 230000005611 electricity Effects 0.000 claims description 13
- 239000002270 dispersing agent Substances 0.000 claims description 12
- 229910021389 graphene Inorganic materials 0.000 claims description 11
- 238000005253 cladding Methods 0.000 claims description 8
- 239000002082 metal nanoparticle Substances 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 3
- 229910052760 oxygen Inorganic materials 0.000 claims 3
- 239000001301 oxygen Substances 0.000 claims 3
- 230000005494 condensation Effects 0.000 claims 2
- 238000009833 condensation Methods 0.000 claims 2
- 206010048669 Terminal state Diseases 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 88
- 229910052799 carbon Inorganic materials 0.000 abstract description 7
- 239000002861 polymer material Substances 0.000 abstract 4
- 239000012790 adhesive layer Substances 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 7
- 238000005868 electrolysis reaction Methods 0.000 description 7
- 239000012530 fluid Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 229920000144 PEDOT:PSS Polymers 0.000 description 2
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- 239000007864 aqueous solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 235000013339 cereals Nutrition 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- MAGFQRLKWCCTQJ-UHFFFAOYSA-M 4-ethenylbenzenesulfonate Chemical compound [O-]S(=O)(=O)C1=CC=C(C=C)C=C1 MAGFQRLKWCCTQJ-UHFFFAOYSA-M 0.000 description 1
- -1 Alkene sulfonate Chemical class 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000002042 Silver nanowire Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
Abstract
The invention discloses a solid electrolytic capacitor packaging structure for improving electrical performance, a capacitor unit and a manufacturing method thereof. The solid electrolytic capacitor packaging structure comprises a capacitor unit, a packaging unit and a conductive unit. The capacitor unit comprises a plurality of first capacitors which are stacked together in sequence and electrically connected with each other. Each first capacitor comprises a valve metal foil, an oxide layer, a conductive polymer composite material layer, a carbon adhesive layer and a silver adhesive layer. The conductive polymer composite material layer comprises a conductive polymer material and a first nano material combined with the conductive polymer material, wherein the first nano material comprises a plurality of first completely embedded nano structures completely covered by the conductive polymer material and a plurality of first partially exposed nano structures partially exposed from the conductive polymer material to contact the oxide layer or the carbon adhesive layer. Therefore, the electrical performance of the solid electrolytic capacitor packaging structure is improved.
Description
Technical field
The present invention relates to a kind of solid electrolytic capacitor encapsulating structure and capacitor cell thereof and manufacture method, particularly relate to
And a kind of solid electrolytic capacitor encapsulating structure for promoting electric property and capacitor cell thereof and manufacture method.
Background technology
Capacitor be widely used for consumer electrical home appliances, computer main frame panel and periphery thereof, power supply unit,
The primary element of communication product and automobile etc., its main effect includes: filter, bypass, rectification, couple, decouple, phase inversion etc..
It it is one of indispensable element in electronic product.Capacitor, according to different materials and purposes, has different kenels.Including aluminum
Matter electrochemical capacitor, tantalum matter electrochemical capacitor, laminated ceramic electric capacity, thin-film capacitor etc..In prior art, solid electrolytic capacitor has
The advantages such as small size, high capacitance, frequency characteristic are superior, and the decoupling effect of the power circuit of central processing unit can be used in
On.It is said that in general, the stacking of available multiple capacitor cells, and form the solid electrolytic capacitor of high-capacitance, present technology
Stack solid electrolytic capacitor include that multiple capacitor cell and lead frame, each of which capacitor cell include anode portion, the moon
Pole portion and insulation division, this insulation division makes anode portion be electrically insulated from negative pole part.Particularly, the negative pole part of capacitor cell is each other
Stacking, and conductor layer is set by between adjacent capacitor cell, so that being electrically connected to each other between multiple capacitor cell.
Summary of the invention
For the deficiencies in the prior art, the invention discloses a kind of solid electrolytic capacitor envelope for promoting electric property
Assembling structure and capacitor cell thereof and manufacture method.
Technical scheme is as follows:
A kind of solid electrolytic capacitor encapsulating structure for promoting electric property, including:
One capacitor cell, described capacitor cell includes multiple the first electric capacity being sequentially stacked and being electrically connected to each other
Device, the first capacitor described in each of which has one first positive pole portion and one first negative pole portion；
One encapsulation unit, described encapsulation unit includes a packing colloid being coated with described capacitor cell completely；And
One conductive unit, described conductive unit includes that one first conducting terminal and divides each other with described first conducting terminal
From the second conducting terminal, wherein said first conducting terminal has one and is electrically connected at described the first of described first capacitor
Positive pole portion and be covered by first in described packing colloid to bury in portion and is connected to described first and bury portion and exposed in institute
State the exposed portion of first outside packing colloid, and described second conducting terminal has an institute being electrically connected at described first capacitor
State the first negative pole portion and being covered by second in described packing colloid and bury in portion and is connected to described second portion of burying and naked
The the second exposed portion being exposed at outside described packing colloid；
Wherein, each described first capacitor includes a valve metal paillon foil, one is coated with described valve metal paillon foil completely
Oxide layer, a cladding conductive polymer composite layer for a part for described oxide layer, one it is coated with described conductive polymer completely
The rubber layer of sub-composite layer and one is coated with the elargol layer of described rubber layer completely；
Wherein, described conductive polymer composite layer include a conducting polymer composite and one with described conducting polymer
The first nano material that material be combined with each other, described first nano material includes multiple complete by described conducting polymer composite institute
First complete built-in type nanostructured of cladding and some exposed and go out to contact institute from described conducting polymer composite
State the Part I bareing nanostructured of oxide layer or described rubber layer.
Its further technical scheme is, described conductive polymer composite layer include one with described conducting polymer material
The dispersant that material and described first nano material be combined with each other.
Its further technical scheme is, described conductive polymer composite layer include one with described conducting polymer material
The second nano material that material and described first nano material be combined with each other, described second nano material includes multiple by described conduction
The second complete built-in type nanostructured that macromolecular material is coated with completely and some from described conducting polymer composite
Exposed and go out to contact the Part II bareing nanostructured of described oxide layer or described rubber layer；Wherein, described conduction height
Molecular composite material layer include one with described conducting polymer composite, described first nano material and described second nano material
The dispersant be combineding with each other；Wherein, described first nano material is CNT, Graphene, metal nanometer line, oxidate nano
Particle and metal nanoparticle are one kind of, described second nano material be CNT, Graphene, metal nanometer line,
Oxide nano-particles and metal nanoparticle are one kind of.
Its further technical scheme is, each described first capacitor includes an appearance being arranged on described oxide layer
On face and around described oxide layer around shape insulating barrier, and the described conductive polymer composite layer of described first capacitor
The length of length, the length of described rubber layer and described elargol layer all limited around shape insulating barrier by described；Wherein, described
There is on the described outer surface of oxide layer an encircled area, and the described of described first capacitor sets around ground around shape insulating barrier
Put in the described encircled area of described oxide layer and contact the end of described conductive polymer composite layer, described carbon simultaneously
The end of glue-line and the end of described elargol layer.
Its further technical scheme is, described capacitor cell includes multiple being sequentially stacked and being electrically connected to each other
The second capacitor, and each described second capacitor has one second positive pole portion and one second negative pole portion；Wherein, Duo Gesuo
State the first capacitor to be arranged on the upper surface burying portion in described the first of described first conducting terminal, and multiple described second electricity
Container is arranged on the lower surface burying portion in described the first of described first conducting terminal.
The manufacture method of a kind of solid electrolytic capacitor encapsulating structure for promoting electric property, comprises the following steps:
One first conducting terminal and one second conducting terminal are provided；
Multiple first capacitors are sequentially stacked and are electrically connected at described first conducting terminal and described second
Between conducting terminal, the first capacitor described in each of which has one first positive pole portion and one first negative pole portion；
Forming a packing colloid to be coated with described capacitor cell completely, wherein said first conducting terminal has one and electrically connects
It is connected to the described first positive pole portion of described first capacitor and is covered by first in described packing colloid portion of burying and even
It is connected in described first portion of burying and exposed the first exposed portion outside described packing colloid, and described second conducting terminal has one
It is electrically connected at the described first negative pole portion of described first capacitor and is covered by second in described packing colloid and buries portion
And one be connected in described second portion of burying and exposed the second exposed portion outside described packing colloid；And
Bend described first exposed portion and described second exposed portion, so that described first exposed portion is second exposed with described
Portion extends all along the outer surface of described packing colloid；
Wherein, each described first capacitor includes a valve metal paillon foil, one is coated with described valve metal paillon foil completely
Oxide layer, a cladding conductive polymer composite layer for a part for described oxide layer, one it is coated with described conductive polymer completely
The rubber layer of sub-composite layer and one is coated with the elargol layer of described rubber layer completely；
Wherein, described conductive polymer composite layer include a conducting polymer composite and one with described conducting polymer
The first nano material that material be combined with each other, described first nano material includes multiple complete by described conducting polymer composite institute
First complete built-in type nanostructured of cladding and some exposed and go out to contact institute from described conducting polymer composite
State the Part I bareing nanostructured of oxide layer or described rubber layer.
Its further technical scheme is, described conductive polymer composite layer include one with described conducting polymer material
The dispersant that material and described first nano material be combined with each other.
Its further technical scheme is, described conductive polymer composite layer include one with described conducting polymer material
The second nano material that material and described first nano material be combined with each other, described second nano material includes multiple by described conduction
The second complete built-in type nanostructured that macromolecular material is coated with completely and some from described conducting polymer composite
Exposed and go out to contact the Part II bareing nanostructured of described oxide layer or described rubber layer；Wherein, described conduction height
Molecular composite material layer include one with described conducting polymer composite, described first nano material and described second nano material
The dispersant be combineding with each other；Wherein, described first nano material is CNT, Graphene, metal nanometer line, oxidate nano
Particle and metal nanoparticle are one kind of, described second nano material be CNT, Graphene, metal nanometer line,
Oxide nano-particles and metal nanoparticle are one kind of.
Its further technical scheme is, each described first capacitor includes an appearance being arranged on described oxide layer
On face and around described oxide layer around shape insulating barrier, and the described conductive polymer composite layer of described first capacitor
The length of length, the length of described rubber layer and described elargol layer all limited around shape insulating barrier by described；Wherein, described
There is on the described outer surface of oxide layer an encircled area, and the described of described first capacitor sets around ground around shape insulating barrier
Put in the described encircled area of described oxide layer and contact the end of described conductive polymer composite layer, described carbon simultaneously
The end of glue-line and the end of described elargol layer.
Its further technical scheme is, described capacitor cell includes multiple being sequentially stacked and being electrically connected to each other
The second capacitor, and each described second capacitor has one second positive pole portion and one second negative pole portion；Wherein, Duo Gesuo
State the first capacitor to be arranged on the upper surface burying portion in described the first of described first conducting terminal, and multiple described second electricity
Container is arranged on the lower surface burying portion in described the first of described first conducting terminal.
A kind of capacitor cell for promoting electric property, including at least one first capacitor, the first electricity described at least
Container has a conductive polymer composite layer, and wherein said conductive polymer composite layer includes a conducting polymer material
Material and first nano material be combineding with each other with described conducting polymer composite, described first nano material includes multiple by institute
With stating the first complete built-in type nanostructured and some that conducting polymer composite is coated with completely from described conductive polymer
The Part I bareing nanostructured that sub-material is exposed and goes out.
Its further technical scheme is, the first capacitor described at least is chip-shaped solid electrolytic capacitor, winding
Type solid electrolytic capacitor or tantalum condenser.
The method have the benefit that:
The beneficial effects of the present invention is, the solid state electrolysis electricity for promoting electric property that the embodiment of the present invention is provided
Container packaging structure and capacitor cell thereof and manufacture method, it can be by " described conductive polymer composite layer includes leading
Electricity macromolecular material and first nano material be combineding with each other with described conducting polymer composite, described first nano material bag
With including multiple the first complete built-in type nanostructured being coated with completely by described conducting polymer composite and some from institute
State conducting polymer composite exposed and go out to contact the Part I bareing nanostructured of described oxide layer or described rubber layer "
Design, to promote the electric property of solid electrolytic capacitor encapsulating structure, wherein electric property includes: promote electric conductivity, carry
Rise heat stability, lifting macromolecule impregnation rate, lifting capacitance, reduction equivalent series resistance, reduction fissipation factor, reduce and leak electricity
Stream etc..
Accompanying drawing explanation
Fig. 1 is the present invention for promoting wherein the one of the manufacture method of the solid electrolytic capacitor encapsulating structure of electric property
The flow chart of possible embodiments.
Fig. 2 is that the present invention is for promoting the signal of the lead frame component of the solid electrolytic capacitor encapsulating structure of electric property
Figure.
Fig. 3 is the enlarged diagram of the part A of Fig. 2.
Fig. 4 is that the present invention is for promoting the step of the manufacture method of the solid electrolytic capacitor encapsulating structure of electric property
The amplification visual angle schematic diagram of S102.
Fig. 5 is that the present invention is for promoting the step of the manufacture method of the solid electrolytic capacitor encapsulating structure of electric property
The amplification visual angle schematic diagram of S104.
Fig. 6 is that the present invention is for promoting the signal of the mould structure of the solid electrolytic capacitor encapsulating structure of electric property
Figure.
Fig. 7 be the present invention for promote the solid electrolytic capacitor encapsulating structure of electric property single first capacitor or
The side elevational cross-section schematic diagram of the second capacitor.
Fig. 8 is the enlarged diagram of the part B of Fig. 7.
Fig. 9 is that the conductive polymer composite layer of Fig. 8 further includes that the cut-away section of the second nano material is illustrated
Figure.
Figure 10 is the present invention to be used and multiple sequentially stacks for promoting the solid electrolytic capacitor encapsulating structure of electric property
The side elevational cross-section schematic diagram of the first capacitor.
Figure 11 is that the present invention is for promoting the manufacture method of the solid electrolytic capacitor encapsulating structure of electric property additionally
The flow chart of one possible embodiments.
Figure 12 is the present invention to be used and multiple sequentially stacks for promoting the solid electrolytic capacitor encapsulating structure of electric property
The first capacitor and the side elevational cross-section schematic diagram of multiple the second capacitor sequentially stacked.
[reference numeral explanation]:
Valve capacitor packaging structure Z；
Lead frame component 1；Conducting bracket 10；First conducting terminal 101；Portion 101A is buried in first；First exposed portion 101B；
Second conducting terminal 102；Portion 102A is buried in second；Second exposed portion 102B；Connect framework 11；Around shape frame portion 110；Connecting portion
111；
Capacitor cell 2；First capacitor 21；First positive pole portion P1；First negative pole portion N1；Second capacitor 22；Second just
Pole portion P2；Second negative pole portion N2；Valve metal paillon foil 200；Oxide layer 201；Encircled area 2010；Conductive polymer composite layer
202；End 2020；Conducting polymer composite 202A；First nano material 202B；First complete built-in type nanostructured 2021B；
Part I bareing nanostructured 2022B；Dispersant 202C；Second nano material 202D；Second complete built-in type nano junction
Structure 2021D；Part II bareing nanostructured 2022D；Rubber layer 203；End 2030；Elargol layer 204；End 2040；Enclose
Around shape insulating barrier 205；
Encapsulation unit 3；Packing colloid 30；
Mould structure M；Sprue M1；Secondary fluid course M2；Colloid injection channel M20；
First predeterminated level direction X1；
Second predeterminated level direction X2.
Detailed description of the invention
The following is illustrated by specific instantiation presently disclosed about " for promoting the solid-state of electric property
Electrolysis condenser encapsulating structure and capacitor cell thereof and manufacture method " embodiment, those skilled in the art can be by this explanation
Book disclosure of that understands advantages of the present invention and effect.The present invention can be implemented by other different specific embodiments
Or application, the every details in this specification also can be carried out under without departing from the spirit based on different viewpoints and application
Various modifications and change.It addition, the accompanying drawing of the present invention is only the most schematically illustrate, not according to the description of actual size, first gives and chatting
Bright.Following embodiment will be explained in further detail the correlation technique content of the present invention, but disclosure of that being not used to
Limit the technology category of the present invention.
Referring to shown in Fig. 1 to Figure 10, the present invention provides a kind of solid electrolytic capacitor envelope for promoting electric property
The manufacture method of assembling structure, it comprises the following steps:
First, coordinate shown in Fig. 1, Fig. 2 and Fig. 3, it is provided that a lead frame component 1 (that is lead frame leadframe), lead
Coil holder component 1 includes that multiple conducting bracket 10 arranged in a matrix fashion and is connected to the connection framework of multiple conducting bracket 10
11, each of which conducting bracket 10 includes that first conducting terminal 101 and being connected to connect framework 11 is connected to connect
Framework 11 and the second conducting terminal 102 (S100) with first conducting terminal 101 preset distance separated from one another.Further to
Say, connect framework 11 and have one and around shape frame portion 110 and multiple be connected to around shape frame portion 110 and by around institute of shape frame portion 110
Around connecting portion 111.It addition, definition one first predeterminated level direction X1 and one second predeterminated level direction X2 is orthogonal,
The second conducting terminal that two adjacent the first conducting terminals 101 or two of wherein extending along the first predeterminated level direction X1 are adjacent
102 is separated from one another, and two adjacent the first conducting terminals 101 or two extended along the second predeterminated level direction X2 are adjacent
Second conducting terminal 102 can be by connecting framework 11 to be connected with each other and relative to corresponding connecting portion 111 to present each other
It is symmetrical arranged.
Then, coordinate shown in Fig. 1, Fig. 3 and Fig. 4, multiple capacitor cells 2 be separately positioned on multiple conducting bracket 10,
Each of which capacitor cell 2 includes multiple the first capacitor 21 being sequentially stacked and being electrically connected to each other, and often
One the first capacitor 21 has the first positive pole of first conducting terminal 101 being electrically connected at corresponding conducting bracket 10
Portion P1 and one is electrically connected at the first negative pole portion N1 (S102) of the second conducting terminal 102 of corresponding conducting bracket 10.Lift
For example, the first capacitor 21 can be chip-shaped solid electrolytic capacitor, Winding-type solid electrolytic capacitor or tantalum matter electricity
Electrolysis condenser etc..The present invention is that chip-shaped solid electrolytic capacitor explains for example with the first capacitor 21, but this
Invention is not illustrated with this and is limited.
It follows that coordinate Fig. 1, Fig. 5 and Fig. 6, by a mould structure M, to be wrapped the most completely by multiple packing colloids 30
Cover multiple capacitor cell 2 (S104).For example, as shown in Figure 6, mould structure M includes a sprue M1 and at least 4 connections
In the secondary fluid course M2 of sprue M1, and each secondary fluid course M2 has multiple colloid injection channel extended towards same direction
M20.It addition, multiple colloid injection channel M20 of each secondary fluid course M2 can correspond to corresponding lead frame component 1, so
Packing colloid 30 (the most lighttight encapsulating material) can be sequentially by sprue M1 and corresponding secondary fluid course M2 and many
Individual colloid injection channel M20, to be directed to lead frame component 1.In other words, for any one lead frame component 1, wherein
Multiple colloid injection channel M20 of one secondary fluid course M2 can correspond to lead frame component 1, so packing colloid 30 can sequentially pass through
Sprue M1 and one of them secondary fluid course M2 and multiple colloid injection channel M20 thereof, to be directed to lead frame component 1.
Coordinating shown in Fig. 2, Fig. 5 and Fig. 7, the present invention still further provides a kind of solid-state electricity for promoting electric property
Electrolysis condenser encapsulating structure Z, comprising: a lead frame component 1, multiple capacitor cell 2 and an encapsulation unit 3.Lead frame component
1 includes that multiple conducting bracket 10 arranged in a matrix fashion and is connected to the connection framework 11 of multiple conducting bracket 10, wherein
Each conducting bracket 10 include first conducting terminal 101 and being connected to connect framework 11 be connected to connect framework 11 and
The second conducting terminal 102 with first conducting terminal 101 preset distance separated from one another.Furthermore, multiple capacitor cells 2 set respectively
Putting on multiple conducting brackets 10, each of which capacitor cell 2 includes multiple being sequentially stacked and being electrically connected to each other
The first capacitor 21, and each first capacitor 21 has one and is electrically connected at the first of corresponding conducting bracket 10
The first positive pole portion P1 and one of conducting terminal 101 is electrically connected at the second conducting terminal 102 of corresponding conducting bracket 10
First negative pole portion N1.It addition, encapsulation unit 3 includes that multiple difference is coated with the packing colloid 30 of multiple capacitor cell 2 completely.
For further, as it is shown in figure 5, the first conducting terminal 101 of each conducting bracket 10 has one and electrically connects
The the first positive pole portion P1 being connected to the first capacitor 21 of corresponding capacitor cell 2 (that is in electrical contact is positioned at the of lowermost end
First positive pole portion P1 of one capacitor 21) and be covered by first in corresponding packing colloid 30 and bury portion 101A and even
It is connected in first the first exposed portion 101B burying portion 101A and being exposed to outside corresponding packing colloid 30.It addition, each
Second conducting terminal 102 of conducting bracket 10 has first capacitor 21 being electrically connected at corresponding capacitor cell 2
First negative pole portion N1 (that is first negative pole portion N1 of the first capacitor 21 being positioned at lowermost end in electrical contact) and be covered by phase
Bury in portion 102A and is connected to second in corresponding in packing colloid 30 second and bury portion 102A and be exposed to corresponding
The second exposed portion 102B outside packing colloid 30.
For further, coordinate shown in Fig. 7 and Fig. 8, each first capacitor 21 include a valve metal paillon foil 200,
The conducting polymer composite wood of a part for one oxide layer 201, the cladding oxide layer 201 being coated with valve metal paillon foil 200 completely
The rubber layer 203 of the complete coated with conductive polymer composite layer 202 of the bed of material 202, one and a complete carbon coated glue-line 203
Elargol layer 204.
For example, as it is shown in fig. 7, each first capacitor 21 includes on an outer surface being arranged on oxide layer 201
And around oxide layer 201 around shape insulating barrier 205, and the conductive polymer composite layer 202 of the first capacitor 21
The length of length, the length of rubber layer 203 and elargol layer 204 is all limited around shape insulating barrier 205.For further,
There is on the outer surface of oxide layer 201 encircled area 2010, and the first capacitor 21 around shape insulating barrier 205 around ground
It is arranged in the encircled area 2010 of oxide layer 201 and contacts the end 2020 of conductive polymer composite layer 202, carbon simultaneously
The end 2030 of glue-line 203 and the end 2040 of elargol layer 204.But, the first capacitor 21 used in the present invention not more than
State institute's illustrated example to be limited.
For example, as shown in Figure 8, conductive polymer composite layer 202 include a conducting polymer composite 202A and
One the first nano material 202B be combineding with each other with conducting polymer composite 202A, and the first nano material 202B is nano-sized carbon
Pipe (carbon nanotube), Graphene (graphene), metal nanometer line (such as nano silver wire (silver
Nanowire)), oxide nano-particles and metal nanoparticle (such as Nano silver grain (silver
Nanoparticle)) one kind of.It addition, the first nano material 202B includes multiple by conducting polymer composite 202A institute
First be coated with completely completely built-in type nanostructured 2021B and some exposed and go out from conducting polymer composite 202A
Part I bareing nanostructured 2022B with catalytic oxidation layer or rubber layer.Furthermore, conductive polymer composite layer
202 further include a dispersant 202C be combineding with each other with conducting polymer composite 202A and the first nano material 202B
(or first interfacial agent).Thereby, the first nano material 202B can be by the effect of dispersant 202C, with more uniform dispersion
Mode be combined with each other with conducting polymer composite 202A.
For example, as it is shown in figure 9, conductive polymer composite layer 202 still further includes one and conductive polymer
The second nano material 202D that sub-material 202A and the first nano material 202B be combined with each other, and the second nano material 202D is
CNT, Graphene, metal nanometer line (such as nano silver wire), oxide nano-particles and metal nanoparticle are (such as
Nano silver grain) one kind of.It addition, the second nano material 202D includes multiple complete by conducting polymer composite 202A institute
Second complete built-in type nanostructured 2021D of cladding and some exposed and go out to connect from conducting polymer composite 202A
Touch oxide layer or Part II bareing nanostructured 2022D of rubber layer.It should be noted that the second nano material 202D also
Can be combined with each other with conducting polymer composite 202A in more uniform scattered mode by the effect of dispersant 202C.
Thereby, the present invention can pass through the first nano material 202B or the use of the second nano material 202D, to promote solid-state
The electric property of electrolysis condenser encapsulating structure Z, wherein electric property includes: promotes electric conductivity, promote heat stability, lifting height
Molecule impregnation rate, lifting capacitance (Capacitance, Cap), reduction equivalent series resistance (Equivalent Series
Resistance, ESR), reduce fissipation factor (Dissipation Factor, DF), reduce leakage current (Leakage
Current, LC) etc..For example, through experiment, the prior art of nano material and the basis using nano material are not used
The electric property of invention is compared as follows shown in table:
Table 1 does not uses the prior art of nano material to compare with the electric property of the present invention using nano material
It should be noted that conducting polymer composite 202A, the most poly-(3,4-ethylenedioxythiophene)-poly-(benzene second
Alkene sulfonate) [Poly (3,4-ethylenedioxythiophene): poly (4-styrenesulfonate), PEDOT:
PSS].Wherein, PEDOT:PSS is the aqueous solution of the high molecular polymer of a kind of high conductivity, by two kinds of materials of PEDOT and PSS
Constitute, the aqueous solutions of polymers of different conductivity can be obtained according to different formula.The existence of PSS improves the molten of PEDOT
Xie Xing.
It is noted that coordinate shown in Figure 10 and Figure 11, for single for promoting the solid state electrolysis of electric property
From the point of view of the manufacture method of capacitor packaging structure Z, its step includes: provide one first conducting terminal 101 and one second conducting end
Son 102 (S200)；Multiple first capacitors 21 are sequentially stacked and are electrically connected at the first conducting terminal 101 and second
Between conducting terminal 102, each of which the first capacitor 21 has one first positive pole portion P1 and one first negative pole portion N1
(S202)；Forming a packing colloid 30 to be coated with capacitor cell 2 completely, wherein the first conducting terminal 101 has an electric connection
In the first positive pole portion P1 of the first capacitor 21 and be covered by first in packing colloid 30 and bury portion 101A and and be connected to
Bury portion 101A and exposed the first exposed portion 101B outside packing colloid 30 in first, and the second conducting terminal 102 has an electricity
Property is connected to the first negative pole portion N1 of the first capacitor 21 and is covered by second in packing colloid 30 and buries portion 102A and
It is connected in second bury portion 102A and exposed the second exposed portion 102B (S204) outside packing colloid 30；And, bend first
Exposed portion 101B and the second exposed portion 102B, so that the first exposed portion 101B and the second exposed portion 102B is all along packing colloid
The outer surface of 30 extends (S206).
It is noted that coordinate shown in Fig. 5, Figure 10 and Figure 11, when lead frame component 1 cuts, and by first
After exposed portion 101B and the second exposed portion 102B bends along the outer surface of packing colloid 30, multiple capacitor can be formed
Encapsulating structure Z.For further, multiple first capacitors 21 can sequentially be stacked and be electrically connected to each other, the most often
Two the first negative pole portion N1 of two the first adjacent capacitors 21 can pass through elargol (non-label) mutually to stack together, and
And two the first positive pole portion P1 of adjacent the first capacitor 21 of each two can pass through weld layer (non-label) mutually to stack
Together.
It should be noted that shown in cooperation Fig. 5 and Figure 12, each capacitor cell 2 also can further include multiple depending on
The second capacitor 22 that sequence is stacked and is electrically connected to each other, and each second capacitor 22 has an electric connection
It is electrically connected at corresponding conduction in the second positive pole portion P2 and of the first conducting terminal 101 of corresponding conducting bracket 10
Second negative pole portion N2 of the second conducting terminal 102 of support 10, multiple first capacitors 21 of each of which capacitor cell 2 set
Put on the upper surface of corresponding conducting bracket 10, and multiple second capacitors 22 of each capacitor cell 2 are arranged on
On the lower surface of corresponding conducting bracket 10.In other words, multiple first capacitors 21 are arranged on the of the first conducting terminal 101
Bury in one on the upper surface of portion 101A, and multiple second capacitor 22 be arranged on the first of the first conducting terminal 101 in bury portion
On the lower surface of 101A.For example, the second capacitor 22 can be chip-shaped solid electrolytic capacitor, convoluted solid state electrolysis
Capacitor or tantalum condenser etc..The present invention is that chip-shaped solid electrolytic capacitor is as example with the second capacitor 22
Explain, but the present invention does not illustrate with this and is limited.
Feasible effect of embodiment:
In sum, the beneficial effects of the present invention is, the embodiment of the present invention provided for promoting electric property
Solid electrolytic capacitor encapsulating structure Z and capacitor cell 2 thereof and manufacture method, it can pass through " conductive polymer composite layer
202 include the first Nanometer material that a conducting polymer composite 202A and one and conducting polymer composite 202A be combined with each other
How 202B, the first Nanometer material 202B include multiple the first complete built-in type being coated with completely by conducting polymer composite 202A
Rice structure 2021B and some ground are exposed and go out first with catalytic oxidation layer or rubber layer from conducting polymer composite 202A
Partial denudation formula nm structure 2022B " design, to promote the electric property of solid electrolytic capacitor encapsulating structure Z, Qi Zhong electricity
Gas performance includes: promotes electric conductivity, promote heat stability, lifting macromolecule impregnation rate, lifting capacitance, reduction equivalent series electricity
Resistance, reduction fissipation factor, reduction leakage current etc..
The foregoing is only the preferable possible embodiments of the present invention, non-the scope of the claims therefore limiting to the present invention, therefore such as
Use the equivalence techniques change that description of the invention and accompanying drawing content are done, be both contained in protection scope of the present invention.
Claims (12)
1. the solid electrolytic capacitor encapsulating structure being used for promoting electric property, it is characterised in that including:
One capacitor cell, described capacitor cell includes multiple the first capacitor being sequentially stacked and being electrically connected to each other,
First capacitor described in each of which has one first positive pole portion and one first negative pole portion；
One encapsulation unit, described encapsulation unit includes a packing colloid being coated with described capacitor cell completely；And
One conductive unit, described conductive unit includes one first conducting terminal and separated from one another with described first conducting terminal
Second conducting terminal, wherein said first conducting terminal has described first positive pole being electrically connected at described first capacitor
Portion and be covered by first in described packing colloid to bury in portion and is connected to described first and bury portion and exposed in described envelope
The first exposed portion outside dress colloid, and described second conducting terminal has one and is electrically connected at described the of described first capacitor
One negative pole portion and being covered by second in described packing colloid bury in portion and is connected to described second portion of burying and exposed
The second exposed portion outside described packing colloid；
Wherein, each described first capacitor includes a valve metal paillon foil, an oxidation being coated with described valve metal paillon foil completely
Layer, a cladding conductive polymer composite layer for a part for described oxide layer, one to be coated with described conducting polymer completely multiple
The rubber layer of condensation material layer and one is coated with the elargol layer of described rubber layer completely；
Wherein, described conductive polymer composite layer include a conducting polymer composite and one with described conducting polymer composite
The first nano material be combineding with each other, described first nano material includes multiple being coated with completely by described conducting polymer composite
The first complete built-in type nanostructured and some ground exposed and go out to contact described oxygen from described conducting polymer composite
Change layer or the Part I bareing nanostructured of described rubber layer.
2. the solid electrolytic capacitor encapsulating structure for promoting electric property as claimed in claim 1, it is characterised in that institute
State conductive polymer composite layer and include that one be combined with each other with described conducting polymer composite and described first nano material
Dispersant.
3. the solid electrolytic capacitor encapsulating structure for promoting electric property as claimed in claim 1, it is characterised in that institute
State conductive polymer composite layer and include that one be combined with each other with described conducting polymer composite and described first nano material
Second nano material, described second nano material include multiple by described conducting polymer composite be coated with completely second complete
Built-in type nanostructured and some ground are exposed and go out to contact described oxide layer or described from described conducting polymer composite
The Part II bareing nanostructured of rubber layer；Wherein, described conductive polymer composite layer include one with described conduction
The dispersant that macromolecular material, described first nano material and described second nano material be combined with each other；Wherein, described first
Nano material be CNT, Graphene, metal nanometer line, oxide nano-particles and metal nanoparticle one of them
Kind, described second nano material is CNT, Graphene, metal nanometer line, oxide nano-particles and metallic nanoparticle
Son is one kind of.
4. the solid electrolytic capacitor encapsulating structure for promoting electric property as claimed in claim 1, it is characterised in that every
It is exhausted around shape that one described first capacitor includes on an outer surface being arranged on described oxide layer and around described oxide layer
Edge layer, and the length of described conductive polymer composite layer of described first capacitor, the length of described rubber layer and described
The length of elargol layer is all limited around shape insulating barrier by described；Wherein, the described outer surface of described oxide layer has enclose
Around region, and the described described encircled area being arranged on described oxide layer around shape insulating barrier around ground of described first capacitor
Go up and contact the end of described conductive polymer composite layer, the end of described rubber layer and the end of described elargol layer simultaneously
End.
5. the solid electrolytic capacitor encapsulating structure for promoting electric property as claimed in claim 1, it is characterised in that institute
State capacitor cell and include multiple the second capacitor being sequentially stacked and being electrically connected to each other, and each described second electricity
Container has one second positive pole portion and one second negative pole portion；Wherein, multiple described first capacitors are arranged on described first conduction
Bury in described the first of terminal on the upper surface in portion, and multiple described second capacitor is arranged on the institute of described first conducting terminal
State on the lower surface burying portion in first.
6. the manufacture method being used for promoting the solid electrolytic capacitor encapsulating structure of electric property, it is characterised in that include
The following step:
One first conducting terminal and one second conducting terminal are provided；
Multiple first capacitors are sequentially stacked and are electrically connected at described first conducting terminal and described second conduction
Between terminal, the first capacitor described in each of which has one first positive pole portion and one first negative pole portion；
Forming a packing colloid to be coated with described capacitor cell completely, wherein said first conducting terminal has one and is electrically connected at
The described first positive pole portion of described first capacitor and be covered by first in described packing colloid and bury portion and and be connected to
Bury portion and exposed the first exposed portion outside described packing colloid in described first, and described second conducting terminal to have one electrical
It is connected to the described first negative pole portion of described first capacitor and is covered by second in described packing colloid portion and of burying
It is connected in described second portion of burying and exposed the second exposed portion outside described packing colloid；And
Bend described first exposed portion and described second exposed portion, so that described first exposed portion is with described second exposed portion all
Outer surface along described packing colloid extends；
Wherein, each described first capacitor includes a valve metal paillon foil, an oxidation being coated with described valve metal paillon foil completely
Layer, a cladding conductive polymer composite layer for a part for described oxide layer, one to be coated with described conducting polymer completely multiple
The rubber layer of condensation material layer and one is coated with the elargol layer of described rubber layer completely；
Wherein, described conductive polymer composite layer include a conducting polymer composite and one with described conducting polymer composite
The first nano material be combineding with each other, described first nano material includes multiple being coated with completely by described conducting polymer composite
The first complete built-in type nanostructured and some ground exposed and go out to contact described oxygen from described conducting polymer composite
Change layer or the Part I bareing nanostructured of described rubber layer.
7. the manufacture method of the solid electrolytic capacitor encapsulating structure for promoting electric property as claimed in claim 6, its
Be characterised by, described conductive polymer composite layer include one with described conducting polymer composite and described first nano material
The dispersant be combineding with each other.
8. the manufacture method of the solid electrolytic capacitor encapsulating structure for promoting electric property as claimed in claim 6, its
Be characterised by, described conductive polymer composite layer include one with described conducting polymer composite and described first nano material
The second nano material be combineding with each other, described second nano material includes multiple being coated with completely by described conducting polymer composite
The second complete built-in type nanostructured and some ground exposed and go out to contact described oxygen from described conducting polymer composite
Change layer or the Part II bareing nanostructured of described rubber layer；Wherein, described conductive polymer composite layer includes one
The dispersant be combineding with each other with described conducting polymer composite, described first nano material and described second nano material；Its
In, described first nano material is CNT, Graphene, metal nanometer line, oxide nano-particles and metallic nanoparticle
Son one kind of, described second nano material be CNT, Graphene, metal nanometer line, oxide nano-particles and
Metal nanoparticle is one kind of.
9. the manufacture method of the solid electrolytic capacitor encapsulating structure for promoting electric property as claimed in claim 6, its
Being characterised by, each described first capacitor includes on an outer surface being arranged on described oxide layer and around described oxide layer
Around shape insulating barrier, and the length of described conductive polymer composite layer of described first capacitor, described rubber layer
The length of length and described elargol layer is all limited around shape insulating barrier by described；Wherein, the described outer surface of described oxide layer
On there is an encircled area, and the described institute being arranged on described oxide layer around shape insulating barrier around ground of described first capacitor
State in encircled area and contact the end of described conductive polymer composite layer, the end of described rubber layer and described silver simultaneously
The end of glue-line.
10. the manufacture method of the solid electrolytic capacitor encapsulating structure for promoting electric property as claimed in claim 6, its
Being characterised by, described capacitor cell includes multiple the second capacitor being sequentially stacked and being electrically connected to each other, and each
Individual described second capacitor has one second positive pole portion and one second negative pole portion；Wherein, multiple described first capacitors are arranged on
Bury in described the first of described first conducting terminal on the upper surface in portion, and multiple described second capacitor is arranged on described first
Bury in described the first of conducting terminal on the lower surface in portion.
11. 1 kinds for promoting the capacitor cells of electric property, it is characterised in that includes at least one first capacitor, and at least one
Described first capacitor has a conductive polymer composite layer, and wherein said conductive polymer composite layer includes leading
Electricity macromolecular material and first nano material be combineding with each other with described conducting polymer composite, described first nano material bag
With including multiple the first complete built-in type nanostructured being coated with completely by described conducting polymer composite and some from institute
State that conducting polymer composite is exposed and the Part I bareing nanostructured that goes out.
12. as claimed in claim 11 for promoting the capacitor cells of electric property, it is characterised in that described at least one first
Capacitor is chip-shaped solid electrolytic capacitor, Winding-type solid electrolytic capacitor or tantalum condenser.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105117853 | 2016-06-06 | ||
| TW105117853A TWI626671B (en) | 2016-06-06 | 2016-06-06 | Solid electrolytic capacitor package structure for increasing electrical performance, and capacitor unit thereof and method of manufacturing the same |
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| Publication Number | Publication Date |
|---|---|
| CN106067380A true CN106067380A (en) | 2016-11-02 |
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| CN201610676578.8A Pending CN106067380A (en) | 2016-06-06 | 2016-08-16 | Solid electrolytic capacitor packaging structure for improving electrical performance, capacitor unit and manufacturing method thereof |
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| Country | Link |
|---|---|
| US (1) | US10068711B2 (en) |
| CN (1) | CN106067380A (en) |
| TW (1) | TWI626671B (en) |
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| CN110895995A (en) * | 2018-09-12 | 2020-03-20 | 钰冠科技股份有限公司 | Capacitor, capacitor packaging structure and manufacturing method thereof |
| CN110942917A (en) * | 2018-09-21 | 2020-03-31 | 钰冠科技股份有限公司 | Capacitor packaging structure, capacitor and polymer composite layer |
| CN110942918A (en) * | 2018-09-21 | 2020-03-31 | 钰冠科技股份有限公司 | Stacked capacitor, manufacturing method thereof and silver colloid layer |
| US10923289B2 (en) * | 2018-09-21 | 2021-02-16 | Andaq Technology Co., Ltd. | Stacked type capacitor package structure without carbon paste layer, stacked type capacitor thereof, and polymer composite layer |
| US10950390B2 (en) * | 2018-09-21 | 2021-03-16 | Andaq Technology Co., Ltd. | Stacked type capacitor without carbon paste layer, manufacturing method thereof and silver paste layer |
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Also Published As
| Publication number | Publication date |
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| US10068711B2 (en) | 2018-09-04 |
| US20170352491A1 (en) | 2017-12-07 |
| TW201743351A (en) | 2017-12-16 |
| TWI626671B (en) | 2018-06-11 |
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