CN108882569A - A kind of production method and PCB of PCB - Google Patents
A kind of production method and PCB of PCB Download PDFInfo
- Publication number
- CN108882569A CN108882569A CN201811011373.3A CN201811011373A CN108882569A CN 108882569 A CN108882569 A CN 108882569A CN 201811011373 A CN201811011373 A CN 201811011373A CN 108882569 A CN108882569 A CN 108882569A
- Authority
- CN
- China
- Prior art keywords
- conductive bond
- bond piece
- conductive
- semi
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
Abstract
The invention discloses the production method of PCB a kind of and PCB, are related to printed wiring board technical field.The production method includes step：An at least semi-solid preparation substrate is provided, and opens up conductive through hole on an at least semi-solid preparation substrate；For every semi-solid preparation substrate sticking the first conductive bond piece；One the second conductive bond piece is provided；The first conductive bond piece and the second conductive bond piece is respectively cut to obtain the line pattern of each layer.Line pattern is made by cutting conductive bond piece in the present invention, and whole processes are mainstream journey, and process is short, spent material is few, then the influence factor for influencing route yield is reduced, also more friendly to environment；Meanwhile conductive bond piece plays layers of copper+prepreg collective effect, in the case where needing to control plate thickness, finished product PCB can reduce the thickness of each layer prepreg.
Description
Technical field
The present invention relates to printed wiring board technical field more particularly to the production methods and PCB of a kind of PCB.
Background technique
The line pattern production of PCB routine includes that photosensitive coat, exposure, development, etching etc. are made in copper-clad plate
Step, process flow is longer, and the influence factor of route yield is more, needs using various materials such as the film, light-sensitive surface, liquid medicine,
And including multiple wet processes in process, larger to the pollution of environment, increased therewith is the costs such as drying-plate and wastewater treatment.
Furthermore it is bonded between copper-clad plate by prepreg, if desired makes the lesser PCB of plate thickness, conventional structure is very
Difficulty reaches requirement.
Summary of the invention
It is an object of the invention to propose the production method and PCB of a kind of PCB, production process is mainstream journey, spent material
Few, process is short, and can reduce plate thickness.
For this purpose, the present invention uses following technical scheme：
On the one hand, the present invention provides the production method of PCB a kind of, including：
An at least semi-solid preparation substrate is provided, and opens up conductive through hole on an at least semi-solid preparation substrate；
For every semi-solid preparation substrate sticking the first conductive bond piece；
One the second conductive bond piece is provided；
The first conductive bond piece and the second conductive bond piece is respectively cut to obtain the line pattern of each layer.
Wherein, a second conductive bond piece is provided, including：
The second conductive bond piece is pasted on lining paper.
Correspondingly, the first conductive bond piece and the second conductive bond piece is respectively cut to obtain the route of each layer
After figure, further include：
The semi-solid preparation substrate for having pasted the first conductive bond piece and the second conductive bond piece are overlapped in order and is pressed, and are obtained
Force fit plate；
Tear the lining paper off.
Alternatively, a second conductive bond piece is provided, including：
The semi-solid preparation substrate for taking PCB bottom is pasted described second and is led in the one side for not pasting the first conductive bond piece
Electric bonding sheet.
Correspondingly, the first conductive bond piece and the second conductive bond piece is respectively cut to obtain the route of each layer
After figure, further include：
Overlapping has pasted the semi-solid preparation substrate of the first conductive bond piece and the semi-solid preparation substrate of the bottom, pressing in order
Obtain force fit plate.
Further, according to the thickness requirement of each layer medium, the semi-solid preparation substrate of respective thickness is selected.
Further, according to the thickness requirement of each sandwich circuit figure, the first conductive bond piece of respective thickness is selected
With the second conductive bond piece.
Further, after obtaining force fit plate, further include：
Non-conductive hole is opened up on the force fit plate.
Wherein, the first conductive bond piece and the second conductive bond piece is respectively cut to obtain the line map of each layer
Shape, including：
According to the line pattern of each layer, the first conductive bond piece and described second is respectively cut using laser equipment and is led
Electric bonding sheet；
Remove the logicalnot circuit visuals of the first conductive bond piece and the second conductive bond piece；
Retain the first conductive bond piece and the second conductive bond piece of the both ends covering of the conductive through hole.
Further, the first conductive bond piece and the second conductive bond piece is respectively cut to obtain the line of each layer
Road figure further includes：
The offset of cutting is set, so that the line width of each sandwich circuit figure obtained is less than design value.
On the other hand, the present invention provides a kind of PCB, is made using above-mentioned production method, including：It semi-solid preparation substrate and leads
Electric bonding sheet；
The outermost layer of PCB is the conductive bond piece, and described half is provided between conductive bond piece described in adjacent two layers
Solidify substrate；
Conductive through hole is offered on an at least semi-solid preparation substrate, the conductive bond piece is cut into the route of each layer
Figure；
The conducting resinl that the conductive bond piece flowed into when in the conductive through hole filled with pressing is fused into.
Beneficial effects of the present invention are：
Line pattern is made by cutting conductive bond piece in the present invention, and whole processes are mainstream journey, and process is short, spent material
Few, then the influence factor for influencing route yield is reduced, also more friendly to environment；Meanwhile conductive bond piece plays layers of copper+half
The collective effect of cured sheets, in the case where needing to control plate thickness, finished product PCB can reduce the thickness of each layer prepreg.
Detailed description of the invention
Fig. 1 is the flow chart of the production method of PCB in the embodiment of the present invention one；
Fig. 2 is the step schematic diagram of the production method of PCB in the embodiment of the present invention one；
Fig. 3 is the sectional view of PCB in the embodiment of the present invention two.
In figure：1, semi-solid preparation substrate；2, conductive through hole；3, the first conductive bond piece；4, the second conductive bond piece；5, it serves as a contrast
Paper；6, conductive bond piece.
Specific embodiment
To keep the technical problems solved, the adopted technical scheme and the technical effect achieved by the invention clearer, below
It will the technical scheme of the embodiment of the invention will be described in further detail in conjunction with attached drawing, it is clear that described embodiment is only
It is a part of the embodiment of the present invention, instead of all the embodiments.
Embodiment one
The present embodiment provides the production methods of PCB a kind of, and production process is mainstream journey, and it is smaller to produce plate thickness
PCB.
Fig. 1 is the flow chart of the production method of PCB in the present embodiment.As shown in Figure 1, the production method includes following step
Suddenly：
S11 provides an at least semi-solid preparation substrate, and opens up conductive through hole on an at least semi-solid preparation substrate.
According to the thickness requirement of each layer medium, the semi-solid preparation substrate of respective thickness is selected.The two sides of semi-solid preparation substrate does not all have
There is layers of copper, main component is B b stage resin b, has certain mobility under specific condition, and semi-solid preparation substrate is arranged adjacent two
Between sandwich circuit figure.According to the line pattern number of plies of PCB design, the semi-solid preparation substrate of respective numbers is selected.
Fig. 2 is the step schematic diagram of the production method of PCB in the present embodiment.As shown in Fig. 2, according to each sandwich circuit figure it
Between conducting requirement, open up on the one or more semi-solid preparation substrate 1 between two layers of line pattern of mutual conduction conductive logical
Hole 2.
S12 is every semi-solid preparation substrate sticking the first conductive bond piece.
Conductive bond piece has conductive capability and cementitiousness, and has lower mobility, for making line pattern.
For the PCB of N sandwich circuit figure, the line pattern of 1 to N-1 layers is all made by the first conductive bond piece, according to each layer line
The thickness requirement of road figure selects the first conductive bond piece 3 of respective thickness, is sticked to phase for the first conductive bond piece 3 is micro-
On the semi-solid preparation substrate 1 answered.
S13 provides a second conductive bond piece.
Such as above-mentioned steps S12, the second conductive bond piece 4 is used to make the line pattern of n-th layer, according to the thickness of line pattern
Degree requires, and selects the second conductive bond piece 4 of respective thickness.The second conductive bond piece 4 is pasted on lining paper 5.Lining
Brown paper or release paper can be selected in paper 5.
The first conductive bond piece and the second conductive bond piece is respectively cut to obtain the line map of each layer in S14
Shape.
It is designed according to the line pattern of each layer, 3 He of the first conductive bond piece is respectively cut using laser cutting device
The second conductive bond piece 4；It should be noted that adjusting the parameter of laser cutting device, it is made to cut conductive bond piece
Meanwhile not injuring the semi-solid preparation substrate or lining paper of lower section.
After cutting, the logicalnot circuit visuals of the first conductive bond piece 3 and the second conductive bond piece 4 is removed；
But need to retain the first conductive bond piece 3 and the second conductive bond piece of the both ends covering of the conductive through hole 2
4。
Further, the offset of cutting is set, so that the line width of each sandwich circuit figure obtained is less than design value.Because
The low-flow of conductive bond piece can make line width of the line width obtained after pressing slightly larger than cutting when pressing, after guaranteeing pressing
Line width it is suitable with design value, then should cutting when suitably reduce line width.
S15 overlaps the semi-solid preparation substrate for having pasted the first conductive bond piece and the second conductive bond piece in order and presses,
Obtain force fit plate.
When pressing, temperature, pressure and other parameters should be adjusted, solidifies conductive bond piece and semi-solid preparation substrate respectively.Preferably,
Parameter when adjustment pressing, melts the first conductive bond piece 3 and the second conductive bond piece 4 first and fills up conductive through hole 2 and solidify,
The fusing of semi-solid preparation substrate 1 is set to fill up logicalnot circuit visuals and solidify again.
After obtaining force fit plate, further include：It tears the lining paper 5 off, non-conductive hole is opened up on the force fit plate.
In other embodiments, step S13, the second conductive bond piece are used to make the line pattern of n-th layer, take the bottom PCB
The semi-solid preparation substrate of layer pastes the second conductive bond piece in the one side for not pasting the first conductive bond piece.
Correspondingly, overlapping has pasted the semi-solid preparation substrate of the first conductive bond piece and the semi-solid preparation base of the bottom in order
Plate, pressing obtain force fit plate.
Line pattern is made by cutting conductive bond piece in the present embodiment, and whole processes are mainstream journey, and process is short, uses object
Material is few, then the influence factor for influencing route yield is reduced, also more friendly to environment；Meanwhile conductive bond piece play layers of copper+
The collective effect of prepreg, in the case where needing to control plate thickness, finished product PCB can reduce the thickness of each layer prepreg.
Embodiment two
The present embodiment provides a kind of PCB, are made using the production method of above-described embodiment, are asked for solving identical technology
Topic, reaches identical technical effect.
Fig. 3 is the sectional view of PCB in the present embodiment.As shown in figure 3, the PCB includes：Semi-solid preparation substrate 1 and conductive bond
Piece 6；
The outermost layer of PCB is the conductive bond piece 6, and is provided between conductive bond piece 6 described in adjacent two layers described
Semi-solid preparation substrate 1；
Conductive through hole 2 is offered on an at least semi-solid preparation substrate 1, for realizing between different layers line pattern
Conducting, the conductive bond piece 6 are cut into the line pattern of each layer；
The conducting resinl that the conductive bond piece 6 flowed into when in the conductive through hole 2 filled with pressing is fused into, in PCB
The semi-solid preparation substrate 1 that the part of portion's logicalnot circuit figure is melted in pressing is filled.
The technical principle of the invention is described above in combination with a specific embodiment.These descriptions are intended merely to explain of the invention
Principle, and shall not be construed in any way as a limitation of the scope of protection of the invention.Based on the explanation herein, the technology of this field
Personnel can associate with other specific embodiments of the invention without creative labor, these modes are fallen within
Within protection scope of the present invention.
Claims (10)
1. a kind of production method of PCB, which is characterized in that including：
An at least semi-solid preparation substrate is provided, and opens up conductive through hole on an at least semi-solid preparation substrate；
For every semi-solid preparation substrate sticking the first conductive bond piece；
One the second conductive bond piece is provided；
The first conductive bond piece and the second conductive bond piece is respectively cut to obtain the line pattern of each layer.
2. manufacturing method according to claim 1, which is characterized in that a second conductive bond piece is provided, including：
The second conductive bond piece is pasted on lining paper.
3. production method according to claim 2, which is characterized in that the first conductive bond piece and described is respectively cut
After line pattern of the second conductive bond piece to obtain each layer, further include：
The semi-solid preparation substrate for having pasted the first conductive bond piece and the second conductive bond piece are overlapped in order and is pressed, and are pressed
Plate；
Tear the lining paper off.
4. manufacturing method according to claim 1, which is characterized in that a second conductive bond piece is provided, including：
It is conductive viscous to paste described second in the one side for not pasting the first conductive bond piece for the semi-solid preparation substrate for taking PCB bottom
Sheeting.
5. production method according to claim 4, which is characterized in that the first conductive bond piece and described is respectively cut
After line pattern of the second conductive bond piece to obtain each layer, further include：
Overlapping has pasted the semi-solid preparation substrate of the first conductive bond piece and the semi-solid preparation substrate of the bottom in order, and pressing obtains
Force fit plate.
6. manufacturing method according to claim 1, which is characterized in that further include：
According to the thickness requirement of each layer medium, the semi-solid preparation substrate of respective thickness is selected.
According to the thickness requirement of each sandwich circuit figure, the first conductive bond piece of respective thickness and described second conductive is selected
Bonding sheet.
7. manufacturing method according to claim 1, which is characterized in that after obtaining force fit plate, further include：
Non-conductive hole is opened up on the force fit plate.
8. manufacturing method according to claim 1, which is characterized in that the first conductive bond piece and described is respectively cut
Second conductive bond piece to obtain the line pattern of each layer, including：
According to the line pattern of each layer, the first conductive bond piece is respectively cut using laser equipment and second conduction is viscous
Sheeting；
Remove the logicalnot circuit visuals of the first conductive bond piece and the second conductive bond piece.
9. according to claim 1 or 8 described in any item production methods, which is characterized in that it is conductive viscous to be respectively cut described first
Sheeting and the second conductive bond piece further include to obtain the line pattern of each layer：
The offset of cutting is set, so that the line width of each sandwich circuit figure obtained is less than design value.
10. a kind of PCB, which is characterized in that it is made using the described in any item production methods of claim 1 to 9, including：Half is solid
Change substrate and conductive bond piece；
The outermost layer of PCB is the conductive bond piece, and the semi-solid preparation is provided between conductive bond piece described in adjacent two layers
Substrate；
Conductive through hole is offered on an at least semi-solid preparation substrate, the conductive bond piece is cut into the line map of each layer
Shape；
The conducting resinl that the conductive bond piece flowed into when in the conductive through hole filled with pressing is fused into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811011373.3A CN108882569B (en) | 2018-08-31 | 2018-08-31 | PCB manufacturing method and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811011373.3A CN108882569B (en) | 2018-08-31 | 2018-08-31 | PCB manufacturing method and PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108882569A true CN108882569A (en) | 2018-11-23 |
| CN108882569B CN108882569B (en) | 2021-02-09 |
Family
ID=64322780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811011373.3A Active CN108882569B (en) | 2018-08-31 | 2018-08-31 | PCB manufacturing method and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108882569B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110412450A (en) * | 2019-08-28 | 2019-11-05 | 生益电子股份有限公司 | A kind of the connecting detection method and PCB of heat eliminating medium and conducting medium |
| CN110505750A (en) * | 2019-08-28 | 2019-11-26 | 生益电子股份有限公司 | A kind of PCB detection method and PCB |
| CN111935909A (en) * | 2020-07-31 | 2020-11-13 | 上海安费诺永亿通讯电子有限公司 | Recyclable electronic circuit with paper substrate and preparation method and recycling method thereof |
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| CN111935909A (en) * | 2020-07-31 | 2020-11-13 | 上海安费诺永亿通讯电子有限公司 | Recyclable electronic circuit with paper substrate and preparation method and recycling method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108882569B (en) | 2021-02-09 |
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