CN103192203A - Process method for preparing silver solder - Google Patents
Process method for preparing silver solder Download PDFInfo
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- CN103192203A CN103192203A CN2013100089171A CN201310008917A CN103192203A CN 103192203 A CN103192203 A CN 103192203A CN 2013100089171 A CN2013100089171 A CN 2013100089171A CN 201310008917 A CN201310008917 A CN 201310008917A CN 103192203 A CN103192203 A CN 103192203A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000002245 particle Substances 0.000 claims abstract description 30
- 239000000843 powder Substances 0.000 claims abstract description 25
- 238000005245 sintering Methods 0.000 claims abstract description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 15
- 239000000956 alloy Substances 0.000 claims abstract description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 14
- 239000010439 graphite Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 17
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 12
- -1 polytetrafluoroethylene Polymers 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 238000000498 ball milling Methods 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 9
- 229910052725 zinc Inorganic materials 0.000 claims description 9
- 239000011701 zinc Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 7
- 238000010792 warming Methods 0.000 claims description 7
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052744 lithium Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 238000005275 alloying Methods 0.000 abstract description 10
- 238000002490 spark plasma sintering Methods 0.000 abstract description 10
- 238000003723 Smelting Methods 0.000 abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052760 oxygen Inorganic materials 0.000 abstract description 5
- 239000001301 oxygen Substances 0.000 abstract description 5
- 238000002360 preparation method Methods 0.000 abstract description 5
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 3
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 abstract description 2
- 230000036632 reaction speed Effects 0.000 abstract 2
- 230000004913 activation Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 10
- 238000005266 casting Methods 0.000 description 6
- 238000000227 grinding Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 238000007499 fusion processing Methods 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001052 transient effect Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910000753 refractory alloy Inorganic materials 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Abstract
The invention relates to a method for preparing silver solder. The method comprises the following specific steps: applying pressure to raw material particles arranged in a graphite crucible by upper and lower graphite press heads in a spark plasma sintering system (SPS) under the vacuum condition; directly heating the raw material particles by using pulse current; and breaking through an oxidation film of each particle of metal powder at instant high temperature and enabling the oxidation film to be subjected to surface activation and quick liquefaction. The reaction speed of particles and the reaction speed among the particles are increased, the diffusion speed of alloy element atoms is increased and the aims of quickly alloying and densifying a sintering body are achieved. Compared with a traditional smelting method, the method disclosed by the invention has the advantages of simple and easily-controlled process, no loss of alloy elements, accurate components of silver-based solder components, low oxygen content, short sintering time, low energy consumption, safety, no pollution and favorable reproducibility. The ingot products prepared by the method are high in density; crystal particles are fine and are uniform in size; and the method is an economic and efficient green preparation process.
Description
Technical field
The present invention relates to a kind of method for preparing silver solder, be different from the preparation method of traditional handicraft, serves as to make processing object with the silver-base solder of recommending among the GB/T 10046-2008 " silver solder ", belongs to brazing material processing and preparing technical field.
Background technology
Silver solder is present most widely used a kind of solder, and it has good processing performance, suitable fusing point, the good wetting and ability of filling up the gap.And the intensity height of solder and fine seam, plasticity is good, therefore electric conductivity and excellent corrosion resistance are widely used in all black and the non-ferrous metal of fine weldering except aluminium, magnesium and other low-melting-point metals, as: mild steel, stainless steel, high temperature alloy, copper and copper alloy, kovar alloy and refractory alloy.Be widely used in industry manufacture field such as refrigeration, lamp decoration, hardware appliance, instrument and meter, chemical industry, Aero-Space.
In recent years, the research of silver solder both at home and abroad mainly concentrates on design and the trial to silver solder chemical composition proportioning, comprises 4 aspects: (1) cadmium-free silver brazing alloy; (2) low silver-colored silver-less solder; (3) influence of alloying element; (4) development of novel brazing filler metal alloy system and the research of solder for ceramic soldering etc.But preparation technology generally adopts the melting mode, and namely raw material according to a certain ratio places intermediate frequency furnace to carry out melting and is cast into ingot, obtains a material by follow-up forging, extruding, drawing, or obtains the strip material by ingot casting cogging, roughing, finish rolling.Also adopt horizontal casting at present, and some other complexity, strict smelting technology guarantee ingot quality, prevent component segregation, improve mechanical property, mechanical performance and the welding performance of silver-base solder with this simultaneously.
But in the actual production no matter adopt which kind of smelting technology, alloying element loss in fusion process is bigger, especially reactive metal element (as: zinc, lithium, magnesium etc.) is easy to oxidation, alloying component is difficult to control, simultaneously because argent is easy to air-breathingly under molten condition, reported in literature is under molten condition, silver can dissolve the oxygen above 21 times of himself volumes, and this character of silver has brought problem for melting and casting.It makes alloy at high temperature volatilize easily or cause a large amount of losses because producing splash from the high temperature cooling procedure.And in subsequently ingot casting and temperature-fall period, can cause the generation of ingot casting internal flaw, or directly have influence on the follow-up mechanical performance of silver-base solder and welding performance.Though adopt modes such as deoxidier or vacuum melting at present, or introduced other impurity elements, or increase vacuum equipment, the continuity that influence is produced.
Summary of the invention
The purpose of this invention is to provide a kind of economy, discharge plasma sintering process prepares silver-base solder efficiently, to reduce the loss of alloying element in the fusion process, the assurance alloying component is accurate, improve ingot quality, reduce ingot casting oxygen content and internal flaw, improve mechanical mechanics property and the welding performance of silver-base solder.
The method that the present invention prepares silver solder comprises: with silver powder, with other simple metal element powders or intermediate alloy powder, according to selected prescription, be placed in the ball grinder of inner liner polytetrafluoroethylene and carry out ball milling, the powder that ball milling mixes is inserted in the SPS system graphite crucible, be evacuated to 2～10Pa, with 5～50
oBe warming up to 900～1100 in C/ minute
oC, pressure are 5MPa～40MPa, 10 minutes～60 minutes dwell time, lower the temperature subsequently cold reach the material come out of the stove, the ingot bar precision behind the sintering is swaged, be drawn to a material subsequently, or rolling be sheet material.
Described silver powder purity 〉=99%, particle size range are 100 orders～500 orders.
Described simple metal element powders is: one of copper, nickel, zinc, tin, palladium, and purity 〉=99%, particle size range is 100 orders～500 orders.
Described intermediate alloy powder is to be M
xN
y, M is: one of copper, nickel, palladium; N is one of zinc, indium, lithium, and the x scope is: 0.50～0.99, y scope is 0.05～0.5.Purity 〉=99%, particle size range are 100 orders～500 orders.
The technology of the present invention principle is (spark plasma sintering in the discharge plasma sintering system, be called for short SPS), under vacuum condition, exert pressure by push-down head on the graphite placing the feed particles of graphite crucible, utilize the direct heating raw particle of pulse current, the oxide-film of breaking through each particle of metal dust under transient high temperature makes its surface active, and fast liquefying.Improve particle/intergranular reaction rate, increase the diffusion rate of alloying element atom, reach the rapid alloying of sintered body and densified purpose.
Compare with traditional smelting process, technology of the present invention is simple and easy to control, the loss of alloy-free element, and the silver-base solder composition is accurate, oxygen content is low, and sintering time is short, and energy consumption is low, safety non-pollution, favorable reproducibility.Prepared ingot density height, the crystal grain fine size is even, and the band of silver-base solder, silk material mechanical mechanics property are good, and weldability is good, is that a kind of technology is terse, cost is low, pollution-free green preparation technology.
The specific embodiment
The method step of preparation silver solder of the present invention comprises: with silver powder, with other simple metal element powders or intermediate alloy powder, according to selected prescription, be placed in the ball grinder of inner liner polytetrafluoroethylene and carry out ball milling, the powder that ball milling mixes is inserted in the SPS system graphite crucible, be evacuated to 2～10Pa, with 5～50
oBe warming up to 900～1100 in C/ minute
oC, pressure are 5MPa～40MPa, 10 minutes～60 minutes dwell time, lower the temperature subsequently cold reach the material come out of the stove, the ingot bar precision behind the sintering is swaged, be drawn to a material subsequently, or rolling be sheet material.
Described silver powder purity 〉=99%, particle size range are 100 orders～500 orders.
Described simple metal element powders is: one of copper, nickel, zinc, tin, palladium, and purity 〉=99%, particle size range is 100 orders～500 orders.
Described intermediate alloy powder is to be M
xN
y, M is: one of copper, nickel, palladium; N is one of zinc, indium, lithium, and the x scope is: 0.50～0.99, y scope is 0.05～0.5.Purity 〉=99%, particle size range are 100 orders～500 orders.
The present invention specifically implements by following steps:
1, with particle size range 100 orders～300 order silver powder, purity 〉=99%.With other particle size range 100 orders～500 order alloying element powders, one of copper, nickel, zinc, tin, palladium, purity 〉=99%, particle size range is 100 orders～500 orders.Or the intermediate alloy powder, M
xN
y, M is: one of copper, nickel, palladium; N is one of zinc, indium, lithium, and the x scope is: 0.50～0.99, y scope is 0.05～0.5, purity 〉=99%, and particle size range is 100 orders～500 orders.According to selected prescription, be placed in the ball grinder of inner liner polytetrafluoroethylene, ratio of grinding media to material 1:3～5, rotating speed 100～300 rpm/min, evenly batch mixing is 0.5～3 hour.
2, the powder that ball milling is mixed is inserted in the SPS system graphite crucible, is evacuated to 2～10Pa, with 5～50
oBe warming up to 900～1100 in C/ minute
oC, pressure are 5MPa～40MPa, 10 minutes～60 minutes dwell time.The cold material that reaches of lowering the temperature is subsequently come out of the stove.
3, the ingot bar precision behind the sintering is swaged, is drawn to a material subsequently, or rolling be sheet material, dimensional tolerance is decided according to actual conditions.
The present invention adopts discharge plasma sintering technique, utilize the transient high temperature under the plasmoid, by control programming rate, sintering temperature, pressing pressure, make the liquefaction of different material particle surface fast activating and the rapid alloying of silver-base solder, form fine and close ingot bar material, the silver-base solder ingot bar crystal grain that obtains is tiny, size is even.Because sintering time is short, compares with traditional smelting technology, the Volatile Elements loss is little, and formulated component is accurate, and oxygen content is low.Make the silver-base solder ingot bar have good plastic working ability, guarantee that silk material or band have good mechanical mechanics property and welding performance.It is simple and easy to control that this invention has technology, the loss of alloy-free element, and silver-colored Composition Control is accurate, and sintering time is short, and energy consumption is low, safety non-pollution, characteristics such as favorable reproducibility.
Below be described in detail several embodiments of the present invention, but the present invention not only is limited to this.
Embodiment 1Be 99.5% with purity, particle size range 100 order silver powder 72 grams, with purity 99%, particle size range 100 purpose copper powders 28 grams place the ball grinder of inner liner polytetrafluoroethylene, ratio of grinding media to material 1:3, rotating speed 100rpm/min, evenly batch mixing is 1 hour.The powder that ball milling mixes to be inserted in the SPS system graphite crucible, graphite crucible is of a size of * and 10, be evacuated to 5Pa, with 5
oBe warming up to 900 in C/ minute
oC, pressure are 5MPa, and 15 minutes dwell times, the cold material that reaches of lowering the temperature is subsequently come out of the stove.Ingot bar precision behind the sintering is swaged to Φ 6, be drawn to a material Φ 1 ± 0.05 subsequently.
Embodiment 2Be 99.5% with purity, particle size range is 200 order silver powder, 80 grams, with purity be 99%, particle size range is 200 purpose copper nickel intermediate alloy powder Cu
0.9Ni
0.120 restrain, and place the ball grinder of inner liner polytetrafluoroethylene, ratio of grinding media to material 1:5, and rotating speed 200rpm/min, evenly batch mixing is 2 hours.The powder that ball milling mixes is inserted in the SPS system graphite crucible, and graphite crucible is of a size of Φ 20 * 10, is evacuated to 5Pa, with 25
oBe warming up to 1100 in C/ minute
oC, pressure are 20MPa, and 20 minutes dwell times, the cold material that reaches of lowering the temperature is subsequently come out of the stove.Ingot bar precision behind the sintering is swaged to Φ 6, and rolling subsequently is sheet material 6 * 0.5 ± 0.01.
Embodiment 3Be 99.5% with purity, particle size range is 300 order silver powder, 70 grams, with purity be 99%, particle size range is 300 purpose copper indium intermediate alloy powder Cu
0.95In
0.0530 restrain, and place the ball grinder of inner liner polytetrafluoroethylene, ratio of grinding media to material 1:4, and rotating speed 300rpm/min, evenly batch mixing is 0.5 hour.The powder that ball milling mixes is inserted in the SPS system graphite crucible, and graphite crucible is of a size of Φ 20 * 10, is evacuated to 3Pa, with 50
oBe warming up to 950 in C/ minute
oC, pressure are 30MPa, and 10 minutes dwell times, the cold material that reaches of lowering the temperature is subsequently come out of the stove.Ingot bar precision behind the sintering is swaged to Φ 10, and rolling subsequently is sheet material 10 * 0.2 ± 0.01.
Claims (4)
1. method for preparing silver solder, its feature comprises: with silver powder, with other simple metal element powders or intermediate alloy powder, according to selected prescription, be placed in the ball grinder of inner liner polytetrafluoroethylene and carry out ball milling, the powder that ball milling mixes is inserted in the SPS system graphite crucible, be evacuated to 2～10Pa, with 5～50
oBe warming up to 900～1100 in C/ minute
oC, pressure are 5MPa～40MPa, 10 minutes～60 minutes dwell time, lower the temperature subsequently cold reach the material come out of the stove, the ingot bar precision behind the sintering is swaged, be drawn to a material subsequently, or rolling be sheet material.
2. a kind of method for preparing silver solder according to claim 1 is characterized in that described silver powder purity 〉=99%, and particle size range is 100 orders～500 orders.
3. a kind of method for preparing silver solder according to claim 1 is characterized in that described simple metal element powders is: one of copper, nickel, zinc, tin, palladium, and purity 〉=99%, particle size range is 100 orders～500 orders.
4. a kind of method for preparing silver solder according to claim 1 is characterized in that described intermediate alloy powder is to be M
xN
y, M is: one of copper, nickel, palladium; N is one of zinc, indium, lithium, and the x scope is: 0.50～0.99, y scope is 0.05～0.5, purity 〉=99%, and particle size range is 100 orders～500 orders.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310008917.1A CN103192203B (en) | 2013-01-10 | 2013-01-10 | Process method for preparing silver solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310008917.1A CN103192203B (en) | 2013-01-10 | 2013-01-10 | Process method for preparing silver solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103192203A true CN103192203A (en) | 2013-07-10 |
| CN103192203B CN103192203B (en) | 2015-06-17 |
Family
ID=48715117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310008917.1A Active CN103192203B (en) | 2013-01-10 | 2013-01-10 | Process method for preparing silver solder |
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| Country | Link |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103659059A (en) * | 2013-12-12 | 2014-03-26 | 北京科技大学 | Method for preparing annular moderate-temperature Ag-Cu-Sn brazing filler metal piece |
| CN105921908A (en) * | 2016-06-23 | 2016-09-07 | 国网江苏省电力公司宿迁供电公司 | Silver solder and preparation method thereof |
| CN106001989A (en) * | 2016-06-23 | 2016-10-12 | 国网江苏省电力公司宿迁供电公司 | Silver brazing flux and preparation method thereof |
| CN108907500A (en) * | 2018-08-03 | 2018-11-30 | 北京有色金属与稀土应用研究所 | A kind of high temperature auri active solder and preparation method thereof |
| CN111015017A (en) * | 2019-12-20 | 2020-04-17 | 西南交通大学 | Mn-Cu-based welding wire and preparation method and application thereof |
| CN114029651A (en) * | 2021-11-18 | 2022-02-11 | 东北大学 | Titanium-containing active solder and preparation method and application thereof |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1064637A (en) * | 1991-03-14 | 1992-09-23 | 中国有色金属工业总公司昆明贵金属研究所 | The method for welding of money base soldering paste and Silver Jewelry |
| JP2001261440A (en) * | 2000-03-17 | 2001-09-26 | Chubu Electric Power Co Inc | Oxidation-resistant hafnium carbide sintered body and oxidation-resistant hafnium carbide-lanthanum boride sintered body, their production processes and electrode for plasma generation, made by using the same |
| CN1446664A (en) * | 2003-04-10 | 2003-10-08 | 贵研铂业股份有限公司 | Silver alloy solder with low palladium content |
| CN1920076A (en) * | 2006-09-08 | 2007-02-28 | 北京科技大学 | Method of producing hydrogen-storage alloy by discharge plasma sintering technique |
| CN101224501A (en) * | 2008-01-25 | 2008-07-23 | 北京科技大学 | Fabricating method of Mg base thermoelectricity material |
| CN101478026A (en) * | 2009-01-21 | 2009-07-08 | 清华大学 | Thermoelectric compounds and preparation thereof |
| CN101575679A (en) * | 2009-06-22 | 2009-11-11 | 北京科技大学 | Preparation method of Mg-Ni series hydrogen storage alloy |
| CN101693325A (en) * | 2009-10-14 | 2010-04-14 | 郑州机械研究所 | High-toughness cadmium-free silver solder and preparation method thereof |
| US20110247671A1 (en) * | 2010-04-08 | 2011-10-13 | Samsung Electronics Co., Ltd. | Thermoelectric material and method of preparing the same |
| CN102240870A (en) * | 2011-05-20 | 2011-11-16 | 杭州华光焊接新材料股份有限公司 | Multielement rare-earth silver solder |
-
2013
- 2013-01-10 CN CN201310008917.1A patent/CN103192203B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1064637A (en) * | 1991-03-14 | 1992-09-23 | 中国有色金属工业总公司昆明贵金属研究所 | The method for welding of money base soldering paste and Silver Jewelry |
| JP2001261440A (en) * | 2000-03-17 | 2001-09-26 | Chubu Electric Power Co Inc | Oxidation-resistant hafnium carbide sintered body and oxidation-resistant hafnium carbide-lanthanum boride sintered body, their production processes and electrode for plasma generation, made by using the same |
| CN1446664A (en) * | 2003-04-10 | 2003-10-08 | 贵研铂业股份有限公司 | Silver alloy solder with low palladium content |
| CN1920076A (en) * | 2006-09-08 | 2007-02-28 | 北京科技大学 | Method of producing hydrogen-storage alloy by discharge plasma sintering technique |
| CN101224501A (en) * | 2008-01-25 | 2008-07-23 | 北京科技大学 | Fabricating method of Mg base thermoelectricity material |
| CN101478026A (en) * | 2009-01-21 | 2009-07-08 | 清华大学 | Thermoelectric compounds and preparation thereof |
| CN101575679A (en) * | 2009-06-22 | 2009-11-11 | 北京科技大学 | Preparation method of Mg-Ni series hydrogen storage alloy |
| CN101693325A (en) * | 2009-10-14 | 2010-04-14 | 郑州机械研究所 | High-toughness cadmium-free silver solder and preparation method thereof |
| US20110247671A1 (en) * | 2010-04-08 | 2011-10-13 | Samsung Electronics Co., Ltd. | Thermoelectric material and method of preparing the same |
| CN102240870A (en) * | 2011-05-20 | 2011-11-16 | 杭州华光焊接新材料股份有限公司 | Multielement rare-earth silver solder |
Non-Patent Citations (2)
| Title |
|---|
| 张启运，庄鸿手册: "《钎焊手册》", 30 January 1999 * |
| 陈文革，王发展: "《粉末冶金工艺及材料》", 30 July 2011 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103659059A (en) * | 2013-12-12 | 2014-03-26 | 北京科技大学 | Method for preparing annular moderate-temperature Ag-Cu-Sn brazing filler metal piece |
| CN103659059B (en) * | 2013-12-12 | 2016-08-17 | 北京科技大学 | A kind of method preparing annular Ag-Cu-Sn intermediate temperature solder sheet |
| CN105921908A (en) * | 2016-06-23 | 2016-09-07 | 国网江苏省电力公司宿迁供电公司 | Silver solder and preparation method thereof |
| CN106001989A (en) * | 2016-06-23 | 2016-10-12 | 国网江苏省电力公司宿迁供电公司 | Silver brazing flux and preparation method thereof |
| CN108907500A (en) * | 2018-08-03 | 2018-11-30 | 北京有色金属与稀土应用研究所 | A kind of high temperature auri active solder and preparation method thereof |
| CN111015017A (en) * | 2019-12-20 | 2020-04-17 | 西南交通大学 | Mn-Cu-based welding wire and preparation method and application thereof |
| CN111015017B (en) * | 2019-12-20 | 2021-09-14 | 西南交通大学 | Mn-Cu-based welding wire and preparation method and application thereof |
| CN114029651A (en) * | 2021-11-18 | 2022-02-11 | 东北大学 | Titanium-containing active solder and preparation method and application thereof |
| CN114029651B (en) * | 2021-11-18 | 2022-07-01 | 东北大学 | Titanium-containing active solder and preparation method and application thereof |
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| CN103192203B (en) | 2015-06-17 |
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