CN108966381B

CN108966381B - Ceramic heating plate structure

Info

Publication number: CN108966381B
Application number: CN201710363054.8A
Authority: CN
Inventors: 李忠宪
Original assignee: Individual
Current assignee: Individual
Priority date: 2017-05-22
Filing date: 2017-05-22
Publication date: 2020-06-09
Anticipated expiration: 2037-05-22
Also published as: WO2018214847A1; CN108966381A

Abstract

The invention relates to a ceramic heating plate structure, which is provided with a heating plate, wherein two opposite sides of the heating plate respectively form a heating surface, a plurality of through holes are arranged in a penetrating way to communicate the heating surfaces at two sides, and the inner peripheral wall of each through hole forms a heating inner surface, wherein the heating surface of at least one side is provided with a metal conductive coating layer with a resistance value below 10 ohm, the heating inner surface of each through hole is provided with a metal conductive coating layer with a resistance value above 20 ohm, and the heating inner surface of each through hole is electrically connected to the heating surfaces at two sides to form a resistance loop, the heating temperature of at least one side surface of the heating sheet is lower, which is suitable for providing the requirement of low-temperature heating, the heating temperature in the through hole of the heating sheet is higher, which provides the use requirement of high-temperature heating, therefore, the device can provide proper temperature according to different temperature requirements, and the safety in installation and heating use is improved.

Description

Ceramic heating plate structure

Technical Field

The invention relates to a heating structure, in particular to a ceramic heating sheet structure.

Background

The ceramic heating sheet is a heating structure which can be applied to electric appliances such as electric warming ovens, hair dryers, electric mosquito repellent and the like which need to be heated or maintain constant temperature, and when in use, the ceramic heating sheet can be electrified, thus achieving the effects of heating or maintaining constant temperature.

The existing ceramic heating plate is mostly made by mixing a ceramic material and a conductive metal material, or a conductive layer is formed on the ceramic plate by adopting a soaking or spraying mode, and then the conductive metal material or the conductive layer is electrified to generate heat.

Because the resistance values of all areas on the existing ceramic heating plate are similar, the ceramic heating plate can be heated together in a whole block after being electrified, different temperature requirements cannot be adjusted even though the functions of all areas of the ceramic heating plate are different, and the temperatures of a heating area and an assembly area are the same or similar, so that the ceramic heating plate is used for heating or mounting and has safety concerns.

Disclosure of Invention

In order to solve the problem that the heating temperature of each area of the existing ceramic heating plate is the same and the proper temperature can not be adjusted by matching the action of each area, the invention provides a ceramic heating plate structure which can be adjusted to the proper temperature according to the action and temperature requirements of each area, thereby improving the safety of the ceramic heating plate in heating and installation.

The invention relates to a ceramic heating sheet structure, which is provided with a heating sheet, wherein two opposite sides of the heating sheet are respectively provided with a heating surface, a plurality of through holes are arranged in a penetrating way to be communicated with the heating surfaces at the two sides, the inner peripheral wall of each through hole is provided with a heating inner surface, a metal conductive coating film layer with the resistance value of below 10 ohm is arranged on the heating surface at least one side, a metal conductive coating film layer with the resistance value of above 20 ohm is arranged on the heating inner surface of each through hole, and the heating inner surfaces of the through holes are respectively and electrically connected with the heating surfaces at the two sides to form a resistance loop.

Preferably, the two opposite sides of the heating sheet are respectively provided with a metal conductive coating layer with a resistance value of less than 10 ohms.

Preferably, a T-shaped insulating region extending to a periphery is disposed on one of the heating surfaces of the heating sheet, and the heating surface is divided into an input region, an upper conducting region and an output region which are not electrically connected to each other, and a linear insulating region extending to the periphery is disposed at a central line position corresponding to the T-shaped insulating region of the other heating surface, and the heating surface is divided into a first lower conducting region and a second lower conducting region which are not electrically connected to each other, wherein the input region is electrically connected to the first lower conducting region through the corresponding through hole, the first lower conducting region is electrically connected to the upper conducting region through the corresponding through hole, the upper conducting region is electrically connected to the second lower conducting region through the corresponding through hole, and the second lower conducting region is electrically connected to the output region through the corresponding through hole.

Preferably, one of the heating surfaces of the heating plate is provided with a linear insulating region extending to the periphery, and the heating surface is divided into an input region and an output region that are not electrically connected to each other, and the other heating surface is provided with a lower conductive region, wherein the input region is electrically connected to the lower conductive region through the corresponding through hole, and the lower conductive region is electrically connected to the output region through the corresponding through hole.

Preferably, the heating sheet has an input terminal and an output terminal on the outer peripheral surface, the input terminal is electrically connected to the input area, and the output terminal is electrically connected to the output area.

The ceramic heating plate structure of the invention mainly utilizes at least one side of two sides of the heating plate to be provided with the metal conductive coating film layer with lower resistance value, so that the heating temperature of at least one side surface of the heating plate is lower, the metal conductive coating film layer with higher resistance value is arranged on the heating inner surface in the through hole of the heating plate, the heating temperature in the through hole of the heating plate is higher, and the use requirement of high-temperature heating is provided, thereby providing proper temperature according to the action and temperature requirements of different areas and increasing the safety in installation and heating use.

Drawings

Fig. 1 is a perspective view of a first embodiment of the present invention.

Fig. 2 is another perspective view of the first embodiment of the present invention.

FIG. 3 is a partially enlarged side sectional view of the first embodiment of the present invention.

Fig. 4 is a partially enlarged end sectional view of the first embodiment of the present invention.

Fig. 5 is a schematic current diagram of the resistor loop according to the first embodiment of the invention.

Fig. 6 is a perspective view of a second embodiment of the present invention.

Fig. 7 is another perspective view of the second embodiment of the present invention.

Fig. 8 is a current diagram of a resistance loop according to a second embodiment of the present invention.

Description of reference numerals:

10 heating plate 11 upper heating surface

112 input area 113 and a conductive area

114 lower heating surface of output area 12

13-via 14-T isolation region

16 input terminal 17 output terminal.

Detailed Description

So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings, wherein:

referring to fig. 1 and 2, a first embodiment of the ceramic heater chip structure of the present invention includes a disc-shaped heater chip 10, which has an upper heating surface 11 and a lower heating surface 12 formed on two opposite sides thereof, the heater chip 10 is provided with a plurality of through holes 13 through which the upper heating surface 11 communicates with the lower heating surface 12, and an inner wall of each through hole 13 forms a heating surface 130, the heating surface 130 is electrically connected to the upper heating surface 11 and the lower heating surface 12, respectively, to form a resistance loop, and the configuration of the resistance loop is not limited by the present invention;

further, referring to fig. 3 and 4, the upper heating surface 11 and/or the lower heating surface 12 of the heating plate 10 are provided with metal

conductive coating layers

111, 121 having a resistance value of 10 ohm or less, and the heating inner surface 130 of each through hole 13 is provided with a metal conductive coating layer 131 having a resistance value of 20 ohm or more;

referring to fig. 1 and 2, the upper heating surface 11 of the heating plate 10 is provided with a T-shaped insulating region 14 extending to the periphery, which divides the upper heating surface 11 into an input region 112, an upper conductive region 113, and an output region 114 that are not electrically connected to each other; the lower heating surface 12 of the heating plate 10 is provided with a linear insulating region 15 extending to two opposite sides of the periphery at a position corresponding to the center line of the T-shaped insulating region 14, so as to divide the lower heating surface 12 into a first lower conducting region 121 and a second lower conducting region 122 which are not energized to the left and right;

the heating sheet 10 may further have an input terminal 16 and an output terminal 17 on the outer peripheral surface, the input terminal 16 is electrically connected to the input region 112 of the upper heating surface 11, and the output terminal 17 is electrically connected to the output region 114 of the upper heating surface 11;

in use, referring to fig. 3 and 5, a current is first input into the input region 112 of the upper heating surface 11 through the input terminal 16, then the current is transmitted to the first lower conductive region 121 on the right side of the lower heating surface 12 through the through holes 13 corresponding to the input region 112, then is transmitted to the upper conductive region 113 of the upper heating surface 112 through the through holes 13 corresponding to the upper conductive region 113, then the current is transmitted to the second lower conductive region 122 on the left side of the lower heating surface 12 through the through holes 13 corresponding to the second lower conductive region 122 on the left side, then is transmitted to the output region 114 of the upper heating surface 11 through the through holes 13 corresponding to the output region 114, and finally flows out from the output terminal 17, thereby completing a cycle of the resistance loop.

In the ceramic heating plate structure of the present invention, since the upper heating surface 11 and/or the lower heating surface 12 are provided with the metal

conductive coating layers

111 and 121 having a resistance value of less than 10 ohms, when a current passes through each region of the upper heating surface 11 and/or the lower heating surface 12, the generated heat energy is less, the temperature is lower, and the ceramic heating plate structure is suitable for being used as a mounting contact surface during assembly or providing a low temperature heating requirement, and further, since the metal conductive coating layer 131 having a resistance value of more than 20 ohms is provided on the heating inner surface 130 of each through hole 13, when a current passes through the heating inner surface 130 of each through hole 13, the generated heat energy is more, the temperature is higher, and the ceramic heating plate structure is suitable for heating wind introduced into a blower or air introduced into an electric heater, and can be used for providing a high temperature heating requirement.

In addition, as the longer the resistance loop path designed on the heating sheet 10 is, the longer the current circulation path is, the efficiency of heating and warming can be improved, and the effects of rapid warming and high heating temperature can be achieved.

Referring to fig. 6 and 7, a second embodiment of the ceramic heater chip structure of the present invention is substantially the same as the first embodiment, but the resistance circuit pattern on the heater chip 10A is different, a linear insulation region 18A extending to the periphery is disposed on the upper heating surface 11A of the heater chip 10A, and the upper heating surface 11A is divided into an input region 112A and an output region 114A that are not electrically connected to each other; the lower heat-generating surface 12A of the heater chip 10A is not provided with an insulating region, and the second lower conductive region 121A is formed over the entire area, the input terminal 16 of the heater chip 10A is electrically connected to the input region 112A of the upper heat-generating surface 11A, and the output terminal 17 is electrically connected to the output region 114A of the upper heat-generating surface 11A, so that the heater chip 10A forms the resistance loop of the second embodiment;

in use, referring to fig. 8, a current is first input into the input region 112A of the upper heating surface 11A through the input terminal 16, then the current is transmitted to the second lower conductive region 121A of the lower heating surface 12A through the through holes 13 corresponding to the input region 112A, then transmitted to the output region 114A of the upper heating surface 11A through the through holes 13 corresponding to the output region 114A of the upper heating surface 11A, and finally flows out from the output terminal 17, so as to complete a cycle of resistance loop.

The ceramic heating plate structure of the invention mainly utilizes at least one side of two sides of the heating plate 10 to be provided with the metal

conductive coating layers

111 and 121 with lower resistance value, so that the heating temperature of at least one side surface of the heating plate 10 is lower, the metal conductive coating layers are suitable for being used as the mounting contact surface for assembly or providing the requirement of low-temperature heating, and the metal conductive coating layers 131 with higher resistance value are arranged on the heating inner surface 130 in the through hole 13 of the heating plate 10, so that the heating temperature in the through hole 13 of the heating plate 10 is higher, the use requirement of high-temperature heating is provided, and therefore, the proper temperature is provided according to the action and temperature requirements of different areas, and the safety in mounting and heating use is improved.

From the foregoing, it will be observed that numerous modifications and variations can be effectuated without departing from the true spirit and scope of the novel concepts of the present invention, and that the specific embodiments of the present disclosure are not to be interpreted as limiting, but rather as encompassing all modifications as fall within the scope of the appended claims.

Claims

1. A ceramic heating sheet structure is provided with a heating sheet, wherein two opposite sides of the heating sheet are respectively provided with a heating surface, a plurality of through holes are arranged in a penetrating manner to be communicated with the heating surfaces at the two sides, the inner peripheral wall of each through hole is provided with a heating inner surface, a metal conductive coating film layer with the resistance value of below 10 ohm is arranged on the heating surface at least one side, a metal conductive coating film layer with the resistance value of above 20 ohm is arranged on the heating inner surface of each through hole, and the heating inner surfaces of the through holes are respectively and electrically connected with the heating surfaces at the two sides to form a resistance loop.

2. The ceramic heater chip structure of claim 1, wherein the heater chip is provided with conductive coating layers of metal having a resistance value of 10 ohm or less on opposite sides thereof.

3. The ceramic heater chip structure as claimed in claim 1 or 2, wherein a T-shaped insulation region extending to the periphery is provided on one of the heating surfaces of the heater chip, the heating surface is divided into an input area, an upper conduction area and an output area which are not electrified, the other heating surface is provided with a straight line insulation area which extends to the periphery corresponding to the central line position of the T-shaped insulation area, and the heating surface is divided into a first lower conduction region and a second lower conduction region which are not mutually electrified, wherein the input region is electrically connected to the first lower conductive region through the corresponding via hole, the first lower conductive region is electrically connected to the upper conductive region through the corresponding via hole, the upper conductive region is electrically connected to the second lower conductive region through a corresponding via, and the second lower conductive region is electrically connected to the output region through a corresponding via.

4. The ceramic heater chip structure of claim 3, wherein the heater chip has an input terminal and an output terminal on the outer peripheral surface, the input terminal is electrically connected to the input region, and the output terminal is electrically connected to the output region.

5. The ceramic heater chip structure as claimed in any one of claims 1 or 2, wherein one of the heating surfaces of the heating chip is provided with a linear insulating region extending to the periphery and separating the heating surface into an input region and an output region which are not electrically connected to each other, and the other heating surface is formed with a lower conductive region, wherein the input region is electrically connected to the lower conductive region through the corresponding via hole, and the lower conductive region is electrically connected to the output region through the corresponding via hole.

6. The ceramic heater chip structure of claim 5, wherein the heater chip has an input terminal and an output terminal on the outer peripheral surface, the input terminal is electrically connected to the input region, and the output terminal is electrically connected to the output region.