CN106590499A - Epoxy resin glue solution with high peel strength for copper-clad plate and preparation method of glue solution - Google Patents
Epoxy resin glue solution with high peel strength for copper-clad plate and preparation method of glue solution Download PDFInfo
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- CN106590499A CN106590499A CN201611260068.9A CN201611260068A CN106590499A CN 106590499 A CN106590499 A CN 106590499A CN 201611260068 A CN201611260068 A CN 201611260068A CN 106590499 A CN106590499 A CN 106590499A
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- epoxy resin
- polyphenylene oxide
- cage
- copper
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses an epoxy resin glue solution with high peel strength for a copper-clad plate. The glue solution comprises, by weight, 100 parts of bisphenol A type epoxy resin, 28-39 parts of diamino diphenyl sulfone, 20-30 parts of polyphenyl ether, a proper amount of tetrahydrofuran, 1-3 parts of n-butyllithium, 8-17 parts of allyl bromide, 7-13 parts of trichlorovinyl silane, 89-120 parts of acetone, 19-33 parts of deionized water, 5-12 parts of metachloroperbenzoic acid, a proper amount of dichloromethane, a proper amount of methyl alcohol, 0.5-1.5 parts of N,N-dimethylaminopyridine, 2-6 parts of aluminum nitride, 2-4 parts of coal-based kaolin ore, 0.2-0.6 part of silane coupling agent and 2-6 parts of acetic acid aqueous solution. Cage-like silsesquioxane containing epoxy groups and unsaturated double bonds is firstly synthesized, allyl is introduced on polyphenyl ether main chains, allyl and the polyphenyl ether main chains take participation in a curing reaction of epoxy resin, the cross-linking density of the resin is increased, and accordingly glass transition temperature of a substrate is increased and the dielectric constant is reduced.
Description
Technical field
The invention belongs to the preparing technical field of copper-clad plate, and in particular to a kind of ring of copper-clad plate with high-peeling strength
Oxygen resin adhesive liquid and preparation method thereof.
Background technology
Electron trade development at present is swift and violent, the requirement more and more higher to copper-clad plate performance, and can directly have influence on the above
The factor of properties of product, is rooted in the dielectric constant (Dk) of substrate and the height of dielectric loss angle tangent (Df) substantially.At present
The matrix resin of copper-clad plate is based on bisphenol A type epoxy resin, but the high speed with electronic product, high frequency and people's ring
Protect the raising of consciousness, bisphenol A type epoxy resin thermostability is poor, dielectric constant and dielectric damage Expendable it is higher the shortcomings of, cannot
The requirement of the high performance copper clad laminate that satisfaction is used under high frequency condition.
The features such as polyphenylene oxide (PPO) has good high frequency characteristics, such as low-k, low dielectric loss, and it has
Extremely low water absorption rate, excellent thermostability, good dimensional stability and the features such as there is excellent adhesive property with Copper Foil,
The wiring board material being suitable in high frequency electronic equipment.But PPO organic solvent resistances are poor, and epoxy resin is in chemical constitution
There is very big difference, be typically dispersed in epoxy matrix in the form of spheroidal particle, belong to thermodynamics Immiscible Polymer Blends, easily make
There is manufacturing deficiency such as hole etc. in the wiring board course of processing, cause wiring board quality unreliable.
Mo Jingchao, treasured minister in ancient times middle Tu et al. are at it《The high-frequency copper-clad plate preparation of polyphenyl ether modified epoxy resin composite material
And performance》In one text, using the polyphenyl ether modified epoxy resin of epoxy radicals end-blocking, epoxy-capped polyphenylene oxide can participate in curing reaction,
The diffusion hindered effect of polyphenylene oxide is effectively reduced, the solidification rate of system can not only be improved, moreover it is possible to improve the degree of cross linking of system.
The dielectric properties of epoxy resin can not only be improved by both advantages, while can also improve polyphenylene oxide organic solvent resistance difference etc.
Defect, can be used for the composite of high-frequency copper-clad plate.
The content of the invention
For the deficiencies in the prior art, the present invention provides a kind of epoxy resin adhesive liquid of copper-clad plate with high-peeling strength
And preparation method thereof.
A kind of epoxy resin adhesive liquid of copper-clad plate with high-peeling strength, is made up of the raw material of following weight portion：Bisphenol-A
100 parts of type epoxy resin, DADPS 28-39 parts, polyphenylene oxide 20-30 parts, appropriate tetrahydrofuran, n-BuLi 1-3 parts,
Allyl bromide, bromoallylene 8-17 parts, vinyl trichlorosilane 7-13 parts, acetone 89-120 parts, deionized water 19-33 parts, a chlorination peroxide benzene
Formic acid 5-12 parts, methylene chloride q, appropriate methanol, N, N- dimethyl aminopyridine 0.5-1.5 parts, aluminium nitride 2-6 parts, coal measures
Kaolin Ore 2-4 parts, silane coupler 0.2-0.6 parts, aqueous acetic acid 2-6 parts.
Comprise the following steps that：
（1）The synthesis of epoxy cage type sesquialter siloxane：
1. vinyl trichlorosilane and acetone, are added in there-necked flask, be slowly added dropwise while stirring under nitrogen protection from
Sub- water, reacts 6-8 days under 25-35 DEG C of constant temperature, and solution becomes dark reddish brown, separates out white crystal, as eight vinyls
Cage-type silsesquioxane；
2., above-mentioned eight ethenyl cage model sesquialter siloxane and a chlorination benzoyl hydroperoxide are dissolved in into dichloromethane, electromagnetic agitation is simultaneously
40-60 DEG C is to slowly warm up to, back flow reaction 1-3 days is dissolved in methanol after concentration, magnetic agitation 22-26 hour is taken out
Filter, obtains white powder and is epoxy cage type sesquialter siloxane；
（2）The preparation of allyl capped polyphenylene oxide：
Polyphenylene oxide is dissolved in tetrahydrofuran, under the protection of nitrogen, n-BuLi, heating reflux reaction 1-2 is slowly added to
Hour, 20-30 DEG C is cooled to, allyl bromide, bromoallylene stirring reaction 20-40 minute is added, separated out using methanol precipitate afterwards, in 50-70
DEG C vacuum drying 9-13 hours, obtain allyl capped polyphenylene oxide；
（3）Cage-type silsesquioxane base is crosslinked polyphenylene oxide/epoxy mixed system：
Bisphenol A type epoxy resin is weighed, according to formula ratio step is added（1）Epoxy cage type sesquialter siloxane, at 110-130 DEG C
Lower stirring 10-18 minutes, it is sufficiently mixed uniformly, is warming up to 150-170 DEG C of addition step（2）Allyl capped polyphenylene oxide, at a high speed
Stirring 30-55 minutes, form uniform mixed liquor；
（4）By Coaseries kaolin ore reduction into the ore particles of 2-8 mesh, it is ground with wet grinding mode, is dried naturally
To moisture ＜ 10%, the calcining at constant temperature 1-3 hour at 600-700 DEG C, be then warmed up to 900-980 DEG C of calcining at constant temperature 1-3 little
When, put it into afterwards in high-speed mixer, material is warming up to into 100-115 DEG C and is kept for constant temperature 5-15 minutes, it is then sprayed into
The aqueous acetic acid of silane coupler, is 2000-4000rpm in mixing velocity, under the conditions of temperature 115-140 DEG C, keeps constant temperature
Discharge after 3-15 minutes, obtain modified Coaseries kaolin；
（5）To step（3）Addition DADPS, N in mixed liquor, N- dimethyl aminopyridines, high-speed stirred 8-15 minute,
Add aluminium nitride, aluminium oxide and modified Coaseries kaolin step（4）Continue to stir 50-75 minutes, in 110-130 after mix homogeneously
Vacuumizing and defoaming at DEG C, obtains final product required glue.
Wherein, the pH value of described aqueous acetic acid is 3-6.
Compared with prior art, the present invention has advantages below：
（1）The present invention has synthesized first eight ethenyl cage model sesquialter siloxanes, then by a chlorination benzoyl hydroperoxide oxidized portion
Vinyl is obtained epoxy cage type sesquialter siloxane, and the cage-type silsesquioxane of generation is simultaneously double containing epoxide group and unsaturation
Key, the cage modle of cage-type silsesquioxane itself, hollow structure form " nano bubble " equivalent in resin matrix, can be effective
The reduction dielectric constant of material, in addition because epoxy terminated presence reactivity is higher, can participate in epoxy resin cure reaction,
Larger cross-linked network is formed, so as to improve the glass transition temperature of substrate.
（2）The present invention can be with by introducing the group-pi-allyl of cross-linking reaction on polyphenylene oxide molecular backbone, on the one hand
Overcome the not curable shortcoming of polyphenylene oxide itself, the polyphenylene oxide of another aspect allyl capped can with contain unsaturated double-bond
Epoxy cage type sesquialter siloxane occur curing reaction, because curing reaction is double bond additive reaction, molecule after curing reaction
Between motion significantly suppressed, improve three-component compound system crosslink density so that the vitrification point liter of substrate
Height, the solvent resistance of polyphenylene oxide and bin stability strengthen, and the dielectric constant of system significantly declines.
（3）The weakly acidic aqueous solution of silane coupler is sprayed at the present invention surface of Kaolin Ore, its in inorganic matters and
Bridge linking effect is played in resin base material, the bridge linking effect of coupling agent can be farthest played, such that it is able to effectively improve glue
The peel strength and toughness of liquid.
Specific embodiment
A kind of epoxy resin adhesive liquid of copper-clad plate with high-peeling strength, is made up of the raw material of following weight portion：Bisphenol-A
100 parts of type epoxy resin, 35 parts of DADPS, 26 parts of polyphenylene oxide, appropriate tetrahydrofuran, 2 parts of n-BuLi, allyl bromide, bromoallylene
11 parts, 12 parts of vinyl trichlorosilane, 120 parts of acetone, 29 parts of deionized water, 9 parts of a chlorination benzoyl hydroperoxide, dichloromethane is fitted
Amount, appropriate methanol, 0.5 part of N, N- dimethyl aminopyridine, 4 parts of aluminium nitride, 3 parts of Coaseries kaolin Ore, silane coupler 0.4
Part, 4 parts of aqueous acetic acid.
Comprise the following steps that：
（1）The synthesis of epoxy cage type sesquialter siloxane：
1. vinyl trichlorosilane and acetone, are added in there-necked flask, be slowly added dropwise while stirring under nitrogen protection from
Sub- water, reacts 7 days under 30 DEG C of constant temperatures, and solution becomes dark reddish brown, separates out white crystal, as eight ethenyl cage models times
Half siloxanes；
2., above-mentioned eight ethenyl cage model sesquialter siloxane and a chlorination benzoyl hydroperoxide are dissolved in into dichloromethane, electromagnetic agitation is simultaneously
50 DEG C are to slowly warm up to, back flow reaction 2 days is dissolved in methanol after concentration, and magnetic agitation 24 hours, sucking filtration obtains white
Powder is epoxy cage type sesquialter siloxane；
（2）The preparation of allyl capped polyphenylene oxide：
Polyphenylene oxide is dissolved in tetrahydrofuran, under the protection of nitrogen, n-BuLi is slowly added to, heating reflux reaction 1 is little
When, 25 DEG C are cooled to, add allyl bromide, bromoallylene stirring reaction 30 minutes, separated out using methanol precipitate afterwards, in 60 DEG C of vacuum drying
11 hours, obtain allyl capped polyphenylene oxide；
（3）Cage-type silsesquioxane base is crosslinked polyphenylene oxide/epoxy mixed system：
Bisphenol A type epoxy resin is weighed, according to formula ratio step is added（1）Epoxy cage type sesquialter siloxane, stirs at 120 DEG C
Mix 16 minutes, be sufficiently mixed uniformly, be warming up to 160 DEG C of addition steps（2）Allyl capped polyphenylene oxide, high-speed stirred 45 minutes,
Form uniform mixed liquor；
（4）By Coaseries kaolin ore reduction into the ore particles of 2-8 mesh, it is ground with wet grinding mode, is dried naturally
To moisture ＜ 10%, calcining at constant temperature 2 hours at 680 DEG C, 950 DEG C of calcining at constant temperature are then warmed up to 2 hours, afterwards by it
In being put into high-speed mixer, material is warming up to into 105 DEG C and constant temperature is kept 10 minutes, be then sprayed into the acetic acid water of silane coupler
Solution, is 3000rpm in mixing velocity, under the conditions of 120 DEG C of temperature, keeps constant temperature to discharge after 10 minutes, obtains modified coal series kaolin
Soil；
（5）To step（3）Addition DADPS, N in mixed liquor, N- dimethyl aminopyridines, high-speed stirred 12 minutes, plus
Enter aluminium nitride, aluminium oxide and modified Coaseries kaolin step（4）Continue to stir 65 minutes, take out true at 120 DEG C after mix homogeneously
Empty deaeration, obtains final product required glue.
Wherein, the pH value of described aqueous acetic acid is 3-6.
The glue prepared using the embodiment of the present invention is obtained copper-clad plate, to its performance test：
176 DEG C of Tg values, dielectric constant ＜ 3.6, dielectric loss ＜ 0.005, thermal conductivity reaches 0.53W/mK, water absorption rate<0.15%.
Claims (3)
1. a kind of copper-clad plate with high-peeling strength epoxy resin adhesive liquid, it is characterised in that by the raw material of following weight portion
Composition：100 parts of bisphenol A type epoxy resin, DADPS 28-39 parts, polyphenylene oxide 20-30 parts, appropriate tetrahydrofuran, positive fourth
Base lithium 1-3 parts, allyl bromide, bromoallylene 8-17 parts, vinyl trichlorosilane 7-13 parts, acetone 89-120 parts, deionized water 19-33 parts,
Chlorination benzoyl hydroperoxide 5-12 parts, methylene chloride q, appropriate methanol, N, N- dimethyl aminopyridine 0.5-1.5 parts, aluminium nitride
2-6 parts, Coaseries kaolin Ore 2-4 parts, silane coupler 0.2-0.6 parts, aqueous acetic acid 2-6 parts.
2. a kind of copper-clad plate according to claims 1 with high-peeling strength epoxy resin adhesive liquid preparation side
Method, it is characterised in that comprise the following steps that：
（1）The synthesis of epoxy cage type sesquialter siloxane：
1. vinyl trichlorosilane and acetone, are added in there-necked flask, be slowly added dropwise while stirring under nitrogen protection from
Sub- water, reacts 6-8 days under 25-35 DEG C of constant temperature, and solution becomes dark reddish brown, separates out white crystal, as eight vinyls
Cage-type silsesquioxane；
2., above-mentioned eight ethenyl cage model sesquialter siloxane and a chlorination benzoyl hydroperoxide are dissolved in into dichloromethane, electromagnetic agitation is simultaneously
40-60 DEG C is to slowly warm up to, back flow reaction 1-3 days is dissolved in methanol after concentration, magnetic agitation 22-26 hour is taken out
Filter, obtains white powder and is epoxy cage type sesquialter siloxane；
（2）The preparation of allyl capped polyphenylene oxide：
Polyphenylene oxide is dissolved in tetrahydrofuran, under the protection of nitrogen, n-BuLi, heating reflux reaction 1-2 is slowly added to
Hour, 20-30 DEG C is cooled to, allyl bromide, bromoallylene stirring reaction 20-40 minute is added, separated out using methanol precipitate afterwards, in 50-70
DEG C vacuum drying 9-13 hours, obtain allyl capped polyphenylene oxide；
（3）Cage-type silsesquioxane base is crosslinked polyphenylene oxide/epoxy mixed system：
Bisphenol A type epoxy resin is weighed, according to formula ratio step is added（1）Epoxy cage type sesquialter siloxane, at 110-130 DEG C
Lower stirring 10-18 minutes, it is sufficiently mixed uniformly, is warming up to 150-170 DEG C of addition step（2）Allyl capped polyphenylene oxide, at a high speed
Stirring 30-55 minutes, form uniform mixed liquor；
（4）By Coaseries kaolin ore reduction into the ore particles of 2-8 mesh, it is ground with wet grinding mode, is dried naturally
To moisture ＜ 10%, the calcining at constant temperature 1-3 hour at 600-700 DEG C, be then warmed up to 900-980 DEG C of calcining at constant temperature 1-3 little
When, put it into afterwards in high-speed mixer, material is warming up to into 100-115 DEG C and is kept for constant temperature 5-15 minutes, it is then sprayed into
The aqueous acetic acid of silane coupler, is 2000-4000rpm in mixing velocity, under the conditions of temperature 115-140 DEG C, keeps constant temperature
Discharge after 3-15 minutes, obtain modified Coaseries kaolin；
（5）To step（3）Addition DADPS, N in mixed liquor, N- dimethyl aminopyridines, high-speed stirred 8-15 minute,
Add aluminium nitride, aluminium oxide and modified Coaseries kaolin step（4）Continue to stir 50-75 minutes, in 110-130 after mix homogeneously
Vacuumizing and defoaming at DEG C, obtains final product required glue.
3. a kind of copper-clad plate according to claims 1,2 with high-peeling strength epoxy resin adhesive liquid preparation side
Method, it is characterised in that the pH value of described aqueous acetic acid is 3-6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611260068.9A CN106590499A (en) | 2016-12-30 | 2016-12-30 | Epoxy resin glue solution with high peel strength for copper-clad plate and preparation method of glue solution |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611260068.9A CN106590499A (en) | 2016-12-30 | 2016-12-30 | Epoxy resin glue solution with high peel strength for copper-clad plate and preparation method of glue solution |
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| CN106590499A true CN106590499A (en) | 2017-04-26 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107936893A (en) * | 2017-12-06 | 2018-04-20 | 广西汇智生产力促进中心有限公司 | Modified kaolin waterproof gasket cement and preparation method thereof |
| CN110218328A (en) * | 2019-06-19 | 2019-09-10 | 陕西天策新材料科技有限公司 | A kind of method of synthesizing epoxy base cage-type silsesquioxane |
| CN114214031A (en) * | 2021-11-30 | 2022-03-22 | 四川大学 | Flame-retardant polyphenyl ether adhesive and preparation method and application thereof |
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| CN101585955A (en) * | 2008-12-31 | 2009-11-25 | 广东生益科技股份有限公司 | Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil |
| CN105968713A (en) * | 2015-11-23 | 2016-09-28 | 重庆市锦艺硅材料开发有限公司苏州分公司 | Preparation method of filling material used for copper-clad plate, resin composition used for copper-clad plate and copper-clad plate thereof |
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2016
- 2016-12-30 CN CN201611260068.9A patent/CN106590499A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101585955A (en) * | 2008-12-31 | 2009-11-25 | 广东生益科技股份有限公司 | Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil |
| CN105968713A (en) * | 2015-11-23 | 2016-09-28 | 重庆市锦艺硅材料开发有限公司苏州分公司 | Preparation method of filling material used for copper-clad plate, resin composition used for copper-clad plate and copper-clad plate thereof |
Non-Patent Citations (2)
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| 司凌霞: "POSS/环氧树脂/氰酸酯纳米复合材料的研究", 《北京化工大学硕士研究生学位论文》 * |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107936893A (en) * | 2017-12-06 | 2018-04-20 | 广西汇智生产力促进中心有限公司 | Modified kaolin waterproof gasket cement and preparation method thereof |
| CN110218328A (en) * | 2019-06-19 | 2019-09-10 | 陕西天策新材料科技有限公司 | A kind of method of synthesizing epoxy base cage-type silsesquioxane |
| CN114214031A (en) * | 2021-11-30 | 2022-03-22 | 四川大学 | Flame-retardant polyphenyl ether adhesive and preparation method and application thereof |
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Application publication date: 20170426 |