CN108934125B - High-efficiency low-cost wire passing hole process - Google Patents
High-efficiency low-cost wire passing hole process Download PDFInfo
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- CN108934125B CN108934125B CN201811055925.0A CN201811055925A CN108934125B CN 108934125 B CN108934125 B CN 108934125B CN 201811055925 A CN201811055925 A CN 201811055925A CN 108934125 B CN108934125 B CN 108934125B
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- cross
- soft board
- cutting die
- outer contour
- fpc
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
Abstract
The invention discloses a high-efficiency low-cost wire passing hole process, which specifically comprises the following steps: manufacturing a bonding pad, fixing a bonding pad area, transforming a lower mould of an FPC (flexible printed circuit) soft board outer contour cutting mould, transforming an upper mould of the FPC soft board outer contour cutting mould, punching an FPC soft board outer contour and finishing the processing of a cross wire passing hole. According to the high-efficiency low-cost wire passing hole process, the cross-shaped wire passing hole is punched simultaneously in the process of punching the outer contour cutting die of the FPC soft board, so that the drilling process is saved, and the processing time is prolonged; meanwhile, the invention changes the processing technology of the wire through hole and avoids the problems of difficult waste discharge and low efficiency of the drilling technology in the past blanking technology.
Description
Technical Field
The invention belongs to the technical field of FPC (flexible printed circuit) processing, and particularly relates to a high-efficiency low-cost wire passing hole process.
Background
The FPC is a Flexible Printed Circuit, which is also called a Flexible Printed Circuit board, a Flexible Circuit board, which is called an FPC or a Flexible board for short, and has the characteristics of high wiring density, light weight, and thin thickness.
The FPC flexible printed circuit is a flexible printed circuit which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The method is mainly used for a plurality of products such as mobile phones, notebook computers, PDAs, digital cameras, LCMs and the like.
In the application process of the FPC, for matching the structure requirement (generally, connection is realized by adopting a wire passing hole mode in order to enable the two sides or different layers of a multilayer board to conduct upper and lower lines), the circuit connection is simplified, the common wire passing hole adopts a mode of directly making a bonding pad on the FPC, punching or drilling a bonding pad area and welding connection after leading a lead.
In the existing wire passing hole operation mode, the processing and production cost of the wire passing hole is high due to the difficult waste discharge of the blanking process and the low production efficiency of the drilling process. Therefore, it is desirable to provide a via hole process with high efficiency and low cost.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a high-efficiency and low-cost wire passing hole process.
In order to achieve the purpose, the invention provides the following technical scheme:
the high-efficiency low-cost wire passing hole process specifically comprises the following steps:
s1, manufacturing a pad: manufacturing a bonding pad on the FPC soft board;
s2, positioning of a pad area: measuring and recording the relative position between the bonding pad area on the FPC and the positioning hole on the FPC according to the position of the bonding pad area on the FPC;
s3, carrying out lower die modification on the FPC soft board outer contour cutting die: sleeving a positioning hole in the FPC soft board on a positioning column of the FPC soft board outer contour cutting die lower die, marking an area position right below a pad area on the surface of the FPC soft board outer contour cutting die lower die according to the information of the relative position of the pad area obtained in S2 by using a marking pen, and forming a cross-shaped notch in the center of the area position;
s4, carrying out mould modification on the FPC soft board outer contour cutting die: according to the specific position of the cross notch on the lower mold of the FPC soft board outer contour cutting die in the step S3, a cross cutting die matched with the cross notch is fixedly connected to the lower surface of the FPC soft board outer contour cutting die upper mold;
s5, punching the outer contour of the FPC: the FPC soft board is installed on a lower die of the FPC outer contour cutting die through the positioning hole and the positioning column, the FPC soft board outer contour cutting die is installed on the punching machine, the punching machine is started to punch the FPC soft board outer contour, meanwhile, a cross-shaped opening is punched in a bonding pad area on the FPC soft board, the cross-shaped opening divides the bonding pad into four parts from the center of the bonding pad area, and machining of the wire passing hole is completed.
Preferably, the positioning holes are a series of holes which are reserved on the FPC soft board and are convenient for processing and positioning of the FPC board, and the positioning columns are columns which are fixedly connected to the lower die of the FPC soft board outer contour cutting die and are convenient for positioning.
Preferably, the cross cutting die is fixedly welded on the lower surface of the upper die of the FPC soft board outer contour cutting die.
Preferably, the cross cutting die and the FPC soft board outer contour cutting die upper die are of an integrated structure.
Preferably, the FPC soft board outer contour cutting die upper die is provided with a mounting hole for mounting a cross cutting die, and the cross cutting die is mounted in the mounting hole.
Preferably, the width of the cross-shaped notch is 3-5 times of the width of the cutting edge of the cross-shaped cutting die, and the cutting edge of the cross-shaped cutting die is aligned and arranged right above the cross-shaped notch.
Preferably, the mouth of the cross-shaped notch is provided with an arc part and is polished.
Preferably, four groups of cross notches are arranged, and four groups of cross cutting dies are vertically aligned with the cross notches.
Preferably, the length of each straight blade of the cross cutting die is 0.5-0.75 times the width of the bonding pad area.
The invention has the technical effects and advantages that: according to the high-efficiency low-cost wire passing hole process, the cross-shaped wire passing hole is punched simultaneously in the process of punching the outer contour cutting die of the FPC soft board, so that the drilling process is saved, and the processing time is prolonged; meanwhile, the invention changes the processing technology of the wire through hole and avoids the problems of difficult waste discharge and low efficiency of the drilling technology in the past blanking technology.
Drawings
FIG. 1 is a schematic structural diagram of an original FPC without processing;
FIG. 2 is a schematic structural diagram of a wiring hole of an original flexible printed circuit board after being processed by the prior art;
FIG. 3 is a schematic structural diagram of a wiring hole of an original flexible printed circuit board processed by the process of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The high-efficiency low-cost wire passing hole process specifically comprises the following steps:
s1, manufacturing a pad: manufacturing a bonding pad on the FPC soft board;
s2, positioning of a pad area: measuring and recording the relative position between the bonding pad area on the FPC and the positioning hole on the FPC according to the position of the bonding pad area on the FPC;
s3, carrying out lower die modification on the FPC soft board outer contour cutting die: sleeving a positioning hole in the FPC soft board on a positioning column of the FPC soft board outer contour cutting die lower die, marking an area position right below a pad area on the surface of the FPC soft board outer contour cutting die lower die according to the information of the relative position of the pad area obtained in S2 by using a marking pen, and forming a cross-shaped notch in the center of the area position;
s4, carrying out mould modification on the FPC soft board outer contour cutting die: according to the specific position of the cross notch on the lower mold of the FPC soft board outer contour cutting die in the step S3, a cross cutting die matched with the cross notch is fixedly connected to the lower surface of the FPC soft board outer contour cutting die upper mold;
s5, punching the outer contour of the FPC: the FPC soft board is installed on a lower die of the FPC outer contour cutting die through the positioning hole and the positioning column, the FPC soft board outer contour cutting die is installed on the punching machine, the punching machine is started to punch the FPC soft board outer contour, meanwhile, a cross-shaped opening is punched in a bonding pad area on the FPC soft board, the cross-shaped opening divides the bonding pad into four parts from the center of the bonding pad area, and machining of the wire passing hole is completed.
Specifically, the locating hole is a series of holes for the FPC board to be convenient for processing and positioning reserved on the FPC soft board, and the locating column is a column fixedly connected to the lower die of the FPC soft board outer contour cutting die and convenient for locating.
Specifically, the cross cutting die is fixedly welded on the lower surface of the FPC soft board outer contour cutting die upper die, or the cross cutting die and the FPC soft board outer contour cutting die upper die are of an integrated structure. The width of the cross-shaped notch is 3-5 times of the width of the cutting edge of the cross-shaped cutting die, and the cutting edge of the cross-shaped cutting die is aligned and arranged right above the cross-shaped notch. The opening part of the cross-shaped notch is an arc part and is polished. The cross-shaped notches are provided with four groups, four groups of cross-shaped cutting dies are aligned with the cross-shaped notches up and down, and one cutting die is arranged in each group. The length of each straight cutting edge of the cross cutting die is 0.5 times of the width of the bonding pad area.
Example 2
Different from the embodiment 1, the FPC soft board outer contour cutting die upper die is provided with a mounting hole for mounting a cross cutting die, and the cross cutting die is mounted in the mounting hole. Through the design of the mounting hole, the cross cutting die on the FPC soft board outer contour cutting die is convenient to mount, dismount and replace, and is convenient to use; the length of each straight blade of the cross cutting die is 0.75 times of the width of the bonding pad area.
Example 3
Different from the embodiment 2, the number of the cross-shaped notches is four, two groups of the cross-shaped cutting dies and the cross-shaped notches are arranged in an up-down alignment mode, and each group is set to be two. The two cross cutting dies are in a group and are connected into an integral structure through the fixing plate or the fixing block to be mounted on the FPC soft board outer contour cutting die upper die, so that the structural layout is convenient, and the fixing space is saved; and the length of each straight cutting edge of the cross cutting die is 0.6 times of the width of the bonding pad area.
In summary, the following steps: according to the high-efficiency low-cost wire passing hole process, the cross-shaped wire passing hole is punched simultaneously in the process of punching the outer contour cutting die of the FPC soft board, so that the drilling process is saved, and the processing time is prolonged; meanwhile, the invention changes the processing technology of the wire through hole and avoids the problems of difficult waste discharge and low efficiency of the drilling technology in the past blanking technology.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (8)
1. A high-efficiency low-cost wire passing hole process is characterized in that: the high-efficiency low-cost wire passing hole process specifically comprises the following steps:
s1, manufacturing a pad: manufacturing a bonding pad on the FPC soft board;
s2, positioning of a pad area: measuring and recording the relative position between the bonding pad area on the FPC and the positioning hole on the FPC according to the position of the bonding pad area on the FPC;
s3, carrying out lower die modification on the FPC soft board outer contour cutting die: sleeving a positioning hole in the FPC soft board on a positioning column of the FPC soft board outer contour cutting die lower die, marking an area position right below a pad area on the surface of the FPC soft board outer contour cutting die lower die according to the information of the relative position of the pad area obtained in S2 by using a marking pen, and forming a cross-shaped notch in the center of the area position;
s4, carrying out mould modification on the FPC soft board outer contour cutting die: according to the specific position of the cross notch on the lower mold of the FPC soft board outer contour cutting die in the step S3, a cross cutting die matched with the cross notch is fixedly connected to the lower surface of the FPC soft board outer contour cutting die upper mold;
s5, punching the outer contour of the FPC: the FPC soft board is installed on a lower die of the FPC outer contour cutting die through the positioning hole and the positioning column, the FPC soft board outer contour cutting die is installed on the punching machine, the punching machine is started to punch the FPC soft board outer contour, meanwhile, a cross-shaped opening is punched in a bonding pad area on the FPC soft board, the cross-shaped opening divides the bonding pad into four parts from the center of the bonding pad area, and machining of the wire passing hole is completed.
2. The high-efficiency low-cost wire passing hole process as claimed in claim 1, wherein: the positioning holes are a series of holes which are reserved on the FPC soft board and are convenient for the FPC board to be processed and positioned, and the positioning columns are columns which are fixedly connected to the lower die of the FPC soft board outer contour cutting die and are convenient for positioning.
3. The high-efficiency low-cost wire passing hole process as claimed in claim 1, wherein: the cross cutting die is fixedly welded on the lower surface of the upper die of the FPC soft board outer contour cutting die.
4. The high-efficiency low-cost wire passing hole process as claimed in claim 1, wherein: the cross cutting die and the FPC soft board outer contour cutting die upper die are of an integrated structure.
5. The high-efficiency low-cost wire passing hole process as claimed in claim 1, wherein: and the FPC soft board outer contour cutting die upper die is provided with a mounting hole for mounting a cross cutting die, and the cross cutting die is mounted in the mounting hole.
6. The high-efficiency low-cost wire passing hole process as claimed in claim 1, wherein: the width of the cross-shaped notch is 3-5 times of the width of the cutting edge of the cross-shaped cutting die, and the cutting edge of the cross-shaped cutting die is aligned and arranged right above the cross-shaped notch.
7. The high-efficiency low-cost wire passing hole process as claimed in claim 1, wherein: four groups of cross notches are arranged, and four groups of cross cutting dies are arranged in an up-and-down alignment manner with the cross notches.
8. The high-efficiency low-cost wire passing hole process as claimed in claim 1, wherein: the length of each straight blade of the cross cutting die is 0.5-0.75 times of the width of the bonding pad area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811055925.0A CN108934125B (en) | 2018-09-11 | 2018-09-11 | High-efficiency low-cost wire passing hole process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811055925.0A CN108934125B (en) | 2018-09-11 | 2018-09-11 | High-efficiency low-cost wire passing hole process |
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| Publication Number | Publication Date |
|---|---|
| CN108934125A CN108934125A (en) | 2018-12-04 |
| CN108934125B true CN108934125B (en) | 2020-10-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811055925.0A Active CN108934125B (en) | 2018-09-11 | 2018-09-11 | High-efficiency low-cost wire passing hole process |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6182357B1 (en) * | 1999-01-05 | 2001-02-06 | Intermedics Inc. | Method and apparatus for dicing electronic substrate |
| US7637008B2 (en) * | 2002-12-18 | 2009-12-29 | Intel Corporation | Methods for manufacturing imprinted substrates |
| CN204968224U (en) * | 2015-09-25 | 2016-01-13 | 杭州华三通信技术有限公司 | Circuit board |
| CN205389292U (en) * | 2016-02-29 | 2016-07-20 | 广州广电运通金融电子股份有限公司 | Take electrostatic shield's circuit board |
-
2018
- 2018-09-11 CN CN201811055925.0A patent/CN108934125B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6182357B1 (en) * | 1999-01-05 | 2001-02-06 | Intermedics Inc. | Method and apparatus for dicing electronic substrate |
| US7637008B2 (en) * | 2002-12-18 | 2009-12-29 | Intel Corporation | Methods for manufacturing imprinted substrates |
| CN204968224U (en) * | 2015-09-25 | 2016-01-13 | 杭州华三通信技术有限公司 | Circuit board |
| CN205389292U (en) * | 2016-02-29 | 2016-07-20 | 广州广电运通金融电子股份有限公司 | Take electrostatic shield's circuit board |
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| CN108934125A (en) | 2018-12-04 |
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Effective date of registration: 20190401 Address after: 528200 South China Electric Light Source Lighting City A Block 416, 417, Luocun, Shishan Town, Nanhai District, Foshan City, Guangdong Province Applicant after: Foshan City Han Feng Technology Co. Ltd. Address before: 528200 South China Light Source Lighting City No. 418/419, Shishan Town, Nanhai District, Foshan City, Guangdong Province Applicant before: Guangdong Tuifeng Electronic Technology Co., Ltd. |
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