CN108875215A - PCB Layout is laid out to the method for changing into PCB 3D model - Google Patents
PCB Layout is laid out to the method for changing into PCB 3D model Download PDFInfo
- Publication number
- CN108875215A CN108875215A CN201810637022.7A CN201810637022A CN108875215A CN 108875215 A CN108875215 A CN 108875215A CN 201810637022 A CN201810637022 A CN 201810637022A CN 108875215 A CN108875215 A CN 108875215A
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- pcb
- model
- layout
- electronic device
- laid out
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
Abstract
The present invention provides a kind of method for being laid out PCB Layout and changing into PCB 3D model, belongs to pcb board design field.The present invention includes the following steps：It is that an individual 2D pcb board block diagram is arranged in each PCB Layout in 3D software；Pcb board block diagram is corrected, the continuous single line item of the lines of the pcb board block diagram is made；Modified pcb board block diagram is imported in PCB Layout design software, then imports the encapsulation with element height and size information, is laid out in pcb board frame, then correct pcb board thickness is set；PCB 3D model is exported by PCB Layout software.The present invention can reduce the duplicate workload that design occurs and quickly design PCB 3D model.
Description
Technical field
The present invention relates to pcb board design fields more particularly to a kind of be laid out PCB Layout to change into PCB 3D model
Method.
Background technique
With electronics industry in the market various product tend to, it is rapid, design synchronize, from product concept, ID design, side
Case hardware PCB (printed circuit board) design, MD (structure) design, many designs are completed according to certain step before,
Than very fast, the design cycle is compressed to the limit for more abundant and now successive generations of products on time, everybody all and time race
It runs, each engineering staff of each design link of product item entire in this way, needs cross events point collaborative design, improve design
Efficiency reduces the entire development cycle.
At present for PCB Layout (PCB design) engineer, being commonly designed step is to build device envelope
Dress-components' placement-circuit trace-goes out Gerebr file-pcb board production.For with structural engineer's interaction design most
More be also this link of device layout, because being related to, entire product Peripheral Interface sets structure design, internal structure is set
The design of the structures such as meter and optimization.Design software in circuit board, it is most of to support export PCB3D model, while can check online
PCB 3D pattern diagram.
For common Cadence allegro PCB Layout software design in the market.Operation carries itself
Software can directly be seen that the PCB circuit board 3D illustraton of model after PCB layout.But this method can only check, save picture
Deng cannot save as mechanism design software Pro/E, UG etc. can open the format of editor.
Therefore, most to use second method, i.e. export can support emn, emp the format text opened with 3D design software
Part.But will appear various problems in second method practical operation, lead to not generate correct emn, emp file.
For example, open file can be supported by exporting 3D software completely in PCBLayout software, but in Pro/e etc.
PCB circuit board can not be seen in software, only can only see hanging device, as shown in Figure 1-Figure 3；
For example, open file can be supported by exporting 3D software completely in PCBLayout software, but in Pro/e etc.
It but needs to enter amendment pcb board frame interface in software, can not normally check PCB 3D model；
For example, open file can be supported by exporting 3D software completely in PCBLayout software, but in Pro/e etc.
But the height and natural scale of proper device can not be shown in software, as shown in Figure 4 and Figure 5.
Summary of the invention
To solve the problems of the prior art, the present invention provides a kind of be laid out PCB Layout and changes into PCB 3D model
Method.
The present invention includes the following steps：
A：It is that an individual 2D pcb board block diagram is arranged in each PCB Layout in 3D software；
B：Pcb board block diagram is corrected, the continuous single line item of the lines of the pcb board block diagram is made；
C：Modified pcb board block diagram is imported in PCB Layout design software, then is imported with element height and size
The encapsulation of information, is laid out in pcb board frame, and correct pcb board thickness is then arranged；
D：PCB 3D model is exported by PCB Layout software.
The present invention is further improved, and further includes step E：On the basis of derived PCB 3D model, electronics device is rebuild
Part 3D encapsulation.
The present invention is further improved, and further includes establishment step in step E：It establishes and is made of electronic device 3D encapsulation
Electronic device 3D encapsulate library.
The present invention is further improved, when exporting PCB 3D model, the path in association electronic device 3D encapsulation library, and Neng Goucheng
Function exports PCB 3D mock-up figure identical with electronic device.
The present invention is further improved, and the foundation and modification of the electronic device 3D encapsulation must be exported in PCB Layout
PCB 3D model in modify.
The present invention is further improved, and when modification electronic device 3D is encapsulated, needs to meet three conditions：Respective center coordinate
It cannot change；The adjacent reference plane contacted with pcb board cannot be changed；Electronic device 3D encapsulates name and PCB Layout encapsulation
Name is consistent.
The present invention is further improved, and further includes pcb board frame polymerization procedure in stepb：If the pcb board block diagram
In pcb board frame, figure in pcb board frame be non-occluded state, a girth sheets frame of PCB, internal figure are aggregated into respectively
One individual, closed figure.
Compared with prior art, the beneficial effects of the invention are as follows：Reduce the duplicate workload and quickly set that design occurs
PCB 3D model is counted out, design time can be effectively saved, reduces the development cycle of product, improves product efficiency.
Detailed description of the invention
Fig. 1 is the effect picture without successfully importing pcb board frame；
Fig. 2 is 3D screenshot of the embodiment one without PCB circuit board；
Fig. 3 is 3D screenshot of the embodiment two without PCB circuit board；
Fig. 4 is the effect picture of one packaging information of embodiment not pair；
Fig. 5 is the effect picture of two packaging information of embodiment not pair；
Fig. 6 is that lines breakpoint schematic diagram occur；
Fig. 7 is that lines are overlapped schematic diagram；
Fig. 8 is the revised PCB chase figure of embodiment one；
Fig. 9 is the revised PCB chase figure of embodiment two；
Figure 10 is the layout effect picture that embodiment one is imported according to DXF；
Figure 11 is the 3D package drawing one that electronic component PCB is modified on one direction XYZ of embodiment；
Figure 12 is the 3D package drawing two that electronic component PCB is modified on one direction XYZ of embodiment；
Figure 13 is one overall effect figure of embodiment；
Figure 14 is two overall effect figure of embodiment.
Specific embodiment
The present invention is described in further details with reference to the accompanying drawings and examples.
The present invention is described in detail respectively according to step：
1, big firstly the need of one independent PCB of design is required for any one PCB Layout (PCB design)
Small pcb board frame, this is that Structure of need requirement of engineering provides, the DXF or DWG that format can be supported for auto CAD
Format.
2, can realize smoothly smoothly export correct 3D formatted file from PCB Layout software, need to carry out PCB
The amendment of sheet frame figure makes the continuous single line item of the lines of the pcb board block diagram.Do not pass through amendment step, frequently results in each
The problem of kind various kinds is that can not know in PCB Layout software because 2D and 3D design software radian is much a composition
Other, this is also that many designers solve for a long time indeterminable reason.
Therefore, the present invention will guarantee that there can be no breakpoints in the pcb board block diagram (abbreviation 2D figure) of 2D, and there can be no dotted arcs
Sheet frame, there can be no this 3 points of the duplicate sheet frames of same position.
As shown in fig. 6, occurring breakpoint in 2D figure not being fully connected much being in tiny place.As shown in fig. 7,2D schemes
In the line or camber line that are duplicated in same position, in addition, since design is derived from the 3D software, in arc in PCB 2D figure
Spending position is dotted camber line, is not linear camber line, these situations require to be modified.
It has corrected after influencing the 2D figure that normal sheet frame is shown, (all PCB Layout softwares all support the DXF of 2D in the market
Formatted file imports), following steps are executed inside auto CAD, pedit- chooses all line segments (a plurality of M) -- by lower keyboard
Straight line and radian are converted to multi-line section-merging by enter-, thus can pcb board frame form one be individually closed one
The sheet frame of body, if the step of cannot converting, need before repetition inspection, modification, revised PCB chase figure such as Fig. 8 and Fig. 9
It is shown.
In addition it there are also the method for not having to aggregate into individually closure sheet frame, is not further described as universal method, the present invention
The step of increasing this improvement make sure that it is subsequent can export correct PCB 3D model, be not in export it is unsuccessful and
It needs repeatedly to look for reason, 2D (DXF, DWG) file is repeatedly imported into PCB Layout design software, to be delayed the plenty of time
Problem.
3, the pcb board block diagram that will have been corrected is imported into PCB Layout design software, the present invention temporarily according to
For allegro, it is certainly not limited to this software, can also be the softwares such as PADS, PROTEL, AD.Then element height will be had
Encapsulation with size information imports, and is laid out according to institution requests and hardware electric requirement according in pcb board frame, understands shape in this way
At effect picture as shown in Figure 10.
It is also desirable to which correct pcb board thickness is arranged, this point is also critically important, many derived PCB 3D moulds
Type prompts pcb board thickness and inconsistent problem in kind, causes design mistake occur, needs to export PCB 3D model repeatedly, reduces
Efficiency.
4, the openable format of 3D software (usually two files of emn, emp) are exported by PCB Layout software,
Contained inside correct format the device that pcb board is thick, size, is laid out on pcb board specific accurate location and natural scale and
Highly, the information such as screw hole site.
But this derived PCB 3D model is the simple blocky encapsulation pictorial diagram with information such as length, width and height,
There are also a certain distance with electronic device pictorial diagram, this is mainly in terms of PCB Layout design software itself tends to circuit
What property determined, PCB Layout design software does not have the function of 3D edit effect.
5, the present invention is improved as follows on the basis of above-mentioned design, this is also the very important innovation of the present invention
Point.
After exporting PCB 3D model, if the device 3D illustraton of model that the manufacturer of electronic component is provided, each is in turn
Replacement, can lead to the problem of very much, and part of it device genuine does not provide detailed 3D model (except connector)；Secondly in this way
Replacement device 3D model every time easily causes data deviation to structure, to influence due to not accurate control point reference
The design (including cooling fin, shielding case, detent, the design such as keep away position) of structure；Third, different pcb board types is designed, it cannot
Achieve the purpose that reuse, causes the waste of time resource.
Therefore, in summary problem, the present invention rebuild electronic device 3D encapsulation on the basis of exporting PCB 3D model.
When namely establishing the electronic device 3D encapsulation library, so each export PCB 3D illustraton of model based on electronic device 3D encapsulation composition
The path in electronic device 3D encapsulation library need to be only associated with, so that it may the identical PCB 3D mock-up figure of electronic device is successfully exported,
Overall effect is as shown in Figure 13 and Figure 14, facilitates the purpose of subsequent structural and PCB Layout Synchronization Design, to play saving
Design time improves product efficiency.
This example embodiment one is two different pcb boards, using the mesh of two embodiments as the principle of embodiment two
Be：Two device of embodiment is more representative, and the encapsulation library electronic device 3D is obvious in Figure 14 embodiment of embodiment two,
In addition, several situations of the error of description of the prior art may be appeared in simultaneously in a pcb board design, it is also possible to hand over individually
Fork appears in several different board designs, in this way with more persuasion property.
The electronic device 3D encapsulation library of this example can be stored in local, such as a path of D disk or E, or clothes
A path on business device is ok.For example, E:SourceCode CIS-Library Emdoor_3D_Footprint, or
Person Z:SourceCode CIS-Library Emdoor_3D_Footprint etc.；Being associated with electronic device is set in 3D software
It sets, the path in electronic device 3D encapsulation library is loaded into software.
Above-mentioned electronic device 3D encapsulation library of establishing have to be noted that electronic device 3D encapsulation library is built up in 3D software, electronics
The foundation and modification of device 3D encapsulation must be modified in the PCB 3D model derived from PCB Layout, need when modification to meet with
Lower three conditions：
Respective center coordinate cannot be changed；The adjacent reference plane contacted with pcb board cannot be changed；Electronic device 3D encapsulates name
Word is consistent with the name that PCB Layout is encapsulated.Guarantee the electronics that the present invention that these design focal points can be used precisely establishes
Device 3D encapsulates library.
That is, the electronic device face that pcb board is tightly attached in electronic device 3D encapsulation is still to keep and circuit board is opposite
Position, electronic device coordinate central point is still in geometric center, only in this way when subsequent this electronic device of every secondary association 3D model,
Just it is able to maintain relative position of the electronic device on pcb board, height, the positive and negative of device do not have any error.
As is illustrated by figs. 11 and 12, modify and establish appliance component model must on this basis, and X,
Y, the direction of Z three wants consistent with data before, and electronic device PCB encapsulation name and electrical part 3D model name will keep one
It causes, electronic device 3D encapsulation library just can correctly be called normally to show in PCB circuit board in this way.
To sum up, PCB Layout is laid out the method for changing into PCB 3D model by the present invention, and key is embodied in following two sides
The improvement in face.
One, many engineers have attempted many methods, according to daily step, export the lattice that can be opened by 3D software
Formula file, but this file is only formatted file, there is many potential uncertainties, does not ensure that derived 3D file can
With proper use of and realize its function.Since all PCB Layout softwares (allegro, AD, PADS, Protel etc.) are all
The software of electronic circuit characteristic is laid particular emphasis on, although the planar section processing function of compatible 2D, many operations still need
(such as Auto CAD) is handled in 2D software.Due to being related to being mutually linked problem between 2D, 3D, PCB Layout software,
Prolonged experience accumulation and the discovery of mistake etc. are needed, pcb board frame turns derived from 3D (Pro/e etc.) software in the present invention
It is melted into 2D data (auto CAD), it is possible that the arc that part is dotted, rather than linear arc, so as to cause PCB Layout
Software can not normally import qualified PCB 3D formatted file, and such case needs are corrected again in 2D software；Again due to short
Line segment, the appearance for being overlapped line segment, PCB outline (sheet frame) such case being non-fully closed is in PCB Layout software
It is that can not rapidly find out, leads to not normally import correct format PCB 3D model format, as long as therefore executes sheet in 2D software
Mono- girth sheets frame of PCB is aggregated into an individual closed frame by the modification method of invention, similarly for internal hole and special-shaped frame
And an individual frame is aggregated into, the PCB frame of intersection is avoided the occurrence of, it is soft that the pcb board frame of 2D is imported PCB Layout in this way
In part, and by layout PCB, derived PCB 3D model format file correctly will be identified and be handled completely behaviour by 3D software
Make.
Secondly, due in the market PCB Layout design, electronic device be all in software by encapsulation embody, packet
Characteristic containing electronic circuit (such as PIN definition), electronic device natural scale (information such as length, width and height), what is embodied is all the flat of 2D
The information in face, therefore PCB 3D model is also the length, width and height information comprising electronic device derived from PCB Layout software, no
It can include that the information of the embodiment 3D solid such as pinout information, ladder height information, radian information of electronic component can not embody
Come；For today's society product towards light and small thin development, mechanism and heat dissipation just need the accurate of each device on accurately pcb board
Information can just design the product that performance is more excellent, thinner.General 3D model derived from usual PCB layout engineer, only
It is block-like, not complete 3D design information of the can completely comprising electronic device, therefore PCB 3D of the present invention after export
Electron device package is rebuild on model, so as to quickly design PCB 3D model, can effectively save design time, is reduced
The development cycle of product improves product efficiency.
The specific embodiment of the above is better embodiment of the invention, is not limited with this of the invention specific
Practical range, the scope of the present invention includes being not limited to present embodiment, all equal according to equivalence changes made by the present invention
Within the scope of the present invention.
Claims (7)
1. PCB Layout to be laid out to the method for changing into PCB 3D model, it is characterised in that include the following steps：
A：It is that an individual 2D PCB sheet frame figure is arranged in each PCB Layout in 3D software；
B：PCB sheet frame figure is corrected, the continuous single line item of the lines of the PCB sheet frame figure is made；
C：Modified PCB sheet frame figure is imported in PCB Layout design software, then is imported with element height and size information
Encapsulation, be laid out in pcb board frame, then correct pcb board thickness be set；
D：PCB 3D model is exported by PCB Layout software.
2. according to claim 1 be laid out PCB Layout the method for changing into PCB 3D model, it is characterised in that：Also wrap
Include step E：On the basis of derived PCB 3D model, electronic device 3D encapsulation is rebuild.
3. according to claim 2 be laid out PCB Layout the method for changing into PCB 3D model, it is characterised in that：In step
It further include establishment step in rapid E：It establishes and library is encapsulated by the electronic device 3D that electronic device 3D encapsulation forms.
4. according to claim 3 be laid out PCB Layout the method for changing into PCB 3D model, it is characterised in that：Export
When PCB 3D model, it is real can successfully to export PCB 3D identical with electronic device for the path in association electronic device 3D encapsulation library
Object illustraton of model.
5. according to claim 4 be laid out PCB Layout the method for changing into PCB 3D model, it is characterised in that：It is described
The foundation and modification of electronic device 3D encapsulation must be modified in the PCB 3D model derived from PCB Layout.
6. according to claim 5 be laid out PCB Layout the method for changing into PCB 3D model, it is characterised in that：Modification
When electronic device 3D is encapsulated, need to meet three conditions：Respective center coordinate cannot be changed；The neighboring reference contacted with pcb board
Face cannot be changed；It is consistent with the name that PCB Layout is encapsulated that electronic device 3D encapsulates name.
7. according to claim 1-6 be laid out PCB Layout the method for changing into PCB 3D model, feature
It is：It in stepb, further include PCB sheet frame polymerization procedure：If PCB sheet frame, PCB sheet frame in the PCB sheet frame figure
Interior figure is non-occluded state, and a girth sheets frame of PCB, internal figure are aggregated into an individual, closed figure respectively
Shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810637022.7A CN108875215A (en) | 2018-06-20 | 2018-06-20 | PCB Layout is laid out to the method for changing into PCB 3D model |
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|---|---|---|---|
| CN201810637022.7A CN108875215A (en) | 2018-06-20 | 2018-06-20 | PCB Layout is laid out to the method for changing into PCB 3D model |
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| CN108875215A true CN108875215A (en) | 2018-11-23 |
Family
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| CN201810637022.7A Pending CN108875215A (en) | 2018-06-20 | 2018-06-20 | PCB Layout is laid out to the method for changing into PCB 3D model |
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| CN110610021A (en) * | 2019-07-31 | 2019-12-24 | 贵州省广播电视信息网络股份有限公司 | Method for quickly designing DDR wiring by LAYOUT |
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| CN111739162A (en) * | 2020-08-10 | 2020-10-02 | 成都智明达电子股份有限公司 | Automatic PCBA accurate three-dimensional model generation method based on ECAD interface |
| CN111739162B (en) * | 2020-08-10 | 2020-12-04 | 成都智明达电子股份有限公司 | Automatic PCBA accurate three-dimensional model generation method based on ECAD interface |
| CN112699426A (en) * | 2020-12-09 | 2021-04-23 | 深圳微步信息股份有限公司 | IO baffle plate design method and IO baffle plate |
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