CN108866548A - A kind of coat of metal and its preparation method and application - Google Patents
A kind of coat of metal and its preparation method and application Download PDFInfo
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- CN108866548A CN108866548A CN201810763461.2A CN201810763461A CN108866548A CN 108866548 A CN108866548 A CN 108866548A CN 201810763461 A CN201810763461 A CN 201810763461A CN 108866548 A CN108866548 A CN 108866548A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02697—Forming conducting materials on a substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of coat of metal and its preparation method and application, the coat of metal is located on substrate, is followed successively by palladium layers, nickel layer and layer gold from top to bottom.The present invention provides a kind of new metal deposition protective layers; nickel layer is placed between palladium layers and layer gold; on the one hand the problems such as can solve layer gold to be difficult to the plating in palladium layers the problem of, on the other hand can solve diffusion alternate due to nickel layer consistency is lower and occurs metal.
Description
Technical field
The invention belongs to technical field of surface, it is related to a kind of coat of metal and its preparation method and application.
Background technique
In the process of surface treatment such as Electronic Packaging industry, including wafer-level packaging, IC support plate, PCB and FPC, last century
The chemical nickel gold technique that the eighties proposes, the coating that chemistry leaching gold is formed have good inoxidizability and electric conductivity, nickel conduct
Barrier layer prevents copper from diffusing into one another with golden, but the nickel layer consistency of chemical nickel gold is lower, plating leakage often occurs, seeps gold, black nickel
Or the quality problem that layer gold is whitened；Then propose chemical NiPdAu process of surface treatment, it be to chemical nickel gold technique again
Chemical plating palladium layers are added between chemical Ni-plating layer and leaching layer gold in development, to chemical nickel plating when avoiding chemistry leaching gold well
The corrosion of layer.
With the rapid development of electronics industry, electronic product is gradually to high-performance, multi-functional, highly reliable, the frivolous side such as small
To development, therefore, chemical NiPdAu technique is taken seriously because of its excellent performance；The technique can satisfy the plating of a variety of packaging technologies
Layer requires, and reaches good electric conductivity, corrosion resistance and anti-friction performance, meets the requirement of electronic product.
CN105543818A discloses a kind of method and apparatus for optimizing chemical NiPdAu coating, in the range of equipment
Solve the problems, such as how to be evenly and rapidly pressed into tin cream in the die hole of steel form, but substantially there is no solve NiPdAu
Technique there are the problem of；CN105112892A discloses a kind of Chemical nickel and palladium plating process for printed circuit board, including removes
Oil-microetch-preimpregnation-activation-chemical nickel-chemistry palladium-chemistry gold and etc.；CN102956604A provides a kind of thin NiPdAu plating
Layer and with conducting wire this coating institute at encapsulating structure and preparation method thereof.Although NiPdAu technique can satisfy a variety of encapsulation
The coating requirement of technique, still, however it remains some problems, such as nickel layer consistency are lower, and porosity is higher, it is possible that
The problem of phase counterdiffusion between palladium layers and substrate copper；And there is also the material hardness come due to metallic nickel hardness higher band increasings
Add, ductility reduction, so that subsequent the problem of can not be successfully routing combination copper wire or copper palladium line, and be difficult to apply in palladium layers
The problem of Gold plated Layer etc..
It needs to develop the new technique of one kind at present to solve the above problems.
Summary of the invention
The purpose of the present invention is to provide a kind of coats of metal and its preparation method and application.
For this purpose, the present invention uses following technical scheme：
In a first aspect, the coat of metal is located on substrate, from top to bottom successively the present invention provides a kind of coat of metal
For palladium layers, nickel layer and layer gold.
The present invention provides a kind of new metal deposition protective layers, nickel layer are placed between palladium layers and layer gold, compared to palladium
Layer, layer gold are easier the plating on nickel layer, therefore can solve layer gold and be difficult to the plating in palladium layers the problem of；Another aspect palladium layers
Consistency it is higher, can solve due to nickel layer consistency is lower and occur substrate and phase counterdiffusion between palladium layers and layer gold
Problem.
In the present invention, the palladium layers with a thickness of 0.05-0.2 μm, such as 0.08 μm, 0.1 μm, 0.12 μm, 0.15 μm,
0.18 μm etc..
Preferably, the material of the palladium layers is pure palladium or palladium phosphorus alloy.
Preferably, the nickel layer with a thickness of 0.05-1 μm, such as 0.08 μm, 0.1 μm, 0.3 μm, 0.5 μm, 0.8 μm etc.,
It is preferred that 0.05-0.08 μm.
In the present invention, the thickness of nickel layer can be specifically chosen according to the actual situation, preferably as make nickel layer thin as possible
A bit, in this way can it is a degree of alleviate because nickel layer exist make the material hardness finally obtained increase, ductility decline ask
Topic.
Well known to those skilled in the art, when coating is thinner, the porosity of coating is higher, and consistency is poorer, if in order to change
It is apt to there are problems that reducing the thickness of nickel layer due to making the material hardness finally obtained increase, ductility decline because of nickel layer, then can leads
It causes porous nickel layer rate to increase, and then aggravates substrate and the phase counterdiffusion between palladium layers and layer gold, therefore, set palladium layers in the present invention
Between substrate and nickel layer, the problem of can solve phase counterdiffusion between substrate and coated metal.
Preferably, the layer gold with a thickness of 0.05-0.15 μm, such as 0.08 μm, 0.1 μm, 0.12 μm, 0.14 μm etc..
Preferably, the material of the substrate is copper.
Thickness of coating of the present invention is the accessible general thickness range of this field coating, in actual production process
In, it needs to select actual thickness of coating to meet application requirement as the case may be.
Second aspect, the present invention provides the preparation method of the coat of metal as described in relation to the first aspect, the preparation method
Including：Palladium layers, nickel layer and layer gold are successively plated on substrate, obtain the coat of metal.
The step of provided by the invention preparation method is simple, and palladium layers, nickel layer and layer gold are formed in the present invention can benefit
Reached with customary way known in this technical field, such as the chemical techniques such as plating or plating, and in chemical plating range
It is interior, it can choose the chemical plating method of displaced type, reduced form or half displacement semi-reduction type reaction；The present invention is not limited to preceding
Method is stated, it can be with as long as any method of palladium layers, nickel layer and layer gold purpose can be formed.
Preferably, the preparation method of the palladium layers, nickel layer and layer gold is each independently selected from chemical plating or plating.
Preferably, the preparation method of the layer gold is：The chemical plating on nickel layer using displaced type and/or reduced form reaction
Gold obtains layer gold.
Preferably, the preparation method of the layer gold is：Using displaced type reaction chemical gilding on nickel layer, layer gold is obtained.
In the present invention, it is reacted using displaced type and carries out chemical gilding, nickel coating can be made thinning, delayed to a certain extent
Solution there are problems that making the material hardness finally obtained increase, ductility decline due to nickel layer.
Preferably, the preparation method of the layer gold is：It is gold-plated on nickel layer using half displacement semi-reduction type reaction, obtain gold
Layer.
React gold-plated using half displacement semi-reduction type, displaced type reaction can be such that gold grows under the catalytic action of nickel, and
Reduced form reaction can make gold continued growth under the catalysis for the layer gold that displacement grows out, and finally obtain layer gold.
The third aspect, the present invention provides the coats of metal as described in relation to the first aspect in wafer-level packaging, IC support plate, printing
Application on circuit board or flexible circuit board.
Compared with the existing technology, the invention has the advantages that：
(1) the present invention provides a kind of new metal deposition protective layer, nickel layer is placed between palladium layers and layer gold, due to phase
Than in palladium layers, layer gold is easier the plating on nickel layer, therefore it can solve layer gold and be difficult to the plating in palladium layers the problem of；Another party
The consistency of face palladium layers is higher, can solve due to mutually expanding between the coating and substrate metal that nickel layer consistency is lower and occurs
Scattered problem；
(2) provided by the invention preparation method is simple, any that plating palladium layers, the system of nickel layer and layer gold purpose may be implemented
Preparation Method can be used, and the mode of the preferred chemical plating of the present invention or plating realizes technical solution of the present invention.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the coat of metal provided by the invention.
Wherein, 1- substrate, 2- coating, 201- palladium layers, 202- nickel layer, 203- layer gold.
Specific embodiment
The technical scheme of the invention is further explained by means of specific implementation.Those skilled in the art should be bright
, the described embodiments are merely helpful in understanding the present invention, should not be regarded as a specific limitation of the invention.
Embodiment 1
A kind of coat of metal is followed successively by palladium layers as shown in Figure 1, the coat of metal (2) is located on substrate (1) from top to bottom
(201), nickel layer (202) and layer gold (203).
Preparation method is as follows：
(1) oil removing：2-3min is impregnated at 35-45 DEG C with acid deoiling liquid, is then washed；
(2) microetch：Under room temperature, 1-2min is impregnated in the mixed solution of sodium peroxydisulfate (60g/L) and sulfuric acid (20mL/L),
Then it washes；
(3) it activates：Utilize activator (10ppm Pd2+(complexing palladium salt), 5ppm surfactant, 30ppm complexing agent, sulphur
Acid for adjusting pH is 1~1.5), 1-2min is activated at normal temperature, is then washed；
(4) chemical palladium：Using chemical palladium plating solution, (about 0.1g/L palladium salt cooperates the nitrogenous class heterocycle organic complex of 0.5~1g/L
Agent uses sodium hypophosphite for reducing agent, pH=6.5~7), 50-60 DEG C of plating temperature, plating time 10-20min；
(5) change nickel：Using chemical nickel-plating liquid (NiSO4·6H2O 20g/L；NaH2PO2·H2O 25g/L；Malic acid 20g/
L；Other complexant 15g/L), 80~85 DEG C of plating temperature, time 8-10min；
(6) gold-plated：Utilize chemical gold plating liquid (gold sodium sulfide 20g/L；Sodium thiosulfate 16g/L；Nitrilotriacetic acid 5g/L；
Hydrazine hydrate 8g/L；Other complexant 20g/L) gold-plated 10min is carried out at 60-70 DEG C.
Embodiment 2
A kind of coat of metal is located on substrate, is followed successively by palladium layers, nickel layer and layer gold from top to bottom.
The difference of preparation method and embodiment 1 is only that in the present embodiment, the method that step (4) plates palladium layers is different,
In the present embodiment, the plating method of palladium layers is palladium plating：Utilize palladium electroplating liquid (complexing palladium salt 15g/L；NH4SO480g/L；
(NH4)2HPO460g/L；Sulfamic acid 1g/L；Urea 10g/L) plating at 45-55 DEG C.
Embodiment 3
A kind of coat of metal is located on substrate, is followed successively by palladium layers, nickel layer and layer gold from top to bottom.
The difference of preparation method and embodiment 1 is only that in the present embodiment, the method for step (5) nickel coating is different,
In the present embodiment, the plating method of nickel layer is plating：Using nickel plating solution (nickel sulfate 280g/L；Nickel chloride 40g/L；Boric acid
45g/L；Open cylinder agent 9mL/L；Brightener 0.2mL/L；PH is the 4.2) plating at 50-60 DEG C.
Embodiment 4
A kind of coat of metal is located on substrate, is followed successively by palladium layers, nickel layer and layer gold from top to bottom.
The difference of preparation method and embodiment 1 is only that in the present embodiment, the method for step (6) Gold plated Layer is different,
In the present embodiment, the plating method of layer gold is plating：Using gold plating bath (gold sodium sulfide 12.8g/L；Adenine 24.3g/L；
Sodium nitrate 8.5g/L；Sodium hydroxide 40g/L；L-cysteine 0.2g/L；PH is the 12) plating at 50-60 DEG C.
Comparative example 1
Difference with embodiment 1 is only that, in this comparative example, is first carried out step (5) nickel plating, is then carried out step (4)
Palladium is plated, and controls that the nickel plating layer thick in this comparative example is identical with the plating palladium layers thickness in embodiment 1, is i.e. this comparative example offer
The coat of metal is followed successively by nickel layer, palladium layers and layer gold from top to bottom.
In the process flow that embodiment 1-4 and comparative example 1 provide, for oil removal process be all made of identical temperature and
Identical time, microetch, activation process use same processing method.
Technological parameter (time, temperature) in Ni-Speed in embodiment 1 and comparative example 1 is identical, and plating palladium process uses
Same processing method.
Performance test
Embodiment 1-4 and comparative example 1 coat of metal provided are tested for the property：
(1) layer gold thickness：The metal-plated of embodiment 1-4 and the offer of comparative example 1 are provided using metal layer thickness detector
The thickness of layer gold in layer；
Test result is shown in Table 1：
Table 1
| Sample | Layer gold thickness/μm |
| Embodiment 1 | 0.135 |
| Embodiment 2 | 0.112 |
| Embodiment 3 | 0.148 |
| Embodiment 4 | 0.151 |
| Comparative example 1 | 0.07 |
By embodiment 1 and comparative example 1 it is found that under identical plating conditions, layer gold thickness ratio that the present invention finally obtains
The layer gold thickness that comparative example 1 obtains wants high, shows that layer gold is easier the plating on nickel layer, i.e. the present invention solves layer gold and is difficult to
In palladium layers the problem of plating；Also, palladium layers metal compaction degree is better than nickel layer metal compaction degree, therefore, plating after first plating palladium layers
Nickel layer can be asked to avoid due to substrate caused by porous nickel layer rate is high, consistency is low and phase counterdiffusion between palladium layers and layer gold
Topic.
The Applicant declares that the present invention is explained by the above embodiments coat of metal of the invention and preparation method thereof and answering
With, but the invention is not limited to above-mentioned processing steps, that is, it is real not mean that the present invention must rely on above-mentioned processing step ability
It applies.It should be clear to those skilled in the art, any improvement in the present invention, to the equivalent of raw material selected by the present invention
Replacement and addition, the selection of concrete mode of auxiliary element etc., all of which fall within the scope of protection and disclosure of the present invention.
Claims (10)
1. a kind of coat of metal, which is characterized in that the coat of metal is located on substrate, is followed successively by palladium layers, nickel layer from top to bottom
And layer gold.
2. the coat of metal according to claim 1, which is characterized in that the palladium layers with a thickness of 0.05-0.2 μm；
Preferably, the material of the palladium layers is pure palladium or palladium phosphorus alloy.
3. the coat of metal according to claim 1 or 2, which is characterized in that the nickel layer with a thickness of 0.05-1 μm, preferably
0.05-0.08μm。
4. the coat of metal described in any one of -3 according to claim 1, which is characterized in that the layer gold with a thickness of
0.05-0.15μm。
5. the coat of metal described in any one of -4 according to claim 1, which is characterized in that the material of the substrate is copper.
6. the preparation method of the coat of metal described in any one of -5 according to claim 1, which is characterized in that the preparation side
Method includes：Palladium layers, nickel layer and layer gold are successively plated on substrate, obtain the coat of metal.
7. preparation method according to claim 6, which is characterized in that the preparation method of the palladium layers, nickel layer and layer gold is equal
It is each independently selected from chemical plating or plating.
8. preparation method according to claim 6 or 7, which is characterized in that the preparation method of the layer gold is：Utilize displacement
Type and/or reduced form reaction are gold-plated on nickel layer, obtain layer gold；
Preferably, gold-plated on nickel layer using displaced type reaction, obtain layer gold.
9. the preparation method according to any one of claim 6-8, which is characterized in that the preparation method of the layer gold
For：It is gold-plated on nickel layer using half displacement semi-reduction type reaction, obtain layer gold.
10. the coat of metal described in any one of -5 is in wafer-level packaging, IC support plate, printed circuit board according to claim 1
Or on flexible circuit board in application.
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| CN201810763461.2A CN108866548B (en) | 2018-07-12 | 2018-07-12 | Metal coating and preparation method and application thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111778498A (en) * | 2020-07-02 | 2020-10-16 | 深圳市化讯半导体材料有限公司 | Coating structure and preparation method thereof |
| CN112609173A (en) * | 2020-12-10 | 2021-04-06 | 安徽环瑞电热器材有限公司 | Corrosion-resistant material and manufacturing method thereof |
| CN115087760A (en) * | 2020-02-18 | 2022-09-20 | 日本高纯度化学株式会社 | Plated laminate |
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| CN103491716A (en) * | 2013-08-20 | 2014-01-01 | 鑫纮有限公司 | Pattern electrically conductive circuit structure and forming method thereof |
| US20140267510A1 (en) * | 2013-03-13 | 2014-09-18 | Seiko Epson Corporation | Liquid ejecting head, liquid ejecting apparatus, piezoelectric element, and manufacturing method thereof |
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| US20140267510A1 (en) * | 2013-03-13 | 2014-09-18 | Seiko Epson Corporation | Liquid ejecting head, liquid ejecting apparatus, piezoelectric element, and manufacturing method thereof |
| CN103491716A (en) * | 2013-08-20 | 2014-01-01 | 鑫纮有限公司 | Pattern electrically conductive circuit structure and forming method thereof |
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| CN111778498A (en) * | 2020-07-02 | 2020-10-16 | 深圳市化讯半导体材料有限公司 | Coating structure and preparation method thereof |
| CN111778498B (en) * | 2020-07-02 | 2024-04-26 | 深圳市化讯半导体材料有限公司 | Coating structure and preparation method thereof |
| CN112609173A (en) * | 2020-12-10 | 2021-04-06 | 安徽环瑞电热器材有限公司 | Corrosion-resistant material and manufacturing method thereof |
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