CN109166962B - 一种互补型磁性存储单元 - Google Patents
一种互补型磁性存储单元 Download PDFInfo
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- CN109166962B CN109166962B CN201810901797.0A CN201810901797A CN109166962B CN 109166962 B CN109166962 B CN 109166962B CN 201810901797 A CN201810901797 A CN 201810901797A CN 109166962 B CN109166962 B CN 109166962B
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- 230000005291 magnetic effect Effects 0.000 title claims abstract description 255
- 230000000295 complement effect Effects 0.000 title claims abstract description 55
- 239000010408 film Substances 0.000 claims abstract description 44
- 230000005290 antiferromagnetic effect Effects 0.000 claims abstract description 39
- 229910001385 heavy metal Inorganic materials 0.000 claims abstract description 32
- 239000010409 thin film Substances 0.000 claims abstract description 25
- 238000003860 storage Methods 0.000 claims abstract description 15
- 230000005294 ferromagnetic effect Effects 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 238000012546 transfer Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 13
- 230000005415 magnetization Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 2
- 230000007246 mechanism Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 25
- 239000010410 layer Substances 0.000 description 19
- 239000010949 copper Substances 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 229910052715 tantalum Inorganic materials 0.000 description 8
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 8
- 229910003321 CoFe Inorganic materials 0.000 description 7
- 229910019236 CoFeB Inorganic materials 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910019041 PtMn Inorganic materials 0.000 description 5
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 229910052707 ruthenium Inorganic materials 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- FQMNUIZEFUVPNU-UHFFFAOYSA-N cobalt iron Chemical compound [Fe].[Co].[Co] FQMNUIZEFUVPNU-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- SHMWNGFNWYELHA-UHFFFAOYSA-N iridium manganese Chemical compound [Mn].[Ir] SHMWNGFNWYELHA-UHFFFAOYSA-N 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- OQCGPOBCYAOYSD-UHFFFAOYSA-N cobalt palladium Chemical compound [Co].[Co].[Co].[Pd].[Pd] OQCGPOBCYAOYSD-UHFFFAOYSA-N 0.000 description 2
- 230000007850 degeneration Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000005641 tunneling Effects 0.000 description 2
- 229910020707 Co—Pt Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- AVMBSRQXOWNFTR-UHFFFAOYSA-N cobalt platinum Chemical compound [Pt][Co][Pt] AVMBSRQXOWNFTR-UHFFFAOYSA-N 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical group [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- IGOJMROYPFZEOR-UHFFFAOYSA-N manganese platinum Chemical compound [Mn].[Pt] IGOJMROYPFZEOR-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1673—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1659—Cell access
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/18—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using Hall-effect devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/225—Auxiliary circuits
- G11C11/2275—Writing or programming circuits or methods
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1693—Timing circuits or methods
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201810901797.0A CN109166962B (zh) | 2018-08-09 | 2018-08-09 | 一种互补型磁性存储单元 |
US16/162,174 US10910029B2 (en) | 2018-08-09 | 2018-10-16 | Complementary magnetic memory cell |
Applications Claiming Priority (1)
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CN201810901797.0A CN109166962B (zh) | 2018-08-09 | 2018-08-09 | 一种互补型磁性存储单元 |
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CN109166962A CN109166962A (zh) | 2019-01-08 |
CN109166962B true CN109166962B (zh) | 2020-10-20 |
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US (1) | US10910029B2 (zh) |
CN (1) | CN109166962B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110061127B (zh) * | 2019-05-20 | 2023-08-08 | 中国科学院微电子研究所 | 磁隧道结的形成方法及磁阻式随机存储器 |
US10916282B2 (en) * | 2019-06-20 | 2021-02-09 | International Business Machines Corporation | Control of switching trajectory in spin orbit torque devices by micromagnetic configuration |
CN110391331B (zh) * | 2019-07-05 | 2021-03-09 | 北京航空航天大学 | 一种磁性模数转换器 |
CN112928135B (zh) * | 2019-12-05 | 2023-04-07 | 浙江驰拓科技有限公司 | 磁性存储器及其制备方法 |
CN113451356B (zh) * | 2021-02-10 | 2022-12-20 | 北京航空航天大学 | 磁性随机存储单元、存储器及设备 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US7826259B2 (en) * | 2009-01-29 | 2010-11-02 | Seagate Technology Llc | Staggered STRAM cell |
JP2012069181A (ja) * | 2010-09-21 | 2012-04-05 | Toshiba Corp | 半導体記憶装置 |
US20140204661A1 (en) * | 2011-12-22 | 2014-07-24 | Brian S. Doyle | Memory with elements having two stacked magnetic tunneling junction (mtj) devices |
US8988923B2 (en) * | 2012-09-11 | 2015-03-24 | The Regents Of The University Of California | Nonvolatile magneto-electric random access memory circuit with burst writing and back-to-back reads |
CN104795489A (zh) * | 2015-04-20 | 2015-07-22 | 北京航空航天大学 | 一种新型的四端磁存储器件 |
CN106374034B (zh) * | 2016-09-05 | 2019-01-18 | 清华大学 | 一种可重构的磁逻辑器件及其制备方法 |
US10355204B2 (en) * | 2017-03-07 | 2019-07-16 | International Business Machines Corporation | Selective growth of seed layer for magneto-resistive random access memory |
JP6881148B2 (ja) * | 2017-08-10 | 2021-06-02 | Tdk株式会社 | 磁気メモリ |
CN107611255B (zh) * | 2017-09-11 | 2019-09-10 | 北京航空航天大学 | 一种高密度磁性存储器件 |
WO2019075171A1 (en) * | 2017-10-13 | 2019-04-18 | Everspin Technologies, Inc. | PERPENDICULAR MAGNETIC MEMORY USING A SPIN-ORBIT TORQUE |
-
2018
- 2018-08-09 CN CN201810901797.0A patent/CN109166962B/zh active Active
- 2018-10-16 US US16/162,174 patent/US10910029B2/en active Active
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CN109166962A (zh) | 2019-01-08 |
US20190051339A1 (en) | 2019-02-14 |
US10910029B2 (en) | 2021-02-02 |
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Effective date of registration: 20210309 Address after: 100191 rooms 504a and 504b, 5th floor, 23 Zhichun Road, Haidian District, Beijing Patentee after: Zhizhen storage (Beijing) Technology Co.,Ltd. Address before: 100191 No. 37, Haidian District, Beijing, Xueyuan Road Patentee before: BEIHANG University |
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Effective date of registration: 20231221 Address after: Room 1605, Building 1, No. 117 Yingshan Red Road, Huangdao District, Qingdao City, Shandong Province, 266400 Patentee after: Qingdao Haicun Microelectronics Co.,Ltd. Address before: 100191 rooms 504a and 504b, 5th floor, 23 Zhichun Road, Haidian District, Beijing Patentee before: Zhizhen storage (Beijing) Technology Co.,Ltd. |
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