CN109016051A - A kind of novel reed plate - Google Patents
A kind of novel reed plate Download PDFInfo
- Publication number
- CN109016051A CN109016051A CN201811048843.3A CN201811048843A CN109016051A CN 109016051 A CN109016051 A CN 109016051A CN 201811048843 A CN201811048843 A CN 201811048843A CN 109016051 A CN109016051 A CN 109016051A
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- China
- Prior art keywords
- adhesive
- urea
- sesame protein
- quality
- reed plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
Abstract
A kind of novel reed plate provided by the invention, including reed and high-performance composite adhesive, its production technology is that reed and high-performance composite adhesive are carried out to mixing to mat formation, roll and the forming of saw side, wherein high-performance composite adhesive is by adding filler in inorganic adhesive, increase defect in the skeleton structure of silica, to promote the interaction between different nano particles, gumminess is improved.Promote the crosslinking degree between sesame protein by additive, improves its gumminess.Finally by inorganic adhesive and biological adhesive is compound, interaction between the two is improved, to improve the performance of final products.The adhesive production procedure is simple, and cost of material is low, environmental-friendly, green, has obviously application value.
Description
Technical field
The present invention relates to artificial board production field, in particular to a kind of novel reed plate.
Background technique
China is the very short country of a forest reserves, and currently there are many wood-base fibre and particle panel material factory and office stops in halt production or partly
Production stage, reason are exactly that raw material is in short supply, and enterprise can not undertake the cost of material of raising.Developing straw plant, this is huge
Living resources can alleviate the contradiction of wood-based plate wood material shortage.China's reed sediment substrate is abundant, and widely distributed and concentration is gathered around
There is the good condition for developing artificial board of straw.The research of reed wood-based plate can provide a kind of new raw material for Wood-based Panel Production, right
In protecting forest resources, alleviate timber supply and demand contradiction, expand reed purposes, drives the economic development of reed producing region significant.
Reed fiber state is similar to the poor broadleaf of material, thus intensity is preferable, this is the performance of reed flakeboard
Some cases greater than certain wood particulate plates the reason of.The maximum moisture absorption rate of reed stalk is 24.49%, maximum water absorption rate 149%,
Lower than timber and cotton stalk, therefore reed wood-based plate water resistance is better than timber wood-based plate.
The presence of wax coat causes reed surface wettability poor, interferes reacting between adhesive and reed.In order to make
Glue performance plate up to standard is obtained, the wettability of raw material need to be enhanced, makes the surface tension of glue lower than reed.It therefore need to be to original
Material is pre-processed to eliminate wax and extract, to improve plate glue performance.
Although can produce performance reed flakeboard up to standard using MDI adhesive, resin added is high, expensive,
It and is to be difficult to avoid that organic pollution always.
In recent years, to solve the above-mentioned problems, natural biomass materials prepare grinding for adhesive substitution formaldehydes adhesive
Study carefully and is increasingly becoming research hotspot.Vegetable protein adhesive has many advantages, such as that raw material sources are abundant, cheap, non-toxic, but its
Water resistance is poor, can not meet production requirement.We have found that having by adding suitable inorganic adhesive in biological adhesive
Help that High-performance adhesive is made.The object of the invention is just to provide for a kind of method for preparing this adhesive.
Summary of the invention
The purpose of the present invention is overcome the deficiencies of the prior art and provide a kind of novel reed plate.
To achieve the goals above, a kind of novel reed plate provided by the invention, including reed and the compound gluing of high-performance
Agent, production technology is that reed and high-performance composite adhesive are carried out to mixing to mat formation, roll and saw side forming, wherein high
The preparation flow of performance composite adhesive are as follows:
A. 5 ~ 30 g nano silicas are weighed and are dispersed in 100 mL deionized waters obtained silica solution, then take AlCl3、Al2O3、
The fillers such as MgO, ZnO are mixed with above-mentioned silica solution after mixing, are placed in dispersion sand mill and are uniformly dispersed, obtain inorganic glue
Glutinous agent A.In above-mentioned steps, the nano silica partial size is 20 ~ 50 nm.AlCl3、Al2O3, the fillers such as MgO, ZnO
Additive amount is respectively 1 ~ 5%, 1 ~ 4%, 1 ~ 4%, the 2 ~ 5% of nano silica quality.Filler primarily to silica bone
Increase defect in frame structure, to promote the interaction between different nano particles, improves gumminess.
B. 5 ~ 30g of sesame protein is weighed, is added in 200 mL urea liquids, stirs 20 min under conditions of 25 DEG C,
Tributyl phosphate is added while stirring, it is glyoxal solution or zinc oxide that mass concentration, which is then added, is stirred under conditions of 25 DEG C
30 ~ 60 min are mixed, urea-modified sesame protein adhesive B is obtained.The preparation of above-mentioned urea-modified sesame protein adhesive B
In the process, the urea concentration is 2 ~ 3 mol/L.Glyoxal solution concentration is 40%.The quality of glyoxal is sesame protein
The 4 ~ 18% of quality.If the quality of zinc oxide is the 4 ~ 18% of sesame protein quality using zinc oxide.Tributyl phosphate be for
Eliminate the foam generated in whipping process, and glyoxal or zinc oxide effect is promote the crosslinking degree between sesame protein,
Improve gumminess.
C. A is poured into B, after being vigorously stirred 10 min, is placed in dispersion sand mill and is uniformly dispersed to get compound adhesive is arrived
Glutinous agent.
A kind of novel reed plate provided by the invention passes through compound, both raisings by inorganic adhesive and biological adhesive
Between interaction, to improve the gluing ability of product.The adhesive production procedure is simple, and cost of material is low, environment
Friendly, green, has obviously application value.
Specific embodiment
Embodiment 1
To achieve the goals above, a kind of novel reed plate provided by the invention, including reed and high-performance composite adhesive,
Production technology is that reed and high-performance composite adhesive are carried out to mixing to mat formation, roll and saw side forming, wherein high-performance
The preparation flow of composite adhesive are as follows:
A. 5 ~ 30 g nano silicas are weighed and are dispersed in 100 mL deionized waters obtained silica solution, then take AlCl3、Al2O3、
The fillers such as MgO, ZnO are mixed with above-mentioned silica solution after mixing, are placed in dispersion sand mill and are uniformly dispersed, obtain inorganic glue
Glutinous agent A.In above-mentioned steps, the nano silica partial size is 20 ~ 50 nm.AlCl3、Al2O3, the fillers such as MgO, ZnO
Additive amount is respectively 1 ~ 5%, 1 ~ 4%, 1 ~ 4%, the 2 ~ 5% of nano silica quality.
B. 5 ~ 30g of sesame protein is weighed, is added in 200 mL urea liquids, stirs 20 min under conditions of 25 DEG C,
Tributyl phosphate is added while stirring, it is glyoxal solution or zinc oxide that mass concentration, which is then added, is stirred under conditions of 25 DEG C
30 ~ 60 min are mixed, urea-modified sesame protein adhesive B is obtained.The preparation of above-mentioned urea-modified sesame protein adhesive B
In the process, the urea concentration is 2 ~ 3 mol/L.Glyoxal solution concentration is 40%.The quality of glyoxal is sesame protein
The 4 ~ 18% of quality.If the quality of zinc oxide is the 4 ~ 18% of sesame protein quality using zinc oxide.
C. A is poured into B, after being vigorously stirred 10 min, is placed in dispersion sand mill and is uniformly dispersed to get compound adhesive is arrived
Glutinous agent.
In order to reach test purpose, adhesive is prepared for according to parameters described below.The nano silica partial size used is 20
nm。AlCl3、Al2O3, the fillers such as MgO, ZnO additive amount be respectively 2%, 2%, 3%, the 2% of nano silica quality.Urea changes
Property sesame protein adhesive B preparation process in, the urea concentration be 2.5 mol/L.Glyoxal solution concentration is
40%.The quality of glyoxal is the 6% of sesame protein quality.If the quality of zinc oxide is sesame protein using zinc oxide
The 6% of amount.According to adhesive prepared by this process, using with the Lauxite identical processing conditions of preparation reed plate and identical
Resin added, the internal bond strength of the reed plate manufactured experimently is the 128% of Lauxite glued board.
Embodiment 2
The nano silica partial size used is 40 nm.AlCl3、Al2O3, the fillers such as MgO, ZnO additive amount be respectively nanometer
2%, 2%, 3%, the 2% of silica quality.In the preparation process of urea-modified sesame protein adhesive B, the urea is dense
Degree is 2.5 mol/L.Glyoxal solution concentration is 40%.The quality of glyoxal is the 6% of sesame protein quality.If using oxygen
Change zinc, then the quality of zinc oxide is the 6% of sesame protein quality.According to adhesive prepared by this process, use and Lauxite
The identical processing conditions of reed plate and identical resin added are prepared, the internal bond strength for the reed plate manufactured experimently is Lauxite
The 117% of glued board.
Embodiment 3
The nano silica partial size used is 20 nm.AlCl3、Al2O3, the fillers such as MgO, ZnO additive amount be respectively nanometer
5%, 4%, 4%, the 5% of silica quality.In the preparation process of urea-modified sesame protein adhesive B, the urea is dense
Degree is 2.5 mol/L.Glyoxal solution concentration is 40%.The quality of glyoxal is the 6% of sesame protein quality.If using oxygen
Change zinc, then the quality of zinc oxide is the 6% of sesame protein quality.According to adhesive prepared by this process, use and Lauxite
The identical processing conditions of reed plate and identical resin added are prepared, the internal bond strength for the reed plate manufactured experimently is Lauxite
The 111% of glued board.
Embodiment 4
The nano silica partial size used is 20 nm.AlCl3、Al2O3, the fillers such as MgO, ZnO additive amount be respectively nanometer
2%, 2%, 3%, the 2% of silica quality.In the preparation process of urea-modified sesame protein adhesive B, the urea is dense
Degree is 2.5 mol/L.Glyoxal solution concentration is 40%.The quality of glyoxal is the 14% of sesame protein quality.If using oxygen
Change zinc, then the quality of zinc oxide is the 14% of sesame protein quality.According to this process prepare adhesive, using with ureaformaldehyde tree
Rouge prepares the identical processing conditions of reed plate and identical resin added, and the internal bond strength for the reed plate manufactured experimently is ureaformaldehyde tree
The 109% of rouge glued board.
Embodiment 5
The nano silica partial size used is 20 nm.AlCl3、Al2O3, the fillers such as MgO, ZnO additive amount be respectively nanometer
2%, 2%, 3%, the 2% of silica quality.In the preparation process of urea-modified sesame protein adhesive B, the urea is dense
Degree is 2 mol/L.Glyoxal solution concentration is 40%.The quality of glyoxal is the 6% of sesame protein quality.If using oxidation
Zinc, then the quality of zinc oxide is the 6% of sesame protein quality.According to this process prepare adhesive, using with Lauxite system
The standby identical processing conditions of reed plate and identical resin added, the internal bond strength for the reed plate manufactured experimently are urea-formaldehyde resin adhesive
The 122% of plywood.
Embodiment 6
The nano silica partial size used is 20 nm.AlCl3、Al2O3, the fillers such as MgO, ZnO additive amount be respectively nanometer
2%, 2%, 3%, the 2% of silica quality.In the preparation process of urea-modified sesame protein adhesive B, the urea is dense
Degree is 3 mol/L.Glyoxal solution concentration is 40%.The quality of glyoxal is the 6% of sesame protein quality.If using oxidation
Zinc, then the quality of zinc oxide is the 6% of sesame protein quality.According to this process prepare adhesive, using with Lauxite system
The standby identical processing conditions of reed plate and identical resin added, the internal bond strength for the reed plate manufactured experimently are urea-formaldehyde resin adhesive
The 116% of plywood.
Claims (7)
1. a kind of novel reed plate, which is characterized in that including reed and high-performance composite adhesive, production technology is by reed
Mixing, which is carried out, with high-performance composite adhesive mats formation, rolls and saw side forming, the wherein preparation of high-performance composite adhesive
Process are as follows:
A. 5 ~ 30 g nano silicas are weighed and are dispersed in 100 mL deionized waters obtained silica solution, then take AlCl3、Al2O3、
The fillers such as MgO, ZnO are mixed with above-mentioned silica solution after mixing, are placed in dispersion sand mill and are uniformly dispersed, obtain inorganic glue
Glutinous agent A；
B. 5 ~ 30g of sesame protein is weighed, is added in 200 mL urea liquids, 20 min are stirred under conditions of 25 DEG C, while stirring
Mix side be added tributyl phosphate, then be added mass concentration be glyoxal solution or zinc oxide, under conditions of 25 DEG C stir 30 ~
60 min obtain urea-modified sesame protein adhesive B；
C. A is poured into B, after being vigorously stirred 10 min, is placed in dispersion sand mill and is uniformly dispersed to get composite adhesive is arrived.
2. a kind of novel reed plate according to claim 1, which is characterized in that the nano silica partial size is 20
~50 nm。
3. a kind of novel reed plate according to claim 1, which is characterized in that AlCl3、Al2O3, the fillers such as MgO, ZnO
Additive amount is respectively 1 ~ 5%, 1 ~ 4%, 1 ~ 4%, the 2 ~ 5% of nano silica quality.
4. a kind of novel reed plate according to claim 1, which is characterized in that urea-modified sesame protein adhesive B
Preparation process in, the urea concentration be 2 ~ 3 mol/L.
5. a kind of novel reed plate according to claim 1, which is characterized in that the urea-modified sesame protein glue
In the preparation process of glutinous agent B, glyoxal solution concentration is 40%.
6. a kind of novel reed plate according to claim 1, which is characterized in that the urea-modified sesame protein glue
In the preparation process of glutinous agent B, the quality of glyoxal is the 4 ~ 18% of sesame protein quality.
7. a kind of novel reed plate according to claim 1, which is characterized in that the urea-modified sesame protein glue
In the preparation process of glutinous agent B, the quality of zinc oxide is the 4 ~ 18% of sesame protein quality.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811048843.3A CN109016051A (en) | 2018-09-10 | 2018-09-10 | A kind of novel reed plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811048843.3A CN109016051A (en) | 2018-09-10 | 2018-09-10 | A kind of novel reed plate |
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| CN109016051A true CN109016051A (en) | 2018-12-18 |
Family
ID=64620734
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| CN201811048843.3A Pending CN109016051A (en) | 2018-09-10 | 2018-09-10 | A kind of novel reed plate |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181218 |
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