CN108896965B

CN108896965B - 200GHz frequency band signal receiving and transmitting measurement system

Info

Publication number: CN108896965B
Application number: CN201810387267.9A
Authority: CN
Inventors: 王学田; 刘迟; 高洪民
Original assignee: Beijing Institute of Technology BIT
Current assignee: Beijing Institute of Technology BIT
Priority date: 2018-04-26
Filing date: 2018-04-26
Publication date: 2022-05-17
Anticipated expiration: 2038-04-26
Also published as: CN108896965A

Abstract

The invention provides a 200GHz frequency band signal receiving and transmitting measuring system, which comprises: the frequency source module is used for providing a first radio frequency signal and a second radio frequency signal, and the first radio frequency signal and the second radio frequency signal are coherent signals; the transmitting front-end module is used for receiving the first radio-frequency signal and outputting a third radio-frequency signal in a 200GHz frequency band; a transmitting antenna for transmitting the third radio frequency signal; the receiving antenna is used for receiving a reflected signal corresponding to the third radio frequency signal; the receiving front-end module is used for receiving the reflected signal and the second radio frequency signal and outputting a fourth radio frequency signal with set frequency, and the set frequency is less than the frequency of the 200GHz frequency band; the intermediate frequency receiving module is used for receiving the fourth radio frequency signal and outputting an I/Q demodulation signal so as to analyze a measurement result; wherein the devices in the transmit front-end module and the receive front-end module are implemented based on solid-state electronics principles. The invention can realize the 200GHz frequency band transceiving measurement based on solid-state electronics.

Description

200GHz frequency band signal receiving and transmitting measurement system

Technical Field

The invention relates to the technical field of measurement of electromagnetic radiation and scattering characteristics of a terahertz frequency band radar target, in particular to a 200GHz frequency band signal receiving and transmitting measurement system.

Background

Terahertz frequency band radar has the advantage over microwave and millimeter wave radar: firstly, the antenna system is easy to realize miniaturization and planarization; secondly, the spatial resolution is high; thirdly, the working frequency band is wide, and the imaging precision is high; fourthly, the system is small in size and suitable for space platform application.

In the outer space, the electromagnetic wave can be transmitted without loss, which can ensure that the remote detection is realized by using smaller power, and moreover, the terahertz frequency band has an atmosphere transmission window, which is convenient for improving the anti-interference capability of the ground high-power radar. For the field of target identification, the terahertz frequency band radar has a wider working frequency band compared with microwave and millimeter wave radars, so that the imaging precision can be greatly improved. Therefore, how to effectively acquire the scattering data of the target in the terahertz frequency band, reasonably and accurately extract the scattering center distribution from the scattering data, and perform necessary analysis to find out the scattering mechanism of interaction between each scattering center and each scattering center has important significance not only for target modeling and identification, but also for the stealth technology for reducing the Radar scattering Section (RCS) of the target and the Radar anti-stealth technology for enhancing the RCS detection capability.

For the research of the target scattering center, two means of experimental measurement and theoretical calculation can be adopted to acquire data. Experimental measurements can be used as proof-of-simulation means of theoretical calculations and even as the only tool for targets with extremely complex structures and materials.

However, most of the foreign researches on terahertz frequency band radar transmitting and receiving systems are based on vacuum electronics and quasi-optics principles, and the domestic researches on solid-state electronics 200GHz frequency band radar transmitting and receiving are based on that instruments such as vector network analyzers and the like provided by german technology, rodde and schwarz companies and the like are used as frequency sources, the measuring time of the instruments is slow, and the quality of the vector network analyzers is overlarge.

Disclosure of Invention

The invention provides a 200GHz frequency band signal receiving and transmitting measurement system, which is used for solving one or more problems.

The embodiment of the invention provides a 200GHz frequency band signal receiving and transmitting measurement system, which comprises: the frequency source module is used for providing a first radio frequency signal and a second radio frequency signal, and the first radio frequency signal and the second radio frequency signal are coherent signals; the transmitting front-end module is used for receiving the first radio-frequency signal and outputting a third radio-frequency signal in a 200GHz frequency band; a transmitting antenna for transmitting the third radio frequency signal; the receiving antenna is used for receiving a reflected signal corresponding to the third radio frequency signal; a receiving front-end module, configured to receive the reflected signal and the second radio frequency signal, and output a fourth radio frequency signal with a set frequency, where the set frequency is less than the frequency of the 200GHz band; the intermediate frequency receiving module is used for receiving the fourth radio frequency signal and outputting an I/Q demodulation signal so as to analyze a measurement result; wherein the devices in the transmit front-end module and the receive front-end module are implemented based on solid-state electronics principles.

According to the 200GHz frequency band signal receiving and transmitting measurement system, the system only having the 200GHz frequency band signal receiving and transmitting measurement function can be realized through the frequency source module, the transmitting front-end module, the transmitting antenna, the receiving front-end module and the intermediate frequency receiving module, the requirements of researching the electromagnetic radiation and scattering characteristics of a 200GHz frequency band target can be met, and the problems that an existing analytical instrument is complex in function, too large in weight and the like can be solved. Moreover, the first radio frequency signal and the second radio frequency signal are coherent signals, and the devices in the transmitting front-end module and the receiving front-end module are realized based on the solid-state electronics principle, so that the transmitting and receiving measurement of the 200GHz frequency band signal based on the solid-state electronics principle can be realized, and the blank of a 200GHz frequency band coherent system transmitting and receiving measurement system based on the solid-state electronics principle is filled.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts. In the drawings:

fig. 1 is a schematic structural diagram of a 200GHz band signal transceiving measurement system according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a frequency source module according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a transmit front-end module according to an embodiment of the present invention;

FIG. 4 is a block diagram of a receive front-end module according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of an intermediate frequency receiving module according to an embodiment of the present invention;

FIGS. 6 and 7 are schematic side and top views, respectively, of a transmitting antenna in one embodiment of the present invention;

fig. 8 and 9 are a side view and a top view, respectively, of a receiving antenna in accordance with an embodiment of the present invention;

FIGS. 10-12 are graphs of performance data for the PA3-110 chips;

FIG. 13 is a graphical representation of performance data for the CHA1008-99F chip;

FIGS. 14 and 15 are schematic structural diagrams of a 3mm power amplifier at a transmitting end based on a CHA1008-99F chip.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention are further described in detail below with reference to the accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.

Aiming at the necessity of research on electromagnetic radiation and scattering characteristics of a target in a 200GHz frequency band and the blank of research on a 200GHz frequency band coherent system transceiving system based on the solid-state electronics principle, the invention provides a transceiving measurement system for a 200GHz frequency band signal based on the solid-state electronics principle.

Fig. 1 is a schematic structural diagram of a 200GHz band signal transceiving measurement system according to an embodiment of the present invention. As shown in fig. 1, the 200GHz band signal transceiving measurement system may include: the frequency source module 100, the transmission front end module 200, the transmission antenna 300, the reception antenna 400, the reception front end module 500, and the intermediate frequency reception module 600.

The frequency source module 100 is configured to provide a first radio frequency signal and a second radio frequency signal, where the first radio frequency signal and the second radio frequency signal are coherent signals. The frequency range of the first radio frequency signal is, for example, 12.5Hz to 13.125Hz, and the frequency range of the second radio frequency signal is, for example, 12.25Hz to 12.875 Hz. The first rf signal and the second rf signal are coherent signals (coherent), and may be implemented by a power divider, for example.

The transmission front-end module 200 is connected to the frequency source module 100, and configured to receive the first radio frequency signal and output a third radio frequency signal in a 200GHz band. The 200GHz band is a band around 200GHz, and may be a band including 200GHz, and specifically may be 200GHz to 210 GHz.

And a transmitting antenna 300 connected to the transmit front-end module 200, for transmitting the third rf signal.

And a receiving antenna 400, configured to receive a reflected signal corresponding to the third radio frequency signal. The reflected signal may have the same frequency as the third rf signal, for example, a frequency range of 200GHz to 210 GHz. The reflected signal may be a signal reflected by the measurement target after the third radio frequency signal reaches the measurement target, so that measurement, radar imaging and the like of the measurement target can be realized.

A receiving front-end module 500, connected to the receiving antenna 400 and the frequency source module 100, respectively, and configured to receive the reflected signal and the second radio frequency signal and output a fourth radio frequency signal with a set frequency, where the set frequency is less than the frequency of the 200GHz band. The set frequency may be different according to the mixer in the receive front-end module 500, and may be 4GHz, for example. The second rf signal may be input to the receive front-end module 500 as a local oscillator signal. The receive front-end module 500 may output the fourth rf signal by mixing the reflected signal and the second rf signal.

And an intermediate frequency receiving module 600, connected to the receive front-end module 500, configured to receive the fourth radio frequency signal and output an I/Q demodulation signal for measurement result analysis. The I/Q demodulation signal may include a direct current I signal and a direct current Q signal. The I/Q demodulated signal may be further processed for baseband sampling and collected to analyze the measurement results of the measurement target, such as ranging, radar imaging, and the like.

Wherein the devices in the transmit front-end module 200 and the receive front-end module 500 are implemented based on solid-state electronics principles. The transmitting front-end module and the receiving front-end module may include, for example, amplifiers, filters, frequency multipliers, and the like, which are implemented based on solid-state electronics principles. Solid-state electronics based transceive measurement systems are essentially different from vacuum electronics and quasi-optical principles in device selection and implementation.

In this embodiment, through the frequency source module, the transmitting front-end module, the transmitting antenna, the receiving front-end module and the intermediate frequency receiving module, a system having only a 200GHz band signal transceiving measurement function can be realized, and not only can the requirements for the research on electromagnetic radiation and scattering characteristics of a 200GHz band target be met, but also the problems of complex function, excessive weight and the like of the existing analysis instrument can be overcome. Moreover, the first radio frequency signal and the second radio frequency signal are coherent signals, and the devices in the transmitting front-end module and the receiving front-end module are realized based on the solid-state electronics principle, so that the transmitting and receiving measurement of the 200GHz frequency band signal based on the solid-state electronics principle can be realized, and the blank of a 200GHz frequency band coherent system transmitting and receiving measurement system based on the solid-state electronics principle is filled.

In some embodiments, the system parameters of the 200GHz band signal transceiving measurement system may include one or more of the following parameters:

the 200GHz band signal transceiving measurement system of this embodiment is implemented based on the solid-state electronics principle, and in the frequency source module 100, by appropriately selecting the device type, a stepped frequency coherent system can be adopted, and the system has a light body and a wider relative bandwidth, and a pulse repetition period is short.

Fig. 2 is a schematic structural diagram of a frequency source module according to an embodiment of the invention. As shown in fig. 2, the frequency source module 100 may include: a first phase-locked loop 110, a second phase-locked loop 120, a third phase-locked loop 130, a power divider 140, a first mixer 150, and a second mixer 160.

The first phase-locked loop 110, the second phase-locked loop 120, and the third phase-locked loop 130 are configured to generate a first local oscillator signal, a second local oscillator signal, and an initial radio frequency signal, respectively. The first local oscillator signal may be a signal of one frequency, for example, a 10.5GHz signal. The second local oscillator signal may be a signal of one frequency, for example, a 10.25GHz signal. The initial RF signal may be a frequency band signal, such as a signal having a frequency range of 2 to 2.625 GHz. In an embodiment, in a phase-locked loop, a reference signal may be generated by an oscillator, and then frequency synthesis may be performed via a phase detector, a low-pass filter, and a voltage-controlled oscillator.

A power divider 140, connected to the third phase-locked loop 130, configured to distribute the initial rf signal into a first rf signal and a second rf signal. The frequency of the first rf signal and the frequency of the second rf signal may be identical and may be the same as the frequency of the initial rf signal. The first path of radio frequency signal and the second path of radio frequency signal are obtained from the same initial radio frequency signal, so that the first path of radio frequency signal and the second path of radio frequency signal are coherent signals easily. For example, the initial rf signal is a signal with a frequency range of 2GHz to 2.625GHz, and both the first rf signal and the second rf signal obtained by the power divider 140 may be signals with a frequency range of 2GHz to 2.625 GHz. In an embodiment, the parameters of the first rf signal and the second rf signal may be, for example: the frequency range is 2 GHz-2.625 GHz; the frequency step is 0.5 MHz; the phase noise was 95dBc/Hz @1kHz (95 dBc/Hz for phase noise at 1 kHz); the spur is-70 dBc; the output power was 10 dBm.

The first mixer 150 is connected to the first phase-locked loop 110 and the power divider 140, and configured to mix the first radio frequency signal and the first local oscillator signal, and output the first radio frequency signal. The first rf signal may be filtered by a loop filter, for example, and then transmitted from the frequency source module 100 to the transmit front end module 200 through an rf cable. In an embodiment, the parameters of the first rf signal transmitted to the front-end module 200 may be: the frequency range is 12.5 Hz-13.125 Hz; the frequency step is 0.5 MHz; the phase noise is 95dBc/Hz @1 kHz; the spur is-70 dBc; the output power was 10 dBm.

The second mixer 160 is connected to the second phase-locked loop 120 and the power divider 140, and configured to mix the second channel of radio frequency signals with a second local oscillator signal, and output the second radio frequency signal. The second rf signal may be filtered by a loop filter, for example, and then transmitted from the frequency source module 100 to the receiver front-end module 500 through an rf cable. In an embodiment, the parameters of the second rf signal transmitted to the receiving front-end module 500 may be, for example: the frequency range is 12.25 Hz-12.875 Hz; the frequency step is 0.5 MHz; the phase noise is 95dBc/Hz @1 kHz; the spur is-70 dBc; the output power was 10 dBm.

In this embodiment, the output of the first radio frequency signal and the second radio frequency signal is realized based on a power divider, and the first radio frequency signal and the second radio frequency signal can be easily made to be coherent signals.

In some embodiments, in the frequency source module 100, after passing through the power divider, the 2-2.625 GHz digital frequency generator is divided into two paths of signals, which are respectively mixed with the 10.5GHz and 10.25GHz local oscillator signals to generate two paths of radio frequency signals of 12.5-13.125 GHz and 12.25-12.875 GHz, and the two paths of radio frequency signals are respectively output to the transmitting front end module 200 and the receiving front end module 500, and ensure that the transmitting and receiving signals are coherent.

In some embodiments, the parameters of the first rf signal (transmission stepped rf signal source) output by the frequency source module 100 may be as follows:

in some embodiments, the parameters of the second rf signal (the received local oscillator stepped rf signal source) output by the frequency source module 100 may be as follows:

in an embodiment, the step frequency 8MHz and the number of hopping points 1250 can determine a distance resolution of a target measurement of the transceiving measurement system, and the distance resolution calculation formula may be: Δ R ═ C/(2N · Δ f), where C represents the speed of light, N represents the number of hops, and Δ f represents the step frequency.

In some embodiments, the parameters of the initial rf signal (quadrature demodulation lo-lock frequency source) output by the frequency source module 100 may be as follows:

frequency range: 4GHz

Stray: < -70dBc

Output frequency reference signal power: not less than 5 dBm.

Fig. 3 is a schematic structural diagram of a transmitting front-end module according to an embodiment of the present invention. As shown in fig. 3, the transmit front-end module 200 may include: a first frequency multiplication chain. The first frequency doubling link may include a first frequency doubling 201, a second frequency doubling 202, a third frequency doubling 203, and a fourth frequency doubling 204, which are connected in sequence, and are configured to increase the frequency of the first radio frequency signal to the 200GHz band. The connection between the first 201, second 202, third 203 and fourth 204 doubling frequencies may be a direct connection or an indirect connection. The first radio frequency signal is, for example, a signal with a frequency range of 12.5Hz to 13.125Hz, the frequency of the output signal is 25Hz to 26.25Hz after the first frequency doubling 201, the frequency of the output signal is 50Hz to 52.5Hz after the second frequency doubling 202, the frequency of the output signal is 100Hz to 105Hz after the third frequency doubling 203, and the frequency of the output signal is 200Hz to 210Hz after the fourth frequency doubling 204. In this embodiment, the frequency of the first radio frequency signal can be increased to a desired frequency through four frequency doublers. The first frequency doubling 201 may be implemented based on, for example, an HMC576 chip, the second frequency doubling 202 may be implemented based on, for example, a CHX2192 chip, the fourth frequency doubling 204 may be implemented based on, for example, a FARRAN chip, and a chip model adopted by the third frequency doubling 203 may be selected as needed.

As further shown in fig. 3, the transmitting front-end module 200 may further include: a third amplifier 210. The third amplifier 210 is connected between the third frequency doubling 203 and the fourth frequency doubling 204, and is configured to perform power amplification on the first radio frequency signal. The third amplifier 203 may be implemented based on a CHA1008-99F chip. In this embodiment, the third amplifier 210 may increase the power of the first radio frequency signal to a required power, and the third amplifier 210 is disposed near the output end of the front-end transmission module 200 (connected between the third frequency doubling 203 and the fourth frequency doubling 204), so that the loss of the signal transmitted in the front-end transmission module 200 can be reduced. The selection of the CHA1008-99F chip to implement the third amplifier 203 is made by the inventor through creative work, and the inventor breaks through the limitation of the performance parameters provided by the CHA1008-99F chip manual to the understanding of the technical personnel in the field, and the specific creative work process will be described in the following content.

As further shown in fig. 3, the transmitting front-end module 200 may further include: a first filter 205, a first amplifier 206, a second filter 207, a second amplifier 208 and a third filter 209. The first amplifier 206 and the second amplifier 208 may be integrated operational amplifiers.

The first filter 205 and the first amplifier 206 are connected between the first frequency doubling 201 and the second frequency doubling 202, and are respectively configured to filter and amplify an output signal of the first frequency doubling 201. The first filter 205 and the first amplifier 206 may be connected to each other, for example, the first filter 205 and the first amplifier 206 are connected to the first frequency doubling 201 and the second frequency doubling 202, respectively. The connection locations may be interchanged depending on the particular device selection of the first filter 205 and the first amplifier 206.

A second filter 207 and a second amplifier 208, connected between the second frequency doubling 202 and the third frequency doubling 203, for respectively filtering and amplifying the output signal of the second frequency doubling 202. The second filter 207 and the second amplifier 208 may be connected to each other, e.g. the second filter 207 and the second amplifier 208 may be connected to said second frequency doubling 202 and said third frequency doubling 203, respectively. The connection positions may be interchanged depending on the particular device selection of the second filter 207 and the second amplifier 208.

A third filter 209 is connected between the third frequency doubling 203 and the fourth frequency doubling 204, and is configured to filter an output signal of the third frequency doubling 203. A third filter 209 may be connected to the above-mentioned third amplifier 210, for example, the third filter 209 and the above-mentioned third amplifier 210 may be connected to the third doubling frequency 203 and the fourth doubling frequency 204, respectively. The connection locations may be interchanged depending on the particular device selection of the third filter 209 and the third amplifier 210 described above.

In some embodiments, the transmission front-end module 200 receives 12.5 to 13.125GHz radio frequency signals output by the frequency source module 100, outputs 200 to 210GHz radio frequency signals through a frequency doubling link of 4 frequency doublers, and directionally radiates in space through a high-gain low-sidelobe transmission antenna.

In some embodiments, the parameters of the transmit front-end module 200 may be as follows:

fig. 4 is a schematic structural diagram of a receive front-end module according to an embodiment of the present invention. As shown in fig. 4, the receive front-end module 500 may include: a second frequency multiplying link. The second frequency doubling link may include a fifth frequency doubling 501, a sixth frequency doubling 502, and a seventh frequency doubling 503 connected in sequence, and is configured to perform frequency doubling processing on the second radio frequency signal. The connections between the fifth frequency doubling 501, the sixth frequency doubling 502 and the seventh frequency doubling 503 may be direct connections or indirect connections. The second radio frequency signal (local oscillator signal) is, for example, a signal with a frequency range of 12.25Hz to 12.875Hz, the frequency of the output signal is 24.5Hz to 25.75Hz after the fifth frequency doubling 501, the frequency of the output signal is 49Hz to 51.5Hz after the sixth frequency doubling 502, and the frequency of the output signal is 98Hz to 103Hz after the seventh frequency doubling 503. In this embodiment, the frequency of the second radio frequency signal can be increased to a desired frequency through three frequency doubling. The fifth frequency doubling 501 may be implemented based on, for example, an HMC576 chip, the sixth frequency doubling 502 may be implemented based on, for example, a CHX2192 chip, and a chip model adopted by the seventh frequency doubling 503 may be selected as needed.

As further shown in fig. 4, the receive front-end module 500 may further include: a sixth amplifier 509. The sixth amplifier 509 is connected to the seventh frequency doubling 503, and configured to perform power amplification on the output signal of the seventh frequency doubling 503; the sixth amplifier 509 is implemented based on the CHA1008-99F chip. In this embodiment, the sixth amplifier 509 can increase the power of the second rf signal to a required power, and the sixth amplifier 509 is disposed at a position close to the output end of the front-end receiving module 500 (connected to the seventh frequency doubling 503), so that the loss of the signal transmitted in the front-end receiving module 500 can be reduced. The selection of the CHA1008-99F chip to implement the sixth amplifier 509 is made by the inventor through creative work, and the inventor breaks through the limitation of the performance parameters provided by the CHA1008-99F chip manual to the understanding of those skilled in the art, and the specific creative work process will be described in the following.

As further shown in fig. 4, the receive front-end module 500 may further include: a fourth filter 504, a fourth amplifier 505, a fifth filter 506, a fifth amplifier 507, a sixth filter 508, and a third mixer 510. The fourth amplifier 505 and the fifth amplifier 507 may be integrated operational amplifiers.

A fourth filter 504 and a fourth amplifier 505, connected between the fifth frequency doubling 501 and the sixth frequency doubling 502, for filtering and signal amplifying the output signal of the fifth frequency doubling 501. The fourth filter 504 and the fourth amplifier 505 may be connected to each other, for example, the fourth filter 504 and the fourth amplifier 505 are connected to the fifth frequency doubling 501 and the sixth frequency doubling 502, respectively. The connection positions may be interchanged depending on the particular device selection of the fourth filter 504 and the fourth amplifier 505.

A fifth filter 506 and a fifth amplifier 507, connected between the sixth frequency doubling 502 and the seventh frequency doubling 503, for filtering and signal amplifying the output signal of the sixth frequency doubling 502. The fifth filter 506 and the fifth amplifier 507 may be connected to each other. For example, the fifth filter 506 and the fifth amplifier 507 may be connected with the sixth and seventh frequency doubling 502 and 503, respectively. The connection positions may be interchanged depending on the particular device selection of the fifth filter 506 and the fifth amplifier 507.

A sixth filter 508, connected to the seventh frequency doubling 503, for filtering an output signal of the seventh frequency doubling 503. The sixth filter 508 may be connected to a sixth amplifier 509. A sixth filter 508 and a sixth amplifier 509 may be connected between the seventh frequency doubling 503 and the third mixer 510, and the connection positions may be interchanged depending on the specific device selection of the sixth filter 508 and the sixth amplifier 509.

A third mixer 510, configured to receive the reflected signal and the filtered and power-amplified output signal of the seventh frequency doubling 503, and output the fourth radio frequency signal. The third mixer 510 may be directly connected to the sixth amplifier 509, and may be indirectly connected to the sixth filter 508.

In some embodiments, the receive front-end module 500 receives the spatially reflected 200GHz to 210GHz rf signals, and outputs 4GHz rf signals through the harmonic mixer. The local oscillation signal at the receiving front end is derived from another path of 12.25-12.875 GHz radio frequency signal output by the frequency source module 100, and the radio frequency signal of 98-103 GHz is output through a frequency doubling link of 3 frequency doublers. In the frequency range of 200GHz band (for example, 200GHz to 210GHz), a single frequency point test or a frequency hopping test can be performed.

In some embodiments, the parameters of the receive front-end module 500 may be as follows:

fig. 5 is a schematic structural diagram of an intermediate frequency receiving module according to an embodiment of the present invention. As shown in fig. 5, the if receiving module 600 may include: a fourth mixer 601 and an I/Q demodulator 602.

The fourth mixer 601 is configured to receive the fourth radio frequency signal and a third local oscillator signal, and output a fifth radio frequency signal of 100 MHz. The fourth rf signal may be a 4GHz if signal, and the frequency input to the fourth mixer 601 may not be changed, i.e. still be a 4GHz if signal. The third local oscillator signal may be generated by a phase locked loop PLL and amplified by the amplifier 612 to output, for example, a radio frequency signal of 3.9 GHz. The 4GHz intermediate frequency signal and the 3.9GHz radio frequency signal may output a fifth radio frequency signal, for example, 100MHz, through the fourth mixer 601. The fourth mixer 601 may be implemented, for example, based on an HMC128 chip.

An I/Q demodulator 602, connected to the fourth mixer 601, for receiving the fifth rf signal and outputting the I/Q demodulated signal. The fifth rf signal may be input to the I/Q demodulator 602 along with a given demodulation signal (e.g., 100MHz), and then output the I/Q demodulation signal. The I/Q demodulated signal includes a DC I signal and a DC Q signal. Further, the I/Q demodulated signal may be linearly amplified for acquisition for measurement analysis. The chip type used by the I/Q demodulator 602 may be selected as desired.

Referring to fig. 5 again, the intermediate frequency receiving module 600 may further include: filter 603, amplifier 604, digitally controlled attenuator 605, amplifier 606, digitally controlled attenuator 607, amplifier 608, amplifier 609, first linear amplifier 610 and second linear amplifier 620. Amplifier 604, amplifier 606, amplifier 608, and amplifier 609 may be integrated operational amplifiers that may amplify a signal.

In some embodiments, the intermediate frequency receiving module 600 amplifies the 4GHz signal output by the receiving front-end module, mixes the amplified signal with the 3.9GHz local oscillator signal to output a100 MHz signal, and then demodulates the output 100MHz signal and the 100MHz to output a dc I, Q signal and performs linear amplification for acquisition. The signal acquisition can be a100 kHz multi-path acquisition card, and I, Q signals are converted into digital signals.

In some embodiments, the parameters of the if receiving module 600 may be as follows:

in some embodiments, the waveguides in the transmitting antenna 300 and the receiving antenna 400 are WR4 waveguides. The WR4 waveguide has a frequency range of 170GHz-260GHz, and can meet the frequency band requirement of a transceiving measurement system. The waveguide may refer to a waveguide located at one end port of the transmitting antenna 300 and the receiving antenna 400. Fig. 6 and 7 are a side view and a top view, respectively, of a transmitting antenna in an embodiment of the invention. The size and shape of the transmitting antenna 300 may be as shown in fig. 6 and 7. In addition, the parameters of the transmitting antenna 300 may include: WR 4: 1.0922 × 0.5461 mm; gain: 23.06dBi (center frequency); full-band standing waves: less than or equal to 1.1; side lobe level: -17.5 dB; 3dB lobe width: 14 deg.. Fig. 8 and 9 are a side view and a top view of a receiving antenna according to an embodiment of the invention. The size and shape of the receiving antenna 400 may be as shown in fig. 8 and 9. In addition, the parameters of the receiving antenna 400 may include: WR 4: 1.0922 × 0.5461 mm; gain: 25.1dBi (center frequency); full-band standing waves: less than or equal to 1.1; side lobe level: -22 dB; 3dB lobe width: 12 deg.

In some embodiments, the transmit antenna 300 and the receive antenna 400 may employ high gain low sidelobe antennas. The technical specifications of the transmitting antenna 300 and the receiving antenna 400 may be as follows:

the invention will be illustrated in a specific embodiment below:

the 200GHz frequency band signal transceiving measurement system comprises the following parts:

a system transmit front end;

a system receives a front end;

the system case comprises a system frequency source part and an intermediate frequency receiving part;

a system radio frequency cable;

a transmitting antenna and a receiving antenna;

PCI acquisition card and system control frequency hopping acquisition software.

(1) The 200GHz frequency band signal transceiving measurement system adopts a step frequency system, and the parameters are as follows:

(2) the technical indexes of the transmitting front end are as follows:

the transmitting front end receives 12.5-13.125 GHz radio frequency signals output by the control system, outputs 200-210 GHz radio frequency signals through a frequency doubling link of 4 frequency doublers, and directionally radiates to space through a high-gain low-side lobe antenna. A schematic block diagram may be seen in fig. 3.

(3) The technical indicators of the receiving front end are as follows:

the receiving front end receives a 200-210 GHz radio frequency signal reflected by the space, and outputs a 4GHz radio frequency signal through the harmonic mixer. The local oscillation signal of the receiving front end is derived from another path of 12.25-12.875 GHz radio frequency signal output by the control system, and the radio frequency signal of 98-103 GHz is output through a frequency doubling link of 3 frequency doublers. The schematic block diagram is shown in fig. 4.

(4) The technical indexes of the frequency source are as follows:

the frequency source part is that a 2-2.625 GHz digital frequency generator is subjected to frequency mixing with 10.5GHz and 10.25GHz local oscillation signals respectively after passing through a power divider, so that two paths of radio frequency signals of 12.5-13.125 GHz and 12.25-12.875 GHz are generated and output to a transmitting front end and a receiving front end respectively, and the transmitting and receiving signals are ensured to be coherent. The schematic block diagram is shown in fig. 2.

-transmitting stepped frequency signal source

-receiving local oscillator step frequency signal source

-quadrature demodulation local oscillator phase-locked frequency source

(5) The technical indexes of the intermediate frequency receiving part are as follows:

the intermediate frequency receiver amplifies a 4GHz signal output by a receiving front end, mixes the amplified signal with a 3.9GHz local oscillation signal to output a100 MHz signal, demodulates the signal with the 100MHz to output a direct current I, Q signal, and performs linear amplification for acquisition. The signal acquisition is a100 kHz multi-path acquisition card, and I, Q signals are converted into digital signals. The schematic block diagram is shown in fig. 5.

(5) The technical indexes of the transmitting antenna and the receiving antenna are as follows:

the technical indexes of the high-gain low-sidelobe horn antenna are shown in fig. 6 to 9.

In some embodiments, the transmitting front end of the 200GHz band transceiving system has the size of 239mm × 100mm × 58.8mm and the mass of 2.047 kg; the system receives the front end with the size of 160.1mm multiplied by 80mm and the mass of 0.945 kg; the size of the system chassis is 420mm multiplied by 365mm multiplied by 80mm, and the mass is 7.95 kg.

In the above embodiment, the third amplifier 210 and the sixth amplifier 509 can be based on the CHA1008-99F chip, which is the inventor's creative work, and the analysis is as follows:

as shown in fig. 3, the final amplifier (the third amplifier 210) of the front-end module 200 amplifies 100 GHz-105 GHz signals, and the signal power needs to reach about +14dBm, so as to meet the typical input power requirement of the frequency doubler (the fourth frequency doubler 204) of the next-stage FARRAN company, thereby ensuring that 200 GHz-210 GHz signals can be obtained at the output end of the front-end module 200 and the power is greater than 10 mW. As shown in fig. 4, the final amplifier of the front-end receiving module 500 amplifies the power of the 98-103 GHz signal to +10dBm, so as to meet the requirement of the harmonic mixer (third mixer 510) of the next stage FARRAN company on the local oscillation driving.

Therefore, a power amplifier needs to be specially designed in a frequency band of 98-105 GHz to ensure that the power of + 10-15 dBm can be output under the condition of receiving-20 dBm input power.

The existing power amplifier chips with the working frequency reaching 105GHz are two types, namely PA3-110 chips of HRL company and CHA1008-99F chips of UMS company. The data of the PA3-110 chips are shown in FIG. 10, FIG. 11 and FIG. 12, the data of the CHA1008-99F chips are shown in FIG. 13, and it can be seen from the data of the two chips that the saturation output power of the PA3-110 chips reaches 13dBm and the gain is about 13dB, while the output 1dB compression point power of the CHA1008-99F chips is +5dBm and the gain is about 16dBm, and no saturation output power value is given on the data. At high output power requirements, those skilled in the art are generally inclined to select PA3-110 die without selecting CHA1008-99F chips based on the disclosed chip performance data.

However, in the actual test process, the inventor finds that the gain and the output power of the PA3-110 chip at 105GHz are reduced seriously, the measured saturated output power is about +3dBm (at 105GHz), which is far from the requirement of the invention, and the self-excitation is easily generated in the test process, which causes the abnormal working state. Moreover, for the above problems, even if adjustment and debugging are performed from multiple aspects, including cavity optimization design, addition of a 96-110 GHz band pass filter, microstrip line impedance matching debugging, chip micro-assembly technology optimization, and dc power supply optimization, the problems cannot be solved.

In this case, the inventors tested the CHA1008-99F chips, and the results are shown in tables 1 and 2.

Frequency (GHz)	96	97	98	99	100	101	102	103	104	105	106
												Input power (dBm)	-20	-20	-20	-20	-20	-20	-20	-20	-20	-20	-20
Output power (dBm)	-4.8	-4.7	-5	-5	-5	-5.2	-5.2	-5.5	-5.1	-5.1	-5.3
												Gain (dB)	15.2	15.3	15	15	15	14.8	14.8	14.5	14.9	14.9	14.7

TABLE 1 Small Signal test results for CHA1008-99F chips

Frequency (GHz)	96	97	98	99	100	101	102	103	104	105	106
												Input power (dBm)	-4	-4	-4	-4	-4	-4	-4	-4	-4	-4	-4
Output power (dBm)	10.2	10.5	10	10	10.3	10.2	10.1	9.8	9.8	9.6	9.7
												Gain (dB)	14.2	14.5	14	14	14.3	14.2	14.1	13.8	13.8	13.6	13.7

TABLE 2 Large Signal test results for CHA1008-99F chips

According to the initial test result of the CHA1008-99F chip, the inventor finds that the small signal gain is about 15dB, and the output power can reach 10dBm when the gain is compressed by 2dB, which is far higher than the output 1dB compression point given in the data manual. Based on this finding, in the embodiment, the receiving end 3mm power amplifier (and the sixth amplifier 509) based on the CHA1008-99F chip design can be as shown in fig. 14 and fig. 15. As shown in fig. 14, after the 3mm frequency band signal generated after multiple frequency doubling, filtering and amplification is amplified by a CHA1008-99F chip primary amplifier, power distribution is performed by a four-way power divider, four-way power division signals are subjected to secondary amplification by four CHA1008-99F chips, and a 3mm output signal of +15dBm is obtained through power synthesis, so that the FARRAN frequency doubling operation can be promoted. As shown in fig. 15, the 3mm band signal generated after multiple frequency multiplication, filtering and amplification is directly subjected to secondary amplification by the CHA1008-99F chip twice, and a 3mm reception local oscillator signal meeting the requirement can be obtained, so that the FARRAN harmonic mixer can be pushed to work. The 3mm power amplifier at the receiving end shown in fig. 14 and 15 was tested, and the test results are shown in table 3. As can be seen from Table 3, the power amplifier designed based on the CHA1008-99F chip can meet the power requirement in the transceiving measurement system. Similarly, a transmitting end 3mm power amplifier (the third amplifier 210) may be designed based on the CHA1008-99F chip, and under the condition that the power requirements of the receiving end and the transmitting end are consistent, the design of the transmitting end 3mm power amplifier may be the same as that of the receiving end 3mm power amplifier, as shown in fig. 14 and fig. 15, and the test result of the transmitting end 3mm power amplifier after the design may be as shown in table 3.

Frequency (GHz)	96	97	98	99	100	101	102	103	104	105	106
												Input power (dBm)	-15	-15	-15	-15	-15	-15	-15	-15	-15	-15	-15
Output power (dBm)	11.3	12.1	12	11	11.2	10.9	10.8	11	10.7	10.9	10.9

Table 3 initial measurement result of 3mm power amplifier at receiving end

The 200GHz frequency band transceiving measurement system of the embodiment comprises the following steps:

1. before the 200GHz band transceiving measurement system of the above embodiment is used to perform target measurement, each part in the system may be tested separately, and the specific process is as follows:

(1) test of receiving front-end input local oscillator signal

The technical index requirements are as follows:

output frequency (to fifth frequency doubling 501): 12.25-12.875 GHz;

output power (to fifth frequency doubling 501): 12 + -1 dBm;

stray: less than or equal to-60 dBc;

phase noise: less than or equal to-85 dBc/Hz @1 kHz.

The testing steps are as follows: the frequency source module part inputs a local oscillation 4GHz signal by using a signal source, the frequency spectrograph is accessed to the frequency source and outputs the signal to the part of the receiving front end, the corresponding output power, stray and phase noise of an output frequency point are monitored, and a test result needs to meet the requirements of technical indexes.

(2) Transmit front-end output radio frequency signal testing

The technical index requirements are as follows:

output frequency (to fourth frequency doubling 204): 12.5 to 13.125 GHz;

output power (to fourth frequency doubling 204): 12 + -1 dBm;

stray: less than or equal to-60 dBc;

phase noise: less than or equal to-85 dBc/Hz @1 kHz.

The testing steps are as follows: the frequency source module part inputs a 4GHz signal by using a signal source, the frequency spectrograph is connected to the frequency source and outputs the signal to the part of the transmitting front end, the corresponding output power, stray and phase noise of an output frequency point are monitored, and a test result needs to meet the requirements of technical indexes.

(3) Receive front end 3mm module output power (to third mixer 510) test

The technical index requirements are as follows:

the output of the receiving front-end 3mm module is used as a local oscillator of the 200GHz harmonic mixer, and the local oscillator power is within the range of 8-10 dBm and not more than 12dBm according to the requirements of the use specification of the harmonic mixer product.

The testing steps are as follows: the frequency source module part inputs 12.25-12.875 GHz signals by using a signal source, the power is 12 +/-1 dBm, the power meter is connected to the part of the receiving front end outputting 98-103 GHz signals, and the corresponding output power of the monitoring output frequency point meets the requirement of technical indexes.

(4) Test of output power (to fourth frequency doubling 204) of 3mm module at transmitting front end

The technical index requirements are as follows:

the module with the 3mm front end is used for outputting a pushing signal serving as a 200GHz frequency multiplier, and the pushing power is not less than 14dBm according to the requirements of the use specification of a frequency multiplier product.

The testing steps are as follows: the frequency source module part inputs 12.5-13.125 GHz signals by using a signal source, the power is 12 +/-1 dBm (+/-1 represents that the fluctuation range is 1, for example, the power range is 11 dBm-13 dBm), the power meter is accessed to the part of the receiving front end for outputting 100-105 GHz signals, and the corresponding output power of the monitoring output frequency point meets the technical index requirements.

(5) Intermediate frequency module gain and attenuation test

The technical index requirements are as follows:

the maximum gain of the intermediate frequency module is not less than 60dB, the maximum attenuation of the intermediate frequency module is not less than 60dB, and the step amount is 1 dB.

The testing steps are as follows: the method comprises the steps that a 4GHz local oscillator signal is accessed to an intermediate frequency module of a system, the rear end of a mixer module is accessed to a frequency spectrograph, and the maximum gain, the maximum attenuation and the step quantity of a signal part (the output end of a mixer 504) with the output frequency of 100MHz after a mixer of a monitoring module need to meet the requirements of technical indexes.

(6) IQ demodulation module technical index test

The technical index requirements are as follows:

the design requirement of the IQ demodulation module is that I, Q two paths of direct current signals are output under the conditions that a radio frequency signal is 100MHz, the power is 10dBm, a local oscillation signal is 100MHz and the power is 0dBm, the orthogonality of the direct current signals is not more than 5 degrees, and the level of the output signals is not less than +/-1V (guaranteed by a direct current amplifier).

The testing steps are as follows: a radio frequency signal and a local oscillation signal of 100MHz are accessed to an IQ demodulation module part of the system, the power is required to meet the technical index requirement, and an oscilloscope is accessed to an IQ signal output part to detect the amplitude and the orthogonality of the output signal.

2. Before the 200GHz band transceiving measurement system of the above embodiment is used to perform target measurement, the system may be subjected to installation test, which includes the following processes:

and after the key components are tested to be qualified, performing system test.

(1) Three radio frequency cables are used for connecting the receiving, transmitting and local oscillation parts of the transceiver module and the case.

(2) The J30J21ZKP interface line is connected with the RS485 USB line, the J30J21ZKP interface line is connected with the control acquisition part of the case, and the USB is connected with the USB port of the computer.

(3) The acquisition card J1 joint is connected with the two SMA coaxial lines, the coaxial lines are connected with the I/Q demodulation signal of the case for acquiring the I/Q output signal, and the J1 joint is connected with the PCI acquisition card.

(4) And the J30J9ZKP interface line is used for connecting the transceiver module and the host and supplying power to the transmitting module and the receiving module.

(5) The distance between the receiving and transmitting antennas is 1.5m, and when the misalignment of the main lobe of the antenna is measured, the amplitude of the S21 signal needs to be ensured to be larger than +/-4V when an IQ signal is acquired in the frequency sweeping process.

3. The 200GHz frequency band transceiving measurement system of the embodiment is used for carrying out target imaging test, and the process is as follows:

(1) connecting the transceiver module and the control cabinet, ensuring that the transceiver antenna is strictly arranged in the same polarization mode, connecting the control cabinet and the computer, and initializing parameters of the control module;

(2) initializing a rotary table, adjusting the rotary table to an initial position, or selecting a proper position as the initial position;

(3) carrying out frequency sweep test on the background, measuring to obtain background S21 data, and storing the background data;

(4) placing a calibration ball at the center of the turntable under the condition of ensuring that the test environment is not changed, and carrying out frequency sweep test on the calibration ball to obtain S21 data of the calibration ball;

(5) under the condition that other conditions are not changed, replacing the calibration ball with the target to be measured, and placing the calibration ball at the central position of the turntable;

(6) adjusting the turntable to the initial position, performing corner frequency sweep test on the target, namely acquiring S21 data of the target once by the computer through the control cabinet at a certain corner interval and storing the data into the computer;

(7) the one-dimensional imaging data processing can select a group of data under a certain angle from the corner frequency sweep test data of the target to perform one-dimensional imaging processing, display a one-dimensional graph (relation between RCS and distance), and also can directly perform frequency sweep test without rotation to finish one-dimensional imaging.

In order to solve the problem of the 200GHz band of the lower band, the present embodiment provides a 200GHz band transceiving measurement system based on solid-state electronics. By using the 200GHz frequency band transmitting-receiving measurement system, an effective and feasible test system can be provided for the research of electromagnetic radiation and scattering characteristics of a target in the 200GHz frequency band. By examining the existing terahertz transceiving measurement system, the embodiment provides a solid-state electronics broadband high-resolution transceiving measurement system with a 200GHz frequency band based on a step frequency radar principle. The usability of the system is verified through the design and development of the 200GHz frequency band transceiving measurement system and the one-dimensional distance imaging test. Therefore, an effective and feasible test system can be provided for terahertz frequency band target electromagnetic radiation and scattering measurement. The system can be matched with a compact field measurement system to finish indoor target electromagnetic scattering simulation measurement, and can also be matched with a two-dimensional turntable to finish target ISAR (Inverse Synthetic Aperture Radar) two-dimensional scattering center imaging.

The application example of the measuring system of the embodiment of the invention is as follows:

(1) imaging system RCS accuracy testing

The RCS of 11cm diameter metal spheres was determined using a calibration sphere of 20cm diameter (RCS ═ 15dBsm), and the RCS of the resulting 11cm diameter calibration spheres was compared and tested for differences from the theoretical value (RCS ═ 20 dBsm).

The experimental result shows that the RCS test value of the metal ball with the diameter of 11cm is closer to the theory, the backward RCS value of the metal ball is-18.83 dBsm, and the error is about 1dB according to-20 dBsm, which indicates that the experimental system is reliable, the imaging algorithm is correct, and the software programming is correct.

However, since the inter-antenna separation can only be solved by adjusting the distance and the angle between the transmitting and receiving antennas, it is normal that the error is within 1 dB.

(2) System one-dimensional imaging longitudinal resolution test

The actual resolution achievable using two dihedral corner reflectors tests the system. The experiment was carried out in two runs, with a distance of 4cm and 6cm between the front and back of the two corner reflectors.

Experimental results show that the test system can clearly distinguish between the two corner reflectors when they are 6cm apart. In the case of actual measurement, the distinction at a distance of 4cm is not sufficiently obvious.

In summary, the 200GHz band signal transceiving measurement system according to the embodiment of the present invention can implement a system having only a 200GHz band signal transceiving measurement function by using the frequency source module, the transmitting front end module, the transmitting antenna, the receiving front end module, and the intermediate frequency receiving module, so as to not only meet the requirement of researching electromagnetic radiation and scattering characteristics of a 200GHz band target, but also overcome the problems of complex function, excessive weight, and the like of the existing analyzer. And, first radio frequency signal with second radio frequency signal is the coherent signal, the transmission front end module with device in the receiving front end module is realized based on solid-state electronics principle to this, can realize the 200GHz frequency channel signal receiving and dispatching measurement based on solid-state electronics principle, filled the blank of 200GHz frequency channel coherent system receiving and dispatching measurement system based on solid-state electronics principle, and can adopt step-by-step frequency coherent system, possess advantages such as miniaturization, light weight and wideer relative bandwidth, and pulse repetition cycle is shorter.

In the description herein, reference to the description of the terms "one embodiment," "a particular embodiment," "some embodiments," "for example," "an example," "a particular example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. The sequence of steps involved in the various embodiments is provided to schematically illustrate the practice of the invention, and the sequence of steps is not limited and can be suitably adjusted as desired.

As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.

The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.

These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.

The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A200 GHz frequency band signal receiving and dispatching measurement system is characterized by comprising:

the frequency source module is used for providing a first radio frequency signal and a second radio frequency signal, and the first radio frequency signal and the second radio frequency signal are coherent signals;

the transmitting front-end module is connected with the frequency source module and used for receiving the first radio-frequency signal and outputting a third radio-frequency signal in a 200GHz frequency band;

the transmitting antenna is connected with the transmitting front-end module and used for transmitting the third radio frequency signal;

the receiving antenna is used for receiving a reflected signal corresponding to the third radio frequency signal;

a receiving front-end module, connected to the receiving antenna and the frequency source module, respectively, and configured to receive the reflected signal and the second radio frequency signal and output a fourth radio frequency signal with a set frequency, where the set frequency is less than the frequency of the 200GHz band;

the intermediate frequency receiving module is connected with the receiving front-end module and used for receiving the fourth radio frequency signal and outputting an I/Q demodulation signal so as to analyze a measuring result;

wherein the devices in the transmit front-end module and the receive front-end module are implemented based on solid-state electronics principles;

the frequency source module includes:

the first phase-locked loop, the second phase-locked loop and the third phase-locked loop are used for respectively generating a first local oscillator signal, a second local oscillator signal and an initial radio frequency signal;

the power divider is connected with the third phase-locked loop and used for dividing the initial radio frequency signal into a first path of radio frequency signal and a second path of radio frequency signal;

the first frequency mixer is respectively connected with the first phase-locked loop and the power divider, and is configured to mix the first radio frequency signal and a first local oscillator signal and output the first radio frequency signal;

and the second frequency mixer is respectively connected with the second phase-locked loop and the power divider, and is used for mixing the second path of radio-frequency signals and the second local oscillator signals and outputting the second radio-frequency signals.

2. The 200GHz band signal transceiving measurement system of claim 1, wherein the transmit front-end module comprises:

the first frequency doubling link comprises a first frequency doubling frequency, a second frequency doubling frequency, a third frequency doubling frequency and a fourth frequency doubling frequency which are sequentially connected, and is used for increasing the frequency of the first radio-frequency signal to the 200GHz frequency band.

3. The 200GHz band signal transceiving measurement system of claim 2, wherein the transmit front-end module further comprises:

the third amplifier is connected between the third frequency doubling and the fourth frequency doubling and used for performing power amplification on the first radio-frequency signal; the third amplifier is realized based on a CHA1008-99F chip.

4. The 200GHz band signal transceiving measurement system of claim 3, wherein the transmit front-end module further comprises:

the first filter and the first amplifier are connected between the first frequency doubling and the second frequency doubling and are respectively used for filtering and amplifying the output signal of the first frequency doubling;

the second filter and the second amplifier are connected between the second frequency doubling and the third frequency doubling and are respectively used for filtering and amplifying the output signal of the second frequency doubling;

and the third filter is connected between the third frequency doubling and the fourth frequency doubling and is used for filtering the output signal of the third frequency doubling.

5. The 200GHz band signal transceiving measurement system of claim 1, wherein the receive front-end module comprises:

and the second frequency doubling link comprises a fifth frequency doubling, a sixth frequency doubling and a seventh frequency doubling which are sequentially connected and is used for carrying out frequency doubling processing on the second radio-frequency signal.

6. The 200GHz band signal transceiving measurement system of claim 5, wherein the receive front-end module further comprises:

a sixth amplifier, connected to the seventh frequency doubling, for performing power amplification on the seventh frequency-doubled output signal; the sixth amplifier is realized based on a CHA1008-99F chip.

7. The 200GHz band signal transceiving measurement system of claim 6, wherein the receive front-end module further comprises:

a fourth filter and a fourth amplifier, connected between the fifth frequency doubling and the sixth frequency doubling, for filtering and signal amplifying the fifth frequency doubled output signal;

a fifth filter and a fifth amplifier, connected between the sixth frequency doubling and the seventh frequency doubling, for filtering and signal amplifying the sixth frequency doubled output signal;

a sixth filter, connected to the seventh frequency doubling, for filtering the seventh frequency-doubled output signal;

and the third mixer is used for receiving the reflected signal and the seventh frequency-doubled output signal after filtering and power amplification and outputting the fourth radio-frequency signal.

8. The 200GHz band signal transceiving measurement system of claim 1, wherein the if receiving module comprises:

the fourth frequency mixer is used for receiving the fourth radio frequency signal and a third local oscillator signal and outputting a fifth radio frequency signal of 100 MHz;

and the I/Q demodulator is connected with the fourth mixer and used for receiving the fifth radio-frequency signal and outputting the I/Q demodulation signal.

9. The 200GHz band signal transceiving measurement system of claim 1, wherein the waveguides in the transmit antenna and the receive antenna are WR4 waveguides.