CN109041516A - A kind of big data server of high efficiency and heat radiation - Google Patents
A kind of big data server of high efficiency and heat radiation Download PDFInfo
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- CN109041516A CN109041516A CN201810776180.0A CN201810776180A CN109041516A CN 109041516 A CN109041516 A CN 109041516A CN 201810776180 A CN201810776180 A CN 201810776180A CN 109041516 A CN109041516 A CN 109041516A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/202—Air convective hinge
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- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
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- Thermistors And Varistors (AREA)
Abstract
This application involves a kind of big data servers of high efficiency and heat radiation, including shell (2), the front of shell (2) is provided with door (1), at least three partitions (5) are provided in shell (2), partition (5) is horizontally disposed to be divided into multi-layer cavity for shell (2) interior space, temperature sensor (4) are provided in each layer of cavity, temperature sensor (4) is connect with the input terminal of singlechip controller (7), and the output end of singlechip controller (7) is connected with warning device;The temperature sensor (4) is that one kind is based on NTC thermo-sensitive material, is used for pyrometric temperature sensor, the temperature sensor includes thermistor substrate (10), which is a kind of core-shell structure, NTC thermal sensitive ceramic material based on Fe-Ca-Ce-Ti-W-O;Specifically, nuclear structure is CaWO4‑0.3Fe2(WO4)3‑0.2CeTi2O6, shell structure SiO2。
Description
Technical field
This application involves network server technical field more particularly to a kind of big data servers of high efficiency and heat radiation.
Background technique
Big data refers to the data that can not be captured, managed and be handled with conventional software tool within certain time
Set is magnanimity, the Gao Zeng for needing new tupe that could have stronger decision edge, see clearly discovery power and process optimization ability
Long rate and diversified information assets.
Since operand is huge, the fever of processor is serious, and data volume is huge in addition needs to install many hard disks, big data
Server would generally generate a large amount of heat at runtime.Existing big data server is usually dissipated in the form of installing exhaust fan
The shortcomings that heat, this mode is that structure is too simple, usually occurs heat dissipation dead angle in server, leads to the excessively high damage of local temperature
Server.
Summary of the invention
The present invention is intended to provide a kind of big data server of high efficiency and heat radiation, set forth above to solve the problems, such as.
A kind of big data server of high efficiency and heat radiation, including shell (2), shell (2) are provided in the embodiment of the present invention
Front be provided with door (1), is provided at least three partitions (5) in shell (2), partition (5) is horizontally disposed will be empty in shell (2)
Between be divided into multi-layer cavity, partition (5) arrangement that intermeshes keeps the clearance position communicated between two layers of cavity mutual in vertical direction
It is staggered;Air inlet fan (3) is provided in the cavity of top layer, the air inlet fan (3) is set on shell (2) back side;It is undermost
It is provided in cavity exhaust fan (8), the exhaust fan (8) is set on the back side of shell (2);It is provided with outside the shell (2)
One singlechip controller (7) is provided with temperature sensor (4) in each layer of cavity, temperature sensor (4) and single-chip microcontroller control
The input terminal of device (7) processed connects, and the output end of singlechip controller (7) is connected with warning device;The temperature sensor (4)
For one kind based on NTC thermo-sensitive material, for pyrometric temperature sensor, which includes thermistor substrate
(10), which is a kind of core-shell structure, NTC thermal sensitive ceramic material based on Fe-Ca-Ce-Ti-W-O;
Specifically, nuclear structure is CaWO4-0.3Fe2(WO4)3-0.2CeTi2O6, shell structure SiO2。
The technical solution that the embodiment of the present invention provides can include the following benefits:
1. the gap that is communicated between multi-layer cavity and cavity formed can supplied gas flowing curved channel.Cooling air is curved
Flowing can come into full contact with the heat generating components being arranged on flow path in meander is dynamic, to provide good cooling effect, disappear
Except the dead angle of heat dissipation, the excessively high damage to server of local temperature is avoided.
Make flowing of the cooling air in bending flowing unobstructed 2. air inlet fan, auxiliary blower and exhaust fan is arranged, heat dissipation
High efficient and reliable.
3. temperature sensor, warning device and wireless launcher is arranged, intelligent temperature can be provided for big data server
Degree monitoring and warning function.
The additional aspect of the application and advantage will be set forth in part in the description, and will partially become from the following description
It obtains obviously, or recognized by the practice of the application.It should be understood that above general description and following detailed description are only
Be it is exemplary and explanatory, the application can not be limited.
Detailed description of the invention
The present invention will be further described with reference to the accompanying drawings, but the embodiment in attached drawing is not constituted to any limit of the invention
System, for those of ordinary skill in the art, without creative efforts, can also obtain according to the following drawings
Other attached drawings.
Fig. 1 is the structural schematic diagram of big data server of the present invention;
Fig. 2 is the structural schematic diagram of temperature sensor described in the embodiment of the present invention.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistented with the present invention.On the contrary, they be only with it is such as appended
The example of device and method being described in detail in claims, some aspects of the invention are consistent.
Embodiment 1
Embodiments herein is related to a kind of big data server of high efficiency and heat radiation, including shell 2, and the front of shell 2 is set
It is equipped with door 1, there are five partitions 5 for setting in shell 2.Partition 5 includes three partition I51 and two partition II52, partition I51 and shell
The back side of body 2 and side connect and between door 1 there are gap, and partition II52 is connect with the side of shell 2, and and shell
It is provided between the front plan of door 1 and does not interspace on 2, there are gaps between partition II52 and the back side of shell 2.Three partitions
I51 and two partition II52 horizontal parallel, which is arranged, is divided into multi-layer cavity, three partition I51 and two partitions for space in shell 2
II52 intermeshes arrangement, mutually staggers the clearance position communicated between two layers of cavity in vertical direction.The cavity of top layer
It is inside provided with air inlet fan 3, air inlet fan 3 is set on 2 back side of shell;Exhaust fan 8, exhaust fan 8 are provided in undermost cavity
It is set on the back side of shell 2;Auxiliary blower 6 is provided in gap between partition II52 and the back side of shell 2.Big data clothes
The heat generating components such as the processor and hard disk of business device are mounted on partition.
When big data server works, air inlet fan 3 is blown into cooling air into cavity, and cooling air is in multi-layer cavity and chamber
It is flowed in the curved runner that the gap communicated between body is formed, auxiliary blower can provide additional driving force in flow process.
Sufficient heat exchange occurs with the heat generating components being arranged on multi-layer cavity internal partition in cooling air flowing, takes away big data clothes
The heat that business device operation generates, finally excludes from exhaust fan 8.This radiating mode is avoided by reasonable space and runner design
Heat dissipation dead angle.
Embodiment 2
A kind of big data server of high efficiency and heat radiation, including shell 2, the front of shell 2 are provided with door 1, setting in shell 2
There are three partitions 5.Three partitions 5 include the back side and side of two partition I51 and a partition II52, partition I51 and shell 2
Connect and between door 1 there are gap, partition II52 is connect with the side of shell 2, and be provided with door 1 on shell 2
It does not interspace between front plan, there are gaps between partition II52 and the back side of shell 2.Two partition I51 and a partition
Space in shell 2 is divided into multi-layer cavity by the setting of II52 horizontal parallel, and two partition I51 and a partition II52 intermesh row
Column, mutually stagger the clearance position communicated between two layers of cavity in vertical direction.Air inlet fan is provided in the cavity of top layer
3, air inlet fan 3 is set on 2 back side of shell;Exhaust fan 8 is provided in undermost cavity, exhaust fan 8 is set to the back of shell 2
On face;Auxiliary blower 6 is provided in gap between partition II52 and the back side of shell 2.The processor of big data server and
The heat generating components such as hard disk are mounted on partition.It is provided with a singlechip controller 7 outside shell 2, is respectively provided in each layer of cavity
There is temperature sensor 4, temperature sensor 4 is connect with the input terminal of singlechip controller 7, and the output end of singlechip controller 7 connects
It is connected to warning device.The output end of singlechip controller 7 is also connected with a wireless signal transmitting device.
The radiation processes of embodiment 2 are same as Example 1, unlike, temperature sensor 4 is additionally provided with to each layer
The temperature of chamber is monitored, if temperature is more than safe working temperature, temperature sensor 4 can send a signal to singlechip controller
7, singlechip controller 7 receive signal after can control warning device alarm and make wireless signal transmitting device to remote terminal sending
Alarm signal.
In embodiment 2, the temperature sensor 4 is that one kind is passed based on NTC thermo-sensitive material, for pyrometric temperature
Sensor, in conjunction with Fig. 2, which includes thermistor substrate 10, which is rectangle, in rectangle temperature-sensitive
Conducting wire A20 and conducting wire B30 are respectively welded in the opposing sides of resistance substrate 10, that is, conducting wire A20 is welded on thermistor substrate
On 10 first surface 101, conducting wire B30 is welded on the second surface 102 of thermistor substrate 10, to realize conducting wire A20
The thermistor substrate 10 is clamped with conducting wire B30, is externally provided with encapsulated layer in thermistor substrate 10 and conducting wire A20, conducting wire B30
40, which is glass glaze encapsulated layer, and main component is magnesia;Conducting wire A20 and conducting wire B30 selects Dumet wire to lead
Line.
Temperature sensor is the core component in temperature measuring instrument, can experience the temperature of measured medium and by its
It is converted into available output signal, to realize that temperature measures.In field of temperature measurement, thermo-sensitive material is in temperature sensor
Core, extremely sensitive to temperature change, the more thermo-sensitive material of application includes PTC thermo-sensitive material and NTC thermo-sensitive material at present.
NTC thermo-sensitive material is a kind of sensitive material of negative temperature coefficient, and with quick response, at low cost, small in size, sensitivity is high etc.
Advantage, however, current NTC thermo-sensitive material is not suitable for high temperature measurement.In terms of encapsulation, traditional epoxy is substituted with glass glaze
Resin substitutes traditional copper wire with Dumet silk thread, carries out sealed knot at high temperature.Due to Dumet wire and glass-glazed leakproofness, make
For the temperature sensor made of the present invention after boiling water boiling 1000 hours, electrical property is unchanged.It has great practical value.Its
In, the package length of above-mentioned encapsulated layer 40 is determined according to temperature sensor needs.
In the application, in terms of welding, conducting wire A and conducting wire B are by ultrasonic welding, gold ball bonding and silver paste slugging
A kind of realize.40 thickness of encapsulated layer can be 2000~5000 μm;The diameter of conducting wire A and conducting wire B can be 100~500 μ
m。
In the present invention, in terms of thermistor substrate, the thermistor substrate be a kind of core-shell structure, be based on Fe-Ca-
The NTC thermal sensitive ceramic material of Ce-Ti-W-O;Specifically, nuclear structure is CaWO4-0.3Fe2(WO4)3-0.2CeTi2O6, shell structure
For SiO2.In the prior art, the demand sensor that can be worked under the high temperature conditions is increased, however, traditional spinelle shape
NTC thermistor material due on A and the position B under high temperature transition-metal ions can reset, high temperature ageing characteristic is serious, unsuitable
300 degree or more of temperature measurement;In technical scheme, the creative Fe-Ca-Ce-Ti-W-O system using core-shell structure
NTC thermal sensitive ceramic material, shell structure are specially SiO2, can play a role in conjunction with internal nuclear structure, improve temperature-sensitive
The resistivity-temperature characteristics of resistance substrate at high temperature, have obtained unexpected technical effect.In addition, by using core-shell structure temperature-sensitive
Ceramic material effectively reduces the thickness of thermistor substrate, so that temperature sensor has ultra-thin effect, expands using model
It encloses.
The SiO2It is prepared using hydro-thermal method.
With SiO2Coat nuclear structure CaWO4-0.3Fe2(WO4)3-0.2CeTi2O6, the NTC effect of material can be significantly improved
It answers, unexpected technical results have been achieved.
The CaWO4-0.3Fe2(WO4)3-0.2CeTi2O6It is by CaCO3、CeO2、TiO2、WO3、Fe2O3Powder is mixed through ball milling
Conjunction pre-burning, is again formed after ball milling, preferred 2-5 μm of partial size.In terms of thermistor substrate, the base of nuclear structure creativeness
The NTC effect of material is improved, unexpected technology is achieved by doping in Fe-Ca-Ce-Ti-W-O series ceramic material
Effect.
The thermistor substrate 10 with a thickness of 100~200 μm, length can be 450~500 μm, width can for 300~
350μm.Due to using above-mentioned thermal sensitive ceramic material, which compares conventional substrate and greatly reduces, play
Ultra-thin technical effect.
It the following is the preparation step of herein described thermistor substrate:
Wherein, primary raw material such as the following table 1 that the above process is used
The primary raw material that table 1 uses
Raw material | Purity grade | Manufacturer |
CaCO3 | Analyze pure (99.0%) | Shanghai traditional Chinese medicines reagent |
CeO2 | Analyze pure (99.0%) | Shanghai traditional Chinese medicines reagent |
TiO2 | Analyze pure (99.5%) | Shanghai traditional Chinese medicines reagent |
WO3 | Analyze pure (99.0%) | Shanghai traditional Chinese medicines reagent |
Fe2O3 | Analyze pure (99.0%) | Shanghai traditional Chinese medicines reagent |
Step 1 follows above-mentioned stoichiometric ratio and weighs CaCO3、CeO2、TiO2、WO3、Fe2O3Powder is with wet ball-milling
Powder is uniformly mixed and makes powder refining, and the mass ratio for controlling powder and zirconium ball is 1:3, and the mass ratio with deionized water is 1:2,
Ball-milling Time is 10h, and revolving speed is 350 revs/min, slurry obtained by ball milling is put into drying box, in 90 DEG C of drying 10h, drying
Powder afterwards is in 1158 DEG C of pre-burning 3h;Then second of ball milling and drying are carried out again, and method is identical as first time;Second of ball milling
Afterwards, screening partial size is 2-5 μm, obtains powder E;
Above-mentioned powder E is added in ethanol solution by step 2, then suitable H is added in ultrasonic agitation2O is added
Suitable ethyl orthosilicate dehydrated alcohol mixed liquor is finally slowly added dropwise ammonium hydroxide and adjusts pH, and ultrasonic disperse stirs again, is added few
Citric acid modification surface is measured, is filtered, washing is dried to obtain core-shell structure SiO2/ powder E;
Step 3 prepares thermistor substrate: by the above-mentioned SiO prepared2The PVA that 6wt.% is incorporated as in/powder E makees
Binder is pressed into rectangle under 180Mpa pressure;Sintering, sintering process are as follows: 580 DEG C are warming up to the rate of 2 DEG C/min,
580 DEG C of heat preservation 1h, are warming up to 670 DEG C with the rate of 3 DEG C/min, in 670 DEG C of heat preservation 3h, are warming up to the rate of 4 DEG C/min
It 1310 DEG C, in 1310 DEG C of heat preservation 6h, then cools to room temperature, obtains the thermistor substrate.
After measured, the thermistor substrate that the application obtains is 2.66 × 10 in 25 DEG C of resistivity7Ω m, 800 DEG C
Resistivity is 149 Ω m;There is preferable NTC performance at high temperature;High-temperature stability: thermistor substrate is tested 500
DEG C heat preservation aging 200h before and after resistivity variation, find it by 3.87 × 106Ω m changes to 3.98 × 106Ω m becomes
Rate is 2.8%, and high-temperature stability is preferable.
The foregoing is merely preferred modes of the invention, are not intended to limit the invention, all in spirit and original of the invention
Within then, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of big data server of high efficiency and heat radiation, including shell (2), the front of shell (2) are provided with door (1), feature
It is: is provided at least three partitions (5) in shell (2), partition (5) is horizontally disposed is divided into multilayer chamber for shell (2) interior space
Body, partition (5), which intermeshes to arrange, mutually staggers the clearance position communicated between two layers of cavity in vertical direction;Top layer
Air inlet fan (3) is provided in cavity, the air inlet fan (3) is set on shell (2) back side;The row of being provided in undermost cavity
Fan (8), the exhaust fan (8) are set on the back side of shell (2);A single-chip microcontroller control is provided with outside the shell (2)
Device (7) is provided with temperature sensor (4) in each layer of cavity, the input of temperature sensor (4) and singlechip controller (7)
End connection, the output end of singlechip controller (7) are connected with warning device;The temperature sensor (4) is a kind of based on NTC
Thermo-sensitive material is used for pyrometric temperature sensor, which includes thermistor substrate (10), the thermistor
Substrate (10) is a kind of core-shell structure, NTC thermal sensitive ceramic material based on Fe-Ca-Ce-Ti-W-O;Specifically, nuclear structure is
CaWO4-0.3Fe2(WO4)3-0.2CeTi2O6, shell structure SiO2。
2. a kind of big data server of high efficiency and heat radiation according to claim 1, which is characterized in that partition (5) packet
Include partition I (51) and partition II (52), partition I (51) connect with the back side of shell (2) and side and between door (1) there are
Gap, partition II (52) connect with the side of shell (2) and do not interspace between door (1), partition II (52) and shell (2)
The back side between there are gaps.
3. a kind of big data server of high efficiency and heat radiation according to claim 2, which is characterized in that partition II (52) and shell
Auxiliary blower (6) are provided in gap between the back side of body (2).
4. a kind of big data server of high efficiency and heat radiation according to claim 1, which is characterized in that the thermistor substrate
(10) it is rectangle, conducting wire A (20) and conducting wire B (30) is respectively welded in the opposing sides of rectangle thermistor substrate (10),
That is, conducting wire A (20) is welded on the first surface (101) of thermistor substrate (10), conducting wire B (30) is welded on thermistor base
On the second surface (102) of piece (10), thus realize conducting wire A (20 and conducting wire B (30) clamps the thermistor substrate (10),
Thermistor substrate (10) and conducting wire A (20, (30 are externally provided with encapsulated layer (40) to conducting wire B, which is glass glaze envelope
Layer is filled, main component is magnesia;Conducting wire A (20) and conducting wire B (30) selects Dumet wire conducting wire.
5. a kind of big data server of high efficiency and heat radiation according to claim 4, which is characterized in that 40 thickness of encapsulated layer
It is 2000~5000 μm;The diameter of conducting wire A and conducting wire B are 100~500 μm.
6. a kind of big data server of high efficiency and heat radiation according to claim 4, which is characterized in that the CaWO4-0.3Fe2
(WO4)3-0.2CeTi2O6It is by CaCO3、CeO2、TiO2、WO3、Fe2O3Powder through ball milling mixing, pre-burning, again formed after ball milling
, preferred 2-5 μm of partial size.
7. a kind of big data server of high efficiency and heat radiation according to claim 6, which is characterized in that the thermistor substrate
(10) with a thickness of 100~200 μm, length is 450~500 μm, and width is 300~350 μm.
8. a kind of big data server of high efficiency and heat radiation according to claim 6, which is characterized in that the thermistor base
The preparation step of piece:
Step 1 follows above-mentioned stoichiometric ratio and weighs CaCO3、CeO2、TiO2、WO3、Fe2O3Powder is powder with wet ball-milling
It is uniformly mixed and makes powder refining, the mass ratio for controlling powder and zirconium ball is 1:3, and the mass ratio with deionized water is 1:2, ball milling
Time is 10h, and revolving speed is 350 revs/min, slurry obtained by ball milling is put into drying box, in 90 DEG C of drying 10h, after drying
Powder is in 1158 DEG C of pre-burning 3h;Then second of ball milling and drying are carried out again, and method is identical as first time;After second of ball milling,
Screening partial size is 2-5 μm, obtains powder E;
Above-mentioned powder E is added in ethanol solution by step 2, then suitable H is added in ultrasonic agitation2O is added appropriate
Ethyl orthosilicate dehydrated alcohol mixed liquor, be finally slowly added dropwise ammonium hydroxide adjust pH, again ultrasonic disperse stir, a small amount of lemon is added
Lemon acid modification of surfaces filters, and washing is dried to obtain core-shell structure SiO2/ powder E;
Step 3 prepares thermistor substrate: by the above-mentioned SiO prepared2The PVA that 6wt.% is incorporated as in/powder E is bonded
Agent is pressed into rectangle under 180Mpa pressure;Sintering, sintering process are as follows: 580 DEG C are warming up to the rate of 2 DEG C/min, 580
DEG C heat preservation 1h, be warming up to 670 DEG C with the rate of 3 DEG C/min, in 670 DEG C of heat preservation 3h, be warming up to 1310 with the rate of 4 DEG C/min
DEG C, in 1310 DEG C of heat preservation 6h, then cools to room temperature, obtain the thermistor substrate.
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CN108871452A (en) * | 2018-07-16 | 2018-11-23 | 深圳众厉电力科技有限公司 | Domestic environment detection system based on many reference amounts |
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Application publication date: 20181218 |