CN108993414A - A kind of preparation method of MOFs- foam metal compound adsorbent - Google Patents
A kind of preparation method of MOFs- foam metal compound adsorbent Download PDFInfo
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- 239000003463 adsorbent Substances 0.000 title claims abstract description 77
- 239000006260 foam Substances 0.000 title claims abstract description 65
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 150000002736 metal compounds Chemical class 0.000 title claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 239000000725 suspension Substances 0.000 claims abstract description 21
- 239000012621 metal-organic framework Substances 0.000 claims abstract description 15
- 238000003618 dip coating Methods 0.000 claims abstract description 11
- 238000003756 stirring Methods 0.000 claims abstract description 6
- 239000013177 MIL-101 Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 238000007654 immersion Methods 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 46
- 238000000034 method Methods 0.000 abstract description 20
- 238000012546 transfer Methods 0.000 abstract description 11
- 238000010521 absorption reaction Methods 0.000 abstract description 10
- 239000011230 binding agent Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 2
- 238000001179 sorption measurement Methods 0.000 description 13
- 238000005057 refrigeration Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 230000004913 activation Effects 0.000 description 7
- 239000002808 molecular sieve Substances 0.000 description 6
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 6
- 230000003068 static effect Effects 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000003795 desorption Methods 0.000 description 4
- 238000011065 in-situ storage Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000013207 UiO-66 Substances 0.000 description 3
- 239000002250 absorbent Substances 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000274 adsorptive effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 239000005749 Copper compound Substances 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000002156 adsorbate Substances 0.000 description 1
- 150000001399 aluminium compounds Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003306 harvesting Methods 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 235000013847 iso-butane Nutrition 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N sec-butylidene Natural products CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000002336 sorption--desorption measurement Methods 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- 229960002415 trichloroethylene Drugs 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J20/00—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof
- B01J20/22—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising organic material
- B01J20/223—Solid sorbent compositions or filter aid compositions; Sorbents for chromatography; Processes for preparing, regenerating or reactivating thereof comprising organic material containing metals, e.g. organo-metallic compounds, coordination complexes
- B01J20/226—Coordination polymers, e.g. metal-organic frameworks [MOF], zeolitic imidazolate frameworks [ZIF]
Abstract
The present invention relates to a kind of preparation methods of MOFs- foam metal compound adsorbent, the specific steps are that: MOFs is mixed with water, stirs to get unit for uniform suspension；Suspension is filled into the hole of foam metal using dip coating under room temperature, MOFs- foam metal compound adsorbent is prepared, wherein the mass fraction of MOFs is 19~51% in MOFs- foam metal compound adsorbent.The method of the present invention preparation process is simple, and without molding, the dense porous structure of the complex three-dimensional of foam metal is while improving material heat transfer mass-transfer performance to MOFSPlay the role of good integrated, and the physics of binder free addition compound will not influence MOFs absorption property.
Description
Technical field
The present invention relates to a kind of preparation method of MOFs- foam metal compound adsorbent, belong to novel function in chemical field
It can material preparation technology.
Background technique
Absorption refrigeration is that solid absorbent is utilized to obtain cooling capacity to the adsorption process of adsorbate (refrigerant), can use the sun
Can or industrial exhaust heat driving etc. low grade heat energies, have it is environmentally protective, operating cost is low, structure is simple, it is noiseless and apply model
Enclose many advantages, such as wide.It since the 1970s, is to drive with low grade heat energy since global energy crisis is increasingly sharpened
The adsorptive refrigeration technology of the power extensive concern by countries in the world scientific worker again.
Unit adsorbent mass refrigeration work consumption is low, and adsorption refrigerating device takes up a large area to be limited with high cost outstanding problem
The commercialization of adsorptive refrigeration technology, main cause have: adsorbent bed heat and mass transfer performance is poor, and traditional adsorption refrigeration adsorbent is deposited
It is small in circulation absorption amount, the problems such as heating conduction difference and unstable long-term loop structure.Adsorbent is usually with particles filled in suction
In attached bed, absorbent particles and the heat exchanger surface way of contact a predominantly point face contact cause the system coefficient of heat transfer low, influence be
System refrigeration work consumption.Heat and mass transfer enhancement is to push the widely applied pass of adsorption refrigeration technique in high-efficiency adsorbent exploitation and adsorbent bed
Key.
In order to strengthen adsorption refrigeration adsorbent bed heat transfer property, can mainly changed at present by in-situ synthesis or binder
Hot device surface forms adsorbent coating, and the thickness of the adsorbent layer obtained by the method is too thin, and with the thickness of adsorbent layer
Degree increases, and heating conduction weakens.It is thermally conductive improving by the fabricated in situ compound adsorbent in aperture, fine and close foam metal
While can also effectively control the thickness of adsorption layer.In addition, foam metal is due to its high surface area, the foam of per unit volume
Metal can carry the adsorbent of sufficient amount, and since the extremely strong plasticity of foam metal can be simple and practical by compound adsorbent
It is applied to absorbing refrigeration system.
The excellent heating conduction of foam metal can greatly enhance the heating conduction of compound adsorbent.On the other hand, due to bubble
The dense porous structure of foam metal complex three-dimensional, without molding can play the role of to adsorbent it is good integrated, and improve
The mass-transfer performance of compound adsorbent.Hyunho Kim et al. is by filling the simple physics of MOF-801 powder to porosity
95% foam metal is to enhance adsorbent heating conduction and apply in air water fetching device, in feelings of the humidity level down to 20%
Daily every kilogram of MOF can harvest 2.8L water under condition.HuP et al. by THROUGH METHOD prepare molecular sieve/foamed aluminium compound adsorbent come
Reinforce the heat and mass transfer performance in Process of Adsorption, the thermal conductivity of the material is measured using hot disk method, up to 2.89W/
MK, the thermal conductivity than the molecular sieve of particle packing improve nearly 30 times or so.Maiti S K et al. is on the outer surface of copper pipe
The highly porous foam copper of direct sintering, and by Vacuum-assisted method, 4A molecular sieve coating is wrapped in foam copper surface, is adopted
It is had a clear superiority on specific volume power with the adsorbent bed of the structure.Bonaccorsi L et al. is in foamed aluminium surface in situ
It has synthesized SAPO-34 and SAPO-44 molecular sieve and has tested their absorption properties to water, the results showed that the presence of foam alumina supporter
The absorption property of molecular sieve is not influenced.Currently, apply the research in absorption refrigeration field less foam metal both at home and abroad,
And mostly be conventional adsorbent such as molecular sieve etc. is compound in foam metal by the method for fabricated in situ, preparation method it is complicated and
It is impracticable, it there have been no document report by dip coating and prepare adsorption refrigeration MOFs/ foam metal compound adsorbent.
Summary of the invention
The object of the present invention is to provide a kind of MOFs- foam metal compound adsorbent preparation methods, this preparation method is simple,
Adhesive-free addition, formed absorbent obtained have good heat-transfer, mass-transfer performance is good, water suction/dewatering cycle stability is good
The features such as.
The technical solution of the present invention is as follows: a kind of MOFs- foam metal compound adsorbent preparation method is provided, it is specific to walk
It is rapid as follows: MOFs being mixed with water, stirs to get unit for uniform suspension；Suspension is filled to foam gold using dip coating under room temperature
MOFs- foam metal compound adsorbent is prepared in the hole of category, wherein MOFs in MOFs- foam metal compound adsorbent
Mass fraction is 19~51%.MOFs prepares compound adsorbent in conjunction with foam metal to enhance adsorbent heating conduction, can use
In absorption refrigeration/heat pump process.
It is preferred that the MOFs is any one in MIL-101, MOF-801, UIO-66 or CAU-10.
It is preferred that the foam metal be foam copper, foamed aluminium, Foam silver or nickel foam any one；The hole of foam metal
Gap rate is 90%~98%.
It is preferred that MOFs is with water with mass ratio 1:(1~5) it mixes.It is preferred that whipping temp is 20~50 DEG C.
Preferred foams sheet metal is pre-processed, specific steps are as follows: 1) super to foam metal carrier using trichloro ethylene
Sound cleaning, the greasy dirt for the metal surface that defoams；2) it is washed after being rinsed with deionized water with EtOH Sonicate, removes remaining trichlorine
Ethylene；3) it dries after being washed with deionized water, weighs to foam metal.
Suspension is filled into the hole of foam metal with the method for dip-coating, preferably time of immersion is 30~180s.It is excellent
It selects compound adsorbent is spare after 100~120 DEG C of 1~4h of activation in 50~80 DEG C of dry 3~8h.
The present invention also provides the measuring method of above-mentioned compound adsorbent thermal conductivity and absorption/desorption water stability test sides
Method.
Wherein, at 15 DEG C~150 DEG C of test temperature, different holes are measured using Hot disk TPS2500S thermal analyzer
Gap rate prepares the thermal conductivity of compound adsorbent, and the thermal conductivity of compound adsorbent is same test up to 0.28~1.16W/ (m.K)
Under the conditions of 3~20 times of MOFs powder thermal conductivity, heating conduction is significantly improved.By compound adsorbent at 25 DEG C~40 DEG C
Carrying out static adsorption from aqueous solution, measurement compound adsorbent adsorbs/water stability is desorbed.Compound adsorbent at 25 DEG C~40 DEG C into
Row 10 times static aqueous solution adsorption/desorptions, static water adsorption amount keep stablizing.
The reagents and materials used in the present invention are commercially available.
The utility model has the advantages that
1, present invention process is simple, does not add binder, does not influence absorption and save the cost.
2, compound adsorbent good heat-transfer produced by the present invention, water suction/dewatering cycle stability are good.It can be applicable to typical case
Enclosed absorption air conditioner/heat pump working condition in application, refrigerant can be water, ethyl alcohol, methanol, iso-butane, normal butane, propane
Deng.In, low temperature exhaust heat and the sun can be carried out regeneration.
Detailed description of the invention
Fig. 1 is the XRD diagram of compound adsorbent made from embodiment 1.
Fig. 2 is the SEM figure of compound adsorbent made from embodiment 1；Wherein (a) foam copper carrier, (b) MIL-101/ foam
Copper amplifies 50 times, and (c) MIL-101/ foam copper amplifies 200 times, and (d) MIL-101/ foam copper amplifies 500 times.
Fig. 3 is the DTA figure of compound adsorbent made from embodiment 1.
Fig. 4 is the sample topography figure of compound adsorbent made from embodiment 1.
Fig. 5 is 10 water suctions/dewatering cycle stability of compound adsorbent made from embodiment 7.
Specific embodiment
Below by embodiment, the present invention will be further described, purpose be only that better understand it is of the invention interior
Hold, but therefore the invention is limited to the scope of the described embodiments.
SEM instrument model: TM-3000, Hitachi, Japan；TG-DTA thermal analyzer model: JC503-WCT-1D/2D,
Baiwan electronic, China；XRD instrument model: Smartlab, Rigaku, Japan, scanning range: 2-20 °, step-length
0.02, scanning speed: 2 °/min, scanning voltage 40kV, electric current 30Ma；Hot disk thermal constant analyzer model: TPS2500S,
Uppsala Hot Disk, Sweden.
Embodiment 1
1, selecting pretreated porosity is 95% foam copper foil as metallic carrier.By MIL-101 and water with matter
Amount stirs to get unit for uniform suspension at 25 DEG C than being that 1:3 is mixed with water.Suspension is filled to the hole of foam copper with dip coating
In gap, time of immersion 60s, wherein the mass fraction of MIL-101 is 39% (on the basis of compound adsorbent total weight).It is compound
Adsorbent is spare after 120 DEG C of activation 2h after 60 DEG C of dry 6h.Suspension MIL-101 and water quality are answered than what is prepared for 1:3
XRD spectrum, SEM spectrum, the thermogravimetric analysis figure for closing adsorbent are shown in that Fig. 1, Fig. 2 and Fig. 3, Fig. 4 are obtained multiple under this condition respectively
Close the sample topography figure of adsorbent.By Fig. 1 it can be found that physics is compound to will not influence the crystal structure of MIL-101, and foam copper
Surface is not oxidized at copper oxide.Fig. 2 shows that MIL-101 is completely embedded with foam copper in the compound adsorbent of preparation, is effectively subtracted
Few thermal contact resistance between the two.Fig. 3 shows that MIL-101 is 80 DEG C to the desorption summit temperature of water, and MIL-101/ foam copper is compound
Adsorbent is 69 DEG C to the desorption summit temperature of water, and desorption temperature is 11 DEG C about low.
2, the thermal conductivity that the compound adsorbent is measured using Hot disk TPS2500S thermal analyzer, in 25 DEG C and 90 DEG C
The thermal conductivity of lower compound adsorbent is respectively 0.87W/ (m.K) and 0.95W/ (m.K), the heat of MIL-101 powder under the same terms
Conductance is respectively 0.06W/ (m.K) and 0.07W/ (m.K), and heat conductivity promotes 15 times and 14 times respectively in contrast.
The thermal conductivity of copper is about 400W/ (m.K), and compound adsorbent heating conduction greatly improves.
Embodiment 2
1, selecting porosity is 90% pretreated foam copper foil as metallic carrier.By MIL-101 and water with matter
Amount stirs to obtain unit for uniform suspension than being that 1:5 is mixed at 50 DEG C.Suspension is filled to the hole of foam copper with the method for dip-coating
In, time of immersion 180s, wherein the mass fraction of MIL-101 is 19% (on the basis of compound adsorbent total weight).It is compound
Adsorbent is spare after 120 DEG C of activation 4h after 80 DEG C of dry 8h.
2, the thermal conductivity that the compound adsorbent is measured using Hot disk TPS2500S thermal analyzer, in 25 DEG C and 90 DEG C
The thermal conductivity of lower compound adsorbent is respectively 0.96W/ (m.K) and 1.08W/ (m.K), the heat of MIL-101 powder under the same terms
Conductance is respectively 0.06W/ (m.K) and 0.07W/ (m.K), and heat conductivity promotes 16 times and 15 times respectively in contrast.
Embodiment 3
1, selecting porosity is 98% pretreated foam copper foil as metallic carrier.MIL-101 and water are pressed into matter
Amount is mixed than 1:1, and unit for uniform suspension is stirred to obtain at 20 DEG C.Suspension is filled to the hole of foam copper with the method for dip-coating
In, time of immersion 30s, wherein the mass fraction of MIL-101 is 51% (on the basis of compound adsorbent total weight).Compound suction
Attached dose spare after 100 DEG C of activation 1h after 50 DEG C of dry 3h.
2, the thermal conductivity that the compound adsorbent is measured using Hot disk TPS2500S thermal analyzer, in 25 DEG C and 90 DEG C
The thermal conductivity of lower compound adsorbent is respectively 0.36W/ (m.K) and 0.45W/ (m.K), the heat of MIL-101 powder under the same terms
Conductance is respectively 0.06W/ (m.K) and 0.07W/ (m.K), and heat conductivity promotes 6 times and 7 times respectively in contrast.
Embodiment 4
1, selecting porosity is 95% pretreated foam aluminum slice as metallic carrier.MOF-801 and water are pressed into matter
Amount is mixed than 1:2.5, and unit for uniform suspension is stirred to obtain at 25 DEG C.Suspension is filled to the hole of foamed aluminium with the method for dip-coating
In, time of immersion 60s, wherein the mass fraction of MOF-801 is 41% (on the basis of compound adsorbent total weight).Compound suction
Attached dose spare after 120 DEG C of activation 2h after 60 DEG C of dry 6h.
2, the thermal conductivity that the compound adsorbent is measured using Hot disk TPS2500S thermal analyzer, in 25 DEG C and 90 DEG C
The thermal conductivity of lower compound adsorbent is respectively 0.34W/ (m.K) and 0.47W/ (m.K), the heat of MOF-801 powder under the same terms
Conductance is respectively 0.05W/ (m.K) and 0.06W/ (m.K), and heat conductivity promotes 7 times and 8 times respectively.
Embodiment 5
1, selecting porosity is 95% pretreated nickel foam thin slice as metallic carrier.CAU-10 and water are pressed into matter
Amount is mixed than 1:3, and unit for uniform suspension is stirred to obtain at 25 DEG C, and wherein the mass fraction of CAU-10 is 31% (with compound adsorbent
On the basis of total weight).Suspension is filled into the hole of nickel foam with the method for dip-coating, time of immersion 60s.Composite adsorption
Agent is spare after 120 DEG C of activation 2h after 60 DEG C of dry 6h.
2, the thermal conductivity that the compound adsorbent is measured using Hot disk TPS2500S thermal analyzer, in 25 DEG C and 90 DEG C
The thermal conductivity of lower compound adsorbent is respectively 0.28W/ (m.K) and 0.32W/ (m.K), the thermal conductivity of CAU-10 powder under the same terms
Rate is respectively 0.07W/ (m.K) and 0.09W/ (m.K), and heat conductivity promotes 4 times and 3 times respectively in contrast.
Embodiment 6
1, selecting porosity is 95% pretreated Foam silver thin slice as metallic carrier.By UIO-66 and water by pressing
Mass ratio 1:3 mixing, stirs to obtain unit for uniform suspension at 25 DEG C.Suspension is filled to the hole of foamed aluminium with the method for dip-coating
In, time of immersion 60s, on the basis of compound adsorbent total weight, mass fraction shared by adsorbent MOF-801 is 20%.It is multiple
It is spare after 120 DEG C of activation 2h after 60 DEG C of dry 6h to close adsorbent.
2, the thermal conductivity that the compound adsorbent is measured using Hot disk TPS2500S thermal analyzer, in 25 DEG C and 90 DEG C
The thermal conductivity of lower compound adsorbent is respectively 0.90W/ (m.K) and 1.11W/ (m.K), the thermal conductivity of UIO-66 powder under the same terms
Rate is respectively 0.05W/ (m.K) and 0.07W/ (m.K), and heat conductivity promotes 18 times and 16 times respectively.
Embodiment 7
Selecting foam copper porosity is 95%, and wash coat suspension MIL-101 and water quality are than being respectively prepared by 1:3 and 1:5
MIL-101/ foam copper compound adsorbent adsorb/be desorbed the test of water cyclical stability.Coating static state water adsorption amount is with following
The situation of change of ring number is shown in Fig. 5, by Fig. 5 it can be found that coating does not occur obviously to peel off when cycle-index is 10 times, and
Static water adsorption amount keeps stablizing under different condition, illustrates that MIL-101 can be integrated in foam well without adding binder
On copper carrier.
Claims (6)
1. a kind of preparation method of MOFs- foam metal compound adsorbent, it is characterised in that: mix MOFs with water, stir
To unit for uniform suspension；Suspension filled into the hole of foam metal using dip coating and MOFs- foam metal is prepared answers
Adsorbent is closed, wherein the mass fraction of MOFs is 19~51% in MOFs- foam metal compound adsorbent.
2. preparation method according to claim 1, it is characterised in that the MOFs is MIL-101, MOF-801, UIO-
Any one in 66 or CAU-10.
3. preparation method according to claim 1, it is characterised in that the foam metal is foam copper, foamed aluminium, bubble
Foam silver or nickel foam any one；The porosity of foam metal is 90%~98%.
4. preparation method according to claim 1, it is characterised in that MOFs is with water with mass ratio 1:(1~5) it mixes.
5. preparation method according to claim 1, it is characterised in that whipping temp is 20~50 DEG C.
6. preparation method according to claim 1, it is characterised in that the time of immersion is 30~180s.
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| CN110102271A (en) * | 2019-05-15 | 2019-08-09 | 天津清科环保科技有限公司 | The Multi-hole section and its method, equipment containing nano adsorber administered for VOCs |
| CN110605097A (en) * | 2019-09-19 | 2019-12-24 | 太原理工大学 | Binder-free MIL-100Cr forming method |
| CN111871007A (en) * | 2020-07-24 | 2020-11-03 | 北方工业大学 | Preparation method of sponge aluminum-based composite material for oil-gas separation |
| CN112844326A (en) * | 2020-12-09 | 2021-05-28 | 南京工业大学 | Magnetic-thermal composite material, preparation method and application thereof |
| CN113117647A (en) * | 2019-12-31 | 2021-07-16 | 中国石油化工股份有限公司 | Foam metal supporting adsorption material and preparation method thereof |
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| CN113117647B (en) * | 2019-12-31 | 2023-07-28 | 中国石油化工股份有限公司 | Foam metal supporting adsorption material and preparation method thereof |
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| CN114984934A (en) * | 2022-06-07 | 2022-09-02 | 大连理工大学 | Preparation method of foam metal in-situ growth MOFs (metal-organic frameworks) hierarchical pore composite material and application of foam metal in-situ growth MOFs hierarchical pore composite material in electro-adsorption of pollutants |
| CN115962586A (en) * | 2022-12-20 | 2023-04-14 | 江苏容汇通用锂业股份有限公司 | Direct solar adsorption brine concentration refrigeration system and use method |
| CN115962586B (en) * | 2022-12-20 | 2023-09-19 | 江苏容汇通用锂业股份有限公司 | Direct solar adsorption brine concentration refrigeration system and use method |
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