CN108994453A - Ultra-short pulse laser working process parameter self-adaptation control method in numerical control processing - Google Patents
Ultra-short pulse laser working process parameter self-adaptation control method in numerical control processing Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
Abstract
The invention belongs to pulse laser Computerized Numerical Control processing technology fields, it is related to ultra-short pulse laser working process parameter self-adaptation control method in a kind of numerical control processing, in ultra-short pulse laser punching on the basis of material ablation threshold method for solving, propose the representation method of material ablation threshold when laser is mobile to be processed, and combine threshold effect correlation theory and actual processing process data, working width model and working depth model are established based on laser parameter and process velocity, finally establish ultra-short pulse laser working process parameter adaptive model, in numerical control processing, mean power and the pulse period of pulse laser can be adaptively determined according to working width and working depth, the requirement of energy Adaptive matching processing dimension, avoid the waste of material, improve machining accuracy and processing quality.
Description
Technical field
The invention belongs to pulse laser Computerized Numerical Control processing technology field, it is related to ultra-short pulse laser processing in a kind of numerical control processing
Technological parameter self-adaptation control method.
Background technique
Manufacturing industry is the primary industry, is the main body of national real economy, is the guarantee of national security, is to enhance national core
The important place of competitiveness.China is manufacture big country, but is not manufacturing power, in innovation ability, total quality and competitiveness side
All there are a certain distance with developed country in face, become apparent in accurate, Ultra-precision Turning field performance.To realize that manufacture is big
State changes this High-Interest Object to manufacturing power, and 2015, country formulated " made in China 2025 " strategy, to China's manufacturing industry
Transition and upgrade made integral deployment and selected ten big major fields as break-through point, wherein there is high speed, is accurate with intelligence
Etc. the high-grade, digitally controlled machine tools of characteristics arranging.
Laser technology combined with Numeric Control Technology generation the tool and digital control of laser processing machine can plane to various complexity and
Curved surface carries out the processing of high-precision, high efficiency and high quality.Long Pulse LASER numerical control processing is not suitable for equipment of Flammable and Explosive Materials
The appearance of ultra-short pulse laser of processing, femtosecond, picosecond solves the problems, such as this, and the advantage of laser numerical control processing is performed to
It is maximum.
Ultra-short pulse laser refer to laser pulse width less than 10 picoseconds (ps, 10-12S) laser.Ultra-short pulse laser has extremely short
Pulsewidth and high peak power, in extremely short time and minimum space behavior in material surface, by action material surface
Local temperature instantaneously steeply rise, far more than material melt and gasify temperature value, cause material occur multi-photon height electricity
From finally escaping out base material in the form that plasma erupts and take away almost all energy, realize the removal of material.It is ultrashort
The mechanism of pulsed laser action material is different from Long Pulse LASER, and the process of ultra-short pulse laser action material is mainly shown as material
Expect multiphoton ionization process, no heat-affected zone generates, and can focus on the region of superfine, machined surface roughness
It is low, it is non-microcracked, can be realized the processing to the materials such as superhard, frangible, high-melting-point, explosive material, have Long Pulse LASER without
The advantage of method analogy.Therefore, ultra-short pulse laser numerical control processing is often applied to the fields such as aerospace, military and national defense and medical treatment
Precision instruments and part processing in.
Compared with Long Pulse LASER processing, ultra-short pulse laser process is non-reflow process, has many advantages:
(1) without heat affected area: ultra-short pulse laser is processed as non-reflow process, avoids the production of caused heat affected area when heat transmitting
It is raw；(2) contamination-free: plasma is positively charged, and when eruption is mutually exclusive, the pollution that dripless is unrestrained and regelation generates
Area；(3) range of work is wide: ultra-short pulse laser processing has threshold effect, theoretically, as long as laser pulse width is short enough, peak value
Power is sufficiently high, and the processing to any material may be implemented in ultra-short pulse laser；(4) processing inside transparent material: laser energy is used
Metric density is slightly below the laser beam focusing irradiation transparent material internal focal point of material ablation threshold, and beam energy all converges at
Material internal focal point, the only laser energy density of focal point are higher than the ablation threshold of material, only the material quilt of focal point
Removal is realized to the retrofit inside transparent material；(5) utilization ratio of laser energy is high: when ultra-short pulse laser is processed, material
Ablation threshold usually only millijoule or micro- joule of magnitude, therefore, can to material generate ablation effect laser beam radius
Larger, utilization ratio of laser energy is also higher therewith；(6) environmentally friendly: ultra-short pulse laser processing generates almost without waste residue, waste liquid,
It is environmentally protective；(7) special material is processed: ultra-short pulse laser is processed as non-hot melt processing, it can be achieved that superhard, frangible, Gao Rong
The processing of the special materials such as point, explosive material.
In ultra-short pulse laser NC Machining Process, in addition to the numerical controlled machinery ontology accuracy of manufacture, assembly precision, positioning and
The factors such as repetitive positioning accuracy, movement rigidity directly affect outside the machining accuracy of product, and working process parameter is even more to influence product
An important factor for machining accuracy, is also more difficult to break through.
In ultra-short pulse laser NC Machining Process, since workpieces processing is complicated, machine tool capability limits and processing efficiency
It is required that the problems such as, processing dimension requires and process velocity also often changes.At this point, if laser parameter cannot be preferable with process velocity
Ground matches the requirement of processing dimension, then will lead to the generation of material burning or underburnt phenomenon, to cause waste of material, processing matter
Amount difference and the problems such as processing efficiency is low.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provide in a kind of numerical control processing ultra-short pulse laser working process parameter from
Adaptive control method, the requirement of energy Adaptive matching processing dimension, avoids the waste of material, improves machining accuracy and processing matter
Amount.
The present invention is implemented as follows:
Ultra-short pulse laser working process parameter self-adaptation control method in a kind of numerical control processing, specifically includes following step
It is rapid:
S1, it is based on laser parameter and process velocity, establishes working width model；
S11, ultra-short pulsed laser beam are in Gaussian Profile, and when ultra-short pulse laser carries out pulse punching, ablation hole is straight
Diameter D and laser gaussian beam waist ω0, laser peak energy densityAnd material single pulse ablation threshold valueRelational expression it is as follows:
Wherein,For material single pulse ablation threshold value；For laser peak energy density；
S12, equivalent pulse quantity indicate:
The machining path of ultra-short pulse laser is equivalent to multi-pulse laser processing, the material ablation threshold under multiple-pulse processingFor
Wherein, ε is the accumulation factor of material, NeFor equivalent pulse quantity, NeFormula specific as follows indicates:
Wherein, D is laser irradiation spot diameter, and the ablation bore dia D in value and step S11 is of equal value；V is processing speed
Degree；T is laser pulse period；
S13, working width model is established:
In ultra-short pulse laser processing, working width W and laser energy densityProcess velocity v, laser pulse period
The relational expression of T is as follows:
Laser energy densityIt is indicated by average laser power P with pulse period T, isWherein, P is
The mean power of laser, f are laser pulse repetition frequency；
Then in ultra-short pulse laser processing, indicated using parameter average laser power P, process velocity v and pulse period T
Working width W model are as follows:
S2, it is based on laser parameter and process velocity, establishes working depth model；
Working depth H and average laser power P, equivalent pulse quantity NeRelational expression be
Wherein, linear scale factor k1、k2Average laser power P, processing with constant coefficient b by three groups of actual processings
Speed v, laser pulse period T, laser spot diameter D and working depth H are determined；
Average laser power P is equivalent to multi-shot ablation threshold power Pth(N), then itself and single pulse ablation threshold power
Pth(1), the relational expression of number of pulses N is
S3, ultra-short pulse laser working process parameter adaptive model is established；
The working depth model of working width model and step S2 based on step S1 establishes ultra-short pulse laser processing work
Skill parameter adaptive model:
Preferably, the specific representation method of equivalent number of pulses is as follows in step S12:
Total laser energy EAlwaysTo act on the sum of useful effect energy of all pulses within the scope of the spot diameter, express
Formula is as follows:
Wherein, EiThe useful effect energy for being i-th of laser pulse within the scope of spot diameter, expression formula are
Wherein, D is laser irradiation spot diameter, and v is process velocity, and T is laser pulse period, and i is laser pulse serial number,
i∈[1,2,...,n]；E is pulsed laser energy,
If n is useful effect number of pulses, it is expressed asIn formulaFor upper rounding symbol, it is not small to indicate that n takes
InInteger in one the smallest, then total laser energy EAlwaysIt is expressed as
Preferably, in step S2, linear scale factor k1、k2It is specific as follows with the determination method of constant coefficient b:
If three groups of actual processing data are respectively (P1,v1,T1,D1,H1)、(P2,v2,T2,D2,H2) and (P3,v3,T3,D3,
H3), then k2Expression formula it is as follows:
Wherein, Ne1、Ne2、Ne3For the corresponding equivalent pulse quantity of first, second and third group of actual processing process data,
The expression formula of constant coefficient b is
B=w1b12+w2b23
Wherein, w1、w2--- it is weight coefficient, b12、b23Respectively by first and group actual processing work of two groups, second and three
The constant coefficient that skill data acquire, expression formula are as follows:
k1Expression formula it is as follows:
Compared with prior art, the invention has the following advantages:
Ultra-short pulse laser working process parameter self-adaptation control method, ultrashort pulse is swashed in numerical control processing of the invention
The mobile process of light is equivalent to multi-pulse laser process, establishes working width model based on laser parameter and process velocity
It is final to determine ultra-short pulse laser working process parameter adaptive model with working depth model, according to working width and it can add
Work depth adaptive determines mean power and the pulse period of pulse laser, and the requirement of energy Adaptive matching processing dimension avoids
The waste of material improves machining accuracy and processing quality.The present invention has stronger versatility and adaptability, ultrashort for improving
Pulse laser machining technological experiment efficiency reduces cost etc. and is also of great significance.
Detailed description of the invention
Fig. 1 is the foundation and its workflow of ultra-short pulse laser working process parameter adaptive model.
Fig. 2 is the schematic diagram of the mobile process of ultra-short pulse laser.
Relationship of the Fig. 3 between working depth and average laser power natural logrithm.
Relationship of the Fig. 4 between working depth and equivalent pulse quantity natural logrithm.
Fig. 5 is the mean power comparison diagram that actual average power and self-adaptation control method of the invention obtain.
Fig. 6 is practical equivalent pulse quantity logarithm and the equivalent pulse quantity logarithm comparison diagram that the present invention predicts.
Specific embodiment
Below with reference to the attached drawing exemplary embodiment that the present invention will be described in detail, feature and aspect of performance.It is identical in attached drawing
Appended drawing reference indicate element functionally identical or similar.Although the various aspects of embodiment are shown in the attached drawings, remove
It non-specifically points out, it is not necessary to attached drawing drawn to scale.
Ultra-short pulse laser working process parameter self-adaptation control method in a kind of numerical control processing, specifically includes following step
It is rapid:
S1, it is based on laser parameter and process velocity, establishes working width model；
In ultra-short pulse laser processing, material working width is mainly by the number of laser energy density and material ablation threshold
Value relationship determines that the mobile process of ultra-short pulse laser is equivalent to multi-pulse laser process, and equivalent pulse quantity passes through
Process velocity and laser pulse period determine that the equivalent ablation threshold of material can also pass through process velocity and laser pulse period table
Show.Therefore available laser parameter and process velocity indicate the equivalent ablation threshold of material, and then determine that working width is joined about laser
Several and process velocity expression formula.
S11, ultra-short pulsed laser beam are in Gaussian Profile, and when ultra-short pulse laser carries out pulse punching, ablation hole is straight
Diameter D and laser gaussian beam waist ω0, laser peak energy densityAnd material single pulse ablation threshold valueRelational expression it is as follows:
D in formula --- ablation bore dia；
ω0--- laser gaussian beam waist is also waist radius；
--- laser peak energy density；
--- material single pulse ablation threshold value, value are fixed.
In formula (1), laser peak energy densityRepresentation method such as formula (2) shown in.
Wherein, f is laser pulse repetition frequency,
Pulse energy has cumulative effect when multi-pulse laser is processed, when laser pulse quantity increases, the ablation of material
Threshold value can be different with the difference of number of pulses.Under normal circumstances, material ablation threshold and number of pulses are in inverse ratio, and
After number of pulses reaches certain value, material ablation threshold can also reach a saturation value.Within the scope of ablation threshold saturation value,
Material multi-shot ablation threshold valueWith material single pulse ablation threshold valueShown in the relationship of number of pulses N such as formula (3):
In formula--- material multi-shot ablation threshold value；
N --- number of pulses；
--- material single pulse ablation threshold value；
The accumulation factor of ε --- material is fixed value.
It can be acquired by formula (1) and formula (3) when ultra-short pulse laser carries out multiple-pulse punching, multi-shot ablation bore dia D
(N) with laser gaussian beam waist ω0, laser peak energy densityMaterial single pulse ablation threshold valueAnd number of pulses N
Between relationship, as shown in formula (4).
S12, equivalent pulse quantity indicate:
The mobile process of ultra-short pulse laser can be regarded as the superposition of multiple laser pulse ablation effects on the surface of the material,
As shown in Figure 2.In figure, DoIndicate that laser irradiation spot diameter, T indicate that laser pulse period, v indicate process velocity, LTIndicate phase
The center spacing of adjacent laser light spot, also illustrates that the moving distance of laser head opposite piece under a laser pulse period.
When ultra-short pulse laser is at the uniform velocity processed, laser pulse is considered as being evenly distributed on machining path.Due to swashing
The cumulative effect of optical pulse energy, ultra-short pulse laser, which processes the path, can be equivalent to multi-pulse laser processing, equivalent pulse number
Amount is Ne, ablation threshold at this timeIt is represented by formula (5).
N in formulae--- equivalent pulse quantity.
In the mobile processing of ultra-short pulse laser, equivalent pulse quantity refers to effect upper single laser irradiation on the surface of the material
The quantity of laser pulse within the scope of spot diameter, can be by acting on upper single laser irradiation spot diameter range on the surface of the material
Interior total laser energy EAlwaysIts value is determined with the ratio between pulsed laser energy E.
Total laser energy EAlwaysIt can be by acting on the sum of useful effect energy of all pulses within the scope of the spot diameter
It calculates, as shown in formula (6).
E in formulai--- useful effect energy of i-th of laser pulse within the scope of spot diameter, calculation method such as formula (7)
It is shown；
N --- useful effect number of pulses determines shown in method such as formula (8):
E in formulai--- useful effect energy of i-th of laser pulse within the scope of spot diameter；
D --- laser irradiation spot diameter；
V --- process velocity；
T --- laser pulse period；
I --- laser pulse serial number, i ∈ [1,2 ..., n]；
E --- pulsed laser energy.
Shown in the calculation method such as formula (8) of useful effect number of pulses n.
In formulaFor upper rounding symbol, indicates that n takes and be not less thanInteger in it is one the smallest.
It can be obtained by formula (6) and formula (7), total laser energy EAlwaysIt is represented by formula (9).
Formula (8) are substituted into formula (9) to obtain, total laser energy EAlwaysIt is represented by formula (10):
Then equivalent pulse quantity NeCalculation method be represented by formula (11):
It can be obtained by formula (5) and formula (11), when ultra-short pulse laser movement is processed, ablation threshold can be indicated with process velocity.
At this point, ablation thresholdIt is represented by formula (12).
S13, working width model is established
It can be obtained by formula (4) and formula (12), in ultra-short pulse laser processing, working width W and laser energy densityAdd
Work speed v, laser pulse period T relationship be represented by formula (13):
W in formula --- working width.
Laser energy densityIt can be indicated by average laser power P.It can be obtained by formula (2) with (13), in ultrashort arteries and veins
In punching laser processing, the relationship of the parameters such as working width W and average laser power P, process velocity v, laser pulse period T can table
It is shown as formula (14).
It can be seen from formula (14) in ultra-short pulse laser processing, working width and average laser power, processing speed
Degree, laser pulse period, material single pulse ablation threshold power, material accumulation factor, laser gaussian beam waist, laser facula are straight
These parameters of diameter are related.It therefore, in process, can be by adjusting average laser power, process velocity, laser pulse week
Phase, laser spot diameter obtain certain working width.
S2, it is based on laser parameter and process velocity, establishes working depth model；
5 kinds of different process velocities and the reality of totally 25 groups of ntD materials under 5 kinds of different average laser power scenes are selected to add
Work process data, process velocity take 0.01mm/s, 0.05mm/s, 0.1mm/s, 0.5mm/s, 1mm/s, average laser power respectively
10mW, 20mW, 30mW, 40mW, 50mW are taken respectively, determine the relationship and processing of working depth Yu average laser power natural logrithm
The relationship of depth and equivalent pulse quantity.
(1) relationship of working depth and average laser power
According to 25 groups of actual processing process datas, the relationship between working depth H and average laser power P is intended
It closes, finds the linear correlativity of natural logrithm of working depth and average laser power, and linear scale factor and equivalent arteries and veins
It is unrelated to rush quantity, as shown in Figure 3.
(2) relationship of working depth and equivalent pulse quantity
According to 25 groups of actual processing process datas, to working depth H and equivalent pulse quantity NeBetween relationship carry out
Fitting finds the linear correlativity of natural logrithm of working depth and equivalent pulse quantity, and linear scale factor and laser
Mean power is unrelated, as shown in Figure 4.
It can be obtained by Fig. 3 and Fig. 4, working width H and average laser power P, equivalent pulse quantity NeRelationship, such as formula (15)
It is shown:
H=k1lnP+k2lnNe+b (15)
It can be obtained according to formula (15) and formula (11), the relationship of working depth H and average laser power P, process velocity v, such as formula
(16) shown in:
Wherein, linear scale factor k1、k2Average laser power P, processing with constant coefficient b by three groups of actual processings
Speed v, laser pulse period T, laser spot diameter D and working depth H are determined；
Herein, average laser power P can be equivalent to multi-shot ablation threshold power Pth(N), then itself and single pulse ablation threshold
It is worth power Pth(1), the relational expression of number of pulses N is
In ultra-short pulse laser process it can be seen from formula (15), the nature of working depth and average laser power
Logarithm, equivalent pulse quantity natural logrithm between linear correlativity.Linear scale factor k1、k2It can with constant coefficient b
By three groups of actual processing data, (average laser power, process velocity, laser pulse period, laser spot diameter and processing are deep
Degree acquires:
Assuming that three groups of actual processing data are respectively (P1,v1,T1,D1,H1)、(P2,v2,T2,D2,H2) and (P3,v3,T3,D3,
H3), then k2, b and k1Solution mode be expressed as formula (18), formula (19) and formula (22).
N in formulae1、Ne2、Ne3--- the corresponding equivalent pulse quantity of first, second and third group of actual processing process data can lead to
Formula (11) are crossed to determine.
Shown in the solution mode such as formula (19) of constant coefficient b:
B=(b12+b23)/2 (19)
B in formula12--- the constant coefficient that first and second group of actual processing process data acquires, the method for determination are shown in formula (20)；
b23--- the constant coefficient that second and third group of actual processing process data acquires, the method for determination are shown in formula (21).
Proportionality coefficient k1Solution mode such as formula (22) shown in.
S3, ultra-short pulse laser working process parameter adaptive model is established；
On the basis of based on the working width model and working depth model of laser parameter and process velocity foundation, to formula
(14), formula (16) is converted, and can finally obtain the ultra-short pulse laser working process parameter adaptive model as shown in formula (23):
For certain material, material single pulse ablation threshold value and material accumulation factor are fixed value；Swash for specific
For light device, laser beam waist radius will not generally change easily with laser spot diameter.Therefore, from point of theory, material with
One timing of laser, according to actual processing process data, it is established that the ultrashort pulse laser processing technology as shown in formula (23)
Parameter adaptive model, can be according to working width, working depth and the process velocity given in actual condition, to seek meeting
The average laser power and laser pulse period of ultra-short pulse laser characteristic processing.Ultrashort pulse laser working process parameter is certainly
The foundation of adaptive model and its workflow are as shown in Figure 1.
3 groups in 25 groups of actual processing process datas are chosen, formula (18), formula (20), formula (21) and formula (22) is substituted into, obtains
k1It is 4.163, k2It is -13.348 for 1.461, b, wherein w1, w2Take 1.The substitution ultrashort pulse of actual processing process data is swashed
Optical parameter adaptive model (formula 23), can be obtained average laser power and laser pulse period.By comparing laser of the invention
The average laser power and laser pulse period of mean power, laser pulse period and actual processing, verify pulse of the invention
The accuracy of laser parameter self-adaptation control method.Influence of the laser pulse period to working depth is mainly reflected in equivalent pulse
On the logarithm of quantity, therefore, the obtained equivalent pulse quantity logarithm of the present invention and practical equivalent pulse quantity logarithm are carried out pair
Than.
The graphical comparison for the mean power that actual average power is obtained with the present invention indicates as shown in figure 5, practical equivalent
The graphical comparison for the equivalent pulse quantity logarithm that number of pulses logarithm and the present invention obtain indicates as shown in Figure 6.
In conclusion the laser that ultra-short pulse laser working process parameter self-adaptation control method of the invention obtains is average
Power error is 0.69%, and pulse period corresponding equivalent pulse quantity log error is -0.1077.Therefore, arteries and veins of the invention
Impulse optical parameter self-adaptation control method is reasonable, and accuracy is higher.
It, only could be real when laser energy density is greater than ablation threshold according to the threshold effect that ultra-short pulse laser is processed
Existing material removal.Therefore, the average laser power and laser pulse period obtained according to the present invention obtains ablation threshold and laser
Energy density, compare ablation threshold and laser energy density relationship, judge present invention determine that laser parameter meet ablation threshold
Value constraint.Ablation threshold and laser energy density correlation data are as shown in table 1.
1 ablation threshold of table and laser energy density compare
As shown in Table 1, present invention determine that the corresponding laser energy density of laser parameter be all larger than ablation in addition to the 21st group
The case where threshold value, the 21st group of laser energy density are less than ablation threshold, with working width when actual processing are 0 meets.Therefore,
Pulsed Laser Parameters self-adaptation control method of the invention meets threshold effect theory.
On the basis of material ablation threshold method for solving, it is mobile to propose laser when ultra-short pulse laser punches by the present invention
The representation method of material ablation threshold when processing, and threshold effect correlation theory and actual processing process data are combined, based on sharp
Optical parameter and process velocity establish working width model and working depth model respectively, finally, establish ultra-short pulse laser processing
Technological parameter adaptive model can adaptively determine pulse laser according to working width and working depth in numerical control processing
Mean power and pulse period, the requirement of energy Adaptive matching processing dimension avoid the waste of material, improve machining accuracy and add
Working medium amount.
Finally, it should be noted that above-described each embodiment is merely to illustrate technical solution of the present invention, rather than it is limited
System；Although the present invention is described in detail referring to the foregoing embodiments, those skilled in the art should understand that: its
It can still modify to technical solution documented by previous embodiment, or part of or all technical features are carried out
Equivalent replacement；And these modifications or substitutions, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution
Range.
Claims (3)
1. ultra-short pulse laser working process parameter self-adaptation control method in a kind of numerical control processing, it is characterised in that: it is specific
The following steps are included:
S1, it is based on laser parameter and process velocity, establishes working width model；
S11, ultra-short pulsed laser beam be in Gaussian Profile, ultra-short pulse laser carry out pulse punching when, ablation bore dia D with
Laser gaussian beam waist ω0, laser peak energy densityAnd material single pulse ablation threshold valueRelational expression it is as follows:
Wherein,For material single pulse ablation threshold value；For laser peak energy density；
S12, equivalent pulse quantity indicate:
The machining path of ultra-short pulse laser is equivalent to multi-pulse laser processing, the material ablation threshold under multiple-pulse processingFor
Wherein, ε is the accumulation factor of material, NeFor equivalent pulse quantity, NeFormula specific as follows indicates:
Wherein, D is laser irradiation spot diameter, and the ablation bore dia D in value and step S11 is of equal value；V is process velocity；T is
Laser pulse period；
S13, working width model is established:
In ultra-short pulse laser processing, working width W and laser energy densityProcess velocity v, laser pulse period T
Relational expression is as follows:
Laser energy densityIt is indicated by average laser power P with pulse period T, isWherein, P is laser
Mean power, f is laser pulse repetition frequency；
Then in ultra-short pulse laser processing, adding for parameter average laser power P, process velocity v and pulse period T expression is utilized
Work width W model are as follows:
S2, it is based on laser parameter and process velocity, establishes working depth model；
Working depth H and average laser power P, equivalent pulse quantity NeRelational expression be
Wherein, linear scale factor k1、k2Pass through average laser power P, the process velocity of three groups of actual processings with constant coefficient b
V, laser pulse period T, laser spot diameter D and working depth H are determined；
Average laser power P is equivalent to multi-shot ablation threshold power Pth(N), then itself and single pulse ablation threshold power Pth(1)、
The relational expression of number of pulses N is
S3, ultra-short pulse laser working process parameter adaptive model is established；
The working depth model of working width model and step S2 based on step S1 establishes ultra-short pulse laser processing technology ginseng
Number adaptive model:
2. ultra-short pulse laser working process parameter self-adaptation control method in numerical control processing according to claim 1,
Be characterized in that: the specific representation method of equivalent number of pulses is as follows in step S12:
Total laser energy EAlwaysTo act on the sum of useful effect energy of all pulses within the scope of the spot diameter, expression formula is such as
Under:
Wherein, EiThe useful effect energy for being i-th of laser pulse within the scope of spot diameter, expression formula are
Wherein, D is laser irradiation spot diameter, and v is process velocity, and T is laser pulse period, and i is laser pulse serial number, i ∈
[1,2,...,n]；E is pulsed laser energy,
If n is useful effect number of pulses, it is expressed asIn formulaFor upper rounding symbol, indicates that n takes and be not less than
Integer in one the smallest, then total laser energy EAlwaysIt is expressed as
3. ultra-short pulse laser working process parameter self-adaptation control method in numerical control processing according to claim 1,
It is characterized in that: in step S2, linear scale factor k1、k2It is specific as follows with the determination method of constant coefficient b:
If three groups of actual processing data are respectively (P1,v1,T1,D1,H1)、(P2,v2,T2,D2,H2) and (P3,v3,T3,D3,H3), then
k2Expression formula it is as follows:
Wherein, Ne1、Ne2、Ne3For the corresponding equivalent pulse quantity of first, second and third group of actual processing process data,
The expression formula of constant coefficient b is
B=w1b12+w2b23
Wherein, w1、w2--- it is weight coefficient, b12、b23Respectively by first and group actual processing technique number of two groups, second and three
According to the constant coefficient acquired, expression formula is as follows:
k1Expression formula it is as follows:
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| CN111889893A (en) * | 2020-07-07 | 2020-11-06 | 江苏海洋大学 | Ultrashort pulse laser precision machining method for dry gas sealed micron-sized groove |
| CN113199137A (en) * | 2021-06-18 | 2021-08-03 | 湖南汽车工程职业学院 | Method for controlling laser parameters of finish micro-machining curved surface gear based on dynamic effect mechanism |
| CN114055091A (en) * | 2021-11-19 | 2022-02-18 | 佛山市美地陶瓷有限公司 | Preparation method of butterfly wing diamond buckle |
| CN114985944A (en) * | 2022-04-26 | 2022-09-02 | 西安中科微精光子科技股份有限公司 | Self-adaptive laser engraving method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111889893A (en) * | 2020-07-07 | 2020-11-06 | 江苏海洋大学 | Ultrashort pulse laser precision machining method for dry gas sealed micron-sized groove |
| CN111889893B (en) * | 2020-07-07 | 2021-12-03 | 江苏海洋大学 | Ultrashort pulse laser precision machining method for dry gas sealed micron-sized groove |
| CN113199137A (en) * | 2021-06-18 | 2021-08-03 | 湖南汽车工程职业学院 | Method for controlling laser parameters of finish micro-machining curved surface gear based on dynamic effect mechanism |
| CN114055091A (en) * | 2021-11-19 | 2022-02-18 | 佛山市美地陶瓷有限公司 | Preparation method of butterfly wing diamond buckle |
| CN114985944A (en) * | 2022-04-26 | 2022-09-02 | 西安中科微精光子科技股份有限公司 | Self-adaptive laser engraving method |
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