CN109002141B - Computer mainframe heat dissipation equipment - Google Patents
Computer mainframe heat dissipation equipment Download PDFInfo
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- CN109002141B CN109002141B CN201810877762.8A CN201810877762A CN109002141B CN 109002141 B CN109002141 B CN 109002141B CN 201810877762 A CN201810877762 A CN 201810877762A CN 109002141 B CN109002141 B CN 109002141B
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- computer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
Abstract
The invention discloses a computer mainframe box heat dissipation device, which comprises a computer case shell, a computer mainboard and a power supply, wherein the computer mainboard and the power supply are installed in the computer case shell, a semicircular ring plate is arranged between the computer case shell and the computer mainboard, the bottom of the semicircular ring plate is provided with an air inlet hole plate, a semiconductor device is arranged on the inner wall of the computer case shell positioned in the semicircular ring plate, the semiconductor device comprises a silica gel sheet attached to the back side of the computer mainboard, a scroll pole piece A is attached to the silica gel sheet, the scroll pole piece A is connected with a scroll pole piece B through a heat conduction bridge, a first miniature electric fan is embedded on the surface of the computer case shell opposite to the scroll pole piece B, a metal mesh layer is arranged between the first miniature electric fan and the scroll pole piece B, and the scroll pole piece A and the scroll pole piece B are electrically connected to the computer mainboard.
Description
Technical Field
The invention relates to the field of computer heat dissipation, in particular to a computer mainframe heat dissipation device.
Background
At present, intelligent electronic equipment such as computers, televisions and the like are widely used in daily life as an information transmission medium, along with the rapid development of information technology, the electronic equipment is continuously updated and occupies more and more important positions in daily life, as is known, because the electronic equipment uses a large amount of integrated circuits, the high temperature is a enemy of the integrated circuits, the high temperature can not only cause unstable system operation and short service life, but also can even cause that some parts are burnt, and the high-temperature heat comes from the inside of the electronic equipment or the inside of the integrated circuits, so in order to ensure the service life and the use effect of the electronic equipment, the electronic equipment is generally added with a heat dissipation function to absorb the heat generated inside the electronic equipment and then dissipate the heat to the outside of the terminal, in the related technology, the electronic equipment is provided with a certain number of heat dissipation windows, the heat dissipation window is arranged on the shell of the electronic equipment and keeps an open state, and heat generated inside the electronic equipment is dissipated to the outside of the electronic equipment through the heat dissipation window.
A plurality of components are disposed inside the enclosure, wherein the main heat generating components include, but are not limited to: CPU, display card, power etc. these 3 parts set up various heat dissipation measures respectively, for example fan etc. all are uncontrollable when the fan is general, very high to the combination requirement of fan then, in case a certain part high temperature will influence the service function, what so urgently need to solve is effectively to CPU, display card, power dispel the heat, and it is also very important to carry out real time monitoring to the whole radiating temperature of each computer mainframe.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the heat dissipation equipment for the computer mainframe, which improves the heat dissipation efficiency of the computer mainframe and can effectively solve the problems in the background art.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the utility model provides a computer mainframe heat dissipation equipment, includes the computer case casing to and install computer mainboard and the power in the computer case casing, be provided with the semicircle board between computer case casing and the computer mainboard, the bottom of semicircle board is provided with the air inlet board, is located be provided with semiconductor device on the inside computer case casing inner wall of semicircle board, semiconductor device is including laminating at the dorsal silica gel thin slice of computer mainboard, the laminating has scroll pole piece A on the silica gel thin slice, scroll pole piece A has connect scroll pole piece B through the heat conduction bridge, the relative computer case casing surface of scroll pole piece B inlays and is equipped with first miniature electric fan, be provided with the metal mesh layer between first miniature and the scroll pole piece B, scroll pole piece A and scroll pole piece B pass through USB interface electric connection on the computer mainboard.
Furthermore, semicircular plate both sides are provided with the bridging board device, the bridging board device includes the connecting seat, be provided with the copper contact piece on the connecting seat, be provided with the screw thread tube hole on the connecting seat of copper contact piece bottom, the connecting seat surface of screw thread tube hole bottom is provided with inlays the dress groove, install the circulating water cooling device in the dress groove, the circulating water cooling device includes plane vortex section and straight tube section to and inlet tube and the wet return of connecting on the horizontal vortex section, in the straight tube section embedding dress groove, the plane vortex section passes through the support mounting on the casing inner wall of the aircraft engine case, it is equipped with the miniature electric fan of second to inlay on the casing inner wall of the aircraft case that the plane vortex section is just right.
Further, be provided with the shape frame of returning on the casing at power top, the top dorsal surface horizontal installation of shape frame has the software plastics frame, be provided with the silica gel plate in the software plastics frame, four edges and corners of software plastics frame are provided with the screw hole, install metal radiating fin on the software plastics frame, the bottom plate and the silica gel plate laminating that metal radiating fin bottom set up are in the same place.
Furthermore, a rectangular metal frame is horizontally arranged on the back side of the clip frame positioned at the bottom, a water inlet pipe of the planar vortex pipe section winds around the clip frame positioned at the bottom from the clip frame positioned at the top, a plurality of continuous U-shaped pipe sections are formed in the rectangular metal frame, one end of each U-shaped pipe section is connected with a water return pipe of the planar vortex pipe section, a micro vortex pump is arranged on a pipeline between each U-shaped pipe section and each water return pipe, and the rectangular metal frame is just attached to the top surface of the power supply.
Further, the top of casing is provided with the top-mounted board, the top at the casing is installed through the gib block in the both sides of top-mounted board, the gib block is installed at the inside surface top of casing, top-mounted board bottom is provided with the air inlet intermediate layer, both ends surface is provided with the spout around air inlet intermediate layer one side, insert the dead lever of fixed mounting in gib block one end in the spout, both ends are provided with miniature piston rod around the air inlet intermediate layer is located one side of semicircle circle board.
Furthermore, two ends of the clip frame are mounted on the case shell through buckles, the back side of the clip frame at the top is provided with a threaded pipe hole which is the same as that of the bridging seat, the section of the clip frame is in an omega shape, a pipeline of the planar vortex pipe section penetrates through the circular part of the clip frame along the length direction, and the contact surface of the planar vortex pipe section and the clip frame is coated with heat-conducting glue.
Furthermore, an S-shaped heat conduction pipe is arranged between the metal radiating fin and the bottom plate, the heat conduction pipe transversely penetrates through the metal radiating fin, two ends of the heat conduction pipe are connected to the circular frame, and the surface of the metal radiating fin is in a corrugated tooth shape.
Furthermore, the semiconductor device, the first miniature electric fan, the second miniature electric fan, the miniature vortex pump and the miniature piston rod are controlled by an STM single chip microcomputer which is independent, and the STM single chip microcomputer supplies power through a computer mainboard.
Compared with the prior art, the invention has the beneficial effects that:
the semiconductor device is arranged on the case shell on the back side of the computer mainboard, and the semiconductor device is used for efficiently radiating heat of a heating source on the computer mainboard, wherein the semiconductor device is used for carrying out contact heat conduction on the computer mainboard through the silica gel sheet, the scroll pole piece A, the scroll pole piece B and the heat conduction bridge form the whole semiconductor refrigerating device, meanwhile, the heat conduction bridge, the metal net layer and the silica gel sheet form a scroll-shaped inner cavity, the heat conduction bridge between the scroll pole piece A and the scroll pole piece B is used for rapidly transferring heat to the metal net layer, the first miniature electric fan is used for rapidly radiating heat, and when the first miniature electric fan works, negative pressure is formed in the scroll-shaped inner cavity, so that air in the scroll-shaped inner cavity rapidly flows, the heat transfer of the heat conduction bridge is accelerated, and the heat conduction efficiency of the first miniature electric.
Drawings
FIG. 1 is a schematic view of a semiconductor device according to the present invention;
FIG. 2 is a schematic view of the installation structure of the circulating water cooling device of the present invention;
FIG. 3 is a side view perspective view of the present invention;
FIG. 4 is a schematic view of a planar scroll section configuration of the present invention;
FIG. 5 is a schematic diagram of a top mounting plate structure according to the present invention;
FIG. 6 is a schematic longitudinal sectional view of a heat conductive bridge according to the present invention;
fig. 7 is a schematic top view of a thermal bridge according to the present invention.
Reference numbers in the figures:
1-a housing of the machine box; 2-a computer motherboard; 3-a power supply; 4-semicircular plate; 5-air inlet hole plate; 6-a semiconductor device; 7-bridge plate means; 8-circulating water cooling device; 9-a second micro electric fan; 10-a clip frame; 11-soft plastic frame; 12-silica gel plate; 14-a base plate; 15-rectangular metal frame; 16-a U-shaped tube; 17-a micro vortex pump; 18-a top-mounted plate; 19-a guide bar; 20-air inlet interlayer; 21-a chute; 22-a fixation rod; 23-a miniature piston rod; 24-a heat pipe;
601-silica gel sheet; 602-scrolling pole piece a; 603-vortex pole piece B; 604-a thermally conductive bridge; 605-a first micro-electric fan; 606-a metal mesh layer;
701-a connecting seat; 702-a copper tab; 703-threaded pipe holes; 704-an embedding groove;
801-planar vortex section; 802-a straight pipe section; 803-water inlet pipe; 804-return pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 7, the present invention provides a heat dissipating apparatus of a computer main chassis, including a chassis housing 1, and a computer main board 2 and a power supply 3 which are installed in the computer case body 1, a semicircular plate 4 is arranged between the computer case body 1 and the computer main board 2, an air inlet hole plate 5 is arranged at the bottom of the semicircular plate 4, a semiconductor device 6 is arranged on the inner wall of the computer case body 1 inside the semicircular plate 4, the semiconductor device 6 comprises a silica gel sheet 601 which is attached to the back side of the computer main board 2, a scroll pole piece A602 is attached to the silica gel sheet 601, the scroll pole piece A602 is connected with a scroll pole piece B603 through a heat conduction bridge 604, a first miniature electric fan 605 is embedded on the surface of the computer case body 1 opposite to the scroll pole piece B603, a metal mesh layer is arranged between the first miniature electric fan 605 and the scroll pole piece B603, and the scroll pole piece A602 and the scroll pole piece B603 are electrically connected to the computer main.
The invention arranges the semiconductor device 6 on the case shell 1 at the back side of the computer mainboard 2, and the semiconductor device 6 is used for high-efficiency heat dissipation of the heating source on the computer mainboard 2, wherein the semiconductor device 6 conducts heat conduction by contacting the computer motherboard 2 through the silicone sheet 601, the scroll pole piece A602, the scroll pole piece B603 and the heat conduction bridge 604 form the whole semiconductor refrigeration device, meanwhile, the heat conducting bridge 604, the metal mesh layer 606 and the silica gel sheet 601 form a scroll-shaped inner cavity, rapid heat transfer to the metal mesh layer 606 occurs through the thermally conductive bridge 604 between the scroll pole piece a602 and the scroll pole piece B603, the first micro electric fan 605 can dissipate heat quickly, when the first micro electric fan 605 works, negative pressure is formed in the inner cavity of the scroll, therefore, air in the inner cavity of the scroll shape flows rapidly, the heat transfer of the heat conduction bridge 604 is accelerated, and the heat conduction efficiency is improved.
The two sides of the semicircular plate 4 are provided with bridge plate devices 7, each bridge plate device 7 comprises a connecting seat 701, a copper connecting sheet 702 is arranged on each connecting seat 701, a threaded pipe hole 703 is formed in each connecting seat 701 at the bottom of each copper connecting sheet 702, an embedded groove 704 is formed in the surface of each connecting seat 701 at the bottom of each threaded pipe hole 703, a circulating water cooling device 8 is installed in each embedded groove 704, each circulating water cooling device 8 comprises a plane vortex pipe section 801 and a straight pipe section 802, a water inlet pipe 803 and a water return pipe 804 which are connected to the horizontal vortex pipe section 801, the straight pipe section 802 is embedded into the embedded groove 704, the plane vortex pipe section 801 is installed on the inner wall of the machine case body 1 through a support, and a second micro electric fan 9 is embedded in.
The case shell 1 at the top of the power supply 3 is provided with a flexible frame 10, the back side surface of the top of the flexible frame 10 is horizontally provided with a soft plastic frame 11, a silica gel plate 12 is arranged in the soft plastic frame 11, four corners of the soft plastic frame 11 are provided with screw holes, the soft plastic frame 11 is provided with metal radiating fins, and a bottom plate 14 arranged at the bottom of each metal radiating fin is attached to the silica gel plate 12.
A rectangular metal frame 15 is horizontally arranged on the back side of the clip frame 10 at the bottom, a water inlet pipe 803 of the planar vortex pipe section 801 winds from the clip frame 10 at the top to the clip frame 10 at the bottom, a plurality of continuous U-shaped pipe sections 16 are formed in the rectangular metal frame 15, one end of each U-shaped pipe section 16 is connected to a water return pipe 804 of the planar vortex pipe section 801, a micro vortex pump 17 is arranged on a pipeline between each U-shaped pipe section 16 and each water return pipe 804, and the rectangular metal frame 15 is just attached to the top surface of the power supply 3.
The top of casing 1 is provided with top-mounted plate 18, the top at casing 1 is installed through gib block 19 in the both sides of top-mounted plate 18, gib block 19 is installed at the inside surface top of casing 1, top-mounted plate 18 bottom is provided with air inlet intermediate layer 20, both ends surface is provided with spout 21 around air inlet intermediate layer 20 one side, insert the dead lever 22 of fixed mounting in gib block 19 one end in the spout 21, both ends are provided with miniature piston rod 23 around air inlet intermediate layer 20 is located one side of semicircle board 4.
The two ends of the clip frame 10 are mounted on the chassis shell 1 through buckles, the back side of the clip frame 10 at the top is provided with a threaded pipe hole 703 which is the same as that of the bridging seat 701, the section of the clip frame 10 is in an omega shape, the pipeline of the planar vortex pipe section 801 passes through the circular part of the clip frame along the length direction, and the contact surface of the planar vortex pipe section 801 and the clip frame is coated with heat-conducting glue.
An S-shaped heat conduction pipe 24 is arranged between the metal radiating fin and the bottom plate 14, the heat conduction pipe 24 transversely penetrates through the metal radiating fin, two ends of the heat conduction pipe 24 are connected to the clip frame 10, and the surface of the metal radiating fin is in a corrugated tooth shape.
The semiconductor device 6, the first micro electric fan 605, the second micro electric fan 9, the micro vortex pump 17 and the micro piston rod 23 are controlled by an STM single chip microcomputer which is independent and supplies power through the computer mainboard 2.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a computer mainframe heat dissipation equipment, includes computer case casing (1) to and install computer mainboard (2) and power (3) in computer case casing (1), its characterized in that: a semicircular plate (4) is arranged between the case shell (1) and the computer mainboard (2), an air inlet hole plate (5) is arranged at the bottom of the semicircular plate (4), a semiconductor device (6) is arranged on the inner wall of the case shell (1) positioned in the semicircular plate (4), the semiconductor device (6) comprises a silica gel sheet (601) adhered to the back side of the computer mainboard (2), a scroll pole piece A (602) is attached to the silicone sheet (601), the scroll pole piece A (602) is connected with a scroll pole piece B (603) through a heat conduction bridge (604), a first miniature electric fan (605) is embedded on the surface of the case shell (1) opposite to the scroll pole piece B (603), a metal screen layer (606) is arranged between the first micro electric fan (605) and the scroll pole piece B (603), the scroll pole piece A (602) and the scroll pole piece B (603) are electrically connected to the computer mainboard (2) through a USB interface.
2. The heat dissipating device of a computer mainframe according to claim 1, wherein: bridging plate devices (7) are arranged on two sides of the semicircular plate (4), the bridging plate devices (7) comprise connecting seats (701), a copper connecting sheet (702) is arranged on the connecting seat (701), a threaded pipe hole (703) is arranged on the connecting seat (701) at the bottom of the copper connecting sheet (702), the surface of the connecting seat (701) at the bottom of the threaded pipe hole (703) is provided with an embedded groove (704), a circulating water cooling device (8) is arranged in the embedded groove (704), the circulating water cooling device (8) comprises a plane vortex pipe section (801) and a straight pipe section (802), a water inlet pipe (803) and a water return pipe (804) connected with the horizontal vortex pipe section (801), the straight pipe section (802) is embedded into the embedding groove (704), the plane vortex section (801) is installed on the inner wall of the machine box shell (1) through a bracket, and a second miniature electric fan (9) is embedded on the inner wall of the case shell (1) opposite to the plane vortex section (801).
3. The heat dissipating device of a computer mainframe according to claim 2, wherein: be provided with back shape frame (10) on the quick-witted case casing (1) at power (3) top, the top dorsal surface horizontal installation of back shape frame (10) has software plastics frame (11), be provided with silica gel board (12) in software plastics frame (11), four corners of software plastics frame (11) are provided with the screw hole, install metal radiating fin on software plastics frame (11), bottom plate (14) and silica gel board (12) the laminating that metal radiating fin bottom set up are in the same place.
4. The heat dissipating device of a computer mainframe according to claim 3, wherein: the water return device is characterized in that a rectangular metal frame (15) is horizontally arranged on the back side of a clip frame (10) at the bottom, a water inlet pipe (803) of a planar vortex pipe section (801) winds around the clip frame (10) at the bottom from the clip frame (10) at the top, a plurality of continuous U-shaped pipe sections (16) are formed in the rectangular metal frame (15), one end of each U-shaped pipe section (16) is connected into a water return pipe (804) of the planar vortex pipe section (801), a miniature vortex pump (17) is arranged on a pipeline between each U-shaped pipe section (16) and each water return pipe (804), and the rectangular metal frame (15) is just attached to the top surface of a power supply (3).
5. The heat dissipating device of a computer mainframe according to claim 1, wherein: the top of quick-witted case casing (1) is provided with top-mounted board (18), the top at quick-witted case casing (1) is installed through gib block (19) in the both sides of top-mounted board (18), gib block (19) are installed at the inboard surface top of quick-witted case casing (1), top-mounted board (18) bottom is provided with air inlet intermediate layer (20), both ends surface is provided with spout (21) around air inlet intermediate layer (20) one side, insert in spout (21) dead lever (22) of fixed mounting in gib block (19) one end, both ends are provided with miniature piston rod (23) around air inlet intermediate layer (20) is located one side of semicircle board (4).
6. The heat dissipating device of a computer mainframe according to claim 3, wherein: the two ends of the clip frame (10) are mounted on the case shell (1) through buckles, the back side of the clip frame (10) at the top is provided with a threaded pipe hole (703) which is the same as that of the bridging seat (701), the section of the clip frame (10) is in an omega shape, a pipeline of the planar vortex pipe section (801) penetrates through the circular part of the clip frame along the length direction, and the contact surface of the planar vortex pipe section (801) and the clip frame is coated with heat-conducting glue.
7. The heat dissipating device of a computer mainframe according to claim 3, wherein: an S-shaped heat conduction pipe (24) is arranged between the metal radiating fins and the bottom plate (14), the heat conduction pipe (24) transversely penetrates through the metal radiating fins, two ends of the heat conduction pipe (24) are connected to the clip-shaped frame (10), and the surfaces of the metal radiating fins are in corrugated tooth shapes.
8. The heat dissipating device of a computer mainframe according to claim 1, wherein: the semiconductor device (6), the first micro electric fan (605), the second micro electric fan (9), the micro vortex pump (17) and the micro piston rod (23) are controlled by an STM single chip microcomputer which is independent, and the STM single chip microcomputer supplies power through a computer mainboard (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810877762.8A CN109002141B (en) | 2018-08-03 | 2018-08-03 | Computer mainframe heat dissipation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810877762.8A CN109002141B (en) | 2018-08-03 | 2018-08-03 | Computer mainframe heat dissipation equipment |
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| CN109002141A CN109002141A (en) | 2018-12-14 |
| CN109002141B true CN109002141B (en) | 2021-06-25 |
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| CN201810877762.8A Active CN109002141B (en) | 2018-08-03 | 2018-08-03 | Computer mainframe heat dissipation equipment |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110703890B (en) * | 2019-12-05 | 2020-04-14 | 北京中航科电测控技术股份有限公司 | Radiator based on dragon core processor |
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| CN203941491U (en) * | 2014-07-15 | 2014-11-12 | 铁岭师范高等专科学校 | A kind of movable computer cabinet of high heat dispersion |
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| CN109002141A (en) | 2018-12-14 |
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Inventor after: Sheng Ruilian Inventor after: Xie Zhixiong Inventor before: Sheng Ruilian |
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