CN109037108A - 一种带缺陷检测功能的料饼上料装置 - Google Patents
一种带缺陷检测功能的料饼上料装置 Download PDFInfo
- Publication number
- CN109037108A CN109037108A CN201810869325.1A CN201810869325A CN109037108A CN 109037108 A CN109037108 A CN 109037108A CN 201810869325 A CN201810869325 A CN 201810869325A CN 109037108 A CN109037108 A CN 109037108A
- Authority
- CN
- China
- Prior art keywords
- charging
- cake
- feeding device
- defects detection
- material cake
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Feeding Of Articles To Conveyors (AREA)
- Basic Packing Technique (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810869325.1A CN109037108B (zh) | 2018-08-02 | 2018-08-02 | 一种带缺陷检测功能的料饼上料装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810869325.1A CN109037108B (zh) | 2018-08-02 | 2018-08-02 | 一种带缺陷检测功能的料饼上料装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109037108A true CN109037108A (zh) | 2018-12-18 |
CN109037108B CN109037108B (zh) | 2020-09-08 |
Family
ID=64648885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810869325.1A Active CN109037108B (zh) | 2018-08-02 | 2018-08-02 | 一种带缺陷检测功能的料饼上料装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109037108B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111650893A (zh) * | 2020-04-01 | 2020-09-11 | 安徽大华半导体科技有限公司 | 一种芯片料饼自动投放控制方法及*** |
CN112295937A (zh) * | 2020-12-13 | 2021-02-02 | 黑龙江科技大学 | 一种重量分类机 |
CN116001149A (zh) * | 2023-02-17 | 2023-04-25 | 深圳市曜通科技有限公司 | 一种塑封料饼的自动上料装置及半导体封装设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100118912A1 (en) * | 2008-11-10 | 2010-05-13 | Changyi Lai | Quality control of the frit for oled sealing |
CN102990804A (zh) * | 2012-12-07 | 2013-03-27 | 铜陵三佳山田科技有限公司 | 用于auto模调试的投料装置 |
CN104647686A (zh) * | 2013-11-19 | 2015-05-27 | 铜陵三佳山田科技有限公司 | 轻便快捷型树脂料饼上料装置 |
CN206194719U (zh) * | 2016-10-21 | 2017-05-24 | 安徽大华半导体科技有限公司 | 一种用于半导体封装设备的上料机械手 |
-
2018
- 2018-08-02 CN CN201810869325.1A patent/CN109037108B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100118912A1 (en) * | 2008-11-10 | 2010-05-13 | Changyi Lai | Quality control of the frit for oled sealing |
CN102990804A (zh) * | 2012-12-07 | 2013-03-27 | 铜陵三佳山田科技有限公司 | 用于auto模调试的投料装置 |
CN104647686A (zh) * | 2013-11-19 | 2015-05-27 | 铜陵三佳山田科技有限公司 | 轻便快捷型树脂料饼上料装置 |
CN206194719U (zh) * | 2016-10-21 | 2017-05-24 | 安徽大华半导体科技有限公司 | 一种用于半导体封装设备的上料机械手 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111650893A (zh) * | 2020-04-01 | 2020-09-11 | 安徽大华半导体科技有限公司 | 一种芯片料饼自动投放控制方法及*** |
CN111650893B (zh) * | 2020-04-01 | 2021-10-26 | 安徽大华半导体科技有限公司 | 一种芯片料饼自动投放控制方法及*** |
CN112295937A (zh) * | 2020-12-13 | 2021-02-02 | 黑龙江科技大学 | 一种重量分类机 |
CN116001149A (zh) * | 2023-02-17 | 2023-04-25 | 深圳市曜通科技有限公司 | 一种塑封料饼的自动上料装置及半导体封装设备 |
Also Published As
Publication number | Publication date |
---|---|
CN109037108B (zh) | 2020-09-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109037108A (zh) | 一种带缺陷检测功能的料饼上料装置 | |
CN105953690B (zh) | 一种花键检测机 | |
CN105537142A (zh) | 一种底板智能测试装置 | |
CN106824812B (zh) | 一种轴类零件自动检测设备 | |
WO2023216739A1 (zh) | 多层交错式料盒收纳装置、下料分选设备和分选*** | |
CN106000902A (zh) | 一种网络变压器的平面度检测及区分设备 | |
CN107030016A (zh) | 一种铸件视觉检测设备 | |
CN110026358A (zh) | 集成电路芯片测试编带机次品收集装置及方法 | |
CN105223089A (zh) | 一种超薄型磁性组件自动化检测装置及其检测方法 | |
CN206854129U (zh) | 一种管接头分拣装置 | |
CN112808617A (zh) | 一种管件搬送检查装置 | |
CN215572699U (zh) | 一种产品尺寸检测设备 | |
CN211100239U (zh) | 一种外观件检查机 | |
CN205887465U (zh) | 一种网络变压器的平面度检测及区分设备 | |
CN211385857U (zh) | 玻瓶检测装置 | |
CN114334698A (zh) | 一种可实现晶元芯片自动检测及分类的智能设备 | |
CN113857080A (zh) | 一种集成芯片pin检测与不良品分类设备及检测分类方法 | |
CN105044580B (zh) | 一种改进型二极管快速检测器 | |
CN218890859U (zh) | 一种pet瓶测漏设备 | |
CN218401291U (zh) | 一种分料装置 | |
CN211488637U (zh) | 一种自动检测分类装置 | |
CN221395715U (zh) | 一种饮料瓶灌装检测机 | |
CN219723741U (zh) | 集成电路芯片分选***的单导轨分料装置 | |
CN219233162U (zh) | 一种金属管类长度检测装置 | |
CN218664022U (zh) | 一种可翻料的传送装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A cake feeding device with defect detection function Effective date of registration: 20210701 Granted publication date: 20200908 Pledgee: Hefei high tech Company limited by guarantee Pledgor: ANHUI DAHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: Y2021980005627 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230626 Granted publication date: 20200908 Pledgee: Hefei high tech Company limited by guarantee Pledgor: ANHUI DAHUA SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: Y2021980005627 |