CN109049889B - Novel composite polymer floor - Google Patents

Novel composite polymer floor Download PDF

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Publication number
CN109049889B
CN109049889B CN201810709817.4A CN201810709817A CN109049889B CN 109049889 B CN109049889 B CN 109049889B CN 201810709817 A CN201810709817 A CN 201810709817A CN 109049889 B CN109049889 B CN 109049889B
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parts
pouring
electronic grade
bamboo
template
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CN109049889A (en
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刘仕宽
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Xingren County Xiangwu New Energy Saving Building Material Co ltd
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Xingren County Xiangwu New Energy Saving Building Material Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/02—Layer formed of wires, e.g. mesh
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/02—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising animal or vegetable substances, e.g. cork, bamboo, starch
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10—Homopolymers or copolymers of propene
    • C09J123/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/04—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C09J127/06—Homopolymers or copolymers of vinyl chloride
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/554—Wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/73—Hydrophobic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2419/00—Buildings or parts thereof
    • B32B2419/04—Tiles for floors or walls
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224—Magnesium hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3009—Sulfides

Abstract

The invention discloses a novel composite polymer floor which comprises a pouring body, a plurality of steel wire meshes, bamboo boards and water sealing glue, wherein the pouring body is internally poured with a plurality of layers of vertically arranged steel wire meshes, the upper surface and the lower surface of the pouring body are the bamboo boards, and the pouring body and the peripheries of the bamboo boards are all sealed with the water sealing glue. The manufacturing steps mainly comprise: 1, preparing glue solution; 2, preparing a mixture; 3, adding the electronic-grade glass fiber filaments or the electronic-grade basalt fiber filaments into the glue solution, heating and melting, and then adding the mixture to melt into a pouring liquid; 4, pouring the molten liquid to form a pouring body; 5, pressing the bamboo wood board and the casting body into a composite material; 7 spraying water sealant on the composite material. The invention has the advantages that the mechanical properties of the invention are better than the traditional PC board in all aspects, the fireproof performance is better, and the thermal expansion rate is low.

Description

Novel composite polymer floor
Technical Field
The invention relates to the technical field of polymer building materials, in particular to a novel composite polymer floor.
Background
With the development of polymer technology, polymer materials are gradually used in building materials or other related fields, and plastics as polymer synthetic materials gradually become a novel material in the building material market due to the characteristics of rich principle, easy manufacture, low cost, high specific strength, acid and alkali resistance and the like. However, many of the existing floors are pure bamboo boards, which consume wood materials, but have low rigidity and strength and low hardness, so the existing floors are easy to wear, have poor heat resistance and are easy to generate thermal expansion.
Disclosure of Invention
The invention aims to provide a novel composite polymer floor with good mechanical property, high strength and large peel strength and a manufacturing method thereof.
The technical scheme of the invention is as follows:
the utility model provides a novel compound polymer floor, is including watering body, a plurality of wire net, bamboo plank and water-stop adhesive, pour the wire net that a plurality of layers of vertical arrangement in watering the body, be the bamboo plank watering the body from top to bottom, it all encapsulates water-stop adhesive all around to water to build the body and bamboo plank.
Further, the casting body comprises the following components in parts by weight: 50-60 parts of epoxy resin or phenolic resin, 1-2 parts of latent electronic grade cyanamide, 0.05-0.085 part of dimethyl imidazole, 20-40 parts of dimethyl formamide, 65-80 parts of polyvinyl chloride or polypropylene or polyamide, 10-20 parts of electronic grade glass fiber filaments or electronic grade basalt fiber filaments, 5-20 parts of magnesium hydroxide or aluminum hydroxide, 2-4 parts of molybdenum disulfide and 2-5 parts of coupling agent.
Further, the casting body comprises the following components in parts by weight: 56 parts of phenolic resin, 1.5 parts of latent electronic grade cyanamide, 0.07 part of dimethyl imidazole, 30 parts of dimethyl formamide, 70 parts of polyamide, 15 parts of electronic grade basalt fiber filament, 10 parts of magnesium hydroxide, 3 parts of molybdenum disulfide and 4 parts of coupling agent.
The invention also provides a method for manufacturing the novel composite polymer floor, which comprises the following process steps:
(1) mixing epoxy resin or phenolic resin with latent electronic grade cyanamide, dimethyl imidazole and dimethyl formamide to prepare a glue solution;
(2) mixing and stirring polyvinyl chloride or polypropylene or polyamide, magnesium hydroxide or aluminum hydroxide, molybdenum disulfide and a coupling agent uniformly to prepare a mixture for later use;
(3) adding electronic grade glass fiber filaments or electronic grade basalt fiber filaments into the glue solution, heating to 185-230 ℃, adding the mixture after the mixture is molten, and continuously keeping the temperature for 10-15min to form molten pouring liquid;
(4) erecting a plurality of layers of steel wire meshes in the template at intervals in the vertical direction, pouring the molten pouring liquid into the template, keeping the temperature of the template at 160-180 ℃, and cooling the template to 50-70 ℃ after 5-10min to form a pouring body;
(5) taking two bamboo boards which are matched with the template in size, treating one surface of each bamboo board into a rough culture surface, and coating an acrylic acid adhesive;
(6) respectively attaching one surface of the bamboo board treated in the step 5 to the upper surface and the lower surface of the casting body, then feeding the bamboo board into a superposed press, pressing the bamboo board at the temperature of 100 ℃ and 150 ℃, and then preserving the heat for 50-80min at the temperature of 150 ℃ and 160 ℃ to form a composite material;
(7) and spraying water sealant on four sides of the composite material after the composite material is cooled.
Furthermore, the surfaces of the casting bodies in the step 6 are treated by adopting an acrylic resin retanning agent.
The invention has the advantages that:
according to the invention, a plurality of layers of reinforced steel wire meshes distributed at intervals in the vertical direction are poured in the casting body, and the temperature of the template is still kept at 160-180 ℃ after molten casting liquid is poured into the template in the manufacturing process, and the reinforced steel wire meshes are naturally cooled after 5-10min, so that the reinforced steel wire meshes can be fully fused in the casting body in the process, air bubbles possibly generated in the molten casting liquid can be removed, the connection strength between the reinforced steel wire meshes and the casting body is increased, and tensile stress can be generated between the interior of the casting body and the steel wire meshes under the effect of cold shrinkage after cooling, so that the steel wire mesh casting structure has strong connection strength and toughness, and the compression resistance and the bending resistance are greatly improved.
The composite board is prepared by melting a mixture in a glue solution, then melting the mixture into a pouring liquid, wherein polyvinyl chloride or polypropylene or polyamide and epoxy resin or phenolic resin are macromolecular compounds, gaps on the surface of the molecular layer are large, talcum powder, wollastonite and the like are added, and latent electronic grade cyanamide is added, so that the physical forms of particles of the polyvinyl chloride or polypropylene or polyamide and the epoxy resin or phenolic resin are in an ultrafine state, the particles are generally dispersed and embedded among macromolecular chains of raw materials under a sub-nanometer state, the synergistic effect of physical properties is realized, the adhesion is enhanced on the surface of the molecular layer, and the wear resistance of the composite board is improved.
The glue solution is prepared by mixing epoxy resin or phenolic resin with latent electronic grade cyanamide, dimethyl imidazole and dimethyl formamide, then adding electronic grade glass fiber filaments or electronic grade basalt fiber filaments into the glue solution, heating to 185-plus-one 230 ℃, then adding the mixture for melting, wherein the strength and the wear resistance of the electronic grade glass fiber filaments or electronic grade basalt fiber filaments can be improved, and the glue solution can increase the bonding strength between the composite materials, so that the strength and the wear resistance of the composite materials are improved, the thermal expansion coefficient is small, and the performance is stable.
The surface of the casting body is treated by adopting an acrylic resin retanning agent, one surface of the bamboo board is treated into a blank surface and then is attached to the upper surface and the lower surface of the casting body and then is sent into a superposed press for pressing at the temperature of 100 plus materials and 150 ℃, and the temperature is kept for 50-80min at the temperature of 150 plus materials and 160 ℃ after pressing to form a composite material, so that the peeling strength between the bamboo board and the casting body can be enhanced, and the waterproof performance of the invention can be further improved by spraying water sealant on the four sides of the composite material after the composite material is cooled.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of a-a cross-sectional structure in fig. 1.
In the figure: 1-casting body, 2-steel wire mesh, 3-bamboo board and 4-water sealant.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
As shown in fig. 1-2:
example 1:
the following cast materials were prepared: 50 parts of epoxy resin or phenolic resin, 1 part of latent electronic grade cyanamide, 0.085 part of dimethyl imidazole, 40 parts of dimethyl formamide, 65 parts of polyvinyl chloride, 10 parts of electronic grade glass fiber, 20 parts of magnesium hydroxide, 4 parts of molybdenum disulfide and 2 parts of coupling agent.
The manufacturing process comprises the following steps:
(1) mixing epoxy resin with latent electronic grade cyanamide, dimethyl imidazole and dimethyl formamide to prepare a glue solution;
(2) uniformly mixing and stirring polyvinyl chloride, magnesium hydroxide, molybdenum disulfide and a coupling agent to prepare a mixture for later use;
(3) adding electronic-grade glass fiber yarns into the glue solution, heating to 185 ℃, adding the mixture after the mixture is molten, and continuously keeping the temperature for 10-15min to form molten pouring liquid;
(4) erecting a plurality of layers of steel wire meshes in the template at intervals in the vertical direction, pouring the molten pouring liquid into the template, keeping the temperature of the template at 160 ℃, and cooling the template to 60 ℃ after 5-10min to form a pouring body;
(5) taking two bamboo boards which are matched with the template in size, treating one surface of each bamboo board into a rough culture surface, and coating an acrylic acid adhesive;
(6) treating the surfaces of the pouring bodies with an acrylic resin retanning agent, respectively attaching one surface of the bamboo board treated in the step 5 to the upper surface and the lower surface of the pouring bodies, then feeding the bamboo board into a superposed press, pressing at 120 ℃, and preserving heat for 50-80min at 155 ℃ after pressing to form a composite material;
(7) and spraying water sealant on four sides of the composite material after the composite material is cooled.
Example 2:
the following cast materials were prepared: 60 parts of epoxy resin or phenolic resin, 2 parts of latent electronic grade cyanamide, 0.05 part of dimethyl imidazole, 20 parts of dimethyl formamide, 80 parts of polypropylene, 20 parts of electronic grade basalt fiber filament, 5 parts of aluminum hydroxide, 2 parts of molybdenum disulfide and 5 parts of coupling agent.
The manufacturing process comprises the following steps:
(1) mixing epoxy resin with latent electronic grade cyanamide, dimethyl imidazole and dimethyl formamide to prepare a glue solution;
(2) mixing and stirring polypropylene, aluminum hydroxide, molybdenum disulfide and a coupling agent uniformly to prepare a mixture for later use;
(3) adding electronic grade basalt fiber filaments into the glue solution, heating to 200 ℃, adding the mixture after the mixture is molten, and continuously keeping the temperature for 10-15min to form molten pouring liquid;
(4) erecting a plurality of layers of steel wire meshes in the template at intervals in the vertical direction, pouring molten pouring liquid into the template, keeping the temperature of the template at 170 ℃, and cooling the template to 50 ℃ after 5-10min to form a pouring body;
(5) taking two bamboo boards which are matched with the template in size, treating one surface of each bamboo board into a rough culture surface, and coating an acrylic acid adhesive;
(6) treating the surfaces of the pouring bodies with an acrylic resin retanning agent, respectively attaching one surface of the bamboo board treated in the step 5 to the upper surface and the lower surface of the pouring bodies, then feeding the bamboo board into a superposed press, pressing at 130 ℃, and preserving heat for 50-80min at 160 ℃ after pressing to form a composite material;
(7) and spraying water sealant on four sides of the composite material after the composite material is cooled.
Example 3:
the following cast materials were prepared: 56 parts of phenolic resin, 1.5 parts of latent electronic grade cyanamide, 0.07 part of dimethyl imidazole, 30 parts of dimethyl formamide, 70 parts of polyamide, 15 parts of electronic grade basalt fiber filament, 10 parts of magnesium hydroxide, 3 parts of molybdenum disulfide and 4 parts of coupling agent.
The manufacturing process comprises the following steps:
(1) mixing phenolic resin with latent electronic grade cyanamide, dimethyl imidazole and dimethyl formamide to prepare a glue solution;
(2) mixing and stirring polyamide, magnesium hydroxide, molybdenum disulfide and a coupling agent uniformly to prepare a mixture for later use;
(3) adding the electronic grade basalt fiber filaments into the glue solution, heating to 230 ℃, adding the mixture after the mixture is molten, and continuously keeping the temperature for 10-15min to form molten pouring liquid;
(4) erecting a plurality of layers of steel wire meshes in the template at intervals in the vertical direction, pouring molten pouring liquid into the template, keeping the temperature of the template at 180 ℃, and cooling the template to 70 ℃ after 5-10min to form a pouring body;
(5) taking two bamboo boards which are matched with the template in size, treating one surface of each bamboo board into a rough culture surface, and coating an acrylic acid adhesive;
(6) respectively attaching one surface of the bamboo board treated in the step 5 to the upper surface and the lower surface of the casting body, then feeding the bamboo board into a superposed press, pressing the bamboo board at 140 ℃, and preserving heat for 50-80min at 150 ℃ after pressing to form a composite material;
(7) and spraying water sealant on four sides of the composite material after the composite material is cooled.
Process parameters and experimental data thereof:
table 1 (composite process parameters of the laminating press in each embodiment)
Example 1 Example 2 Example 3
Surface treatment of acrylic resin retanning agent Treatment of Treatment of Untreated
Sizing amount of acrylic acid adhesive 45 50 55
Pressing temperature of 120 130 140
Rolling pressure kgf/cm2 8 6 7.5
Rolling speed rmp 600 650 700
TABLE 2 (relevant test data (refer to GBT1767))
Figure GDA0002421481560000041
From the above data, it can be analyzed that, compared with the conventional PC board on the market, the mechanical properties of the present invention are superior to those of the conventional PC board in all aspects, the fireproof performance is better, and the thermal expansion rate is low. After surface treatment with an acrylic resin retanning agent, a slight improvement in mechanical properties was obtained over untreated ones.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.

Claims (4)

1. The utility model provides a novel compound polymer floor, is including watering body (1), a plurality of wire net (2), bamboo plank (3) and water sealed glue (4), its characterized in that: a plurality of layers of vertically arranged steel wire meshes (2) are poured in the pouring body (1), bamboo boards (3) are arranged on the upper surface and the lower surface of the pouring body (1), and water sealants (4) are respectively sealed on the peripheries of the pouring body (1) and the bamboo boards (3);
the casting body (1) comprises the following components in parts by weight: 50-60 parts of epoxy resin or phenolic resin, 1-2 parts of latent electronic grade cyanamide, 0.05-0.085 part of dimethyl imidazole, 20-40 parts of dimethyl formamide, 65-80 parts of polyvinyl chloride or polypropylene or polyamide, 10-20 parts of electronic grade glass fiber filaments or electronic grade basalt fiber filaments, 5-20 parts of magnesium hydroxide or aluminum hydroxide, 2-4 parts of molybdenum disulfide and 2-5 parts of coupling agent.
2. The novel composite polymer floor as claimed in claim 1, wherein the casting body (1) is composed of the following components in parts by weight: 56 parts of phenolic resin, 1.5 parts of latent electronic grade cyanamide, 0.07 part of dimethyl imidazole, 30 parts of dimethyl formamide, 70 parts of polyamide, 15 parts of electronic grade basalt fiber filament, 10 parts of magnesium hydroxide, 3 parts of molybdenum disulfide and 4 parts of coupling agent.
3. A method for manufacturing the novel composite polymer floor board as claimed in claim 1, which comprises the following process steps:
(1) mixing epoxy resin or phenolic resin with latent electronic grade cyanamide, dimethyl imidazole and dimethyl formamide to prepare a glue solution;
(2) mixing and stirring polyvinyl chloride or polypropylene or polyamide, magnesium hydroxide or aluminum hydroxide, molybdenum disulfide and a coupling agent uniformly to prepare a mixture for later use;
(3) adding electronic grade glass fiber filaments or electronic grade basalt fiber filaments into the glue solution, heating to 185-230 ℃, adding the mixture after the mixture is molten, and continuously keeping the temperature for 10-15min to form molten pouring liquid;
(4) erecting a plurality of layers of steel wire meshes in the template at intervals in the vertical direction, pouring the molten pouring liquid into the template, keeping the temperature of the template at 160-180 ℃, and cooling the template to 50-70 ℃ after 5-10min to form a pouring body;
(5) taking two bamboo boards which are matched with the template in size, treating one surface of each bamboo board into a rough culture surface, and coating an acrylic acid adhesive;
(6) respectively attaching one surface of the bamboo board treated in the step 5 to the upper surface and the lower surface of the casting body, then feeding the bamboo board into a superposed press, pressing the bamboo board at the temperature of 100 ℃ and 150 ℃, and then preserving the heat for 50-80min at the temperature of 150 ℃ and 160 ℃ to form a composite material;
(7) and spraying water sealant on four sides of the composite material after the composite material is cooled.
4. The method for manufacturing a novel composite polymer floor as claimed in claim 3, wherein: and (6) treating the surfaces of the casting bodies by adopting an acrylic resin retanning agent.
CN201810709817.4A 2018-07-02 2018-07-02 Novel composite polymer floor Active CN109049889B (en)

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US20070059507A1 (en) * 2005-09-13 2007-03-15 Linlin Xing Fiber mat and process for making same
CN201180365Y (en) * 2008-02-03 2009-01-14 杭州大庄地板有限公司 Composite cushion floor
CN201424795Y (en) * 2009-06-08 2010-03-17 江苏爱富希新型建材有限公司 Silicate overhead movable floor
CN102179981B (en) * 2011-03-28 2013-05-15 浙江华正新材料股份有限公司 Wear-resisting high-molecular composite material
US9434136B1 (en) * 2015-06-17 2016-09-06 Monte Phillip Dauer Dauer board
CN107129656A (en) * 2017-06-28 2017-09-05 徐州市玛泰生物科技有限公司 A kind of wear resistant type plastic floor
CN108117692A (en) * 2017-12-26 2018-06-05 东莞磐汩新材料有限公司 A kind of composite high-molecular plastic building template and preparation method thereof

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