CN109038958B - Heat dissipation device and heat dissipation method for motor rotor in vacuum environment - Google Patents
Heat dissipation device and heat dissipation method for motor rotor in vacuum environment Download PDFInfo
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 5
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- 239000000463 material Substances 0.000 claims description 71
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 44
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
- H02K9/22—Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
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Abstract
The invention relates to a method and a device for realizing thermoelectric conversion and radiation heat dissipation, belonging to the technical field of vacuum heat dissipation. The heat of the rotor is transferred to the stator side in an energy conversion mode, and therefore the temperature rise of the rotor is reduced. It includes two heat transfer end faces fixed on the front and back end faces of the rotor; one heat transfer end surface is arranged on the front end surface of the rotor, and the other heat transfer end surface is arranged on the rear end surface of the rotor; each heat transfer end surface is contacted with a thermoelectric conversion device, and the thermoelectric conversion devices are electrically connected with the respective electromagnetic wave emitting devices; the inner side of the stator is electroplated with a black chromium plating layer for increasing the absorption of radiation on the rotor side.
Description
Technical Field
The invention relates to a method and a device for realizing thermoelectric conversion and radiation heat dissipation, belonging to the technical field of vacuum heat dissipation.
Background
With the continuous improvement of the scientific and technical level of China, more and more industries need vacuum environment for production operation, and the demand of vacuum pumps is larger and larger. The conventional vacuum pump adopts an asynchronous motor, and the temperature of a rotor is increased due to the aluminum consumption of the rotor as known from the operating characteristics of the asynchronous motor. Because the high vacuum state is in the shielding sleeve, the heat dissipation condition of heat convection is lost, the rotor can only dissipate heat through heat conduction and heat radiation, the temperature of the rotor is higher and higher, and the heat is transferred to the bearing through the heat conduction, so that the temperature of the inner ring of the bearing is increased. Because the heat dissipation conditions of the inner ring and the outer ring of the bearing are different, the temperature of the inner ring of the bearing is far higher than that of the outer ring, the inner ring and the outer ring expand in different degrees, the effective clearance of the bearing is reduced, the bearing runs for a long time and undergoes a long dynamic transition process, a lubricating oil film in a bearing raceway is difficult to establish, a rolling ball body is extruded, and finally the bearing is possibly glued and locked due to overlarge friction force of the rolling ball body, so that the result is unreasonable.
The invention patent application with publication number CN202424409U discloses a novel rotor heat dissipation structure (application number CN 201120571832.0), wherein a rotor is arranged on a rotating shaft, the rotating shaft is supported on a bearing, the novel rotor heat dissipation structure also comprises a plurality of heat dissipation fins, the heat dissipation fins are arranged between the rotor and the bearing and are embedded on the rotating shaft, a gap is arranged between every two adjacent heat dissipation fins, the novel rotor heat dissipation structure is simple in structure, the temperature of the rotating shaft of a motor is reduced, the temperature of the bearing of the motor is further reduced, the heat dissipation effect is good, the service life of the motor is prolonged, and the normal work of the motor is ensured. Is a novel rotor heat radiation structure.
However, this method and apparatus can be implemented only on the premise that a heat-conducting medium exists around the rotor, and the vacuum environment does not contain a heat-conducting medium such as gas, and heat cannot be transferred by convection and heat conduction of air, so that the method and apparatus are not suitable for heat dissipation of the rotor in the vacuum environment.
Disclosure of Invention
The invention aims at the defects in the prior art and provides a heat dissipation device and a heat dissipation method for a motor rotor in a vacuum environment, which aim at the problem that the motor rotor in the vacuum environment is difficult to dissipate heat, realize thermoelectric energy conversion and radiation heat dissipation, overcome the problem that the temperature of the rotor is higher and higher due to the fact that the motor rotor for the conventional vacuum pump can only dissipate heat through heat conduction and heat radiation, and transfer the heat of the rotor to the side of a stator in an energy conversion mode so as to further reduce the temperature rise of the rotor.
In order to achieve the purpose, the invention adopts the following technical scheme that the heat exchanger comprises two heat transfer end surfaces which are fixed on the front end surface and the rear end surface of a rotor; one heat transfer end face is arranged on the front end face of the rotor, and the other heat transfer end face is arranged on the rear end face of the rotor.
Each heat transfer end surface is in contact with a thermoelectric conversion device, and the thermoelectric conversion devices are electrically connected with the respective electromagnetic wave emitting devices.
The inner side of the stator is electroplated with a black chromium plating layer for increasing the absorption of radiation on the rotor side.
As a preferred aspect of the present invention, the outer surface of the rotor is provided with a double coating: a thermal radiation type barrier coating, a thermal reflection type barrier coating, for reducing absorption of radiation on the stator side.
As another preferable scheme of the invention, the heat transfer end face is connected with the rotor end face in a welding mode; and the heat transfer end face is provided with a hole for the motor rotating shaft to pass through.
As another preferred scheme of the invention, the heat transfer end face is fixed at the end face of the rotor core in a welding mode, and the heat transfer end face is made of a material which is neither magnetically conductive nor electrically conductive and only exchanges heat with the end face of the rotor; the thermoelectric conversion device is fixed on the outer surface of the heat transfer end face in a bonding or welding mode.
As another preferable scheme of the present invention, the heat transfer end surface is a disk structure, the disk structure is composed of a plurality of concentric rings, and two adjacent rings are made of two materials with different specific heat capacities and heat conductivities.
In another preferred embodiment of the present invention, two adjacent rings on the heat transfer end surface are bonded or welded, wherein one ring is made of heat-resistant glass and the other ring is made of stainless steel.
In another preferred embodiment of the present invention, the thermoelectric conversion device is composed of a plurality of concentric ring-shaped semiconductor thermoelectric devices, each of the semiconductor thermoelectric devices includes two different semiconductors of P-type and N-type, the two semiconductors are connected by conductive sheets, a heat conductive substrate is attached to the outer sides of the conductive sheets, and the positive and negative electrodes are led out by wires.
As another preferable scheme of the invention, a layer of ceramic substrate is arranged on the outer surface of the annular inner end surface and the outer surface of the annular outer end surface of the semiconductor thermoelectric device; the ceramic substrate of the inner end surface of each ring is bonded on one ring of the heat conduction end surface, the ceramic substrate of the outer end surface of each ring is bonded on the other ring of the heat conduction end surface, and the two rings are adjacent.
The semiconductor thermoelectric device comprises a P-type semiconductor material and an N-type semiconductor material which are arranged between two ceramic substrates, wherein the P-type semiconductor material and the N-type semiconductor material are arranged at intervals and are divided into a group in pairs, and the group is divided into: a first group S1, a plurality of middle groups (S2-Sp-1) and a tail group Sp.
The end part of the P-type semiconductor material on one side of the first group and the end part of the N-type semiconductor material are both connected with the same copper flow deflector and nickel barrier layer, the end part of the P-type semiconductor material on the other side of the first group is connected with a lead and is led out to be used as a negative electrode, and the end part of the N-type semiconductor material on the other side of the first group and the end part of the P-type semiconductor material on the same side of the adjacent middle group are connected through the copper flow deflector; forming a pi-type structure.
The end part of the P-type semiconductor material and the end part of the N-type semiconductor material on one side of each middle group are connected with the copper guide plate and the nickel barrier layer where the P-type semiconductor material and the N-type semiconductor material are located, and the end part of the P-type semiconductor material on the other side of each middle group is connected with the end part of the N-type semiconductor material of the other group which is adjacent to the same side and on the same side through the same copper guide plate and the same nickel barrier layer, so.
The end part of the P-type semiconductor material and the end part of the N-type semiconductor material on one side of the tail group are both connected with the same copper guide vane and nickel barrier layer, and the end part of the N-type semiconductor material on the other side of the tail group is connected with the end part of the P-type semiconductor material on the same side of the adjacent middle group through the same copper guide vane and nickel barrier layer; the end part of the P-type semiconductor material on the other side of the tail group is connected with a wire and is led out to be used as an anode, so that a pi-shaped structure is formed.
A molybdenum-manganese metallization layer is electroplated between the copper flow deflector and the ceramic substrate and between the nickel barrier layer and the ceramic substrate; the leads of the respective ring-shaped semiconductor thermoelectric devices are connected in series.
As another preferred scheme of the present invention, the electromagnetic wave emitting device includes a plurality of (patch type) light emitting diodes connected in parallel and welded on a circular PCB, the outer diameter of the PCB is not greater than the outer diameter of the motor rotor, and a hole is left in the middle of the PCB for facilitating the passage of the rotating shaft, and the frequency of the electromagnetic wave emitted by the (patch type) light emitting diodes is an infrared ray or other heat ray band which is favorable for radiation absorption; the positive and negative electrodes of the thermoelectric conversion device are used as power sources of the electromagnetic wave emitting device and are connected with the electromagnetic wave emitting device.
As another preferable aspect of the present invention, the other portion of the thermoelectric conversion device than the ceramic substrate is not in contact with the heat-transfer end face.
A heat dissipation method of a motor rotor in a vacuum environment utilizes a closed loop composed of two different metals or semiconductors according to different temperatures of different positions on the end surface of the rotor, when the temperatures of two contact positions are different, a potential is generated in the loop, so that heat energy is converted into electric energy; the electric energy is converted into electromagnetic waves with certain frequency by utilizing the light-emitting diodes, the frequency of the electromagnetic waves is easy to absorb by the stator side, and after the electromagnetic waves are absorbed by the stator side, the energy is transferred from the rotor side to the stator side, so that the temperature rise of the rotor is reduced, and the heat dissipation effect is realized.
Compared with the prior art, the invention has the beneficial effects.
The heat dissipation method and the heat dissipation device are suitable for a vacuum environment, the problem that the temperature of the rotor is higher and higher due to the fact that the rotor can only dissipate heat through heat conduction and heat radiation in the vacuum environment is solved, the heat of the rotor is transferred to the stator side through an energy conversion mode, the temperature rise of the rotor is further reduced, the performance of a motor is improved beneficially, and the operation stability and the reliability are improved.
Drawings
The invention is further described with reference to the following figures and detailed description. The scope of the invention is not limited to the following expressions.
Fig. 1 is a schematic view of the structure of a rotor heat conversion device of the present invention.
Fig. 2 is a schematic structural view of a heat transfer end face of the present invention.
Fig. 3 is a schematic view of the structure of the thermoelectric conversion device of the present invention.
Fig. 4 is a partial configuration diagram of a thermoelectric conversion device of the present invention.
Fig. 5 is a sectional view showing the assembled position of the thermoelectric conversion device of the present invention and a tailored heat-transfer end face.
Fig. 6 is a structural view of an electromagnetic wave emitting device of the present invention.
In the figure, 1 is an electromagnetic wave emitting device, 2 is a thermoelectric conversion device, 3 is a heat transfer end face, 4 is a rotor core, 5 is a motor rotating shaft, 6 is a hole through which the motor rotating shaft passes, 7 is heat-resistant glass, 8 is stainless steel, 9 is a semiconductor thermoelectric device, 10 is a molybdenum-manganese metallization layer, 11 is a ceramic substrate, 12 is a copper guide vane and a nickel barrier layer, 13 is a semiconductor material, 14 is a PCB circuit board, and 15 is a light emitting diode.
Detailed Description
The invention is described in more detail below with reference to the figures and examples of the specification.
As shown in fig. 1-6, the canned motor rotor for a vacuum pump is a specific embodiment, and the present invention includes two heat transfer end faces 3 fixed on the front and rear end faces of the rotor; one heat transfer end face 3 is arranged on the front end face of the rotor, and the other heat transfer end face 3 is arranged on the rear end face of the rotor; each heat transfer end face 3 is in contact with a thermoelectric conversion device 2, and the thermoelectric conversion devices 2 are electrically connected with the respective electromagnetic wave emitting devices 1; the inner side of the stator (comprising the inner surface of the stator shielding sleeve and the inner surface of the end cover) is electroplated with a black chromium plating layer for increasing the absorption of radiation on the rotor side; a nickel protective layer is arranged between the plating layer and the plated piece to prevent the plating layer from cracking due to thermal expansion.
Preferably, the outer surface of the rotor is provided with a thermal radiation type barrier coating, a thermal reflection type barrier coating, for reducing absorption of radiation on the stator side.
Preferably, the heat transfer end face 3 is connected with the rotor end face through a welding mode; and the heat transfer end face 3 is provided with a hole 6 for the motor rotating shaft to pass through.
Preferably, the heat transfer end face 3 is fixed at the end face of the rotor core 4 by welding, and the heat transfer end face 3 is made of a material which is neither magnetically conductive nor electrically conductive; the thermoelectric conversion device 2 is fixed on the outer surface of the heat transfer end face 3 by bonding or welding.
Preferably, the heat transfer end surface 3 is a disc structure, the disc structure is composed of a plurality of concentric rings, and two adjacent rings are made of materials with different specific heat capacities and heat conductivities. The specific heat capacity and the thermal conductivity of the two materials are greatly different, and an obvious thermal gradient can be formed in the process of absorbing heat.
Preferably, two adjacent circular rings of the heat transfer end surface 3 are bonded or welded, wherein one circular ring is made of heat-resistant glass 7, and the other circular ring is made of stainless steel 8. The axial thickness of the disc is 5mm, and the annular width of each ring is 5-10 mm. And the maximum diameter of the disc does not exceed the diameter of the rotor core 4.
Preferably, the thermoelectric conversion device 2 is composed of a plurality of concentric ring-shaped semiconductor thermoelectric devices 9, each semiconductor thermoelectric device 9 comprises two different semiconductors of P type and N type, the two semiconductors are connected through conducting strips, a heat conducting substrate is attached to the outer sides of the conducting strips, and the positive electrode and the negative electrode are led out through conducting wires.
Specifically, a layer of ceramic substrate 11 is arranged on the outer surface of the annular inner end surface and the outer surface of the annular outer end surface of the semiconductor thermoelectric device 9; the ceramic substrate 11 on the inner end surface of each ring is bonded to one ring of the heat-conducting end surface, the ceramic substrate 11 on the outer end surface of the ring is bonded to the other ring of the heat-conducting end surface, and the two rings are adjacent.
More specifically, the semiconductor thermoelectric device 9 includes a P-type semiconductor material 13 and an N-type semiconductor material 13 disposed between two ceramic substrates 11, the two are disposed at intervals, and two of the two are in a group, and are divided into: a first group S1, a plurality of middle groups (S2-Sp-1) and a tail group Sp.
The end part of the P-type semiconductor material 13 at one side of the first group and the end part of the N-type semiconductor material 13 are both connected with the same copper flow deflector and the same nickel barrier layer 12, the end part of the P-type semiconductor material 13 at the other side of the first group is connected with a lead and is led out to be used as a cathode, and the end part of the N-type semiconductor material 13 at the other side of the first group is connected with the end part of the P-type semiconductor material 13 at the same side of the adjacent middle group through the copper flow deflector; forming a pi-type structure.
The end part of the P-type semiconductor material 13 and the end part of the N-type semiconductor material 13 on one side of each middle group are both connected with the copper flow deflector and the nickel barrier layer 12 on which the P-type semiconductor material 13 and the N-type semiconductor material 13 are arranged, and the end part of the P-type semiconductor material 13 on the other side of each middle group is connected with the end part of the N-type semiconductor material 13 of the other group which is adjacent to the same side and on the same side through the same copper flow deflector and the same nickel barrier.
The end part of the P-type semiconductor material 13 at one side of the tail group and the end part of the N-type semiconductor material 13 are both connected with the same copper flow deflector and the same nickel barrier layer 12, and the end part of the P-type semiconductor material 13 at the other side of the tail group and the end part of the P-type semiconductor material 13 at the same side of the adjacent middle group are connected by the same copper flow deflector and the same nickel barrier layer 12; the end of the P-type semiconductor material 13 on the other side of the tail group is connected with a wire and is led out to be used as an anode, and a pi-type structure is formed.
A molybdenum-manganese metallization layer 10 is electroplated between the copper flow deflector and nickel barrier layer 12 and the ceramic substrate 11; the leads of the respective ring-shaped semiconductor thermoelectric devices 9 are connected in series. The anode leads are mutually connected in series and led out, and the cathode leads are mutually connected in series and led out.
Preferably, the electromagnetic wave emitting device 1, includes a plurality of patch type light emitting diodes 15 welded on a circular PCB circuit board 14 in parallel, the outer diameter of the PCB circuit board 14 is not larger than the outer diameter of the motor rotor, and a hole is left in the middle, so as to facilitate the passing of the rotating shaft, and the frequency of the electromagnetic wave emitted by the (patch type) light emitting diodes 15 is the infrared ray or other heat ray wave bands beneficial to radiation absorption; the positive and negative electrodes of the thermoelectric conversion device 2 serve as a power source of the electromagnetic wave emitting device 1 and are connected to the electromagnetic wave emitting device 1. Namely, the positive and negative leads of the thermoelectric conversion device 2 are connected with the electromagnetic wave emitting device 1 through the holes at the U + and U-positions. The electric energy of the thermoelectric conversion device is output through a lead and is connected in series with the input port of the electromagnetic wave emitting device.
Preferably, the other portions of the thermoelectric conversion device 2 than the ceramic substrate 11 are not in contact with the heat-transfer end face 3.
Based on different temperatures of different positions on the end face of the rotor, in a closed loop formed by two different metals (or semiconductors), when the temperatures of two contact positions are different, a potential is generated in the loop, so that heat energy is converted into electric energy, the electric energy is converted into electromagnetic waves with certain frequency by using devices such as a light-emitting diode 15 and the like, the frequency of the electromagnetic waves is easy to absorb by the stator side, and after the electromagnetic waves are absorbed by the stator side, the transmission of the energy from the rotor side to the stator side is completed, so that the temperature rise of the rotor is reduced, and the heat dissipation effect is achieved.
As shown in fig. 5, in the present embodiment, each ring of the thermoelectric conversion device 2 is arranged in order of the diameter size, the outer circle (outer end surface) and the inner circle (inner end surface) of the ring are ceramic substrates 11, and the ceramic substrates 11 on the inner circle and the outer circle are respectively bonded to two adjacent rings of different materials of the heat transfer end surface 3. Two kinds of the materials of the circular ring are heat-resistant glass 7 and stainless steel 8, and other parts of the thermoelectric conversion device except the ceramic substrate 11: the molybdenum-manganese metallization layer 10, the copper flow deflector and the nickel barrier layer 12, and the P-type and N-type semiconductor materials 13 are not in contact with the heat transfer end face 3.
In the above embodiments, in order to increase the heat transfer between the stator and the rotor, the inner layer of the stator and the surface of the rotor may be specially treated: in order to increase the efficiency of the radiation heat exchange of the rotor, special coatings can be added on the outer surface of the device and the surface of the rotor, and the coatings are required to have high emissivity and reflectivity and low absorptivity, and a composite coating of a heat radiation type isolation coating and a heat reflection type isolation coating is adopted in the embodiment; the addition of a coating on the inside of the stator to absorb the heat rays emitted by the rotor side with maximum efficiency requires that the coating have low emissivity and reflectivity, as well as high absorptivity. In the embodiment, the black chromium coating is electroplated on the inner side of the stator, and a nickel protective layer is added between the coating and a plated part to prevent the coating from cracking due to thermal expansion.
By the rotor heat conversion method and the rotor heat conversion device, partial heat energy of the rotor can be converted into radiation energy which can be absorbed by the stator side, so that the energy transfer from the rotor side to the stator side is increased, and the temperature rise of the rotor is reduced. The above embodiments are methods and devices for heat dissipation of a motor rotor for a vacuum pump, but are also applicable to heat dissipation of other motors and in vacuum environments.
It should be understood that the detailed description of the present invention is only for illustrating the present invention and is not limited by the technical solutions described in the embodiments of the present invention, and those skilled in the art should understand that the present invention can be modified or substituted equally to achieve the same technical effects; as long as the use requirements are met, the method is within the protection scope of the invention.
Claims (10)
1. A heat sink of a motor rotor in a vacuum environment is characterized by comprising two heat transfer end surfaces fixed on the front end surface and the rear end surface of the rotor; one heat transfer end surface is arranged on the front end surface of the rotor, and the other heat transfer end surface is arranged on the rear end surface of the rotor;
each heat transfer end surface is contacted with a thermoelectric conversion device, and the thermoelectric conversion devices are electrically connected with the respective electromagnetic wave emitting devices;
the inner side of the stator is electroplated with a black chromium plating layer for increasing the absorption of radiation on the rotor side.
2. The heat sink for an electric motor rotor in a vacuum environment as claimed in claim 1, wherein: the outer surface of the rotor is provided with a double coating: a thermal radiation type barrier coating, a thermal reflection type barrier coating, for reducing absorption of radiation on the stator side.
3. The heat sink for an electric motor rotor in a vacuum environment as claimed in claim 1, wherein: the heat transfer end face is connected with the end face of the rotor in a welding mode; and the heat transfer end face is provided with a hole for the motor rotating shaft to pass through.
4. The heat sink for an electric motor rotor in a vacuum environment as claimed in claim 1, wherein: the heat transfer end face is fixed at the end face of the rotor core in a welding mode, is made of a material which is neither magnetic nor electric conductive and only exchanges heat with the end face of the rotor; the thermoelectric conversion device is fixed on the outer surface of the heat transfer end face in a bonding or welding mode.
5. The heat sink for an electric motor rotor in a vacuum environment as claimed in claim 1, wherein: the heat transfer end face is of a disc structure, the disc structure is composed of a plurality of concentric rings, and two adjacent rings are made of materials with different specific heat capacities and heat conductivities.
6. The heat dissipating device for an electric motor rotor in a vacuum environment as claimed in claim 5, wherein: two adjacent circular rings on the heat transfer end surface are connected by bonding or welding; wherein, the material of one ring is heat-resisting glass, and the material of the other ring is stainless steel.
7. The heat dissipating device for an electric motor rotor in a vacuum environment as claimed in claim 6, wherein: the thermoelectric conversion device is composed of a plurality of concentric annular semiconductor thermoelectric devices, each semiconductor thermoelectric device comprises two different semiconductors of a P type and an N type, the two semiconductors are connected through conducting strips, a heat conducting substrate is attached to the outer sides of the conducting strips, and the positive electrode and the negative electrode are led out through leads.
8. The heat dissipating device for an electric motor rotor in a vacuum environment as claimed in claim 7, wherein: a layer of ceramic substrate is arranged on the outer surface of the annular inner end surface and the outer surface of the annular outer end surface of the semiconductor thermoelectric device; the ceramic substrate of the inner end surface of each ring is bonded on one ring of the heat conduction end surface, the ceramic substrate of the outer end surface of the ring is bonded on the other ring of the heat conduction end surface, and the two rings are adjacent;
the semiconductor thermoelectric device comprises a P-type semiconductor material and an N-type semiconductor material which are arranged between two ceramic substrates, wherein the P-type semiconductor material and the N-type semiconductor material are arranged at intervals and are divided into a group in pairs, and the group is divided into: a first group S1, a plurality of middle groups S2-Sp-1 and a tail group Sp;
the end part of the P-type semiconductor material on one side of the first group and the end part of the N-type semiconductor material are both connected with the same copper flow deflector and nickel barrier layer, the end part of the P-type semiconductor material on the other side of the first group is connected with a lead and is led out to be used as a negative electrode, and the end part of the N-type semiconductor material on the other side of the first group and the end part of the P-type semiconductor material on the same side of the adjacent middle group are connected through the copper flow deflector; forming a pi-shaped structure;
the end part of the P-type semiconductor material and the end part of the N-type semiconductor material on one side of each middle group are connected with the copper flow deflector and the nickel barrier layer where the P-type semiconductor material and the N-type semiconductor material are located, and the end part of the P-type semiconductor material on the other side of each middle group is connected with the end parts of the N-type semiconductor materials of other groups which are adjacent and on the same side through the same copper flow deflector and the same nickel barrier layer to form a pi-shaped structure;
the end part of the P-type semiconductor material and the end part of the N-type semiconductor material on one side of the tail group are both connected with the same copper guide vane and nickel barrier layer, and the end part of the N-type semiconductor material on the other side of the tail group is connected with the end part of the P-type semiconductor material on the same side of the adjacent middle group through the same copper guide vane and nickel barrier layer; the end part of the P-type semiconductor material on the other side of the tail group is connected with a wire and is led out to be used as an anode, so that a pi-shaped structure is formed;
a molybdenum-manganese metallization layer is electroplated between the copper flow deflector and the ceramic substrate and between the nickel barrier layer and the ceramic substrate; the leads of all the annular semiconductor thermoelectric devices are connected in series; other portions of the thermoelectric conversion device than the ceramic substrate are not in contact with the heat-transfer end face.
9. The heat dissipating device for an electric motor rotor in a vacuum environment as claimed in claim 8, wherein: the electromagnetic wave emitting device comprises a plurality of light emitting diodes which are connected in parallel and welded on a circular PCB, the outer diameter of the PCB is not larger than that of a motor rotor, a hole is reserved in the middle of the PCB, a rotating shaft can conveniently pass through the hole, and the frequency of the electromagnetic waves emitted by the light emitting diodes is an infrared ray or other heat ray wave bands which are favorable for radiation absorption; the positive and negative electrodes of the thermoelectric conversion device are used as power sources of the electromagnetic wave emitting device and are connected with the electromagnetic wave emitting device.
10. The method for dissipating heat of a heat dissipating device of a rotor of an electric machine in a vacuum environment according to claim 1, wherein: according to different temperatures of different positions on the end face of the rotor, in a closed loop formed by two different metals or semiconductors, when the temperatures of two contact positions are different, a potential is generated in the loop, so that heat energy is converted into electric energy; the electric energy is converted into electromagnetic waves with certain frequency by utilizing the light-emitting diodes, the frequency of the electromagnetic waves is easy to absorb by the stator side, and after the electromagnetic waves are absorbed by the stator side, the energy is transferred from the rotor side to the stator side, so that the temperature rise of the rotor is reduced, and the heat dissipation effect is realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810915710.5A CN109038958B (en) | 2018-08-13 | 2018-08-13 | Heat dissipation device and heat dissipation method for motor rotor in vacuum environment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN110556963B (en) * | 2019-07-17 | 2023-03-10 | 南京师范大学 | Motor cooling device and method |
| CN114157090A (en) * | 2021-11-19 | 2022-03-08 | 中国科学院电工研究所 | Flywheel energy storage system easy to dissipate heat and method for inhibiting temperature rise of rotor of flywheel energy storage system under vacuum condition |
| CN114389183B (en) * | 2021-12-09 | 2024-02-06 | 江苏大烨智能电气股份有限公司 | Inflatable cabinet with heat dissipation function |
| CN115085407B (en) * | 2022-07-22 | 2022-11-15 | 日本电产凯宇汽车电器（江苏）有限公司 | Assembled heat transfer stator motor |
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