CN109068478B - Flexible circuit board and display device - Google Patents
Flexible circuit board and display device Download PDFInfo
- Publication number
- CN109068478B CN109068478B CN201811294642.1A CN201811294642A CN109068478B CN 109068478 B CN109068478 B CN 109068478B CN 201811294642 A CN201811294642 A CN 201811294642A CN 109068478 B CN109068478 B CN 109068478B
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- circuit board
- flexible circuit
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- layer
- alignment marks
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- 239000000758 substrate Substances 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 62
- 239000012790 adhesive layer Substances 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 239000004642 Polyimide Substances 0.000 claims description 15
- 229920001721 polyimide Polymers 0.000 claims description 15
- 230000007480 spreading Effects 0.000 claims description 9
- 238000003892 spreading Methods 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 6
- 230000001502 supplementing effect Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 10
- 239000013589 supplement Substances 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The embodiment of the invention provides a flexible circuit board and a display device, relates to the technical field of display, and is low in cost because a light supplementing direction does not need to be changed and equipment does not need to be modified or new equipment does not need to be purchased even if a binding mode is changed when two flexible circuit boards are bound. The flexible circuit board includes: a substrate made of a light transmitting material; the functional pins and the first alignment marks are positioned on the first side of the substrate; the flexible circuit board comprises a first contraposition mark area, the first contraposition mark is positioned in the first contraposition mark area, and the functional pins are positioned outside the first contraposition mark area; and the film layers of the flexible circuit board in the first contraposition mark area except the first contraposition mark are all made of light-transmitting materials.
Description
Technical Field
The invention relates to the technical field of display, in particular to a flexible circuit board and a display device.
Background
In electronic devices, a Flexible Printed Circuit (FPC) is often used, for example, in a display device, which includes a display panel, a main board, and two FPCs (Flexible Printed circuits) bonded together, wherein one FPC is connected to the display panel and the other FPC is connected to the main board, so as to electrically connect the main board and the display panel.
When binding between two FPC and connecting, in order to guarantee that the effective electricity of pin on two FPC connects, need counterpoint, generally, set up the counterpoint mark on one of them FPC, set up corresponding printing opacity region on another FPC, however, this kind of counterpoint mode, required light filling direction is fixed, if binding mode in the production process changes, then need reform transform equipment or purchase new equipment with the cooperation bind required light filling direction in time, lead to the cost higher.
Disclosure of Invention
The embodiment of the invention provides a flexible circuit board and a display device, when two flexible circuit boards are bound, even if the binding mode is changed, the light supplementing direction does not need to be changed, equipment does not need to be modified or new equipment does not need to be purchased, and the cost is lower.
In one aspect, an embodiment of the present invention provides a flexible circuit board, including:
a substrate comprising a light transmissive material;
the functional pins and the first alignment marks are positioned on the first side of the substrate;
the flexible circuit board comprises a first contraposition mark area, the first contraposition mark is positioned in the first contraposition mark area, and the functional pins are positioned outside the first contraposition mark area;
and the film layers of the flexible circuit board in the first contraposition mark area except the first contraposition mark are all made of light-transmitting materials.
Optionally, the film layer of the flexible circuit board on the second side of the substrate is made of a light-transmitting material.
Optionally, the flexible circuit board further includes:
the first adhesive layer is positioned on the film layer where the functional pins are positioned and far away from one side of the substrate;
the first polyimide layer is positioned on one side, far away from the substrate, of the first adhesive layer and is adhered to the film layer where the functional pins are positioned through the first adhesive layer;
the second adhesive layer is positioned on the second side of the substrate;
and the second polyimide layer is positioned on one side of the second adhesive layer far away from the substrate and is adhered to the substrate through the second adhesive layer.
Optionally, the flexible circuit board further includes:
the copper spreading layer is positioned on the second side of the substrate and is hollow in the first alignment mark area;
and in the direction perpendicular to the plane of the flexible circuit board, the copper laying layer covers the functional pins.
Optionally, the flexible circuit board further includes:
the first adhesive layer is positioned on the film layer where the functional pins are positioned and far away from one side of the substrate;
the first polyimide layer is positioned on one side, far away from the substrate, of the first adhesive layer and is adhered to the film layer where the functional pins are positioned through the first adhesive layer;
the second adhesive layer is positioned on one side, far away from the substrate, of the copper spreading layer;
and the second polyimide layer is positioned on one side of the second adhesive layer far away from the substrate and is adhered to the copper spreading layer through the second adhesive layer.
Optionally, the first alignment mark and the functional pin are disposed on the same layer, and the shape and size of the first alignment mark and the functional pin are the same.
Optionally, the number of the functional pins is multiple, the number of the first alignment marks is two, the multiple functional pins and two first alignment marks are arranged in a row, and the two first alignment marks are respectively located on two opposite sides of the multiple functional pins.
Optionally, the flexible circuit board further includes:
and the copper laying layer covers the second alignment mark in the direction vertical to the plane of the flexible circuit board.
Optionally, the second alignment mark is one or more test pins.
Optionally, the number of the functional pins is multiple, the number of the first alignment marks is two, the number of the second alignment marks is two, and the multiple functional pins, the two first alignment marks, and the two second alignment marks are arranged in a row;
the two first alignment marks are respectively located on two opposite sides of the plurality of functional pins, the two second alignment marks are respectively located on two opposite sides of the plurality of functional pins, and the two second alignment marks are located between the two first alignment marks.
On the other hand, an embodiment of the present invention further provides a display device, including:
the flexible printed circuit board comprises a first flexible printed circuit board and a second flexible printed circuit board, wherein the first flexible printed circuit board is the flexible printed circuit board, and the first flexible printed circuit board is bound and connected with the second flexible printed circuit board;
a display panel, one of the first flexible circuit board and the second flexible circuit board being connected with the display panel.
In the flexible circuit board and the display device in the embodiment of the invention, the film layers of the flexible circuit board except the first alignment mark are all made of light-transmitting materials in the first alignment mark area where the first alignment mark is located, so that when the flexible circuit board is bonded with other flexible circuit boards, no matter which side of the flexible circuit board the light rays are emitted from, the light rays can pass through the first alignment mark area, and the light supplementing function when the alignment is carried out through the first alignment mark is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the cross-section of FIG. 1 taken along direction AA';
FIG. 3 is a schematic view of another cross-sectional structure along direction AA' in FIG. 1;
FIG. 4 is a schematic structural diagram of another flexible circuit board according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of another flexible printed circuit board according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view along direction BB' in FIG. 5;
fig. 7 is a schematic structural diagram of a display device according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
As shown in fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a flexible circuit board in an embodiment of the present invention, and fig. 2 is a schematic structural diagram of a circumferential cross section along direction AA' in fig. 1, an embodiment of the present invention provides a flexible circuit board, including: a substrate 1, the substrate 1 comprising a light transmissive material; a functional pin 2 and a first alignment mark 31 located on a first side (upper side of the substrate 1 in fig. 2) of the substrate 1; the flexible circuit board comprises a first contraposition mark area 41, wherein the first contraposition mark 31 is positioned in the first contraposition mark area 41, and the functional pin 2 is positioned outside the first contraposition mark area 41; the film layers of the flexible circuit board in the first alignment mark region 41 except the first alignment mark 31 are all made of light-transmitting materials.
Specifically, the functional pins 2 are used for realizing electrical connection with the outside, and may be realized by copper metal, the functional pins 2 are exposed on the upper side of the substrate 1 so as to be electrically connected with other external pins, and the electrical connection is used for realizing electrical connection of a certain normal function, and the first alignment mark 31 is formed by a light-tight material and has a characteristic shape, such as a cross shape in fig. 1, so as to be used as an alignment mark. The first alignment mark region 41 is a region where the first alignment mark 31 is located, the area of the first alignment mark region 41 is larger than that of the first alignment mark 31, only the first alignment mark 31 is made of a non-light-transmitting material in the first alignment mark region 41, and other film layers are made of light-transmitting materials, so that light can pass through the region except the first alignment mark 31 in the first alignment mark region 41, and light supplement is realized when the flexible circuit board is bonded with other flexible circuit boards. In the embodiment of the present invention, the specific shape of the first alignment mark is not limited, and may be, for example, a cross shape, a "T" shape, a circular shape, and the like.
In the flexible circuit board in the embodiment of the invention, in the first alignment mark area where the first alignment mark is located, the film layers except the first alignment mark are made of the light-transmitting materials, so that when the flexible circuit board is bound with other flexible circuit boards, no matter which side of the flexible circuit board the light rays are emitted from, the light rays can pass through the first alignment mark area, and the light supplementing function when the first alignment mark is used for alignment is realized.
Optionally, as shown in fig. 1 and fig. 2, the film layers of the flexible circuit board on the second side of the substrate 1 (the lower side of the substrate 1 in fig. 2) are all made of light-transmitting materials. That is, on whole flexible circuit board, function pin 2 below does not have the copper layer of spreading, when binding counterpoint equipment and carrying out the light filling to this flexible circuit board, no matter carry out the light filling from the top or carry out the light filling from the below, all can normally look over first counterpoint mark 31.
Optionally, as shown in fig. 1 and fig. 2, the flexible circuit board further includes: the first adhesive layer 51 is positioned on the film layer where the functional pins 2 are positioned and far away from the substrate 1; the first polyimide layer 61 is positioned on one side of the first adhesive layer 51, which is far away from the substrate 1, the first polyimide layer 61 is adhered to the film layer where the functional pins 2 are positioned and the substrate 1 through the first adhesive layer 51, and hollow areas are arranged on the first polyimide layer 61 and the first adhesive layer 51, so that the functional pins 2 are exposed and the external electrical connection is realized; a second glue layer 52 on a second side of the substrate 1 (the lower side of the substrate 1 in fig. 2); and the second polyimide layer 62 is positioned on the side, far away from the substrate 1, of the second adhesive layer 52, and the second polyimide layer 62 is adhered to the substrate 1 through the second adhesive layer 52.
Optionally, as shown in fig. 1 and fig. 3, fig. 3 is another schematic cross-sectional structure in the direction of AA' in fig. 1, and the flexible circuit board further includes: the copper spreading layer 7 is positioned on the second side (the lower side of the substrate 1 in the figure 3) of the substrate 1, and the copper spreading layer 7 is hollow in the first alignment mark region 41; in a direction perpendicular to the plane of the flexible circuit board, a copper-clad layer 7 covers the functional pins 2. The copper laying layer 7 in the embodiment of the invention is a film layer laid with metal copper, and can be used for playing a role in conducting electricity and enhancing the structural strength of the flexible circuit board, and certainly, the copper laying layer 7 does not play a role in conducting electricity and only uses the metal copper to enhance the structural strength of the flexible circuit board.
Specifically, spread copper layer 7 and cover function pin 2, so that the regional structural strength in reinforcing function pin 2 place, thereby when binding, make function pin 2 have better pressfitting effect, improve function pin 2's electric connection performance promptly, spread copper layer 7 and be the fretwork in first counterpoint mark region 41, when binding counterpoint equipment and carrying out the light filling to this flexible circuit board, no matter carry out the light filling from the top or carry out the light filling from the below, all can normally look over first counterpoint mark 31 through first counterpoint mark region 41.
Optionally, as shown in fig. 1 and 3, the flexible circuit board further includes: the first adhesive layer 51 is positioned on the film layer where the functional pins 2 are positioned and far away from the substrate 1; the first polyimide layer 61 is positioned on the first adhesive layer 51 and far away from the substrate 1, and the first polyimide layer 61 is adhered to the film layer where the functional pins 2 are positioned and the substrate 1 through the first adhesive layer 51; the second adhesive layer 52 is positioned on the copper laying layer 7 at the side far away from the substrate 1; and the second polyimide layer 62 is positioned on the side, far away from the substrate 1, of the second adhesive layer 52, and the second polyimide layer 62 is adhered to the copper laying layer 7 through the second adhesive layer 52.
Optionally, as shown in fig. 4, fig. 4 is a schematic structural diagram of another flexible circuit board in an embodiment of the present invention, the first alignment mark 31 and the functional pin 2 are disposed on the same layer, and the shape and size of the first alignment mark 31 and the functional pin 2 are the same, that is, the first alignment mark 31 is used as a dummy pin, although the dummy pin does not have a pin function, because the shape, size and position of the dummy pin are the same as those of the functional pin 2, the dummy pin and the functional pin 2 can be formed through the same patterning process, so that the process cost is saved.
Alternatively, as shown in fig. 4, the number of the functional pins 2 is plural, the number of the first pair of bit marks 31 is two, the plural functional pins 2 and the two first pair of bit marks 31 are arranged in a row, and the two first pair of bit marks 31 are respectively located at two opposite sides of the plural functional pins 2.
Specifically, the effect of first counterpoint mark 31 makes functional pin 2 on the flexible circuit board can with the accurate counterpoint of external pin, guarantee functional pin 2's effective electricity and connect, thereby realize stable signal transmission, consequently, when functional pin 2 arranges to the one side, in order to realize counterpointing through first counterpoint mark 31 more accurately, can set up first counterpoint mark 31 respectively in this relative both sides on the row functional pin 2 array orientation, like this, counterpoint through the first counterpoint mark 31 that the relative both sides of one row functional pin 2 set up, can improve this row functional pin 2's counterpoint accuracy.
Optionally, as shown in fig. 5 and fig. 6, fig. 5 is a schematic structural diagram of another flexible circuit board in an embodiment of the present invention, fig. 6 is a schematic structural diagram of a cross section in a direction BB' of fig. 5, where the flexible circuit board further includes: the second alignment mark 32 on the first side of the substrate 1 (the upper side of the substrate 1 in fig. 6) is covered by the copper-clad layer 7 in the direction perpendicular to the plane of the flexible circuit board, and the second alignment mark 32 is covered by the copper-clad layer.
Specifically, copper is spread at the back of second counterpoint mark 32, can counterpoint according to second counterpoint mark 32 through the mode of downside light filling, in addition, copper is not spread at the back of first counterpoint mark 31, be in first counterpoint mark region 41 except that first counterpoint mark 31 be the printing opacity rete promptly, can counterpoint according to first counterpoint mark 31 through the mode of downside light filling or upside light filling, through increasing first counterpoint mark 31 that can both sides light filling, even if the mode of binding changes, also need not to change the light filling direction, need not to reform transform equipment or purchase new equipment, and the cost is lower.
Optionally, as shown in fig. 5 and fig. 6, the second alignment mark 32 is one or more test pins, and the second alignment mark 32 is a normal alignment mark with copper laid on the back surface, so that the second alignment mark 32 can be reused as a test pin, and because the copper laid on the back surface has a strong structural strength, reliability when the test pin is electrically connected with an external pin during testing can be ensured.
Alternatively, as shown in fig. 5 and 6, the number of the functional pins 2 is plural, the number of the first alignment marks 31 is two, the number of the second alignment marks 32 is two, and the plural functional pins 2, the two first alignment marks 31, and the two second alignment marks 32 are arranged in a row; the two first alignment marks 31 are respectively located at two opposite sides of the plurality of functional pins 2, the two second alignment marks 32 are respectively located at two opposite sides of the plurality of functional pins 2, and the two second alignment marks 32 are located between the two first alignment marks 31.
Specifically, the second alignment mark 32 is closer to the functional pin 2, so that the back surface of the functional pin is plated with copper, the structural strength of the functional pin 2 can be further enhanced, and the functional pin 2 has a better pressing effect when being bound; the distance between the first alignment mark 31 and the functional pin 2 is far away, so copper is not laid on the back surface of the first alignment mark, namely, the first alignment mark region 41 is a light-transmitting film layer except the first alignment mark 31, alignment can be performed according to the first alignment mark 31 in a mode of lower side light supplement or upper side light supplement, the first alignment mark 31 capable of realizing both sides light supplement is added, even if the binding mode is changed, the light supplement direction does not need to be changed, equipment does not need to be modified or new equipment needs to be purchased, and the cost is low.
As shown in fig. 7, fig. 7 is a schematic structural diagram of a display device in an embodiment of the present invention, and an embodiment of the present invention further provides a display device, including: a first flexible circuit board 101 and a second flexible circuit board 102, where the first flexible circuit board 101 is a flexible circuit board in the above embodiment, and the first flexible circuit board 101 and the second flexible circuit board 102 are bound and connected; one of the display panel 100, the first flexible circuit board 101, and the second flexible circuit board 102 is connected to the display panel 100.
The display device can be any electronic equipment with a display function, such as a mobile phone, a tablet computer, a notebook computer, an electronic paper book or a television.
The display device provided by the embodiment of the invention is provided with the flexible circuit board, and the film layers of the flexible circuit board except the first alignment mark are all made of light-transmitting materials in the first alignment mark area where the first alignment mark is located, so that when the flexible circuit board is bound with other flexible circuit boards, no matter which side of the flexible circuit board the light rays are emitted from, the light rays can penetrate through the first alignment mark area, and the light supplementing function when the first alignment mark is used for carrying out alignment is realized.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. A flexible circuit board, comprising:
a substrate comprising a light transmissive material;
the functional pins and the first alignment marks are positioned on the first side of the substrate;
the flexible circuit board comprises a first contraposition mark area, the first contraposition mark is positioned in the first contraposition mark area, and the functional pins are positioned outside the first contraposition mark area;
the film layers of the flexible circuit board in the first alignment mark area except the first alignment mark are all made of light-transmitting materials;
the flexible circuit board further includes:
the copper spreading layer is positioned on the second side of the substrate and is hollow in the first alignment mark area;
in the direction perpendicular to the plane of the flexible circuit board, the copper laying layer covers the functional pins;
and the copper laying layer covers the second alignment mark in the direction vertical to the plane of the flexible circuit board.
2. The flexible circuit board of claim 1, further comprising:
the first adhesive layer is positioned on the film layer where the functional pins are positioned and far away from one side of the substrate;
the first polyimide layer is positioned on one side, far away from the substrate, of the first adhesive layer and is adhered to the film layer where the functional pins are positioned through the first adhesive layer;
the second adhesive layer is positioned on one side, far away from the substrate, of the copper spreading layer;
and the second polyimide layer is positioned on one side of the second adhesive layer far away from the substrate and is adhered to the copper spreading layer through the second adhesive layer.
3. The flexible circuit board of claim 1,
the first alignment mark and the functional pin are arranged on the same layer, and the shape and the size of the first alignment mark are the same as those of the functional pin.
4. The flexible circuit board of claim 3,
the number of the functional pins is multiple, the number of the first alignment marks is two, the functional pins and the two first alignment marks are arranged in a row, and the two first alignment marks are respectively located on two opposite sides of the functional pins.
5. The flexible circuit board of claim 1,
the second alignment mark is one or more test pins.
6. The flexible circuit board of claim 1,
the number of the functional pins is multiple, the number of the first alignment marks is two, the number of the second alignment marks is two, and the multiple functional pins, the two first alignment marks and the two second alignment marks are arranged in a row;
the two first alignment marks are respectively located on two opposite sides of the plurality of functional pins, the two second alignment marks are respectively located on two opposite sides of the plurality of functional pins, and the two second alignment marks are located between the two first alignment marks.
7. A display device, comprising:
a first flexible circuit board and a second flexible circuit board, wherein the first flexible circuit board is the flexible circuit board of any one of claims 1 to 6, and the first flexible circuit board and the second flexible circuit board are connected in a binding manner;
a display panel, one of the first flexible circuit board and the second flexible circuit board being connected with the display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811294642.1A CN109068478B (en) | 2018-11-01 | 2018-11-01 | Flexible circuit board and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811294642.1A CN109068478B (en) | 2018-11-01 | 2018-11-01 | Flexible circuit board and display device |
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| Publication Number | Publication Date |
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| CN109068478A CN109068478A (en) | 2018-12-21 |
| CN109068478B true CN109068478B (en) | 2020-04-07 |
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| CN201811294642.1A Active CN109068478B (en) | 2018-11-01 | 2018-11-01 | Flexible circuit board and display device |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110061037A (en) | 2019-04-25 | 2019-07-26 | 京东方科技集团股份有限公司 | Flexible base board and display device |
| CN110286535B (en) * | 2019-06-20 | 2021-08-31 | 上海天马微电子有限公司 | Display module, manufacturing method of display module and display device |
| CN110687729B (en) * | 2019-09-30 | 2022-06-10 | 上海天马微电子有限公司 | Display module and display device |
| CN110930866B (en) * | 2019-11-26 | 2021-07-06 | Tcl华星光电技术有限公司 | Chip on film and display device |
| TWI796550B (en) * | 2020-02-26 | 2023-03-21 | 頎邦科技股份有限公司 | Flexible circuit board |
| CN113380865A (en) * | 2021-06-07 | 2021-09-10 | 京东方科技集团股份有限公司 | Display device |
| CN113421909B (en) * | 2021-06-24 | 2023-01-24 | 云谷（固安）科技有限公司 | Display panel and display device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209581A (en) * | 1997-01-24 | 1998-08-07 | Seiko Epson Corp | Printed wiring board, liquid crystal display and electronic apparatus |
| JP2005340641A (en) * | 2004-05-28 | 2005-12-08 | Nippon Mektron Ltd | Flexible circuit board |
| JP2006235503A (en) * | 2005-02-28 | 2006-09-07 | Optrex Corp | Display device |
| CN105578718B (en) * | 2015-12-29 | 2018-09-04 | 广东欧珀移动通信有限公司 | Flexible PCB, circuit connection structure and mobile terminal |
| CN206470723U (en) * | 2017-02-28 | 2017-09-05 | 上海天马微电子有限公司 | Display panel and display device |
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