CN109041516A - A kind of big data server of high efficiency and heat radiation - Google Patents

A kind of big data server of high efficiency and heat radiation Download PDF

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Publication number
CN109041516A
CN109041516A CN201810776180.0A CN201810776180A CN109041516A CN 109041516 A CN109041516 A CN 109041516A CN 201810776180 A CN201810776180 A CN 201810776180A CN 109041516 A CN109041516 A CN 109041516A
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shell
conducting wire
partition
big data
powder
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邱炎新
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Shenzhen Huichuang Lianhe Automation Control Co ltd
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Shenzhen Huichuang Lianhe Automation Control Co ltd
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Priority to CN201810776180.0A priority Critical patent/CN109041516A/en
Publication of CN109041516A publication Critical patent/CN109041516A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836Thermal management, e.g. server temperature control
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20736Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/202Air convective hinge

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Thermistors And Varistors (AREA)

Abstract

This application involves a kind of big data servers of high efficiency and heat radiation, including shell (2), the front of shell (2) is provided with door (1), at least three partitions (5) are provided in shell (2), partition (5) is horizontally disposed to be divided into multi-layer cavity for shell (2) interior space, temperature sensor (4) are provided in each layer of cavity, temperature sensor (4) is connect with the input terminal of singlechip controller (7), and the output end of singlechip controller (7) is connected with warning device;The temperature sensor (4) is that one kind is based on NTC thermo-sensitive material, is used for pyrometric temperature sensor, the temperature sensor includes thermistor substrate (10), which is a kind of core-shell structure, NTC thermal sensitive ceramic material based on Fe-Ca-Ce-Ti-W-O;Specifically, nuclear structure is CaWO4‑0.3Fe2(WO4)3‑0.2CeTi2O6, shell structure SiO2

Description

A kind of big data server of high efficiency and heat radiation
Technical field
This application involves network server technical field more particularly to a kind of big data servers of high efficiency and heat radiation.
Background technique
Big data refers to the data that can not be captured, managed and be handled with conventional software tool within certain time Set is magnanimity, the Gao Zeng for needing new tupe that could have stronger decision edge, see clearly discovery power and process optimization ability Long rate and diversified information assets.
Since operand is huge, the fever of processor is serious, and data volume is huge in addition needs to install many hard disks, big data Server would generally generate a large amount of heat at runtime.Existing big data server is usually dissipated in the form of installing exhaust fan The shortcomings that heat, this mode is that structure is too simple, usually occurs heat dissipation dead angle in server, leads to the excessively high damage of local temperature Server.
Summary of the invention
The present invention is intended to provide a kind of big data server of high efficiency and heat radiation, set forth above to solve the problems, such as.
A kind of big data server of high efficiency and heat radiation, including shell (2), shell (2) are provided in the embodiment of the present invention Front be provided with door (1), is provided at least three partitions (5) in shell (2), partition (5) is horizontally disposed will be empty in shell (2) Between be divided into multi-layer cavity, partition (5) arrangement that intermeshes keeps the clearance position communicated between two layers of cavity mutual in vertical direction It is staggered;Air inlet fan (3) is provided in the cavity of top layer, the air inlet fan (3) is set on shell (2) back side;It is undermost It is provided in cavity exhaust fan (8), the exhaust fan (8) is set on the back side of shell (2);It is provided with outside the shell (2) One singlechip controller (7) is provided with temperature sensor (4) in each layer of cavity, temperature sensor (4) and single-chip microcontroller control The input terminal of device (7) processed connects, and the output end of singlechip controller (7) is connected with warning device;The temperature sensor (4) For one kind based on NTC thermo-sensitive material, for pyrometric temperature sensor, which includes thermistor substrate (10), which is a kind of core-shell structure, NTC thermal sensitive ceramic material based on Fe-Ca-Ce-Ti-W-O; Specifically, nuclear structure is CaWO4-0.3Fe2(WO4)3-0.2CeTi2O6, shell structure SiO2
The technical solution that the embodiment of the present invention provides can include the following benefits:
1. the gap that is communicated between multi-layer cavity and cavity formed can supplied gas flowing curved channel.Cooling air is curved Flowing can come into full contact with the heat generating components being arranged on flow path in meander is dynamic, to provide good cooling effect, disappear Except the dead angle of heat dissipation, the excessively high damage to server of local temperature is avoided.
Make flowing of the cooling air in bending flowing unobstructed 2. air inlet fan, auxiliary blower and exhaust fan is arranged, heat dissipation High efficient and reliable.
3. temperature sensor, warning device and wireless launcher is arranged, intelligent temperature can be provided for big data server Degree monitoring and warning function.
The additional aspect of the application and advantage will be set forth in part in the description, and will partially become from the following description It obtains obviously, or recognized by the practice of the application.It should be understood that above general description and following detailed description are only Be it is exemplary and explanatory, the application can not be limited.
Detailed description of the invention
The present invention will be further described with reference to the accompanying drawings, but the embodiment in attached drawing is not constituted to any limit of the invention System, for those of ordinary skill in the art, without creative efforts, can also obtain according to the following drawings Other attached drawings.
Fig. 1 is the structural schematic diagram of big data server of the present invention;
Fig. 2 is the structural schematic diagram of temperature sensor described in the embodiment of the present invention.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment Described in embodiment do not represent all embodiments consistented with the present invention.On the contrary, they be only with it is such as appended The example of device and method being described in detail in claims, some aspects of the invention are consistent.
Embodiment 1
Embodiments herein is related to a kind of big data server of high efficiency and heat radiation, including shell 2, and the front of shell 2 is set It is equipped with door 1, there are five partitions 5 for setting in shell 2.Partition 5 includes three partition I51 and two partition II52, partition I51 and shell The back side of body 2 and side connect and between door 1 there are gap, and partition II52 is connect with the side of shell 2, and and shell It is provided between the front plan of door 1 and does not interspace on 2, there are gaps between partition II52 and the back side of shell 2.Three partitions I51 and two partition II52 horizontal parallel, which is arranged, is divided into multi-layer cavity, three partition I51 and two partitions for space in shell 2 II52 intermeshes arrangement, mutually staggers the clearance position communicated between two layers of cavity in vertical direction.The cavity of top layer It is inside provided with air inlet fan 3, air inlet fan 3 is set on 2 back side of shell;Exhaust fan 8, exhaust fan 8 are provided in undermost cavity It is set on the back side of shell 2;Auxiliary blower 6 is provided in gap between partition II52 and the back side of shell 2.Big data clothes The heat generating components such as the processor and hard disk of business device are mounted on partition.
When big data server works, air inlet fan 3 is blown into cooling air into cavity, and cooling air is in multi-layer cavity and chamber It is flowed in the curved runner that the gap communicated between body is formed, auxiliary blower can provide additional driving force in flow process. Sufficient heat exchange occurs with the heat generating components being arranged on multi-layer cavity internal partition in cooling air flowing, takes away big data clothes The heat that business device operation generates, finally excludes from exhaust fan 8.This radiating mode is avoided by reasonable space and runner design Heat dissipation dead angle.
Embodiment 2
A kind of big data server of high efficiency and heat radiation, including shell 2, the front of shell 2 are provided with door 1, setting in shell 2 There are three partitions 5.Three partitions 5 include the back side and side of two partition I51 and a partition II52, partition I51 and shell 2 Connect and between door 1 there are gap, partition II52 is connect with the side of shell 2, and be provided with door 1 on shell 2 It does not interspace between front plan, there are gaps between partition II52 and the back side of shell 2.Two partition I51 and a partition Space in shell 2 is divided into multi-layer cavity by the setting of II52 horizontal parallel, and two partition I51 and a partition II52 intermesh row Column, mutually stagger the clearance position communicated between two layers of cavity in vertical direction.Air inlet fan is provided in the cavity of top layer 3, air inlet fan 3 is set on 2 back side of shell;Exhaust fan 8 is provided in undermost cavity, exhaust fan 8 is set to the back of shell 2 On face;Auxiliary blower 6 is provided in gap between partition II52 and the back side of shell 2.The processor of big data server and The heat generating components such as hard disk are mounted on partition.It is provided with a singlechip controller 7 outside shell 2, is respectively provided in each layer of cavity There is temperature sensor 4, temperature sensor 4 is connect with the input terminal of singlechip controller 7, and the output end of singlechip controller 7 connects It is connected to warning device.The output end of singlechip controller 7 is also connected with a wireless signal transmitting device.
The radiation processes of embodiment 2 are same as Example 1, unlike, temperature sensor 4 is additionally provided with to each layer The temperature of chamber is monitored, if temperature is more than safe working temperature, temperature sensor 4 can send a signal to singlechip controller 7, singlechip controller 7 receive signal after can control warning device alarm and make wireless signal transmitting device to remote terminal sending Alarm signal.
In embodiment 2, the temperature sensor 4 is that one kind is passed based on NTC thermo-sensitive material, for pyrometric temperature Sensor, in conjunction with Fig. 2, which includes thermistor substrate 10, which is rectangle, in rectangle temperature-sensitive Conducting wire A20 and conducting wire B30 are respectively welded in the opposing sides of resistance substrate 10, that is, conducting wire A20 is welded on thermistor substrate On 10 first surface 101, conducting wire B30 is welded on the second surface 102 of thermistor substrate 10, to realize conducting wire A20 The thermistor substrate 10 is clamped with conducting wire B30, is externally provided with encapsulated layer in thermistor substrate 10 and conducting wire A20, conducting wire B30 40, which is glass glaze encapsulated layer, and main component is magnesia;Conducting wire A20 and conducting wire B30 selects Dumet wire to lead Line.
Temperature sensor is the core component in temperature measuring instrument, can experience the temperature of measured medium and by its It is converted into available output signal, to realize that temperature measures.In field of temperature measurement, thermo-sensitive material is in temperature sensor Core, extremely sensitive to temperature change, the more thermo-sensitive material of application includes PTC thermo-sensitive material and NTC thermo-sensitive material at present. NTC thermo-sensitive material is a kind of sensitive material of negative temperature coefficient, and with quick response, at low cost, small in size, sensitivity is high etc. Advantage, however, current NTC thermo-sensitive material is not suitable for high temperature measurement.In terms of encapsulation, traditional epoxy is substituted with glass glaze Resin substitutes traditional copper wire with Dumet silk thread, carries out sealed knot at high temperature.Due to Dumet wire and glass-glazed leakproofness, make For the temperature sensor made of the present invention after boiling water boiling 1000 hours, electrical property is unchanged.It has great practical value.Its In, the package length of above-mentioned encapsulated layer 40 is determined according to temperature sensor needs.
In the application, in terms of welding, conducting wire A and conducting wire B are by ultrasonic welding, gold ball bonding and silver paste slugging A kind of realize.40 thickness of encapsulated layer can be 2000~5000 μm;The diameter of conducting wire A and conducting wire B can be 100~500 μ m。
In the present invention, in terms of thermistor substrate, the thermistor substrate be a kind of core-shell structure, be based on Fe-Ca- The NTC thermal sensitive ceramic material of Ce-Ti-W-O;Specifically, nuclear structure is CaWO4-0.3Fe2(WO4)3-0.2CeTi2O6, shell structure For SiO2.In the prior art, the demand sensor that can be worked under the high temperature conditions is increased, however, traditional spinelle shape NTC thermistor material due on A and the position B under high temperature transition-metal ions can reset, high temperature ageing characteristic is serious, unsuitable 300 degree or more of temperature measurement;In technical scheme, the creative Fe-Ca-Ce-Ti-W-O system using core-shell structure NTC thermal sensitive ceramic material, shell structure are specially SiO2, can play a role in conjunction with internal nuclear structure, improve temperature-sensitive The resistivity-temperature characteristics of resistance substrate at high temperature, have obtained unexpected technical effect.In addition, by using core-shell structure temperature-sensitive Ceramic material effectively reduces the thickness of thermistor substrate, so that temperature sensor has ultra-thin effect, expands using model It encloses.
The SiO2It is prepared using hydro-thermal method.
With SiO2Coat nuclear structure CaWO4-0.3Fe2(WO4)3-0.2CeTi2O6, the NTC effect of material can be significantly improved It answers, unexpected technical results have been achieved.
The CaWO4-0.3Fe2(WO4)3-0.2CeTi2O6It is by CaCO3、CeO2、TiO2、WO3、Fe2O3Powder is mixed through ball milling Conjunction pre-burning, is again formed after ball milling, preferred 2-5 μm of partial size.In terms of thermistor substrate, the base of nuclear structure creativeness The NTC effect of material is improved, unexpected technology is achieved by doping in Fe-Ca-Ce-Ti-W-O series ceramic material Effect.
The thermistor substrate 10 with a thickness of 100~200 μm, length can be 450~500 μm, width can for 300~ 350μm.Due to using above-mentioned thermal sensitive ceramic material, which compares conventional substrate and greatly reduces, play Ultra-thin technical effect.
It the following is the preparation step of herein described thermistor substrate:
Wherein, primary raw material such as the following table 1 that the above process is used
The primary raw material that table 1 uses
Raw material Purity grade Manufacturer
CaCO3 Analyze pure (99.0%) Shanghai traditional Chinese medicines reagent
CeO2 Analyze pure (99.0%) Shanghai traditional Chinese medicines reagent
TiO2 Analyze pure (99.5%) Shanghai traditional Chinese medicines reagent
WO3 Analyze pure (99.0%) Shanghai traditional Chinese medicines reagent
Fe2O3 Analyze pure (99.0%) Shanghai traditional Chinese medicines reagent
Step 1 follows above-mentioned stoichiometric ratio and weighs CaCO3、CeO2、TiO2、WO3、Fe2O3Powder is with wet ball-milling Powder is uniformly mixed and makes powder refining, and the mass ratio for controlling powder and zirconium ball is 1:3, and the mass ratio with deionized water is 1:2, Ball-milling Time is 10h, and revolving speed is 350 revs/min, slurry obtained by ball milling is put into drying box, in 90 DEG C of drying 10h, drying Powder afterwards is in 1158 DEG C of pre-burning 3h;Then second of ball milling and drying are carried out again, and method is identical as first time;Second of ball milling Afterwards, screening partial size is 2-5 μm, obtains powder E;
Above-mentioned powder E is added in ethanol solution by step 2, then suitable H is added in ultrasonic agitation2O is added Suitable ethyl orthosilicate dehydrated alcohol mixed liquor is finally slowly added dropwise ammonium hydroxide and adjusts pH, and ultrasonic disperse stirs again, is added few Citric acid modification surface is measured, is filtered, washing is dried to obtain core-shell structure SiO2/ powder E;
Step 3 prepares thermistor substrate: by the above-mentioned SiO prepared2The PVA that 6wt.% is incorporated as in/powder E makees Binder is pressed into rectangle under 180Mpa pressure;Sintering, sintering process are as follows: 580 DEG C are warming up to the rate of 2 DEG C/min, 580 DEG C of heat preservation 1h, are warming up to 670 DEG C with the rate of 3 DEG C/min, in 670 DEG C of heat preservation 3h, are warming up to the rate of 4 DEG C/min It 1310 DEG C, in 1310 DEG C of heat preservation 6h, then cools to room temperature, obtains the thermistor substrate.
After measured, the thermistor substrate that the application obtains is 2.66 × 10 in 25 DEG C of resistivity7Ω m, 800 DEG C Resistivity is 149 Ω m;There is preferable NTC performance at high temperature;High-temperature stability: thermistor substrate is tested 500 DEG C heat preservation aging 200h before and after resistivity variation, find it by 3.87 × 106Ω m changes to 3.98 × 106Ω m becomes Rate is 2.8%, and high-temperature stability is preferable.
The foregoing is merely preferred modes of the invention, are not intended to limit the invention, all in spirit and original of the invention Within then, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.

Claims (8)

1. a kind of big data server of high efficiency and heat radiation, including shell (2), the front of shell (2) are provided with door (1), feature It is: is provided at least three partitions (5) in shell (2), partition (5) is horizontally disposed is divided into multilayer chamber for shell (2) interior space Body, partition (5), which intermeshes to arrange, mutually staggers the clearance position communicated between two layers of cavity in vertical direction;Top layer Air inlet fan (3) is provided in cavity, the air inlet fan (3) is set on shell (2) back side;The row of being provided in undermost cavity Fan (8), the exhaust fan (8) are set on the back side of shell (2);A single-chip microcontroller control is provided with outside the shell (2) Device (7) is provided with temperature sensor (4) in each layer of cavity, the input of temperature sensor (4) and singlechip controller (7) End connection, the output end of singlechip controller (7) are connected with warning device;The temperature sensor (4) is a kind of based on NTC Thermo-sensitive material is used for pyrometric temperature sensor, which includes thermistor substrate (10), the thermistor Substrate (10) is a kind of core-shell structure, NTC thermal sensitive ceramic material based on Fe-Ca-Ce-Ti-W-O;Specifically, nuclear structure is CaWO4-0.3Fe2(WO4)3-0.2CeTi2O6, shell structure SiO2
2. a kind of big data server of high efficiency and heat radiation according to claim 1, which is characterized in that partition (5) packet Include partition I (51) and partition II (52), partition I (51) connect with the back side of shell (2) and side and between door (1) there are Gap, partition II (52) connect with the side of shell (2) and do not interspace between door (1), partition II (52) and shell (2) The back side between there are gaps.
3. a kind of big data server of high efficiency and heat radiation according to claim 2, which is characterized in that partition II (52) and shell Auxiliary blower (6) are provided in gap between the back side of body (2).
4. a kind of big data server of high efficiency and heat radiation according to claim 1, which is characterized in that the thermistor substrate (10) it is rectangle, conducting wire A (20) and conducting wire B (30) is respectively welded in the opposing sides of rectangle thermistor substrate (10), That is, conducting wire A (20) is welded on the first surface (101) of thermistor substrate (10), conducting wire B (30) is welded on thermistor base On the second surface (102) of piece (10), thus realize conducting wire A (20 and conducting wire B (30) clamps the thermistor substrate (10), Thermistor substrate (10) and conducting wire A (20, (30 are externally provided with encapsulated layer (40) to conducting wire B, which is glass glaze envelope Layer is filled, main component is magnesia;Conducting wire A (20) and conducting wire B (30) selects Dumet wire conducting wire.
5. a kind of big data server of high efficiency and heat radiation according to claim 4, which is characterized in that 40 thickness of encapsulated layer It is 2000~5000 μm;The diameter of conducting wire A and conducting wire B are 100~500 μm.
6. a kind of big data server of high efficiency and heat radiation according to claim 4, which is characterized in that the CaWO4-0.3Fe2 (WO4)3-0.2CeTi2O6It is by CaCO3、CeO2、TiO2、WO3、Fe2O3Powder through ball milling mixing, pre-burning, again formed after ball milling , preferred 2-5 μm of partial size.
7. a kind of big data server of high efficiency and heat radiation according to claim 6, which is characterized in that the thermistor substrate (10) with a thickness of 100~200 μm, length is 450~500 μm, and width is 300~350 μm.
8. a kind of big data server of high efficiency and heat radiation according to claim 6, which is characterized in that the thermistor base The preparation step of piece:
Step 1 follows above-mentioned stoichiometric ratio and weighs CaCO3、CeO2、TiO2、WO3、Fe2O3Powder is powder with wet ball-milling It is uniformly mixed and makes powder refining, the mass ratio for controlling powder and zirconium ball is 1:3, and the mass ratio with deionized water is 1:2, ball milling Time is 10h, and revolving speed is 350 revs/min, slurry obtained by ball milling is put into drying box, in 90 DEG C of drying 10h, after drying Powder is in 1158 DEG C of pre-burning 3h;Then second of ball milling and drying are carried out again, and method is identical as first time;After second of ball milling, Screening partial size is 2-5 μm, obtains powder E;
Above-mentioned powder E is added in ethanol solution by step 2, then suitable H is added in ultrasonic agitation2O is added appropriate Ethyl orthosilicate dehydrated alcohol mixed liquor, be finally slowly added dropwise ammonium hydroxide adjust pH, again ultrasonic disperse stir, a small amount of lemon is added Lemon acid modification of surfaces filters, and washing is dried to obtain core-shell structure SiO2/ powder E;
Step 3 prepares thermistor substrate: by the above-mentioned SiO prepared2The PVA that 6wt.% is incorporated as in/powder E is bonded Agent is pressed into rectangle under 180Mpa pressure;Sintering, sintering process are as follows: 580 DEG C are warming up to the rate of 2 DEG C/min, 580 DEG C heat preservation 1h, be warming up to 670 DEG C with the rate of 3 DEG C/min, in 670 DEG C of heat preservation 3h, be warming up to 1310 with the rate of 4 DEG C/min DEG C, in 1310 DEG C of heat preservation 6h, then cools to room temperature, obtain the thermistor substrate.
CN201810776180.0A 2018-07-16 2018-07-16 A kind of big data server of high efficiency and heat radiation Withdrawn CN109041516A (en)

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CN102515737A (en) * 2011-11-21 2012-06-27 肇庆市金龙宝电子有限公司 NTC (Negative Temperature Coefficient) thermistor material with high B value and high stability and production method thereof
CN105174953A (en) * 2015-09-09 2015-12-23 江苏聚盛电子科技有限公司 Thermal sensitive ceramic double-parameter temperature measuring material and preparation method of thermal sensitive ceramic double-parameter temperature measuring material
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108871452A (en) * 2018-07-16 2018-11-23 深圳众厉电力科技有限公司 Domestic environment detection system based on many reference amounts

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Application publication date: 20181218