CN109002134A - A kind of radiating structure of computer - Google Patents
A kind of radiating structure of computer Download PDFInfo
- Publication number
- CN109002134A CN109002134A CN201810753109.0A CN201810753109A CN109002134A CN 109002134 A CN109002134 A CN 109002134A CN 201810753109 A CN201810753109 A CN 201810753109A CN 109002134 A CN109002134 A CN 109002134A
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- CN
- China
- Prior art keywords
- heat
- cabinet
- pipe
- computer
- chilling plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of radiating structure of computer, including air inlet fan, exhaust fan and radiator structure ontology；Radiator structure ontology includes air intake cover, blast pipe, heat conducting pipe, discharge pipe and the outlet housing being linked in sequence；Radiator structure ontology further includes semiconductor chilling plate, thermally conductive sheet and heat-dissipating pipe；The heating surface of semiconductor chilling plate is bonded with the bottom of heat conducting pipe, and the chill surface of semiconductor chilling plate is bonded with thermally conductive sheet；Thermally conductive sheet is bonded with CPU, for absorbing the heat of CPU generation；Heat-dissipating pipe is arranged in heat conducting pipe, for absorbing the heat of semiconductor chilling plate generation；Air inlet fan is arranged on the one side of cabinet, for blasting outside air in radiator structure ontology；Air draft, which dissipates, to be oppositely arranged on the another side of cabinet, for the intrinsic air of radiator structure to be expelled to the outside of cabinet；Air intake cover is arranged on the cabinet, for covering air inlet fan；Outlet housing is arranged on cabinet, for covering exhaust fan；Realize the benign cooling to CPU.
Description
Technical field
The present invention relates to radiator structure fields, more particularly to a kind of radiating structure of computer.
Background technique
In computer systems, the power of central processing unit (CPU) is increasing, leads to its generation in the process of running
Heat it is more and more, if the heat dissipation problem of central processing unit can not be solved preferably, will lead to computer can not be just
Normal work.
Existing radiator structure because radiating rate is slower, and cannot by the heat fast transfer of generation to the outside of cabinet,
And cause heat dissipation effect poor.
Summary of the invention
In order to solve radiator structure because radiating rate is slower, and cannot by outside the heat fast transfer to cabinet of generation,
Caused by the poor technical problem of heat dissipation effect, the present invention proposes a kind of radiating structure of computer.
Technical problem of the invention is resolved by technical solution below:
A kind of radiating structure of computer, including air inlet fan, exhaust fan and radiator structure ontology；The radiator structure ontology packet
Include air intake cover, blast pipe, heat conducting pipe, discharge pipe and the outlet housing of sequential connection；The radiator structure ontology further includes semiconductor
Cooling piece, thermally conductive sheet and heat-dissipating pipe；The heating surface of the semiconductor chilling plate is bonded with the bottom of the heat conducting pipe, described partly to lead
The chill surface of body cooling piece is bonded with the thermally conductive sheet；The thermally conductive sheet is bonded with CPU, for absorbing the heat of CPU generation；Institute
It states heat-dissipating pipe to be arranged in the heat conducting pipe, the heat generated for absorbing the semiconductor chilling plate；The air inlet fan setting
On the one side of cabinet, for outside air to be blasted in the radiator structure ontology；The air draft, which dissipates, is oppositely arranged on institute
It states on the another side of cabinet, for the intrinsic air of the radiator structure to be expelled to the outside of the cabinet；It is described into
Fan housing is arranged on the cabinet, for covering the air inlet fan；The outlet housing is arranged on the cabinet, for covering
State exhaust fan.
Further, thermal insulation layer is provided on the outer surface of the heat conducting pipe, the discharge pipe and the outlet housing.
Further, the thermal insulation layer includes insulating moulding coating or heat barrier foam.
Further, heat-conducting silicone grease is coated between the semiconductor chilling plate and the heat conducting pipe.
Further, heat-conducting silicone grease is coated between the semiconductor chilling plate and the thermally conductive sheet.
Further, the material of the thermally conductive sheet includes silver, copper or aluminium.
Further, the material of the heat conducting pipe and the heat-dissipating pipe includes including silver, copper or aluminium.
Further, screw rod connection sheet is provided on the air intake cover and the outlet housing；The air intake cover and it is described go out
Fan housing is threadedly coupled by the screw rod connection sheet and screw rod with the cabinet respectively.
Further, the model TEC1-12706 of the semiconductor chilling plate.
Further, the periphery of the thermally conductive sheet and the semiconductor chilling plate uses 704 silica gel or and epoxy resin
Sealing.
The beneficial effect of the present invention compared with the prior art includes:
Radiating structure of computer in the present invention, including air inlet fan, exhaust fan and radiator structure ontology；The radiator structure
Ontology includes air intake cover, blast pipe, heat conducting pipe, discharge pipe and the outlet housing being linked in sequence；The radiator structure ontology further includes
Semiconductor chilling plate, thermally conductive sheet and heat-dissipating pipe；The heating surface of the semiconductor chilling plate is bonded with the bottom of the heat conducting pipe, institute
The chill surface for stating semiconductor chilling plate is bonded with the thermally conductive sheet；The thermally conductive sheet is bonded with CPU, for absorbing CPU generation
Heat；The heat-dissipating pipe is arranged in the heat conducting pipe, the heat generated for absorbing the semiconductor chilling plate；The air inlet
Fan is arranged on the one side of cabinet, for blasting outside air in the radiator structure ontology；The air draft dephasing is to setting
It sets on the another side of the cabinet, for the intrinsic air of the radiator structure to be expelled to the outside of the cabinet；
The air intake cover is arranged on the cabinet, for covering the air inlet fan；The outlet housing is arranged on the cabinet, is used for
Cover the exhaust fan；The temperature that the thermally conductive sheet is reduced by the halfbody conductor cooling piece, increases the thermally conductive sheet and institute
The temperature difference between CPU is stated, so that the heat that the CPU is generated is transferred quickly on the thermally conductive sheet, to reduce the CPU's
Temperature；But the chill surface of the semiconductor chilling plate, while fast-refrigerating, heating surface can generate a large amount of heat,
If above-mentioned heat to be expelled to the outside of cabinet not in time, it will cause the bulk temperature of cabinet inside to rise rapidly, influence
The normal work of other components；In order to solve this problem, using the heat conducting pipe and the heat-dissipating pipe by semiconductor chilling plate
The amount of heat of generation absorbs, then passes through air inlet fan, the air intake cover, the blast pipe, the discharge pipe, the outlet air
Cover dissipates the outside that the heat that the heat-dissipating pipe absorbs is expelled to the cabinet by cooperation with the air draft, to realize to CPU's
Benign cooling.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of radiator structure ontology in a certain embodiment radiating structure of computer of the present invention.
Fig. 2 is the structural blast schematic diagram of radiator structure ontology in Fig. 1.
Fig. 3 is the main view of radiator structure ontology in Fig. 1.
Fig. 4 is the side view of radiator structure ontology in Fig. 1.
Wherein, 1, air intake cover；2, blast pipe；3, thermally conductive sheet；4, cooling piece；5, heat conducting pipe；6, discharge pipe；7, outlet housing；
8, heat-dissipating pipe.
Specific embodiment
Below against attached drawing and in conjunction with preferred embodiment, the invention will be further described.
With reference to Fig. 1-4, radiating structure of computer in the present embodiment, including air inlet fan (not shown), exhaust fan (figure
In be not shown) and radiator structure ontology；The radiator structure ontology includes the air intake cover 1 being linked in sequence, blast pipe 2, heat conducting pipe
5, discharge pipe 6 and outlet housing 7；The radiator structure ontology further includes semiconductor chilling plate 4, thermally conductive sheet 3 and heat-dissipating pipe 8；It is described
The heating surface of semiconductor chilling plate 4 is bonded with the bottom of the heat conducting pipe 5；The semiconductor chilling plate 4 and the heat conducting pipe 5 it
Between be coated with heat-conducting silicone grease；The chill surface of the semiconductor chilling plate 4 is bonded with the thermally conductive sheet 3；The semiconductor chilling plate 4 with
Heat-conducting silicone grease is coated between the thermally conductive sheet 3；The model TEC1-12706 of the semiconductor chilling plate 4；The thermally conductive sheet 3 with
CPU fitting, for absorbing the heat of CPU generation；The material of the thermally conductive sheet 3 is copper；The thermally conductive sheet 3 and the semiconductor system
Cold 4 periphery uses 704 silica gel sealings；The purpose of sealing is the generation of dew in order to prevent；The heat-dissipating pipe 8 is arranged in institute
It states in heat conducting pipe 5, the heat generated for absorbing the semiconductor chilling plate 4；The material of the heat conducting pipe 5 and the heat-dissipating pipe 8
Matter is copper；The air inlet fan is arranged on the one side of cabinet, for blasting outside air in the radiator structure ontology；Institute
State air draft dissipate be oppositely arranged on the another side of the cabinet, for the intrinsic air of the radiator structure to be expelled to institute
State the outside of cabinet；The air intake cover 1 is arranged on the cabinet, for covering the air inlet fan；The setting of outlet housing 7 exists
On the cabinet, for covering the exhaust fan；On the outer surface of the heat conducting pipe 5, the discharge pipe 6 and the outlet housing 7
It is provided with thermal insulation layer (not shown)；The thermal insulation layer is insulating moulding coating；It is arranged on the air intake cover 1 and the outlet housing 7
There is screw rod connection sheet (not shown)；The air intake cover 1 and the outlet housing 7 pass through the screw rod connection sheet and screw rod respectively
It is threadedly coupled with the cabinet.
It writes a composition the deformation of the present embodiment, the thermal insulation layer and can be heat barrier foam.
The material of the deformation of composition the present embodiment, the thermally conductive sheet 3 can also be silver or aluminium.
The material of the deformation of composition the present embodiment, the heat conducting pipe 5 and the heat-dissipating pipe 8 can also be silver or aluminium.
The periphery of the deformation of composition the present embodiment, the thermally conductive sheet 3 and the semiconductor chilling plate 4 can also use epoxy
Resin seal.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those skilled in the art to which the present invention belongs, it is not taking off
Under the premise of from present inventive concept, several equivalent substitute or obvious modifications can also be made, and performance or use is identical, all answered
When being considered as belonging to protection scope of the present invention.
Claims (10)
1. a kind of radiating structure of computer, which is characterized in that including air inlet fan, exhaust fan and radiator structure ontology；The heat dissipation
Structural body includes air intake cover, blast pipe, heat conducting pipe, discharge pipe and the outlet housing being linked in sequence；The radiator structure ontology is also
Including semiconductor chilling plate, thermally conductive sheet and heat-dissipating pipe；It pastes the bottom of the heating surface of the semiconductor chilling plate and the heat conducting pipe
It closes, the chill surface of the semiconductor chilling plate is bonded with the thermally conductive sheet；The thermally conductive sheet is bonded with CPU, is produced for absorbing CPU
Raw heat；The heat-dissipating pipe is arranged in the heat conducting pipe, the heat generated for absorbing the semiconductor chilling plate；It is described
Air inlet fan is arranged on the one side of cabinet, for blasting outside air in the radiator structure ontology；The air draft dephasing
To being arranged on the another side of the cabinet, for the intrinsic air of the radiator structure to be expelled to the outer of the cabinet
Portion；The air intake cover is arranged on the cabinet, for covering the air inlet fan；The outlet housing is arranged on the cabinet,
For covering the exhaust fan.
2. radiating structure of computer as described in claim 1, which is characterized in that the heat conducting pipe, the discharge pipe and described
Thermal insulation layer is provided on the outer surface of outlet housing.
3. radiating structure of computer as claimed in claim 2, which is characterized in that the thermal insulation layer include insulating moulding coating or every
Thermal foam.
4. radiating structure of computer as described in claim 1, which is characterized in that the semiconductor chilling plate and the heat conducting pipe
Between be coated with heat-conducting silicone grease.
5. radiating structure of computer as described in claim 1, which is characterized in that the semiconductor chilling plate and the thermally conductive sheet
Between be coated with heat-conducting silicone grease.
6. radiating structure of computer as described in claim 1, which is characterized in that the material of the thermally conductive sheet include silver, copper or
Person's aluminium.
7. radiating structure of computer as described in claim 1, which is characterized in that the material of the heat conducting pipe and the heat-dissipating pipe
Including including silver, copper or aluminium.
8. radiating structure of computer as described in claim 1, which is characterized in that be arranged on the air intake cover and the outlet housing
There is screw rod connection sheet；The air intake cover and the outlet housing pass through the screw rod connection sheet and screw rod and the cabinet screw thread respectively
Connection.
9. radiating structure of computer as described in claim 1, which is characterized in that the model of the semiconductor chilling plate
TEC1-12706。
10. radiating structure of computer as described in claim 1, which is characterized in that the thermally conductive sheet and the semiconductor refrigerating
The periphery of piece is sealed using 704 silica gel or with epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810753109.0A CN109002134A (en) | 2018-07-10 | 2018-07-10 | A kind of radiating structure of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810753109.0A CN109002134A (en) | 2018-07-10 | 2018-07-10 | A kind of radiating structure of computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109002134A true CN109002134A (en) | 2018-12-14 |
Family
ID=64598932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810753109.0A Pending CN109002134A (en) | 2018-07-10 | 2018-07-10 | A kind of radiating structure of computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109002134A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110597319A (en) * | 2019-09-30 | 2019-12-20 | 菏泽学院 | Intelligent household temperature monitoring device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106406477A (en) * | 2016-10-31 | 2017-02-15 | 华南理工大学 | Tandem type CPU heat dissipating and cooling device |
| CN107202375A (en) * | 2017-07-07 | 2017-09-26 | 佛山领新信息科技有限公司 | A kind of air purifier based on bladeless fan |
| CN107506002A (en) * | 2017-09-18 | 2017-12-22 | 安徽工程大学 | A kind of interior circulating enclosed heat-radiating chassis for computer |
| CN108733185A (en) * | 2018-08-09 | 2018-11-02 | 紫光股份有限公司 | A kind of thermoelectric radiating device for blade server central processing unit |
-
2018
- 2018-07-10 CN CN201810753109.0A patent/CN109002134A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106406477A (en) * | 2016-10-31 | 2017-02-15 | 华南理工大学 | Tandem type CPU heat dissipating and cooling device |
| CN107202375A (en) * | 2017-07-07 | 2017-09-26 | 佛山领新信息科技有限公司 | A kind of air purifier based on bladeless fan |
| CN107506002A (en) * | 2017-09-18 | 2017-12-22 | 安徽工程大学 | A kind of interior circulating enclosed heat-radiating chassis for computer |
| CN108733185A (en) * | 2018-08-09 | 2018-11-02 | 紫光股份有限公司 | A kind of thermoelectric radiating device for blade server central processing unit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110597319A (en) * | 2019-09-30 | 2019-12-20 | 菏泽学院 | Intelligent household temperature monitoring device |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181214 |
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| RJ01 | Rejection of invention patent application after publication |