CN109196422A - Handle the method and substrate carrier system of substrate - Google Patents

Handle the method and substrate carrier system of substrate Download PDF

Info

Publication number
CN109196422A
CN109196422A CN201680086200.0A CN201680086200A CN109196422A CN 109196422 A CN109196422 A CN 109196422A CN 201680086200 A CN201680086200 A CN 201680086200A CN 109196422 A CN109196422 A CN 109196422A
Authority
CN
China
Prior art keywords
substrate
clamping zone
clamping
redundancy
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680086200.0A
Other languages
Chinese (zh)
Inventor
托马斯·沃纳·兹巴于尔
哈拉尔·克劳丝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN109196422A publication Critical patent/CN109196422A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Embodiment as described herein is about a kind of method for handling substrate.This method includes: the clamping zone of multiple separations of the clamp assemblies using electrostatic or magnetism by substrate clamping to support surface, wherein at least one redundancy clamping zone (31) of these clamping zones provides redundancy chucking power, so that substrate is immobilizated in support surface by multiple remaining clamping zones (33) of these clamping zones in the case where at least one described redundancy clamps area failures or short circuit.According to other aspects, a kind of substrate carrier system (20) to execute method described herein is provided.

Description

Handle the method and substrate carrier system of substrate
Technical field
The embodiment of present disclosure about processing substrate method, and especially by clamp assemblies by substrate And/or mask is clamped to the method for support surface, the clamp assemblies are configured to for during the transmission in vacuum chamber Hold substrate and/or mask.Other embodiments are integrated with particularly with regard to one kind quiet about a kind of substrate carrier system The clamp assemblies of the substrate carrier system of the clamp assemblies of electric or magnetic, the electrostatic or magnetism are configured in vacuum chamber Substrate and/or mask are held during transmission in room.More particularly, have the substrate carrier system of the clamp assemblies of integration can be through Construction in vertical orientation for holding substrate and/or mask during the film deposition on substrate.
Background technique
The clamp assemblies of electrostatic can be used for utilizing electrostatic field by substrate clamping to substrate carrier during substrate processing.Substrate Fixing can also realize that and the fixing of substrate can also be real in vacuum environment during high temperature, coating and corona treatment It is existing.Magnetic clamp assemblies can be used for utilizing magnetic field by substrate clamping to substrate carrier during substrate processing.
Mechanical clamping force is often used when the substrate handled in the direction vertical or top (overhead) to be immobilizated in substrate On carrier.However, mechanical grip carrier may have insufficient positioning accuracy and may also be during clamping because of high mechanical folder Holding force and generate particle.
For example for display manufacturing Organic Light Emitting Diode (OLED) manufacture and large-area substrates (for example, for example with In the large-area substrates of display manufacturing) manufacture in, during the deposition of the thin-material layers on substrate, used above substrate The positioning accuracy of mask is challenging, especially in the increased situation of the size of substrate.In particular, in vertical orientation Fixing, which has, is more than 0.5m2Area or have be more than 1m2The thin or ultra-thin large-area substrates of area be challenging. Since chucking power is difficult to be evenly applied to substrate, may cause on substrate by holding the mechanical grip carrier at edge of substrate The positioning of the mask of side is bad, this may cause substrate or mask bending or positional shift.
Therefore, for substrate and mask to be securely held in the branch of substrate carrier during vertically and horizontally processing substrate Fail-safe (failure resistant) system and method on support surface are advantageous.Furthermore fixing clamp is provided in unit area Substrate pressure is equably advantageous on a support surface with enhancing thermal control during processing by holding force.
Summary of the invention
In view of above-mentioned, pass through the method and substrate carrier system to handle substrate.
According to one aspect of the present disclosure, a kind of method for handling substrate is proposed.The method including the use of electrostatic or The clamping zone of multiple separations of magnetic clamp assemblies clamps substrate and/or mask to support surface, wherein the multiple At least one redundancy clamping zone of clamping zone provides redundancy chucking power, so that losing at least one described redundancy clamping zone In the case where effect or short circuit, substrate and/or mask are immobilizated in support table by the remaining clamping zone of the multiple clamping zone Face.
In some embodiments, each clamping zone of the multiple clamping zone is configured to redundancy clamp area Domain, so that substrate and/or mask pass through institute in the case where the failure of any one clamping zone or short circuit of the multiple clamping zone The remaining clamping zone for stating multiple clamping zones is immobilizated in support surface.
According to other aspects of present disclosure, a kind of method for handling substrate is proposed.The method including the use of electrostatic or The clamping zone of multiple separations of magnetic clamp assemblies is by substrate clamping to support surface, wherein the multiple clamping zone At least one redundancy clamping zone provide redundancy chucking power so that at least one described redundancy clamp area failures or short circuit In situation, substrate is immobilizated in support surface by the remaining clamping zone of the multiple clamping zone；Release it is described at least one The redundancy chucking power of redundancy clamping zone, to allow the balance exercise between a part of substrate and clamp assemblies (equalizing movement)；With the redundancy chucking power for restoring at least one redundancy clamping zone.
According to the another aspect of present disclosure, a kind of substrate carrier system is proposed.Substrate carrier system includes: substrate Carrier has support surface, and the support surface is to supporting substrate；The clamp assemblies of electrostatic or magnetism, including multiple separations Clamping zone, the multiple clamping zone is set in substrate carrier, wherein at least one of the multiple clamping zone is superfluous Remaining clamping zone is configured to provide redundancy chucking power, so that clamping the feelings of area failures or short circuit at least one described redundancy In condition, substrate is immobilizated in support surface by the remaining clamping zone of the multiple clamping zone.
Other aspects, the advantages and features of present disclosure are apparent from specification and appended attached drawing.
Detailed description of the invention
In order to understand that the features described above of present disclosure can in detail, can be obtained by referring to embodiment briefly general The present disclosure more specific description being set forth in.Appended attached drawing is related to the embodiment of present disclosure and is illustrated in down.It is real The mode of applying is illustrated in attached drawing and is described in detail below.
Fig. 1 will be constructed to be used to execute the signal of the substrate carrier system according to the method for embodiment described herein Figure；
Fig. 2 is the signal being configured to for executing the substrate carrier system according to the method for embodiment described herein Figure；
Fig. 3 is the signal being configured to for executing the substrate carrier system according to the method for embodiment described herein Figure；
Fig. 4 is the signal being configured to for executing the substrate carrier system according to the method for embodiment described herein Figure；
Fig. 5 is the vacuum processing system with substrate carrier system to execute the method according to embodiment described herein The schematic diagram of system；
Fig. 6 is the flow chart according to the method for the processing substrate of embodiment described herein；
Fig. 7 is the flow chart according to the method for the processing substrate of embodiment described herein；With
Fig. 8 is the flow chart according to the method for the processing substrate of embodiment described herein.
Specific embodiment
It reference will now be made in detail embodiment, one or more examples of these embodiments are illustrated in each attached drawing.Respectively Example is provided by way of explanation and it is not intended that for limitation.For example, illustrate as a part of an embodiment Or the feature of narration can be used for any other embodiment or in conjunction with any other embodiment, further be implemented with obtaining Mode.Present disclosure is intended to include these adjustment and variation.
In Detailed description of the invention below, identical reference numerals mean same or similar element.In general, only for a The deviation of other embodiment is illustrated.Unless otherwise indicated, the explanation of a part in an embodiment or aspect Applied to the corresponding part or aspect in another embodiment.
Fig. 1 is the front view of substrate carrier system 20 according to one embodiment.Substrate carrier system 20 can be used with Bearing substrate 10, and selectively by vacuum flush system, the vacuum flush system will be under for carrying mask (not being painted) Text further illustrates.In Fig. 1, substrate 10 is depicted as dashed square, by the support of the substrate carrier 21 of substrate carrier system 20 Surface 22 is held.
Can be in some embodiments in conjunction with other embodiments described herein, substrate 10 can Vertical Square in itself Support surface 22 is retained in.For example, during transporting through vacuum flush system and/or during depositing operation, base Plate can be immobilizated in essentially perpendicular direction, wherein one or more veneers are on substrate.Therefore, in the processing substrate phase Between, the support surface 22 of substrate carrier 21 can be temporarily, at least substantially vertical direction.It is held in vertical direction in itself Large-area substrates are challenging, and are bent because substrate may be because the weight of substrate, and substrate may be in chucking power deficiency It is slid in the case where enough from support surface and/or substrate may be mobile relative to mask, mask is retained on the front of substrate.
If present disclosure uses in the whole text, when particularly relating to substrate orientation, " substantially vertical " is understood to allow from vertical Histogram to or attitude drift ± 20 ° or hereinafter, be exemplified as ± 10 ° or less.It can provide this offset, for example, because having and hanging down The substrate carrier of some offsets directly oriented there may be more stable substrate positions or face-down substrate orientation may be even The particle on substrate is preferably reduced during deposition.Furthermore such as during layer depositing operation, substrate orientation is considered as substantially Vertically, substantially vertically it is different from horizontal base plate to orient.
In particular, seeming that the term of " vertical direction " or " vertical orientation " is understood as present disclosure uses in the whole text For with " horizontal direction " or " horizontal orientation " different from.Vertical direction is arranged essentially parallel to gravity.
In some embodiments, during processing, substrate can temporarily, at least be immobilizated in substantially horizontal direction, citing For, face-down or top the position for example, for deposition.For example, substrate can be immobilizated in substantially horizontal down On support surface.It the face-down position of substrate can be to be advantageous, to keep the particle absorption of minimum on the surface of the substrate.
In some embodiments, substrate carrier 21 can be between vertical orientation and non-vertically oriented (such as horizontal orientation) It is moveable, it is e.g. pivotable.For example, substrate can be placed on support surface 22 and be pressed from both sides in non-vertically oriented It is held in support surface 22, there is the substrate carrier 21 of the substrate clamped can then be moved into substantially vertical orientation, and And in substrate holder while support surface, substrate can be transmitted and/or be further processed in vertical orientation in itself.One In a little embodiments, substrate from support surface de-clamping (de-chucked) and can be removed in non-vertically oriented.
In some cases, during processing, can also be from a substrate carrier of the clamp assemblies with electrostatic (such as Rest on system or under vacuum) to the clamp assemblies with electrostatic another carrier substantially vertically transmission or transmitting, For example, entering or leaving vacuum deposition system for transmitting substrate.
During (such as layer deposit during), substrate transport through vacuum flush system during transmission and processing, and/or fill It is loaded into vacuum flush system and from during vacuum flush system unloading, the substrate 10 of present disclosure can be 21 by substrate carrier Support.
According to the embodiment of the present disclosure, there is the series winding (in-line) or in batches of one or more transmission devices Formula (batch-type) processing system can be used for transmitting one or more substrate carriers and other base together along transmitting path Plate.In some embodiments, transmission device can be set to magnetic levitation systems, substrate carrier is immobilizated in suspension State.Optionally, magnetic drive system can be used in series winding processing system, and the magnetic drive system is configured in sender Substrate carrier is moved or transmitted along transmitting path in.Magnetic drive system may include in magnetic levitation systems or settable Ingredient from individual.
In some embodiments, it is possible to provide mechanical transmission system.Conveyer system may include roller, in direction of transfer Substrate carrier is transmitted, wherein can provide the driver for rotating roller.Mechanical transmission system can be easy to implement and steady (robust), durable with (maintenance friendly) convenient for safeguarding.
In some embodiments, in deposition material during on substrate, substrate 10 can be immobilizated in substrate carrier 21 Support surface 22.For example, chemical vapor deposition (CVD) and physical vapour deposition (PVD) (PVD) system are developed in vacuum Coated substrates (such as thin glass substrate) in processing chamber housing, such as display application.In vacuum flush system, each substrate It can be held by substrate carrier, and substrate carrier can transport through vacuum processing chamber by a other transmission device.Substrate carrier Can be mobile by transmission device, so that at least part of main surface of substrate is towards apparatus for coating exposure (such as sputtering dress It sets).When substrate can be located at the front of apparatus for coating or transport through apparatus for coating at a predetermined velocity, the main surface of substrate can be applied It is furnished with scumbling layer of cloth.
The substrate used in some embodiments described herein can be non-flexible substrate, for example, chip, such as blue treasured Stone or the transparent crystal of fellow, glass board material or ceramic board.However, present disclosure is not limited, and term substrate It also may include flexible base board, e.g. web (web) or foil (such as metal foil or plastic foil).
In particular, " large-area substrates " can be used in display manufacturing and be glass or plastic base.For example, herein The substrate should be comprising being generally used for liquid crystal display (Liquid Crystal Display, LCD), plasma scope The substrate of (Plasma Display Panel, PDP) and similar display.For example, large-area substrates can have main table Face, the main surface have 0.5m2Or bigger area, especially 1m2Or bigger area.In some embodiments, big face Product substrate can be the 4.5th generation, the 5th generation or bigger substrate, and the 4.5th generation corresponded to the substrate (0.73x of about 0.67m plate 0.92m), in the 5th generation, corresponded to the substrate (1.1m x 1.3m) of about 1.4mm.Greater area of substrate can more the 7.5th generation, In 8.5 generations or even the 10th generation, in the 7.5th generation, corresponded to the substrate (1.95m x 2.2m) of about 4.29m the, the 8.5th generation corresponded to The substrate (2.2m x 2.5m) of about 5.7mm, the 10th generation correspond to the substrate (2.85m 2.5mm tool) of about 8.7m.It even can be with class As mode implement for example, more Gao Dai in the 11st generation and the 12nd generation and corresponding substrate area.
In some embodiments, have down to several cm2Surface area (such as 2cm x 4cm) and/or various individual The array of the smaller size substrate of shape can be positioned on larger substrate carrier.
In some embodiments, the thickness of the substrate in the direction perpendicular to the main surface of substrate can be 1mm or more It is few, it is exemplified as from 0.3mm to 0.7mm.In some embodiments, the thickness of substrate can for 5 μm or more and/or 700 μm or Less.The thin substrate for carrying the thickness of only a few micrometers (such as 8 μm or more and 50 μm or less) can be challenging.
In view of good coating result, substrate 10 is immobilizated in the support surface 22 of substrate carrier 21, so that avoiding The movement of substrate and/or mask can be advantageous during coating.When substrate size increases and applying structure reduces, substrate exists Accurate positionin and substrate on support surface become more challenging relative to the accurate positionin of mask.
According to method described herein, substrate can accurately and reliably be immobilizated in support surface 22 during processing, and The substrate carrier system of fail-safe is provided.Substrate carrier system 20 includes the clamp assemblies 30 of electrostatic or magnetism, also referred to as " electricity Clamp (e-chuck) component ".Electrostatic or the clamp assemblies 30 of magnetism include multiple clamping zones 32.These clamping zones 32 can It is arranged to be separated, so that each clamping zone is configured to for a part of substrate to be fixed on the associated section of support surface. In some embodiments, these clamping zones 32 separate setting transverse to each other at the main body of substrate carrier 21.Citing comes It says, clamping zone can be distribution in a manner of predetermined pattern in the main extension plane of substrate carrier.
In some embodiments, clamping zone can in a manner of linear arrangement (such as horizontal line or vertical row) phase each other It arranges adjacently.In some embodiments, clamping zone can be arranged in a manner of two-dimensional array (such as multiple row and columns).Other 2D pattern or combinations thereof is feasible, such as the clamping zone or intertexture clamping zone of arranged concentric, is such as interweaved tortuous (interwoven meander) structure.For example, the clamping zone of the embodiment of Fig. 1 is arranged to row and two there are two tools The two-dimensional array of a column.Term " clamping zone ", " clamping section " and " gripper pad " can be in the synonymous uses of this paper, and can be expressed as It is configured to generate a part of the clamp assemblies of the chucking power of electrostatic or magnetism in a part of support surface.Each clamping zone It can help to the integral retaining power of clamp assemblies.
For example, each clamping zone can cover a part of area of support surface 22, and can be configured to generate can be The chucking power of adjustable scheduled electrostatic or magnetism.The chucking power generated by each clamping section can with covered by clamping section The part area of support surface is proportional.In some embodiments, each clamping zone of multiple clamping zones covers support The substantially same section area on surface, so that the folder that the integral retaining power that clamp assemblies generate can generate for single clamping zone The several times of holding force.
In some embodiments, clamping zone can be independently controlled.For example, clamping zone can independently power With power-off (de-powered), and/or the chucking power generated by each clamping zone can be provided independently from.
Hereinafter, explanation is had to the clamp assemblies of the electrostatic of the clamping zone of multiple electrostatic.However, in some implementations In mode, it is possible to provide the magnetic clamp assemblies of the clamping zone with multiple magnetism.In further embodiment, it clamps Component can partly be arranged to the clamp assemblies of electrostatic and partly be arranged to magnetic clamp assemblies.For example, multiple folders The first subset for holding region can be configured to the clamping zone of electrostatic, and the second subset of multiple clamping zones can be configured to magnetic The clamping zone of property.
Electric clamp assemblies can be configured to monopole clamp assemblies, bipolar clamp assemblies or multipole clamp assemblies." monopole clamping Component " can be regarded as such a clamp assemblies, wherein each clamping zone includes that may connect to electric power assembly (such as high-voltage power supply) At least one electrode arrangement, wherein electric power assembly is configured to provide unipolar voltage to electrode arrangement.For example, root According to the electrode cloth that can be applied to each clamping zone with some embodiments in conjunction with other embodiments described herein, positive voltage It sets, so that incuding negative electrical charge on the support surface of substrate carrier.Alternatively, negative voltage can be applied to electrode arrangement, so that substrate carries Induced positive on the support surface of body.
" bipolar clamp assemblies " used herein can be regarded as such a clamp assemblies, wherein each clamping zone includes tool There is the electrode arrangement of at least one first electrode He at least one second electrode for may connect to electric power assembly (such as high-voltage power supply), Wherein electric power assembly is configured to provide the first polar voltage to first electrode and provides the second polar voltage to the second electricity Pole.For example, negative voltage can be applied to the first electrode of each clamping zone, and positive voltage can be applied to second electrode, or anti- ?.Therefore, corresponding negatively charged region and corresponding positively charged region can be generated by electrostatic induction carries in substrate The support surface of body.In some embodiments, symmetrical bipolar voltage is provided.
In multipole clamp assemblies, each clamping zone may include multiple electrodes that can be the independently-controlled, such as six electrodes.
The clamp assemblies 30 of substrate carrier system 20 shown in Fig. 1 including electrostatic, plurality of clamping zone 32 is by total Totally four clamping zone compositions, this four clamping zones are schematically shown as dividing transverse to each other in the main extension plane of substrate carrier 21 Every rectangle.In some embodiments, setting is less than four clamping zones, is exemplified as two or three clamping zones.? In some embodiments, setting is more than four clamping zones, is exemplified as six or more, ten or more or 20 A or more clamping zone.In some embodiments, two or more clamping zones are in a horizontal direction and/or vertically Adjacent to arranging each other in direction.In some embodiments, it is rectangle that clamping zone is shapeless, but can have different shape, It is exemplified as arc, circle, linear or polygon." shape " of clamping zone can refer to the clamp area in the plane of support surface The exterior contour of the electrode in domain.
In some embodiments, each clamping zone of multiple clamping zones 32 includes electrode arrangement, it may for example comprise first The electrode arrangement of electrode and second electrode, wherein the first electricity can be applied to by electric power assembly (such as high voltage source) first voltage Pole and second voltage can be applied to second electrode.In some embodiments, first electrode can interlock with second electrode, so as to The chucking power provided by clamping zone is provided.
Can in some embodiments in conjunction with disclosure herein disclosed other embodiments, substrate carrier 21 include electricity Dielectric body, wherein in the electrode arrangement insertion dielectric body of the clamp assemblies of electrostatic.Dielectric body can be by dielectric material Expect (such as high-termal conductivity dielectric substance) manufacture, high-termal conductivity dielectric substance is, for example, pyrolytic boron nitride (pyrolytic Boron nitride), aluminium nitride, silicon nitride, aluminium oxide or equivalent material, the equivalent material be exemplified as heat-resistant polymer base Material, such as polyimide-based material or other organic materials.The electrode of electrode arrangement can be respectively coupled to electric power assembly) for example Voltage source).The electric power assembly can provide predetermined voltage to electrode arrangement, to generate scheduled chucking power.Chucking power can be quiet Electric power, the electrostatic force on substrate with substrate is fixed on substrate carrier support surface on.
When the clamp assemblies of electrostatic include multiple conductive arrangements, such as multiple electrodes arrangement, these electrode arrangements are, for example, Adjacent to second electrode arrangement first electrode when, may have the risk of short circuit between these conductive arrangements.For example, it presss from both sides Holding the short circuit between the first electrode in region and second electrode can lead to an other clamping zone failure.
In traditional electric clamp assemblies, failure or short circuit in the single failure position of electric clamp assemblies may cause electricity The entire clamping zone of clamp assemblies fails.Therefore, during processing there may be substrate relative to substrate carrier it is mobile or from The risk that support surface is fallen.It is compared in this, it is during substrate processing, one or more superfluous according to method disclosed herein Failure or short circuit in remaining clamping zone can not negatively affect the chucking power of remaining clamping zone, these remaining clamping zones can be still So work.
According to method described herein, substrate 10 is held on the support table of substrate carrier using the clamping zone of multiple separations At least one redundancy clamping zone 31 in face 22, plurality of clamping zone provides redundancy chucking power, so that described at least one In the case where a redundancy clamping area failures or short circuit, clamping that substrate is provided by the remaining clamping zone 33 of multiple clamping zones Power and be held the state for attaching to support surface.
In other words, though during substrate processing at least one redundancy clamping zone 31 failure or short circuit in the case where, The remaining clamping zone 33 (that is, whole clamping zones other than redundancy clamping zone) of multiple clamping zones 32 can provide collection Body chucking power, collective's chucking power is securely enough to by substrate holder in support surface.
Can be in some embodiments in conjunction with other embodiments described herein, each clamping of multiple clamping zones 32 Region can be configured to redundancy clamping zone, so that in any one clamping zone failure of multiple clamping zones or the situation of short circuit In, substrate 10 is immobilizated in support surface 22 by the remaining clamping zone of multiple clamping zones.
That is, in the case where the failure of any one clamping zone of multiple clamping zones or short circuit, it is a other surplus Remaining clamping zone provides sufficiently strong chucking power reliably by substrate holder in support surface.It can avoid relative to substrate carrier Substrate movement or displacement.
According to some embodiments as described herein, multiple clamping zones 32 are configured such that be produced by multiple clamping zones 32 Raw collective's chucking power is enough to allow at least one single clamping zone failure, because other clamping zones still work and consolidate Hold substrate.In particular, may be allowed single redundancy clamping even in the case where substrate is immobilizated in support surface in vertical orientation Area failures or two or more redundancy clamp area failures.
Can in some embodiments in conjunction with other embodiments described herein, multiple clamping zones include 5% Or more and the subsets of 50% or less, especially 10% or more and 35% or less multiple clamping zones can provide redundancy Chucking power, so that substrate passes through the surplus of multiple clamping zones in the case where the failure of the subset of multiple clamping zones 32 or short circuit Remaining clamping zone is immobilizated in support surface.
For example, in some embodiments, may be allowed 50% random subset including multiple clamping zones to fail Or short circuit.In the embodiment of figure 1, in any two clamping zone of multiple clamping zones in the case where short circuit, substrate Support surface 22 can be still immobilizated in.In other embodiments, it may be allowed 25% random subset including multiple clamping zones Failure or short circuit.In the embodiment of figure 1, in the case where any one clamping zone of multiple clamping zones is short-circuit, base Plate can still be immobilizated in support surface 22.In another embodiment, it may be allowed 10% anyon including multiple clamping zones Collection failure or short circuit.For example, in including the embodiment of 20 clamping zones in total, in any of multiple clamping zones In two clamping zones in the case where short circuit, substrate can still be immobilizated in support surface.
In order to avoid the failure or short circuit of one of multiple clamping zones damage the function of remaining clamping zone, in some realities It applies in mode, clamping zone at least can electrically decouple (electrically each other in the case where substrate is held by clamp assemblies decoupled)." electrically decoupling " used herein can be regarded as it is electrically isolated between multiple clamping zones so that clamp area The defects of one of domain does not influence the chucking power of remaining clamping zone, the defect be exemplified as charge leakage, two or Voltage between short circuit, and/or two or more electrode between more electrodes changes or collapse of voltage.For example, Each clamping zone of multiple clamping zones 32 may include electrode arrangement, the first electrode of wherein at least one redundancy clamping zone 31 Arrangement can the residue electricity of (such as transmission and during depositing coating on substrate) from remaining clamping zone during substrate processing The electrically decoupling of pole arrangement.Therefore, first electrode arrangement in short circuit can in remaining electrode arrangement voltage and distribution of charges do not have Have an impact.
According to multiple embodiments as described herein, exist to obtain at least one redundancy clamping zone 31 and remaining folder Hold the electrically isolated different selections between region 33.One selection is illustrated in Fig. 1.At least one redundancy clamping zone 31 can By using other electric power assembly 51 (for example, it is associated to be configured to only charge at least one redundancy clamping zone 31 Voltage source) electrically to decouple from remaining clamping zone to the power supply of at least one redundancy clamping zone 31.Can with it is described herein its In some embodiments that his embodiment combines, each clamping zone of multiple clamping zones can be supplied by a other electric power assembly 51 Electricity, for example, being configured to the associated voltage source only to charge to single associated clamping zone.Therefore, multiple clamping zones The failure or short circuit of one of them will not influence remaining clamping zone, because remaining clamping zone is by different individual voltages Source power supply.In some embodiments, a other electric power assembly 51 can be controlled by controller.In some embodiments, individually Electric power assembly can be integrated in common housing, the shell may be disposed on substrate carrier.
A other electric power assembly 51 can be configured to high-voltage module, and the high-voltage module is configured to for mentioning respectively Voltage and/or 10kV or less for 1kV or more, especially 2kV or more, especially 4kV or less voltage.One In a little embodiments, such as when being arranged using organic matrix electrodes, a other electric power assembly 51 is connected to controller, to a Not Kong Zhi electric power assembly voltage, such as controlled in voltage range from 1kV to 2kV.It, can in the case where ceramic matrix Use higher voltage.In some embodiments, high-voltage module can respectively include electric pressure converter or transformer.
According to some embodiments as described herein, using multiple clamping zones by the mask of substrate and selectivity clamp to The support surface of substrate carrier, wherein one or more clamping zones are configured to redundancy clamping zone.It is solid by clamp assemblies The substrate for being held in support surface can also become " substrate clamped ".When the electrostatic that the substrate clamped is generated by clamp assemblies Or magnetic clamping force when being clamped to support surface (such as when clamping substrate in vertical orientation in itself), the substrate clamped can It is sent in processing chamber housing.The substrate clamped can be coated in the processing chamber.
After coating, the substrate clamped is transmittable to leave processing chamber housing, and from support surface de-clamping and is removed.
During transmitting with coated substrates, transmission and phase coated substrates phase especially in the substantially vertical orientation of substrate Between, clamping zone continuous each other can electrically decouple, so that the short-circuit or other defect of the one of them of multiple clamping zones will not Remaining clamping zone is caused to fail.Preventing failure can improve.
Fig. 2 is the signal being configured to for executing the substrate carrier system 20 according to the method for embodiment described herein Figure.The embodiment of Fig. 2 is similar to above embodiment, so that can refer to above-mentioned explanation without repeating.
Illustratively referring to Fig. 2, according to can be with multiple embodiments in conjunction with any other embodiment described herein, base Plate carrier system 20 may include the clamp assemblies 30 of electrostatic, and the clamp assemblies 30 of electrostatic have the clamping of a total of three linear arrangement Region.Substrate carrier system 20 may include substrate carrier 21, and substrate carrier 21 has support surface 22, and support surface 22 is to prop up Support group plate 10, substrate 10 are painted with dashed rectangle.In some embodiments, the clamp assemblies that mask (not being painted) passes through electrostatic 30 are immobilizated in the top of substrate 10.Multiple clamping zones 32 may be provided in substrate carrier 21 or be arranged at substrate carrier 21, Such as it is arranged in the main body of substrate carrier.
At least one clamping zone of multiple clamping zones 32 is configured to redundancy clamping zone, the redundancy clamping zone It is configured to provide redundancy chucking power, so that in the case where at least one redundancy 31 existing defects of clamping zone (such as cause The case where short circuit for the chucking power failure (lapse) that at least one redundancy clamping zone provides or other defect), substrate passes through more The remaining clamping zone 33 of a clamping zone 32 is immobilizated in support surface.
At least one redundancy clamping zone 31 may include first electrode arrangement 41, and first electrode arrangement 41 can clamp From the electrically decoupling of the remaining electrode arrangement of remaining clamping zone 33 43 during the processing of substrate.Therefore, at least one redundancy clip The short circuit held in region 31 does not influence remaining clamping zone 33, and remaining clamping zone 33 still can act.
Can be in some embodiments in conjunction with other embodiments described herein, each folder of multiple clamping zones 32 Region includes first electrode 45 and second electrode 46, and wherein second electrode 46 can interlock with first electrode 45.First electrode 45 can It is connected to the first voltage end of an other electric power assembly 51, first voltage end is configured to apply first voltage (such as positive voltage) To first electrode, and second electrode 46 may connect to the second voltage end of an other electric power assembly 51, and second voltage end is through structure It makes to apply the second voltage (such as negative voltage) for being different from first voltage to second electrode.A other electric power assembly 51 can be distinguished It is configured to high voltage source, and can be charged and/or can be controlled by controller 55 by battery.
Can be in some embodiments in conjunction with other embodiments disclosed herein, controller 55 can be operable to Control signal is provided to electric power assembly 51, so that the voltage for being provided to clamping zone by electric power assembly can be adjusted individually.Citing For, voltage timing (voltage timing), voltage level and/or the voltage that can individually control the offer of electric power assembly 51 are bent Line.In some embodiments, (ramped up) may gradually increase by the voltage that electric power assembly provides, so that being used for electrostatic chuck The electrostatic chuck holding force for holding substrate 10 to support surface is incrementally increased, and is contacted in a manner of generating improperly particle to avoid substrate Support surface.Each clamping zone can be controlled independently of other clamping zones.In some embodiments, electrode arrangement can be with Sequence from center to edge or the sequence from edge to opposite edge are energized or are stepped up, in this way to be reduced or avoided Air pocket (air pockets) is trapped in the mode between substrate and support surface for substrate clamping to support surface, so as to improve The flatness of the substrate clamped.
A other electric power assembly 51 may be disposed on substrate carrier 21, so as to when substrate transports through vacuum flush system It is moveable together with substrate carrier 21.Therefore, during substrate processing, constantly power to the electrode arrangement of clamping zone It can be feasible, that is, electrode arrangement is constantly connected to supply voltage.In some cases, continued power may not be must It wants.For example, electrode arrangement is recharged in specified time interval can be it is enough, to ensure electrode arrangement Too many charge will not be lost with the time and/or there is to ensure electrode arrangement consistently the size and/or again suitable for substrate A certain number of charges of amount.For example, in some embodiments, clamping zone during substrate processing several minutes or It is recharged in the time interval of several seconds or in the time interval of even submicrosecond.In some embodiments, controller 55 passes through Construct recharging with Separation control clamping zone on schedule.
Fig. 3 is the signal being configured to for executing the substrate carrier system 20 according to the method for embodiment described herein Figure.The embodiment of Fig. 3 is similar to above embodiment, so that can refer to above-mentioned explanation without repeating.
Illustratively referring to Fig. 3, according to can be with multiple embodiments in conjunction with any other embodiment described herein, base Plate carrier system 20 may include the clamp assemblies 30 of electrostatic, and the clamp assemblies 30 of electrostatic have multiple clamping zones 32.Each clamping Region may include electrode arrangement, and electrode arrangement for example, at least has first electrode 45 and second electrode 46.In some embodiments In, the first electrode arrangement 41 of at least one redundancy clamping zone 31 can be from 43 electricity of remaining electrode arrangement of remaining clamping zone 33 Property decoupling.In some embodiments, each clamping zone of multiple clamping zones is electrically decoupled from remaining clamping zone, so that the The short circuit of one clamping zone does not damage the chucking power provided by remaining clamping zone.
In the embodiment being shown in Fig. 3, two or more clamping zones of multiple clamping zones 32, and especially It is all clamping zones, can be powered by identical electric power assembly (such as high voltage source)." power supply " used herein can be managed One or more voltage ends that solution is arranged for the electrode arrangement and electric power of clamping zone are electrically connected, so that charging or recharging Electrode arrangement.
In order to ensure electrically isolated between clamping zone, can successively power to clamping zone.That is, being supplied first In the electric stage, the first electrode arrangement 41 of at least one redundancy clamping zone 31 can be by utilizing first electricity of the closure of switching device 61 Electrical connection between pole arrangement 41 and electric power assembly 50 is powered.In the first power supply state, can only 41 be arranged to first electrode Power supply, and the remaining electrode arrangement 43 of remaining clamping zone 33 can be not connected to electric power assembly 50, such as disconnected using switching device 61 Open corresponding electrical connection.
In the second powering phase, the second electrode of the second clamping zone can be arranged and be powered, and first electrode arrangement 41 Electric power assembly 50 can be not connected to remaining electrode arrangement.Only the second clamping zone can be powered in the second powering phase.
By the way that other clamping zones of multiple clamping zones are successively connected to electric power assembly using switching device, power supply can Continue, in particular, wherein once only have one of clamping zone of multiple clamping zones to be electrically connected to electric power assembly, and phase The connection between remaining clamping zone and electric power assembly answered, which can disconnect, to be electrically connected.
In some embodiments, switching device 61 can be disposed at electric power assembly 50 and clamping zone electrode arrangement it Between.Electrically isolated between clamping zone can be ensured by control switching device, so that only one primary clamping zone quilt It is electrically connected to the voltage end of the electrification (live) of electric power assembly.
Switching device 61 can be configured to the switch with multiple switching positions, each toggle bit of plurality of switching position Setting can be configured to as a clamping zone power supply or power off, while the company of corresponding remaining clamping zone is disconnected from electric power assembly It connects.The quantity of switching position can correspond to the quantity of clamping zone.
Switching device 61 can be configured such that in each of multiple switching positions, the clamping zone of multiple clamping zones can It is electrically isolated from each other.
The electrode arrangement of clamping zone is electrically connected to one or more voltage ends of electric power assembly, clamping by being electrically connected Region can be powered to clamp substrate.By the one or more that the electrode arrangement of clamping zone is reconnected to electric power assembly Voltage end, clamping zone can be recharged with predetermined time interval.By the way that the electrode arrangement of clamping zone is connected to electric power group One or more voltage ends (such as by the way that electrode assembly to be grounded) of the offer different voltages of part, clamping zone can be powered down, Such as releasing substrate.
In some embodiments, clamping zone can be configured to bipolar clamping zone or multipole clamping zone, difference Including the electrode arrangement with first electrode 45 and second electrode 46.Electric power assembly 50 may include first voltage end 52 and the second electricity Pressure side 53, first voltage end 52 can successively can be connected to the first electrode 45 of electrode arrangement, and second voltage end 53 can successively connect It is connected to the second electrode 46 of electrode arrangement.First voltage end 52 can provide the voltage provided different from second voltage end 53.If It is clamped using bipolar electric, the voltage that the voltage that first voltage end 52 provides can be provided in contrast to second voltage end 53.
In the first powering phase being illustratively illustrated in Fig. 3, switching device 61 is arranged on the first switching position, The first electrode 45 of wherein at least one redundancy clamping zone 31 is connected to first voltage end 52, and at least one redundancy clamps The second electrode 46 in region 31 is connected to second voltage end 53.Meanwhile remaining clamping zone 33 can by switching device 61 with Electric power assembly 50 is disconnected and/or is disconnected from each other.At least one redundancy clamping zone 31 can individually be powered, recharge and/ Or power-off.The chucking power to be provided by least one redundancy clamping zone can be adjusted on demand.
In the second powering phase (not being painted), switching device 61 can be set to the second switching position, wherein only another The first electrode and second electrode of a clamping zone are respectively connected to first voltage end 52 and second voltage end 53, and remain accordingly Remaining clamping zone and electric power assembly 50 are electrically isolated.The chucking power to be provided by another clamping zone can be adjusted on demand.It can connect Be other powering phases for remaining clamping zone to be powered, recharges or powered off.
Therefore, multiple clamp areas can be connected in some embodiments in conjunction with other embodiments described herein Switching device 61 between domain 32 and electric power assembly 50 can be constructed to once by the selected clamping of multiple clamping zones 32 Region is connected to electric power assembly, selected clamping zone is powered or be powered off.For example, in the processing of the substrate clamped During the clamping substrate of period and during recharging electrode arrangement, it can be ensured that the continuous electrical property point between multiple clamping zones From.
Can be in some embodiments in conjunction with other embodiments described herein, switching device 61 may include that electromechanics is opened At least one of pass, relay, self-recovery fuse (resettable fuse), diode circuit, and/or transistor circuit.
In some embodiments, the controller 55 to control electric power assembly 50 and/or switching device 61 is provided, thus It is successively powered with predetermined power supply order to multiple clamping zones.In some embodiments, power supply order repeats secondary or more Repeatedly, to be recharged in specified time interval to charged clamping zone.For example, the electrode of clamping zone Arrangement may lose charge with the time, and can reconnect to voltage end by by electrode arrangement at preset time intervals To recharge.In some embodiments, constantly repeatedly power supply order.
Fig. 4 is the substrate carrier system 20 being configured to for executing any method according to embodiment described herein Schematic diagram.The embodiment of Fig. 4 can include some or all features of above embodiment in any combination, so that can refer to Explanation is stated without repeating.
Illustratively referring to Fig. 4, according to can with multiple embodiments in conjunction with other embodiments described herein, at least one A redundancy clamping zone 31 may include first electrode arrangement 41, and first electrode arrangement 41 has at least one electrode.At least one Electrode can be the voltage end that may connect to electric power assembly 50, for powering at least one electrode.In some embodiments, Electric power assembly 50 can be configured to for powering to each clamping zone of multiple clamping zones.
Can be in some embodiments in conjunction with other embodiments described herein, substrate carrier system 20 can be further included Circuit 65 is protected, protection circuit 65 is configured to for example during clamping, is only allowed in for electric position towards at least one electricity Electric current in the direction of pole.It is exemplified as during clamping, during transmission and/or during the processing of substrate that other have been clamped, It can be for stopping the electric current in the direction far from least one electrode, the direction such as court far from least one electrode in electric position To electric power assembly and/or towards remaining clamping zone.Therefore, because can for the electric current in electric position far from least one electrode Stopped by protection circuit 65, or even collapse of voltage in the one of them of remaining clamping zone or charge collapse can will not be extremely Charge is caused to decline in a few redundancy clamping zone.
For example, protection circuit 65 may include diode 67 or another semiconductor element, to be barred from a direction In electric charge stream and allow electric charge stream in other direction.
In some embodiments, the first electrode arrangement 41 of at least one redundancy clamping zone 31 can include at least first Electrode 45 and second electrode 46.During substrate processing, first electrode 45 may be provided on positive potential, and second electrode 46 can mention For on negative potential, or vice versa.For example, first electrode 45 can be that may connect to the first voltage end of electric power assembly 50 52 (such as provide positive voltages), and second electrode 46 can be that may connect to the second voltage end 53 of electric power assembly (such as to provide Corresponding negative voltage).
Protection circuit 65 can be configured to allowing the electric current towards first electrode 45 for electric position, and stop electric current from the The outflow of one electrode 45.For example, diode 67 may connect between first voltage end 52 and first electrode 45 so that when to Allow the electric current towards first electrode 45 when applying voltage (such as positive voltage) in front direction.Furthermore protect circuit 65 can be through structure Make in electric position allow towards second electrode 46 negative current, and stop far from second electrode 46 negative current.Citing For, diode 69 may connect between second voltage end 53 and second electrode 46, so that when applying voltage in backward directions When (such as negative voltage), allow the electric current towards second electrode 46.Therefore, second electrode 46 can fill on the contrary with first electrode 45 Electricity, while can avoid the electric discharge of positively charged first electrode and both electronegative second electrodes.
It can protect circuit 65 that can be configured to use in some embodiments in conjunction with other embodiments described herein In selectively allowing (such as power to electrode) towards the electric current in the direction of electrode, or (such as to electrode into Row power-off) far from electrode direction in electric current.It can provide switch 66 and be used to that the setting of circuit 65 will to be protected to for electric position In, it is described to allow from electric power assembly 50 for electric position towards the electric current in the direction of electrode, to power to electrode.For right For electrode is powered off, switch 66 can be set to de-energized, and the de-energized allows the electric current far from electrode.Citing comes It says, power-off diode 71 may connect between electrode and electric power assembly 50, and can be with 67 reversed arrangement of diode.
As shown in Figure 4, in some embodiments, each clamping zone of multiple clamping zones can be for can be by respective Protection circuit 65 is connected to electric power assembly 50.When the substrate holder clamped is in support surface, electric charge stream far from electrode or Electric current can be by protection circuit blocks.For for substrate carries out de-clamping, protection circuit be may be provided in de-energized, described De-energized allows electric charge stream or electric current far from electrode.
The embodiment of Fig. 4 selectively includes switching device 61.Switching device 61 is being represented in Fig. 4 as at stain, and It is constructed in more detailed manner according to the switching device 61 being illustrated in Fig. 3.
Switching device 61 may connect between electric power assembly 50 and multiple clamping zones 32, and can be constructed to once will The single selected clamping zone of multiple clamping zones 32 is connected to electric power assembly 50.
Switching device 61 can be constructed so that clamping zone is electrically separated from each other.For example, once only has a clamp area Domain can be that may connect to electric power assembly 50.
Electric power assembly 50 can be configured to high-voltage module, and the high-voltage module is configured to provide high voltage.High electricity Die block can be configured to electric pressure converter, and the electric pressure converter can provide the charge from Charge Source (such as battery).
Controller 55 can be configured to individually address clamping zone according to power supply order, to (i) add charge Be downloaded in the electrode arrangement of clamping zone, to by substrate clamping in support surface, the process phase of (ii) in the substrate clamped Between successively clamping zone is checked and/or is recharged and/or the electrode arrangement of (iii) unloading clamping zone, with from branch Support surface carries out de-clamping to substrate and removes.
In some embodiments, can simultaneously the multiple clamping zones of load or unload whole clamping zones.However, clamping It region can be in the substrate clamped by successively being recharged during the period of clamping arrangement fixing.
Fig. 5 is the schematic diagram according to the vacuum flush system with substrate carrier system 20 of embodiment described herein. Vacuum flush system includes being vacuum-treated chamber 101, and wherein apparatus for coating 102, which is arranged in, is vacuum-treated in chamber 101.Substrate carries System system 20 is configured to transmit substrate carrier 21 by being vacuum-treated chamber 101 by transmission device 103.During transmission, It is coated with the substrate 10 being immobilizated on the support surface 22 of substrate carrier 21 by multiple clamping zones.
Substrate carrier system 20 further includes the clamp assemblies 30 of electrostatic or magnetism, and electrostatic or magnetic clamp assemblies 30 include Multiple clamping zones 32.Each clamping zone includes electrode arrangement, and electrode arrangement is set in substrate carrier 21 and is configured to use In generate electrostatic or magnetic clamping force with by substrate holder in support surface 22, especially during the processing of the substrate clamped Substrate is held in vertical direction in itself.
At least one clamping zone can be configured to redundancy clamping zone, and redundancy clamping zone includes first electrode arrangement, First electrode is arranged electrically to be decoupled from the remaining electrode arrangement of remaining clamping zone.It can provide (such as the high voltage of electric power assembly 50 Source) for individually powering to clamping zone.In particular, in some embodiments, can successively recharge clamping zone.
Electric power assembly 50 can be controlled by controller 55 and may connect to Charge Source (such as battery 59).Electric power assembly 50 can be with Substrate carrier 21 is moved together by being vacuum-treated chamber 101, also to permit during transmitting substrate and/or during processing substrate Perhaps clamping zone recharges.
By clamp assemblies, mask 11 is selectively clamped to substrate 10, is sunk with will pass through apparatus for coating 102 on substrate Product predetermined material pattern.
Controller 55 can be configured to for controlling electric power assembly 50 and/or switching device 61, with suitable according to predetermined power supply Sequence is successively powered to multiple clamping zones 32.In some embodiments, power supply order can be suitable with same sequence or difference respectively Sequence repeats, recharged at preset time intervals to the electrode arrangement of clamping zone.
Fig. 6 is the flow chart according to the method for the processing substrate of embodiment described herein.In square 500, according to this Substrate and/or mask are clamped in substrate using multiple clamping zones of electrostatic or the clamp assemblies of magnetism by text any method The support surface of supporting element.In optional square 510, the substrate clamped is sent in processing chamber housing, especially in essence In upper vertical direction.Alternatively, the substrate clamped can be immobilizated in support surface in horizontal top direction in itself.Namely Say, substrate can be retained on towards towards ground in downward direction in substantially horizontally disposed support surface on.In square 520 In, when substrate selectively transports through apparatus for coating while being immobilizated in support surface, it is coated in the processing chamber The substrate of clamping.Optionally, mask can additionally be held on clamp assemblies.In the square 530 of selection, the substrate system clamped is passed It is sent from out processing chamber housing.In square 540, from support surface de-clamping and substrate is removed.
During transfer, during transmitting and/or during coating, there is short-circuit or another defect in redundancy clamping zone In situation, remaining clamping zone can maintain to work and provide to be enough substrate holder in the chucking power of support surface.
Fig. 7 is the flow chart according to the method for the processing substrate of embodiment described herein.In square 500, according to this Substrate and/or mask are held on substrate using multiple clamping zones of electrostatic or the clamp assemblies of magnetism by text any method The support surface of supporting element.Under the first background pressure (such as atmospheric pressure, especially in overflow (flooded) vacuum chamber In or vacuum chamber on the outside of), such as generate electrostatic chuck holding force by powering to the electrode arrangement of multiple clamping zones, substrate can Support surface is held in,.
That is, substrate can be placed on support surface, and clamp assemblies can be powered with (such as big in first pressure Atmospheric pressure) under establish chucking power.When do not need before by substrate clamping to support surface to vacuum chamber be vented when, processing speed Degree can increase.
In square 501, the vacuum chamber comprising the substrate clamped can be vented and be down to the second background pressure, and second Background pressure is lower than the first background pressure.Second background pressure can be the pressure lower than 100mbar, especially less than 10mbar's Pressure, the more in particular lower than pressure of 1mbar.That is, the surface clamped can bear the pressure drop of multiple 100mbar.Place Reason speed can increase, but there may be the risks of the movement of substrate and/or mask during exhaust.Furthermore such as in electrode cloth It sets when being provided with high voltage, there is the risk of one or more clamping zones failures or short circuit during exhaust.According to herein The embodiment, the substrate clamped can bear the change of ambient pressure, and the risk and entire clamping group that substrate is mobile The risk of part failure can be reduced.According to method described herein, one or more redundancy clamping area failures are allowed.
Fig. 8 is painted the flow chart of the method for the processing substrate according to multiple embodiments described herein.In square 500, Substrate and/or mask are held on base using multiple clamping zones of electrostatic or the clamp assemblies of magnetism according to methods described herein The support surface of plate support.In square 525, the redundancy chucking power of at least one redundancy clamping zone can be released from, so as to Allow the balance exercise between a part and clamp assemblies of substrate.For example, the son of the clamping zone of multiple clamping zones The chucking power of collection can be released temporarily, so as to the movement (such as expansion) for allowing substrate to cause relative to the heat of substrate carrier. For example, such as during deposition material on substrate, the chucking power of a part by temporarily releasing clamp assemblies, May as substrate caused by the different heat expansion coefficient of substrate and substrate carrier fluctuating (undulation), fluctuation (wave), Bending or other inhomogeneities can be reduced or eliminated.Remaining clamping zone can provide enough chucking powers, so that tolerable solution Except a part of entire chucking power.It can avoid the movement and position change of entire substrate.
In square 527, the redundancy chucking power of at least one redundancy clamping zone can be restored.It can continue processing substrate (example Such as the transmission or coating of substrate).
According to can with the embodiment in conjunction with any other embodiment described herein, provide it is a kind of handle substrate side Method.The method including the use of electrostatic or magnetism clamp assemblies 30 multiple clamping zones 32 by substrate and/or mask clamp to The support surface 22 of substrate carrier 21, at least one redundancy clamping zone 31 of plurality of clamping zone provide redundancy clamping Power, so that at least one of substrate and mask pass through multiple in the case where at least one redundancy clamps area failures or short circuit The remaining clamping zone 33 of clamping zone 32 is immobilizated in support surface 22.
According to can be with the embodiment in conjunction with any other embodiment described herein, each clamp area of multiple clamping zones Domain is configured to redundancy clamping zone, so that in the case where the failure of any one clamping zone of multiple clamping zones or short circuit, At least one of substrate and mask are immobilizated in support surface by the remaining clamping zone of multiple clamping zones.
According to can with multiple embodiments in conjunction with any other embodiment described herein, including multiple clamping zones 5% or more and 50% or less subset redundancy chucking power is provided so that in subset failure or in the case where short circuit, substrate and At least one of mask is immobilizated in support surface by the remaining clamping zone of multiple clamping zones.
According to can be with the embodiment in conjunction with any other embodiment described herein, each clamp area of multiple clamping zones Domain includes electrode arrangement, and the first electrode of wherein at least one redundancy clamping zone arranges the remaining electrode from remaining clamping zone Arrangement electrically decoupling.
According to can be with the embodiment in conjunction with any other embodiment described herein, at least one redundancy clamping zone benefit It is powered with a other electric power assembly, is powered in particular with high-voltage module.
According to can be with the embodiment in conjunction with any other embodiment described herein, each clamp area of multiple clamping zones Domain is powered by corresponding other electric power assembly 51, and especially wherein individual electric power assemblies are controlled by controller 55, controller 55 It can be the shared control unit for whole other electric power assemblies.
According to can be with the embodiment in conjunction with any other embodiment described herein, multiple clamping zones be by will be multiple Clamping zone is sequentially connected at least one voltage end of electric power assembly to power, and especially wherein once only has a clamp area Domain is connected at least one voltage end.
According to can be with the embodiment in conjunction with any other embodiment described herein, each clamp area of multiple clamping zones Domain includes first electrode 45 and second electrode 46, and second electrode 46 is interlocked with first electrode, and wherein first electrode is sequentially connected to The first voltage end of electric power assembly 50, first voltage end provides first voltage, and second electrode is sequentially connected to electric power assembly 50 second voltage end, second voltage end provide second voltage, and second voltage is different from first voltage.
It has been pressed from both sides according to transmission can be further included with the embodiment in conjunction with any other embodiment described herein, the method The substrate and/or mask held into processing chamber housing, be coated in the processing chamber the substrate clamped, the substrate that has clamped of transmission from Open processing chamber housing and from support surface de-clamping substrate.According to embodiment as described herein, the substrate that has clamped and/or The mask of clamping can also (such as under vacuum condition or atmospheric pressure) be transferred to separately in system memory from first substrate carrier One substrate carrier.
According to can be pressed from both sides in the first background pressure with the embodiment in conjunction with any other embodiment described herein, substrate It holds to support surface, especially clamps in atmospheric pressure to support surface, wherein the method can further include: will be comprising having clamped The vacuum chamber of substrate and/or mask is vented to the second background pressure, and the second background pressure is lower than the first background pressure.
According to can may include with the embodiment in conjunction with any other embodiment described herein, the method release at least one The redundancy chucking power of a redundancy clamping zone, the balance fortune between a part and clamping zone to allow substrate and/or mask It is dynamic, and restore the redundancy chucking power of at least one redundancy clamping zone.
According to other aspects of present disclosure, a kind of method for handling substrate is provided.This method is quiet including the use of first The clamping zone of multiple separations of the clamp assemblies of electric or magnetic by the first support surface of substrate clamping to first substrate carrier, At least one redundancy clamping zone of plurality of clamping zone provides redundancy chucking power, so that at least one redundancy clamp area In the case where domain failure or short circuit, substrate is immobilizated in the first support surface by the remaining clamping zone of multiple clamping zones；This Method further includes the substrate clamped by following steps transmission to the second substrate carrier: utilizing the clamping of the second electrostatic or magnetism Second clamping zone of multiple separations of component connects the second support surface of the substrate clamping clamped to the second substrate carrier Release the first clamp assemblies at least one redundancy clamping zone redundancy chucking power and release the first clamp assemblies it is multiple The chucking power of the remaining clamping zone of clamping zone, so that substrate is only held in the second substrate carrier.
According to can be provided a kind of to handle substrate with the embodiment in conjunction with any other embodiment described herein Substrate carrier system 20, comprising: substrate carrier 21 has support surface 22, to supporting substrate and/or mask and electrostatic or Magnetic clamp assemblies 30, have multiple clamping zones 32 at substrate carrier 21, plurality of clamping zone 32 at least one Redundancy clamping zone 31 is configured to provide redundancy chucking power, so that clamping the feelings of area failures or short circuit at least one redundancy In condition, substrate and/or mask are immobilizated in support surface 22 by the remaining clamping zone 33 of multiple clamping zones.
According to can be with the embodiment in conjunction with any other embodiment described herein, each clamp area of multiple clamping zones Domain may include electrode arrangement, and the first electrode of wherein at least one redundancy clamping zone arranges 41 residues from remaining clamping zone The electrically decoupling of electrode arrangement 43.
According to can be further included with the embodiment in conjunction with any other embodiment described herein, substrate carrier system: At least one electric power assembly 50 and is connected at least one electric power assembly 50 and multiple folders to power to multiple clamping zones At least one switching device between region 32 is held, wherein at least one switching device can be configured to multiple clamping zones 32 Clamping zone be connected to electric power assembly 50, selected clamping zone is powered or be powered off.
According to can with the embodiment in conjunction with any other embodiment described herein, switching device 61 can it is constructed to Single selected clamping zone is once connected to electric power assembly 50, so that clamping zone individually can be powered and/or be powered off.
According to can be opened with the embodiment in conjunction with any other embodiment described herein, switching device 61 including electromechanics At least one of pass, relay, self-recovery fuse (resettable fuse), diode circuit and transistor circuit.
According to control can be further included with the embodiment in conjunction with any other embodiment described herein, substrate carrier system Device 55 processed, controller 55 are configured to for controlling at least one electric power assembly 50 and/or at least one switching device, with according to Repeatable predetermined power supply order is successively powered to multiple clamping zones 32.
According to can be with the embodiment in conjunction with any other embodiment described herein, at least one redundancy clamping zone can Including at least one electrode, substrate carrier system 20 further includes protection circuit 65, and protection circuit 65 is configured to for electric position Electric charge stream in the middle direction for allowing towards the electric charge stream in the direction of at least one electrode and stopping at least one separate electrode.
In some embodiments, protection circuit 65 can be configured to allow in de-energized far from least one electrode Direction in electric charge stream.Can provide switch 66 can be used for from for electric position switch protecting circuit to de-energized, or vice versa ?.
In some embodiments, each clamping zone of multiple clamping zones can be by protecting circuit may connect to accordingly Electric power assembly.
According to can be with the embodiment in conjunction with any other embodiment described herein, at least one redundancy clamping zone can Including first electrode and second electrode, and substrate carrier system 20 may include protection circuit 65.In switch for protecting in electric position Protection circuit can be configured to allow the electric charge stream towards first electrode and in the direction far from second electrode, to first electrode It charges on the contrary with second electrode.In the de-energized of switch, protection circuit can be configured to allow far from first electrode Direction neutralize towards the electric charge stream in the direction of second electrode, to be powered off on the contrary to first electrode and second electrode.
This printed instructions discloses present disclosure, including optimal mode using multiple examples, and also leads this technology Those of ordinary skill in domain can implement the theme, including manufacture and use any device or system and execute any be incorporated to Method.Although various specific embodiments are disclosed above, the non-feature that do not repel of above embodiment can It is bonded to each other.The protection scope applied for a patent is defined in the patent claims, and if other examples do not have and claim When the different structural detail of the literal language of book, or if other examples include having non-reality with the literal language of claims When the equivalent structural elements of matter difference, these other examples are intended to be contained in the protection scope of claims.

Claims (15)

1. a kind of method for handling substrate (10), comprising:
Using electrostatic or the clamp assemblies (30) of magnetism multiple separations clamping zone (32) by the substrate and mask extremely Few one is clamped to support surface (22)；
Wherein the multiple clamping zone at least one redundancy clamping zone (31) provide redundancy chucking power so that it is described extremely In the case where few redundancy clamping area failures or short circuit, at least one of the substrate and the mask pass through the multiple The remaining clamping zone (33) of clamping zone (32) is immobilizated in the support surface (22).
2. according to the method described in claim 1, wherein each clamping zone of the multiple clamping zone (32) is constructed For redundancy clamping zone, so that in the case where the failure of any one clamping zone of the multiple clamping zone (32) or short circuit, At least one of the substrate and the mask are immobilizated in described by the remaining clamping zone of the multiple clamping zone (32) Support surface (22).
3. method according to claim 1 or 2, including the multiple clamping zone (32) 5% or more and 50% or less subset redundancy chucking power is provided so that in subset failure or in the case where short circuit, the substrate and institute At least one for stating mask is immobilizated in the support surface (22) by the remaining clamping zone of the multiple clamping zone (32).
4. method according to any one of claims 1 to 3, comprising:
At least one described redundancy clamping zone (31) is given to power using a other electric power assembly (51), in particular with a other Electric power assembly is powered to each clamping zone of the multiple clamping zone (32), wherein individual electric power assembly is by controlling Device (55) control processed.
5. method according to any one of claims 1 to 3, comprising:
It successively powers to the multiple clamping zone (32), especially by being successively connected to the multiple clamping zone (32) At least one voltage end of electric power assembly (50) successively powers to the multiple clamping zone (32), in particular, wherein primary One clamping zone of only the multiple clamping zone (32) is powered.
6. according to claim 1 to method described in any one of 5 items, wherein each clamping of the multiple clamping zone (32) Region includes first electrode (45) and second electrode (46), and the second electrode (46) and the first electrode (45) interlock, Described in first electrode be sequentially connected to the first voltage end (52) of electric power assembly (50), and the second electrode is sequentially connected In the second voltage end (53) of the electric power assembly (50), the first voltage end (52) provides first voltage, second electricity Pressure side (53) provides second voltage, and the second voltage is different from the first voltage.
7. method according to any one of claims 1 to 6, further includes:
The substrate clamped is transmitted into processing chamber housing；
The substrate clamped is coated in the processing chamber housing；
It transmits the substrate clamped and leaves the processing chamber housing；With
De-clamping is carried out to the substrate from the support surface.
8. method according to any one of claims 1 to 7, wherein the substrate is in the first background pressure, especially big Under atmospheric pressure, it is retained to the support surface, the method further includes:
Vacuum chamber comprising the substrate clamped is vented to the second background pressure, second background pressure is lower than institute State the first background pressure.
9. a kind of method for handling substrate, comprising:
The substrate clamping is extremely supported using the clamping zone (32) of multiple separations of electrostatic or the clamp assemblies (30) of magnetism Surface (22)；
Wherein at least one redundancy clamping zone (31) of the multiple clamping zone (32) provides redundancy chucking power, so that in institute In the case where stating at least one redundancy clamping area failures or short circuit, the substrate is pressed from both sides by the remaining of the multiple clamping zone It holds region and is immobilizated in the support surface (22)；
Release the redundancy chucking power of at least one redundancy clamping zone (31), with allow the substrate a part and Balance exercise between the clamp assemblies；With
Restore the redundancy chucking power of at least one redundancy clamping zone (31).
10. a kind of for handling the substrate carrier system (20) of substrate, the substrate carrier system includes:
Substrate carrier (21) has support surface (22), and the support surface (22) is to support the substrate；With
The clamp assemblies (30) of electrostatic or magnetism, the clamping zone (32) including multiple separations, the multiple clamping zone (32) It is set in the substrate carrier (21)；
Wherein at least one redundancy clamping zone (31) of the multiple clamping zone (32) is configured to provide redundancy chucking power, So that the substrate passes through the multiple clamping zone in the case where at least one described redundancy clamps area failures or short circuit (32) remaining clamping zone (33) is immobilizated in the support surface (22).
11. substrate carrier system according to claim 10, wherein each clamping of the multiple clamping zone (32) Region includes electrode arrangement, wherein the first electrode of at least one redundancy clamping zone (31) arranges (41) from the residue The remaining electrode arrangement (43) of clamping zone (33) electrically decouples.
12. substrate carrier system described in 0 or 11 according to claim 1, further includes:
At least one electric power assembly (50), to power to the multiple clamping zone (32)；With
At least one switching device (61) is connected at least one electric power assembly (50) and the multiple clamping zone (32) Between, wherein at least one described switching device (61) is constructed to once by a choosing of the multiple clamping zone (32) Fixed clamping zone is connected to the electric power assembly (50), to the selected clamping zone power supply.
13. substrate carrier system according to claim 12, wherein at least one described switching device (61) includes following At least one of: electric mechanical switch, relay, self-recovery fuse, diode circuit and transistor circuit.
14. substrate carrier system according to claim 12 or 13, further includes:
Controller (55) is configured to for controlling at least one described electric power assembly (50) and/or at least one described switching Device (61), successively to give the multiple clamping zone (32) to power according to duplicate predetermined power supply order.
15. substrate carrier system according to any one of claims 10 to 14, wherein at least one described redundancy clamp area Domain (31) includes at least one electrode, and the substrate carrier system (20) further includes protection circuit (65), the protection circuit (65) it is configured to for allowing in electric position towards the electric charge stream in the direction of at least one electrode and stopping far from institute The electric charge stream in the direction of at least one electrode is stated, and/or wherein the protection circuit (65) is configured in de-energized Allow the electric charge stream in the direction far from least one electrode.
CN201680086200.0A 2016-06-09 2016-06-09 Handle the method and substrate carrier system of substrate Pending CN109196422A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2016/063197 WO2017211422A1 (en) 2016-06-09 2016-06-09 Method of processing a substrate and substrate carrier system

Publications (1)

Publication Number Publication Date
CN109196422A true CN109196422A (en) 2019-01-11

Family

ID=56117720

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680086200.0A Pending CN109196422A (en) 2016-06-09 2016-06-09 Handle the method and substrate carrier system of substrate

Country Status (5)

Country Link
JP (1) JP2019520707A (en)
KR (1) KR20190015511A (en)
CN (1) CN109196422A (en)
TW (1) TWI677764B (en)
WO (1) WO2017211422A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5953200A (en) * 1998-02-05 1999-09-14 Vlsi Technology, Inc. Multiple pole electrostatic chuck with self healing mechanism for wafer clamping
US6055150A (en) * 1996-05-02 2000-04-25 Applied Materials, Inc. Multi-electrode electrostatic chuck having fuses in hollow cavities
US20030176079A1 (en) * 2002-03-12 2003-09-18 Michael Sogard Periodic clamping method and apparatus to reduce thermal stress in a wafer
KR20070091437A (en) * 2006-03-06 2007-09-11 주식회사 에이디피엔지니어링 Electrostatic chuck having bi-polar electrode pattern
CN103066000A (en) * 2011-10-19 2013-04-24 中芯国际集成电路制造(上海)有限公司 Wafer bearing device and method of wafer bearing
US20130100572A1 (en) * 2011-10-19 2013-04-25 Semiconductor Manufacturing International Corp. Apparatus and method for holding a wafer
WO2015042304A1 (en) * 2013-09-20 2015-03-26 Applied Materials, Inc. Substrate carrier with integrated electrostatic chuck

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6055150A (en) * 1996-05-02 2000-04-25 Applied Materials, Inc. Multi-electrode electrostatic chuck having fuses in hollow cavities
US5953200A (en) * 1998-02-05 1999-09-14 Vlsi Technology, Inc. Multiple pole electrostatic chuck with self healing mechanism for wafer clamping
US20030176079A1 (en) * 2002-03-12 2003-09-18 Michael Sogard Periodic clamping method and apparatus to reduce thermal stress in a wafer
KR20070091437A (en) * 2006-03-06 2007-09-11 주식회사 에이디피엔지니어링 Electrostatic chuck having bi-polar electrode pattern
CN103066000A (en) * 2011-10-19 2013-04-24 中芯国际集成电路制造(上海)有限公司 Wafer bearing device and method of wafer bearing
US20130100572A1 (en) * 2011-10-19 2013-04-25 Semiconductor Manufacturing International Corp. Apparatus and method for holding a wafer
WO2015042304A1 (en) * 2013-09-20 2015-03-26 Applied Materials, Inc. Substrate carrier with integrated electrostatic chuck

Also Published As

Publication number Publication date
JP2019520707A (en) 2019-07-18
TW201809897A (en) 2018-03-16
KR20190015511A (en) 2019-02-13
TWI677764B (en) 2019-11-21
WO2017211422A1 (en) 2017-12-14

Similar Documents

Publication Publication Date Title
US9463543B2 (en) Electromagnetic chuck for OLED mask chucking
US10153191B2 (en) Substrate carrier system and method for using the same
TWI664308B (en) Substrate carrier and proessing system and method for transporting substrate using the same
KR101001454B1 (en) Electrostatic Chuck and Manufacturing Device of Organic Light Emitting Diode Having the Same
JP4354983B2 (en) Substrate processing equipment
US10096509B2 (en) Substrate carrier system with protective covering
WO2018141366A1 (en) Substrate carrier and method of processing a substrate
US9959961B2 (en) Permanent magnetic chuck for OLED mask chucking
CN114762097A (en) Adsorption gripping device and object surface processing method
TWI684210B (en) Method of processing a substrate, substrate carrier for holding a substrate and corresponding deposition apparatus
CN109196422A (en) Handle the method and substrate carrier system of substrate
US9281227B2 (en) Multi-resistivity Johnsen-Rahbek electrostatic clamp
JP6670941B2 (en) Apparatus for holding a substrate used in a vacuum deposition process, a system for depositing a layer on a substrate, and a method for holding a substrate
CN113614282A (en) Processing system, carrier for transporting substrates in a processing system and method for transporting a carrier
CN106571328A (en) Substrate clamping method and substrate clamping system based electrical treatment
CN116805621A (en) Ceramic substrate, method of manufacturing the same, electrostatic chuck, substrate fixing device, and package for semiconductor device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20190111

RJ01 Rejection of invention patent application after publication