CN205052051U - Thermal module is mixed to forced air cooling, water -cooling based on semiconductor refrigeration - Google Patents
Thermal module is mixed to forced air cooling, water -cooling based on semiconductor refrigeration Download PDFInfo
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- CN205052051U CN205052051U CN201520817285.8U CN201520817285U CN205052051U CN 205052051 U CN205052051 U CN 205052051U CN 201520817285 U CN201520817285 U CN 201520817285U CN 205052051 U CN205052051 U CN 205052051U
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Abstract
The utility model discloses a thermal module is mixed to forced air cooling, water -cooling based on semiconductor refrigeration, including frame, radiator unit, gear constant delivery pump, inlet outlet temperature sensor, inlet outlet auto -lock liquid stream joint, guide formula overflow valve, power module etc. Water inlet auto -lock liquid stream connects with radiator unit's water inlet continuously, still sets up water inlet temperature sensor on water inlet auto -lock liquid stream connects, and the gear constant delivery pump is connected to radiator unit's delivery port, and another termination delivery port auto -lock liquid stream of gear constant delivery pump connects, on connecting, delivery port auto -lock liquid stream sets up delivery port temperature sensor, parallelly connected guide formula overflow valve on the gear constant delivery pump. This forced air cooling, water -cooling mix thermal module can provide the cooling water that is less than ambient temperature, can normally work in strong vibratory impulse, complicated electromagnetic interference and high temperature, damp and hot environment, and the modularized design, the reliability is high, and relative forced -air cooling heat dissipation system is showing and has improved heat -sinking capability.
Description
Technical field
The utility model belongs to anti-adverse environment electronic device field, particularly a kind of air-cooled, water-cooled mixing radiating module of based semiconductor refrigeration.
Background technology
Along with developing rapidly of microelectric technique and large scale integrated circuit technology, while electronic functionalities is enriched constantly, performance improves constantly, powder consumption of electronic equipment, unit volume heat also significantly increase thereupon.The ruggedized electronics equipment used in current Industry Control electronic equipment, adverse circumstances generally adopts air blast cooling heat dissipation technology, although structure is simple, reliability is high, cost is lower, but because the factor such as low by atmospheric density, thermal capacitance is little, heat exchange coefficient is low limits, the general heat-sinking capability of wind-cooling heat dissipating electronic equipment is less, be only applicable to that device heating power density is little and heat-dissipating space is large when.
Semiconductor refrigerating technology mechanical running part, aneroid, gas working media, cooling parameters not by direction in space and gravity effect, can under strong vibration environment reliably working, and speed of action is fast, long service life, is easy to control; By switch current direction, refrigerator can be made to change into from refrigerating state and to heat operating state, there are refrigeration and heating two kinds of functions.
Liquid cools technology is as a kind of comparatively ripe heat dissipation technology, all be widely used in the cooling system of automobile, high-performance commercial server, as the XW9400 water-cooled work station electronic equipment dissipating heat system etc. of IBM Corporation Aquasar water-cooled supercomputer, Hewlett-Packard Corporation all the time.Perfect through development, liquid cools technology is constantly applied to high performance electronics field and anti-adverse environment electronic device field, and water-cooled electronic equipment dissipating heat energy force rate air cooling system exceeds 3 ~ 5 doubly.
Existing water-cooled electronic equipment, multiplex in large scale electronic equipment system or high-end server field, although heat-sinking capability is higher than air-cooled electronic equipment a lot, based on fail safe, the reliability consideration of water-cooling electronic equipment, the shortcomings such as existing water-cooling electronic equipment ubiquity complex structure, volume is large, maintainability is poor, reliability is low, adaptive capacity to environment is weak, limit application and the scope of application of water-cooling electronic equipment.
Utility model content
The technical problem that the utility model solves is air-cooled, the water-cooled mixing radiating module that provide a kind of based semiconductor to freeze.
The technical solution realizing the utility model object is: it is air-cooled that a kind of based semiconductor freezes, water-cooled mixing radiating module, comprise water inlet self-locking liquid stream joint, water inlet temperature sensor, radiating subassembly, gear quantitative pump, framework, power module, wizard-like overflow valve, outlet temperature transducer, delivery port self-locking liquid stream joint, described water inlet self-locking liquid stream joint is connected with the water inlet of radiating subassembly, water inlet self-locking liquid stream joint also arranges water inlet temperature sensor, the delivery port of radiating subassembly connects gear quantitative pump, the other end of gear quantitative pump picks out mouth of a river self-locking liquid stream joint, described delivery port self-locking liquid stream joint sets out intake temperature sensor, wizard-like overflow valve in parallel on gear quantitative pump, one end of this wizard-like overflow valve is connected with the delivery port of radiating subassembly, and the other end of wizard-like overflow valve is connected with delivery port self-locking liquid stream joint, described power module is positioned at the side of framework.
The utility model compared with prior art, its remarkable advantage is: 1) air-cooled, water-cooled mixing radiating module of the present utility model all adopts modularized design, simple and compact for structure, reliability is high, maintainability is good, and air-cooled, the water-cooled mixing heat dissipation technology that adopt radiating efficiency higher replace traditional wind-cooling heat dissipating technology, and heat exchange coefficient is high, temperature gradient is little, and the heat-sinking capability of outside water-cooled electronic equipment is improve 3 ~ 5 times; 2) the utility model adopts based semiconductor Refrigeration Technique, and can be outside water-cooled electronic equipment and provide cooling water lower than ambient temperature, heat-sinking capability can meet the cooling application demand in minitype high-performance electronic equipment or small server field.
Below in conjunction with accompanying drawing, the utility model is described in further detail.
Accompanying drawing explanation
Fig. 1 is air-cooled, the water-cooled mixing radiating module schematic diagram of based semiconductor Refrigeration Technique.
Fig. 2 is radiating subassembly schematic diagram.Wherein, figure (a) is upward view, and figure (b) is front view.
In figure numbering representated by implication be: 1-water inlet plane self-locking liquid stream joint, 2-water inlet temperature sensor, 3-radiating subassembly, the main constant displacement pump of 4-, 5-framework, 6-power module, 7-wizard-like overflow valve, 8-outlet temperature transducer, 9-delivery port plane self-locking liquid stream joint, 11-semiconductor chilling plate, 12-water cooling heat exchanger, 13-fin, 14-fan assembly.
Embodiment
By reference to the accompanying drawings, of the present utility model air-cooled, water-cooled mixing radiating module structure is simple, reliability is high, maintainability is good, disclosed in the utility model, a kind of based semiconductor refrigeration is air-cooled, water-cooled mixing radiating module, comprise water inlet self-locking liquid stream joint 1, water inlet temperature sensor 2, radiating subassembly 3, gear quantitative pump 4, framework 5, power module 6, wizard-like overflow valve 7, outlet temperature transducer 8, delivery port self-locking liquid stream joint 9, described water inlet self-locking liquid stream joint 1 is connected with the water inlet of radiating subassembly 3, water inlet self-locking liquid stream joint 1 also arranges water inlet temperature sensor 2, the delivery port of radiating subassembly 3 connects gear quantitative pump 4, the other end of gear quantitative pump 4 picks out mouth of a river self-locking liquid stream joint 9, described delivery port self-locking liquid stream joint 9 sets out intake temperature sensor 8, wizard-like overflow valve 7 in parallel on gear quantitative pump 4, one end of this wizard-like overflow valve 7 is connected with the delivery port of radiating subassembly 3, and the other end of wizard-like overflow valve 7 is connected with delivery port self-locking liquid stream joint 9, described power module 6 is positioned at the side of framework 5.
Described water inlet self-locking liquid stream joint 1 and delivery port self-locking liquid stream joint 9 are all positioned at the top of framework 5.
Described framework 5 adopts high-strength aluminum alloy material.
Described framework 5 and upper cover plate, conductive rubber strip pressing between back shroud and front panel, is adopted to seal.
Described radiating subassembly 3 comprises semiconductor chilling plate 11, water cooling heat exchanger 12, fin 13 and fan assembly 14, described semiconductor chilling plate 11 is positioned at the bottom of fan assembly 14, water cooling heat exchanger 12 is positioned at the bottom of semiconductor chilling plate 11, and fin 13 is positioned at the side of fan assembly 14.
Outside water-cooled electronic equipment is connected to water inlet self-locking liquid stream joint 1 that is air-cooled, water-cooled Combined radiating module by fluid flow tube road, cooling water is the inner snakelike smooth water stream channel four peripheral wall surfaces forced-convection heat transfer with water cooling heat exchanger 10 in radiating subassembly 3 under gear quantitative pump 4 drives, heat is through semiconductor chilling plate 11, fin conductive 12, last by fan assembly 13 by heating sink in air with Forced Air Convection heat exchange, the cooling water after temperature reduces is back to outside water-cooled electronic equipment recycles through delivery port self-locking liquid stream joint 9, fluid flow tube road.Radiating subassembly 3 is cooling water circulation heat abstractor, adopts air-cooled, the water-cooled mixing heat dissipation technology of based semiconductor refrigeration, can be outside water-cooled electronic equipment and provides cooling water lower than ambient temperature.Described wizard-like overflow valve 7 is connected between wizard-like overflow valve intake-outlet, and overload protection force value is adjustable.The utility model and outside water-cooled electronic equipment, by the pipeline connection with plane fast self-locking liquid stream joint, can realize quick lock in and unblock.
Described based semiconductor Refrigeration Technique air-cooled, water-cooled mixing radiating module, framework adopts aluminium alloy design of Sealing Structure, radiating subassembly is the place of the passage that flows through of cooling fluid and heat exchange, cooling water is connected to air-cooled by fluid flow tube road, the water inlet self-locking liquid stream joint of water-cooled mixing heat abstractor, the inner snakelike smooth water stream channel four peripheral wall surfaces forced-convection heat transfer with water cooling heat exchanger under gear quantitative pump drives, heat is through semiconductor chilling plate, fin conductive, last by fan assembly by heating sink in air with Forced Air Convection heat exchange, cooling water after temperature reduces is through delivery port self-locking liquid stream joint, fluid flow tube road is back to outside water-cooled electronic equipment and recycles.Air-cooled, the water-cooled mixing radiating module of based semiconductor Refrigeration Technique, adopt semiconductor refrigerating technology, can be outside water-cooled electronic equipment and provide cooling water lower than ambient temperature, in radiating subassembly, water cooling heat exchanger inner flow passage version is simple, process, heat exchange coefficient is high.Intake-outlet is provided with the input of plane fast self-locking, exports water-cooling joint.
Air-cooled, the water-cooled mixing radiating module internal configurations of based semiconductor Refrigeration Technique have wizard-like overflow valve, be connected between gear quantitative pump intake-outlet, air-cooled when effectively can reduce pressure overload, water-cooled mixing radiating module cooling duct is damaged, leakage risk, improves that water-cooled is air-cooled, reliability, the stability of water-cooled mixing radiating module.Adopt semiconductor refrigerating technology, can be outside water-cooled electronic equipment and cooling water lower than ambient temperature is provided.Air-cooled, water-cooled mixing radiating module is realized and outside water-cooled electronic equipment quick lock in and unblock by plane fast self-locking liquid stream joint, when outside water-cooled electronic equipment and plane fast self-locking liquid stream jiont treatment put in place, hear " click " sound, joint auto lock, the automatic conducting of fluid course, when pulling the plug out of the socket, promote joint in the axial direction and rotate, joint automatic spring, joint disconnects moment fluid course automatic-sealed, is that raising modularization is air-cooled, water-cooled mixes one of key technology of heat abstractor maintenanceability.Modularization is air-cooled, water-cooled mixes heat abstractor framework and upper cover plate, adopts conductive rubber strip pressing to seal between lower cover and front panel, effectively can realize waterproof, protection against the tide, dust-proof and electromagnetic shielding, structural strength is large, can in strong vibration environment, the adverse circumstances such as damp and hot reliably working.
Below in conjunction with embodiment, further detailed description is done to the utility model:
Embodiment 1
A kind of based semiconductor Refrigeration Technique air-cooled, water-cooled mixing radiating module, comprise water inlet self-locking liquid stream joint 1, water inlet temperature sensor 2, radiating subassembly 3, gear quantitative pump 4, framework 5, power module 6, wizard-like overflow valve 7, outlet temperature transducer 8, delivery port self-locking liquid stream joint 9, described water inlet self-locking liquid stream joint 1 is connected with the water inlet of radiating subassembly 3, water inlet self-locking liquid stream joint 1 also arranges water inlet temperature sensor 2, the delivery port of radiating subassembly 3 connects gear quantitative pump 4, the other end of gear quantitative pump 4 picks out mouth of a river self-locking liquid stream joint 9, described delivery port self-locking liquid stream joint 9 sets out intake temperature sensor 8, wizard-like overflow valve 7 in parallel on gear quantitative pump 4, one end of this wizard-like overflow valve 7 is connected with the delivery port of radiating subassembly 3, and the other end of wizard-like overflow valve 7 is connected with delivery port self-locking liquid stream joint 9, described power module 6 is positioned at the side of framework 5.Described water inlet self-locking liquid stream joint 1 and delivery port self-locking liquid stream joint 9 are all positioned at the top of framework 5.Described framework 5 adopts high-strength aluminum alloy material.
Described radiating subassembly 3 comprises semiconductor chilling plate 11, water cooling heat exchanger 12, fin 13 and fan assembly 14, described semiconductor chilling plate 11 is positioned at the bottom of fan assembly 14, water cooling heat exchanger 12 is positioned at the bottom of semiconductor chilling plate 11, and fin 13 is positioned at the side of fan assembly 14.
The cooling water of outside water-cooled electronic equipment is connected to water inlet self-locking liquid stream joint 1 that is air-cooled, water-cooled mixing radiating module by fluid flow tube road, the inner snakelike smooth water stream channel four peripheral wall surfaces forced-convection heat transfer with water cooling heat exchanger 12 under gear quantitative pump 4 drives, heat is through semiconductor chilling plate 11, fin conductive 13, last by fan assembly 14 by heating sink in air with Forced Air Convection heat exchange, the cooling water after temperature reduces is back to outside water-cooled electronic equipment recycles through delivery port self-locking liquid stream joint 9, fluid flow tube road.Modularization is air-cooled, water-cooled mixing heat sink interior is configured with wizard-like overflow valve 7; be connected between gear quantitative pump 4 intake-outlet; overload protection force value is adjustable; air-cooled when effectively can reduce pressure overload, water-cooled mixing radiating module cooling duct is damaged, leakage risk, improves air-cooled, water-cooled mixing radiating module reliability, stability.
Air-cooled, water-cooled mixes radiating module and outside water-cooled electronic equipment is communicated as one by plane fast self-locking liquid stream joint, liquid stream rubber hose, can realize and the quick lock in of coolant pump and unblock.When air-cooled, water-cooled mixing radiating module to be connected with plane fast self-locking liquid stream joint put in place time, hear " click " sound, joint auto lock, the automatic conducting of fluid course, when pulling the plug out of the socket, promote joint in the axial direction and rotate, joint automatic spring, joint disconnects moment fluid course automatic-sealed.
Based semiconductor Refrigeration Technique of the present utility model air-cooled, water-cooled mixing radiating module adopts higher air-cooled of radiating efficiency, water-cooled mixing heat dissipation technology replaces traditional wind-cooling heat dissipating technology, effective minimizing wind-cooling heat dissipating form ruggedized electronics equipment and the equivalent thermal resistance in air heat-exchange stage, improve radiating efficiency, the heat-sinking capability of outside water-cooled electronic equipment can be improved 3 ~ 5 times, air-cooled, water-cooled mixing radiating module adopts modularized design, simple and compact for structure, reliability is high, maintainability is good, heat-sinking capability can meet the radiating requirements of minitype high-performance electronic device field.
Claims (5)
1. a based semiconductor refrigeration is air-cooled, water-cooled mixing radiating module, it is characterized in that, comprise water inlet self-locking liquid stream joint (1), water inlet temperature sensor (2), radiating subassembly (3), gear quantitative pump (4), framework (5), power module (6), wizard-like overflow valve (7), outlet temperature transducer (8), delivery port self-locking liquid stream joint (9), described water inlet self-locking liquid stream joint (1) is connected with the water inlet of radiating subassembly (3), water inlet self-locking liquid stream joint (1) is also arranged water inlet temperature sensor (2), the delivery port of radiating subassembly (3) connects gear quantitative pump (4), the other end of gear quantitative pump (4) picks out mouth of a river self-locking liquid stream joint (9), described delivery port self-locking liquid stream joint (9) sets out intake temperature sensor (8), the upper wizard-like overflow valve (7) in parallel of gear quantitative pump (4), one end of this wizard-like overflow valve (7) is connected with the delivery port of radiating subassembly (3), and the other end of wizard-like overflow valve (7) is connected with delivery port self-locking liquid stream joint (9), described power module (6) is positioned at the side of framework (5).
2. air-cooled, the water-cooled mixing radiating module of based semiconductor refrigeration according to claim 1, it is characterized in that, water inlet self-locking liquid stream joint (1) and delivery port self-locking liquid stream joint (9) are all positioned at the top of framework (5).
3. air-cooled, the water-cooled mixing radiating module of based semiconductor refrigeration according to claim 1, it is characterized in that, framework (5) adopts high-strength aluminum alloy material.
4. air-cooled, the water-cooled mixing radiating module of based semiconductor according to claim 3 refrigeration, is characterized in that, framework (5) and upper cover plate, adopts conductive rubber strip pressing to seal between back shroud and front panel.
5. air-cooled, the water-cooled mixing radiating module of based semiconductor refrigeration according to claim 1, it is characterized in that, radiating subassembly (3) comprises semiconductor chilling plate (11), water cooling heat exchanger (12), fin (13) and fan assembly (14), described semiconductor chilling plate (11) is positioned at the bottom of fan assembly (14), water cooling heat exchanger (12) is positioned at the bottom of semiconductor chilling plate (11), and fin (13) is positioned at the side of fan assembly (14).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520817285.8U CN205052051U (en) | 2015-10-20 | 2015-10-20 | Thermal module is mixed to forced air cooling, water -cooling based on semiconductor refrigeration |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520817285.8U CN205052051U (en) | 2015-10-20 | 2015-10-20 | Thermal module is mixed to forced air cooling, water -cooling based on semiconductor refrigeration |
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| CN205052051U true CN205052051U (en) | 2016-02-24 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105873418A (en) * | 2016-05-13 | 2016-08-17 | 镇江市高等专科学校 | Temperature reducing device for traffic monitoring host |
| CN106028762A (en) * | 2016-07-19 | 2016-10-12 | 南京工程学院 | Double-cooling comprehensive system for electric car control system |
-
2015
- 2015-10-20 CN CN201520817285.8U patent/CN205052051U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105873418A (en) * | 2016-05-13 | 2016-08-17 | 镇江市高等专科学校 | Temperature reducing device for traffic monitoring host |
| CN105873418B (en) * | 2016-05-13 | 2018-07-06 | 镇江市高等专科学校 | Traffic monitoring host heat sink |
| CN106028762A (en) * | 2016-07-19 | 2016-10-12 | 南京工程学院 | Double-cooling comprehensive system for electric car control system |
| CN106028762B (en) * | 2016-07-19 | 2018-03-27 | 南京工程学院 | A kind of double cooling integrated systems for electric vehicle control system |
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Address after: 222061 No.18, Shenghu Road, Lianyungang City, Jiangsu Province Patentee after: The 716th Research Institute of China Shipbuilding Corp. Address before: 222061 No.18, Shenghu Road, Lianyungang City, Jiangsu Province Patentee before: 716TH RESEARCH INSTITUTE OF CHINA SHIPBUILDING INDUSTRY Corp. |