CN108987555A - 一种白光芯片制备方法 - Google Patents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
本发明提供了一种白光芯片法,包括:金属电极、倒装蓝光LED芯片、透明硅胶、高反胶以及荧光膜片;其中,金属电极设于LED芯片的下表面;荧光膜片设于LED芯片的上表面,且荧光膜片的面积大于LED芯片表面的面积;透明硅胶于荧光膜片表面呈弧状设于LED芯片四周;高反胶沿透明硅胶表面设于LED芯片和荧光膜片四周。该白光LED芯片发出的白光颜色均匀,不会出现漏蓝光的现象,且出光效率高、发光角度小。
Description
技术领域
本发明涉及半导体发光二极管领域,特别涉及一种白光芯片制备方法。
背景技术
LED(Light Emitting Diode,发光二极管)是一种能够将电能转化为可见光的固态的半导体器件,其发光原理是电激发光,即在PN结上加正向电流后,自由电子与空穴复合而发光,从而直接把电能转化为光能。LED,尤其是白光LED,作为一种新的照明光源材料被广泛应用着,它具有反应速度快、抗震性好、寿命长、节能环保等优点而快速发展,目前已被广泛应用于景观美化及室内外照明等领域。
目前白光LED的制备主要采用的是在蓝光芯片上涂覆黄色荧光粉的工艺制得,即在蓝光LED芯片表面直涂或喷涂一层荧光粉胶,按上述工艺制得的白光LED芯片存在如下两个问题:一是只是在蓝光LED芯片表面涂覆一层荧光粉胶,而芯片侧面并未涂覆有荧光胶,因此会出现芯片四周漏蓝光现象,导致最后封装成的白光LED器件白光颜色不均匀,往往带有黄色或蓝色光斑;二是以上方法制备的白光LED芯片为五面出光,大部分侧面光成为无效光,光的利用率没有得到有效提高。另外,在一些要求LED产品具有小型化、集成化、发光角度更小等特点的应用领域,譬如闪光灯、电视背光等产品,传统方法制备的LED芯片是达不到这些领域的要求的。因此,有必要提供一种新的LED芯片制备方法来解决上述问题。
发明内容
针对上述问题,本发明旨在提供一种白光芯片制备方法,其制备的白光芯片发出的白光颜色均匀,不会出现漏蓝光的现象,且出光效率高、发光角度小。
为达到上述目的,本发明提供的技术方案如下:
一种白光芯片制备方法,包括:
将倒装蓝光LED芯片排列在支撑基板上;
在相邻LED芯片之间印刷透明硅胶并固化;
在相邻LED芯片之间的透明硅胶表面填充高反胶并固化;
去除支撑基板,将荧光膜片设置在LED芯片表面;
沿切割道切割荧光膜片和高反胶,得到白光芯片。
进一步优选地,在所述沿切割道切割荧光膜片和高反胶之后,还包括:
扩开相邻LED芯片之间的距离,放置在支撑基板上;
在相邻LED芯片之间填充高反胶并固化;
沿相邻LED芯片之间的沟槽进行切割,得到白光芯片。
进一步优选地,在倒装蓝光LED芯片表面包括金属电极,所述金属电极的厚度范围为10~200μm。
进一步优选地,采用电镀或者化学镀的方法在所述倒装蓝光LED芯片表面形成金属电极。
进一步优选地,所述透明硅胶于所述荧光膜片表面朝向荧光膜片呈弧状设于所述LED芯片四周。
进一步优选地,沿所述LED芯片的任意一侧,所述透明硅胶的高度范围为10~150μm,宽度范围为10~1000μm。
本发明提供的白光芯片制备方法,由其制备的白光芯片四周设置有高反胶(高反射率白胶),以此从侧面发出的光被该高反胶反射回去,实现单面出光的目的。另外,在倒装蓝光LED芯片和荧光膜片相接表面设有弧状透明硅胶,以此填充在透明硅胶表面的高反胶同样呈现出弧状,该结构的设置使得倒装蓝光LED芯片侧面发出的光反射回去成为有效光从发光面输出,从而大大提高了白光芯片的出光效率。最后,相较于现有白光芯片,本发明提供的白光芯片同时具备了光斑更均匀、导热性好、发光角度小、成本低等优势,大大提高了LED的应用范围和使用的便捷性,尤其是要求发光角度小的应用领域,如LED背光领域。
附图说明
图1至图6为本发明白光芯片制备过程示意图。
图中标识说明:
1-倒装蓝光LED芯片,2-透明硅胶,3-荧光膜片,4-支撑基板,5-高反胶。
具体实施方式
本实施例采用如下步骤:
制备并挑选符合要求的荧光膜片3,在倒装蓝光LED芯片1的电极上电镀金属电极。将倒装蓝光LED芯片1以阵列方式排列在支撑基板4上;在相邻两颗倒装蓝光LED芯片1之间印刷适量的透明硅胶2,并150度烘烤2小时,使倒装蓝光LED芯片四周表面的透明硅胶2呈现下凹弧状,如图1所示;
在相邻两颗倒装蓝光LED芯片1之间的透明硅胶表面填充高反胶5,直到所述高反射胶5的高度与所述金属电极高度一致,如图2所示;
用荧光膜片3替换支撑基板4,如图3所示;
沿着切割道切割高反胶5和荧光膜片3,并扩开相邻颗倒装蓝光LED芯片1之间的距离放置在支撑基底4上,如图4所示;
在相邻两颗倒装蓝光LED芯片1之间沿支撑基底表面和透明硅胶表面填充高反胶5,直到高反射胶5的高度与金属电极高度一致,如图5所示;
沿着相邻两颗倒装蓝光LED芯片1之间的沟槽进行切割,得到单颗高亮度单面出光的白光芯片,如图6所示。
Claims (6)
1.一种白光芯片制备方法,其特征在于,所述白光芯片制备方法中包括:
将倒装蓝光LED芯片排列在支撑基板上;
在相邻LED芯片之间印刷透明硅胶并固化;
在相邻LED芯片之间的透明硅胶表面填充高反胶并固化;
去除支撑基板,将荧光膜片设置在LED芯片表面;
沿切割道切割荧光膜片和高反胶,得到白光芯片。
2.如权利要求1所的白光芯片制备方法,其特征在于,在所述沿切割道切割荧光膜片和高反胶之后,还包括:
扩开相邻LED芯片之间的距离,放置在支撑基板上;
在相邻LED芯片之间填充高反胶并固化;
沿相邻LED芯片之间的沟槽进行切割,得到白光芯片。
3.如权利要求1或2所述的白光芯片,其特征在于,在倒装蓝光LED芯片表面包括金属电极,所述金属电极的厚度范围为10~200μm。
4.如权利要求3所述的白光芯片,其特征在于,采用电镀或者化学镀的方法在所述倒装蓝光LED芯片表面形成金属电极。
5.如权利要求1或2或4所述的白光芯片,其特征在于,所述透明硅胶于所述荧光膜片表面朝向荧光膜片呈弧状设于所述LED芯片四周。
6.如权利要求5所述的白光芯片,其特征在于,沿所述LED芯片的任意一侧,所述透明硅胶的高度范围为10~150μm,宽度范围为10~1000μm。
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CN109904295A (zh) * | 2019-03-21 | 2019-06-18 | 京东方科技集团股份有限公司 | 一种led器件及其制作方法、显示面板 |
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US20140159230A1 (en) * | 2012-12-10 | 2014-06-12 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
CN106129231A (zh) * | 2015-05-05 | 2016-11-16 | 新世纪光电股份有限公司 | 发光装置及其制作方法 |
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US20140159230A1 (en) * | 2012-12-10 | 2014-06-12 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
CN106129231A (zh) * | 2015-05-05 | 2016-11-16 | 新世纪光电股份有限公司 | 发光装置及其制作方法 |
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CN109904295A (zh) * | 2019-03-21 | 2019-06-18 | 京东方科技集团股份有限公司 | 一种led器件及其制作方法、显示面板 |
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