CN108858841A - A kind of silicon wafer cutting machine - Google Patents
A kind of silicon wafer cutting machine Download PDFInfo
- Publication number
- CN108858841A CN108858841A CN201810691784.5A CN201810691784A CN108858841A CN 108858841 A CN108858841 A CN 108858841A CN 201810691784 A CN201810691784 A CN 201810691784A CN 108858841 A CN108858841 A CN 108858841A
- Authority
- CN
- China
- Prior art keywords
- cutting
- clamping jaw
- silicon wafer
- clamping
- rack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 194
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 130
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 130
- 239000010703 silicon Substances 0.000 title claims abstract description 130
- 230000007246 mechanism Effects 0.000 claims abstract description 133
- 239000013078 crystal Substances 0.000 claims abstract description 32
- 210000000078 claw Anatomy 0.000 claims abstract description 24
- 230000003028 elevating effect Effects 0.000 claims abstract description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000006073 displacement reaction Methods 0.000 claims description 46
- 230000033001 locomotion Effects 0.000 claims description 34
- 229910003460 diamond Inorganic materials 0.000 claims description 21
- 239000010432 diamond Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 10
- 238000012545 processing Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 230000001360 synchronised effect Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 208000004350 Strabismus Diseases 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005347 demagnetization Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to a kind of silicon wafer cutting machines, including pedestal, rack, elevating mechanism and clamping cutter unit；Clamping cutter unit includes double-station rotary table and anti-chipping cutter device, and double-station rotary table is set on pedestal, and anti-chipping cutter device is set to above rotary table；Elevating mechanism is installed on the crossbeam of rack, and elevating mechanism is for driving saw blade cutting mechanism to cut silicon crystal bar.Double-station rotary table in this programme realizes the location swap of two clamping stations on workbench, and bar cutting carries out simultaneously with loading and unloading, and cutting area improves production efficiency without waiting for the loading and unloading time；And saw blade cutting mechanism and clip claw mechanism are combined design by anti-chipping cutter device, clip claw mechanism clamps the barred body of silicon crystal bar joint-cutting two sides in cutting process, the cutting fixed function to silicon crystal bar can be played, it can also prevent cutting end face from " chipping " occur, silicon wafer cutting machine is high in machining efficiency, silicon wafer quality is good, and the market competitiveness is strong.
Description
Technical field
The present invention relates to hard and brittle material cutting technology field more particularly to a kind of silicon wafer cutting machines.
Background technique
The photovoltaic industry of use in to(for) silicon wafer is very extensive, global, silicon wafer market swift and violent to the demand growth of silicon wafer
Supply falls short of demand, has biggish market prospects.Therefore the progress of the following crystal silicon bar processing technology is only the core of enterprise development
Competitiveness.
Currently, mostly there is following two urgent need to resolve in silicon wafer material cutting machine available on the market：
First, it is also easy to produce " chipping ".In addition to the saw blade cutting mechanism fluctuation of service for cutting, most important reason is just
It is silicon wafer bar when being cut, two cutting end faces will receive an outside active force, this active force is i.e. will
The shaking force that the self gravity or saw blade cutting for the silicon wafer material that cutting is fallen generate, when silicon wafer bar will be cut through, silicon wafer
Bar splits because that cannot bear the active force, therefore the bottom edge of the cut surface of silicon crystal bar will form flash.Currently, silicon crystal bar is cut
Cutting mill be all special fixture is set on workbench so that entire silicon wafer bar before cutting after all by the branch of workbench
Support, to avoid cutting end face by outside active force.It is solved the problems, such as using the means " chipping ", used clamp structure
Complexity, operational motion is cumbersome, and fixture versatility is poor, when workbench needs movement or does rotary motion, common fixture
It does not adapt to completely then.
Second, bar clamping cutting efficiency is low.Existing cutting machine needs first to carry out the work of silicon crystal bar feeding in workbench,
Then bar is fed into Working position, finally silicon wafer bar is processed in progress saw blade cutting.However use this work
Industry mode, when carrying out feeding and feeding transmission process, saw blade cutting mechanism needs to wait the set-up time of bar, work effect
Rate is more low, and cost of labor is higher.
Summary of the invention
For this reason, it may be necessary to a kind of silicon wafer cutting machine be provided, to solve that individual fixture is arranged on the table in the prior art
Fixed silicon crystal bar, operational motion is cumbersome, use cost is high, and processing efficiency is low, the poor problem of versatility.
To achieve the above object, a kind of silicon wafer cutting machine is inventor provided, the cutting machine includes pedestal, rack, liter
Descending mechanism and clamping cutter unit；
The rack is set on pedestal；
The clamping cutter unit includes double-station rotary table and anti-chipping cutter device, and the double-station turns round work
It is set on pedestal as platform, the anti-chipping cutter device is set to above rotary table；
The anti-chipping cutter device includes saw blade cutting mechanism, clip claw mechanism and sliding equipment；
The saw blade cutting mechanism includes that cutting panel, guide wheel assembly and diamond fretsaw, the guide wheel assembly are installed on
It cuts on panel, the diamond fretsaw is laid in the wire casing of guide wheel assembly, and diamond fretsaw can be in the drive of guide wheel assembly
Lower movement is provided with resigning groove on the cutting panel；
The clip claw mechanism includes the clamping jaw unit for being symmetrically disposed on the two sides of resigning groove, and the clamping jaw unit includes the
One straight line reciprocating apparatus, positioning clamping jaw, balance clamping jaw and displacement clamping jaw, the balance clamping jaw and displacement clamping jaw are mounted on positioning
On clamping jaw, balance clamping jaw and displacement clamping jaw have the abutment face towards silicon crystal bar to be cut, and balance clamping jaw and displacement clamping jaw are distinguished
The two sides of diamond fretsaw below resigning groove, telescopic rod one end and the positioning clamping jaw of the linear reciprocation device are fixed；
The sliding equipment includes the sliding unit for being symmetrically disposed on the two sides of resigning groove, and the sliding unit includes perpendicular
To sliding rail and vertical sliding block, the vertical rails are fixed on the cutting panel of resigning groove two sides, and the vertical sliding block can edge
Vertical rails slide up and down, and the linear reciprocation device is fixed on vertical sliding block；
The elevating mechanism is installed on the crossbeam of rack, and elevating mechanism is for driving saw blade cutting mechanism to cut silicon wafer
Stick.
As a kind of preferred structure of the invention, the double-station rotary table includes workbench, swing mechanism and drive
Motivation structure；
For the workbench tool there are two clamping station, the clamping station is symmetrically disposed on the two sides of workbench；
The swing mechanism includes live spindle, bearing and rotation gear, and the bearing and rotation gear are sheathed on rotation
Turn outside main shaft；
The driving mechanism includes telescoping mechanism and driving rack, and the driving rack is engaged with rotation gear, described to stretch
The telescopic end of contracting mechanism is fixed with driving rack, and the collapsing length of the telescopic end is the half for rotating gear perimeter；
The workbench is fixedly connected with live spindle.
As a kind of preferred structure of the invention, the double-station rotary table further includes positioning buffer gear, described
Positioning buffer gear includes rotational positioning block and buffer bar, and the rotational positioning block is fixed in live spindle, rotational positioning block
It links with live spindle, the buffer bar is two, and two buffer bars are symmetrical arranged along live spindle, and it is fixed that buffer bar is located at rotation
On the path of position block movement, when the telescopic end of telescoping mechanism moves to range and minimum stroke, two bufferings
Bar respectively with rotational positioning block against.
As a kind of preferred structure of the invention, the double-station rotary table further includes electromagnetism locked mechanism, described
Electromagnetism locked mechanism includes mounting rack and electromagnetism locking lever, and the electromagnetism locking lever includes electromagnet and adjusting rod, the adjusting
Bar is fixed on mounting rack, and the electromagnet is set to one end of adjusting rod, and the electromagnetism locking lever is two, two electromagnetic locks
Solid rod is located on the path of rotational positioning block movement, moves to range and minimum stroke in the telescopic end of telescoping mechanism
When, the electromagnet of two electromagnetism locking levers respectively with rotational positioning block against.
As a kind of preferred structure of the invention, the clamping jaw unit further includes second straight line reciprocating apparatus, and described second
Linear reciprocation device and the side wall of balance clamping jaw are fixed, and balance clamping jaw limiting slot are provided on the positioning clamping jaw, for driving
Balance clamping jaw moves left and right in balance clamping jaw limiting slot.
As a kind of preferred structure of the invention, displacement clamping jaw limiting slot, the folder are additionally provided on the positioning clamping jaw
Pawl unit further includes third linear reciprocation device, and the third linear reciprocation device is set on the side wall of positioning clamping jaw, third
The telescopic rod of linear reciprocation device is fixed with displacement clamping jaw, is moved for driving displacement clamping jaw to move front and back in clamping jaw limiting slot in place
It is dynamic.
As a kind of preferred structure of the invention, the clamping cutter unit includes the first anti-chipping cutter device and second
Anti- chipping cutter device, the first anti-chipping cutter device and the second anti-chipping cutter device are arranged side by side to turn round in double-station
The top of workbench is respectively used to the both ends of silicon crystal bar in cutting clamping station.
As a kind of preferred structure of the invention, the cutting machine further includes cutting rack, and the anti-chipping cutter device is solid
Due on cutting rack, the elevating mechanism includes left column lifting assembly and right column lifting assembly, the both ends of the cutting rack
The lifting unit with left column lifting assembly and right column lifting assembly is fixed respectively, the left column lifting assembly and right column liter
The lifting unit of part of coming down to a lower group moves synchronously.
As a kind of preferred structure of the invention, the clamping cutter unit further includes lateral displacement mechanism, the transverse direction
Displacement mechanism includes first servo motor, first ball screw, the second servo motor and the second ball screw, first ball
Bearing, the first anti-chipping cutter device and the second anti-chipping are arranged with outside nut on lead screw, the second ball-screw
The cutting panel of cutter device is separately connected the bearing of first ball screw, the nut outer cover of the second ball screw, and described
One servo motor is for driving the nut on the first ball screw to rotate, and second servo motor is for driving the second ball wire
Nut rotation on bar.
As a kind of preferred structure of the invention, the clamping cutter unit at least two, the clamping cutter unit
Uniformly it is arranged side by side on pedestal.
It is different from the prior art, above-mentioned technical proposal has the following advantages that：The duplex designed in silicon wafer cutting machine of the present invention
Position rotary table, realizes the location swap of two clamping stations on workbench, so that a station be there is no harm in when carrying out cutting work
Hinder another station operation of feeding and discharging, bar cutting carries out simultaneously with loading and unloading, and cutting area mentions significantly without waiting for the loading and unloading time
High efficiency；And saw blade cutting mechanism and clip claw mechanism are combined design by the anti-chipping cutter device in cutting machine, sufficiently
Using the displacement of saw blade cutting mechanism, without designing independent clamping jaw mobile mechanism, and clip claw mechanism is mounted on cutting panel
The cutting region of resigning groove, clip claw mechanism clamps the barred body of silicon crystal bar joint-cutting two sides in cutting process, can play
To the cutting fixed function of silicon crystal bar, moreover it is possible to prevent silicon crystal bar to be broken when will cut off, so that cutting end face be avoided to occur
The case where " chipping ", anti-chipping cutter device operational motion is simple, wide suitable for range, silicon wafer cutting machine cutting efficiency of the present invention
High, processing silicon wafer quality is good, and the market competitiveness is strong.
Detailed description of the invention
Fig. 1 is a kind of schematic view of the front view of one embodiment of silicon wafer cutting machine of the present invention；
Fig. 2 is a kind of schematic cross-sectional view that the part-structure of one embodiment of silicon wafer cutting machine is overlooked of the present invention；
Fig. 3 is a kind of schematic cross-sectional view that the part-structure of one embodiment of silicon wafer cutting machine is overlooked of the present invention；
Fig. 4 is the oblique view of structural diagram of anti-one embodiment of chipping cutter device in a kind of silicon wafer cutting machine of the present invention；
Fig. 5 is the schematic view of the front view of anti-another embodiment of chipping cutter device in a kind of silicon wafer cutting machine of the present invention；
Fig. 6 is the clamping jaw unit of the anti-chipping cutter device of the present embodiment and the strabismus schematic diagram that sliding unit is used cooperatively；
Fig. 7 is the clamping jaw unit of the anti-chipping cutter device of the present embodiment and the schematic top plan view that sliding unit is used cooperatively；
Fig. 8 is that the vertical view of the state change of the clip claw mechanism of the anti-chipping cutter device of the present embodiment in use is shown
It is intended to；
Fig. 9 is the oblique view of structural diagram of one embodiment of double-station rotary table in a kind of silicon wafer cutting machine of the present invention；
Figure 10 is the partial structure diagram of one embodiment of double-station rotary table in a kind of silicon wafer cutting machine of the present invention；
Figure 11 be another embodiment of double-station rotary table in a kind of silicon wafer cutting machine of the present invention schematic front view it
One；
Figure 12 be another embodiment of double-station rotary table in a kind of silicon wafer cutting machine of the present invention schematic front view it
Two；
Figure 13 is that the part-structure of one embodiment of double-station rotary table in a kind of silicon wafer cutting machine of the present invention is overlooked
Schematic cross-sectional view；
Figure 14 is the oblique view of structural diagram of one embodiment of the present embodiment middle rack fixing seat.
Description of symbols：
100, pedestal；
200, rack；
310, left column lifting assembly；
320, right column lifting assembly；
400, double-station rotary table；
410, workbench；411, clamping station；
420, swing mechanism；421, live spindle；422, bearing；423；Rotate gear；424, rotary sleeve；425, upper axis
Hold lid；426, lower ball cover；
430, driving mechanism；431, telescoping mechanism；432, driving rack；
440, rotational positioning block；
450, buffer bar；451, Limit screw；452, spring；453, mandril；454, adjusting nut；
460, Working gantry；
470, rack fixing seat；471, rack gear sliding rail；472, buffer bar accommodating hole；
480, electromagnetism locked mechanism；481, mounting rack；482, electromagnetism locking lever；
490, clamp system；
500, anti-chipping cutter device；
510, saw blade cutting mechanism；511, panel is cut；512, guide wheel assembly 513, diamond fretsaw；514, it steps down recessed
Slot；
520, clamping jaw unit；521, first straight line reciprocating apparatus；522, clamping jaw is positioned；523, clamping jaw is balanced；524, it is displaced
Clamping jaw；525, second straight line reciprocating apparatus；526, clamping jaw limiting slot is balanced；527, it is displaced clamping jaw limiting slot；528, third straight line
Reciprocating apparatus；
530, sliding unit；531, vertical rails；532, mobile sliding block；
600, lateral displacement mechanism；
610, first servo motor；
620, the second servo motor；
630, ball screw；631, nut；632,632, bearing；
700, cutting rack；
800, silicon wafer square rod.
Specific embodiment
Technology contents, construction feature, the objects and the effects for detailed description technical solution, below in conjunction with specific reality
It applies example and attached drawing is cooperated to be explained in detail.
Silicon wafer cutting machine of the present invention is not only suitable for the cutting that silicon wafer pole is suitable for silicon wafer square rod again.The silicon wafer pole is such as
Single silicon crystal bar, the square rod after such as more silicon crystal bars of silicon wafer square rod, single silicon crystal bar evolution.In actual use, silicon wafer is cut
And the clamping station of middle double-station rotary table and the clip claw mechanism of anti-chipping cutter device select different structures (the two knot
Structure is adapted), then it is adapted to the cutting processing of silicon crystal bar of different shapes.
As balanced clamping jaw and displacement clamping jaw and silicon crystal bar in the position clamping station of double-station rotary table, clip claw mechanism
Abutment face be perpendicular, cutting machine is then for silicon wafer square rod；If the abutment face of above structure and silicon crystal bar be V-arrangement or
Arc-shaped surface, cutting machine are then to be suitable for silicon wafer to have an area of stick.The cross sectional shape selection of the silicon crystal bar cut as needed is adapted
Hold assembly be the common knowledge of this field, therefore do not repeat them here.
Below by taking silicon wafer cutting machine is to the cutting of silicon wafer square rod as an example, the present invention will be described in detail.
Fig. 1 is please referred to Figure 14.The present invention provides a kind of silicon wafer cutting machine, the cutting machine includes pedestal 100, rack
200, elevating mechanism and clamping cutter unit.
The rack 200 is set on pedestal 100, and the rack 200 and pedestal 100 cooperate the support as cutting machine
Frame, for installing, carrying other building blocks.
The clamping cutter unit as silicon wafer square rod 800 grip and cutting mechanism.Specifically, the clamping
Cutter unit includes double-station rotary table 400 and anti-chipping cutter device 500, and the double-station rotary table 400 is set
It is placed on pedestal 100, the anti-chipping cutter device 500 is set to 410 top of rotary table, double-station rotary table
Location swap may be implemented in two clamping stations 411 on 400, so that a station when carrying out cutting work, does not interfere another station
Operation of feeding and discharging, bar cutting carry out simultaneously with loading and unloading, and cutting area greatly improves production effect without waiting for the loading and unloading time
Rate.
Please refer to Fig. 1, Fig. 4 and Fig. 5, the anti-chipping cutter device 500 silicon wafer square rod 800 is cut it is same
When, gripping to silicon wafer square rod 800 prevents it from " chipping " occurs.Specifically, the anti-chipping cutter device 500 includes scroll saw
Cutting mechanism 510, clip claw mechanism and sliding equipment.
The saw blade cutting mechanism 510, which specifically executes, acts on the cutting processing of silicon wafer square rod 800, the cutting saddlebag
Include the slice to silicon wafer square rod 800 and truncation work.Specifically, the saw blade cutting mechanism 510 include cutting panel 511,
Guide wheel assembly 512 and diamond fretsaw 513, the guide wheel assembly 512 are installed on cutting panel 511, the diamond fretsaw
513 are laid in the wire casing of guide wheel assembly 512, and diamond fretsaw 513 can move under the drive of guide wheel assembly 512, described to cut
Resigning groove 514 is provided on face plate 511.Further, the guide wheel assembly 512 includes main drive wheel component and driven
Wheel, the drive wheel assemblies include driving motor and driving wheel, and the driving wheel is connected to the output shaft of driving motor, driving electricity
Machine drives driven wheel rotation, and the diamond fretsaw 513 is laid in the wire casing of driving wheel, driven wheel, the guide wheel assembly 512
Diamond fretsaw 513 is driven to move.The resigning groove 514 is used as cutting region, so that saw blade cutting mechanism 510 is to silicon wafer
When square rod 800 is cut, the blocking of cut surface plate 511, diamond fretsaw 513 not will receive to the cutting of silicon wafer square rod 800
It can be completely cut off by silicon wafer square rod 800 radially.
Referring to Fig. 8, the clip claw mechanism is prevented for gripping to the silicon wafer square rod 800 cut
Only there is " chipping " in cutting end face.Specifically, the clip claw mechanism includes the clamping jaw for being symmetrically disposed on the two sides of resigning groove 514
Unit 520, the clamping jaw unit 520 include first straight line reciprocating apparatus 521, positioning clamping jaw 522, balance clamping jaw 523 and displacement
Clamping jaw 524, the balance clamping jaw 523 are mounted on positioning clamping jaw 522 with displacement clamping jaw 524, balance clamping jaw 523 and displacement clip
Pawl 524 has the abutment face towards silicon crystal bar to be cut, and balance clamping jaw 523 and displacement clamping jaw 524 are located at resigning groove 514
The two sides of lower section diamond fretsaw 513, telescopic rod one end of the linear reciprocation device and positioning clamping jaw 522 are fixed.It please refers to
Fig. 8 A, when the cutting work of silicon wafer square rod 800 does not carry out or just starts cutting, clip claw mechanism is separated with polycrystalline silicon rod, this
Device reaches three points in the radial cuts depth of silicon wafer square rod 800 after the cutting region setting clip claw mechanism of cutting panel 511
Two or so when, please refer to Fig. 8 B, linear reciprocation device pushes positioning clamping jaw 522, drive be mounted on it is flat on positioning clamping jaw 522
Weighing apparatus clamping jaw 523 is contacted against plane with silicon wafer square rod 800 with displacement clamping jaw 524, is clamped silicon wafer square rod 800, is cut with overcoming
Cut the case where endface generates active force on the outside of end face, prevents chipping generation.Preferably, clamping jaw 523 and displacement clip are balanced
Pawl 524 is located at the two sides of 514 lower section diamond fretsaw 513 of resigning groove, then balance clamping jaw 523 clamps silicon wafer square rod
800 remaining parts, displacement clamping jaw 524 clamp the part that silicon wafer square rod 800 is cut away, and guarantee that two sections of bars generate cutting end face
Outward force to not will cause cut end face occur " chipping ".Certainly, the first straight line reciprocating apparatus 521 is recessed in resigning
There is setting on the clamping jaw unit 520 of 514 left and right sides of slot, user is by two linear reciprocation devices by uniformly starting switch
The synchronous driving of clamping jaw unit 520 may be implemented in control, and synchronous control technique is more mature, and this will not be repeated here.
Please refer to fig. 4 to fig. 6, the sliding equipment as the connecting component between cutting panel 511 and clamping jaw so that
Clip claw mechanism can be slided up and down along cutting panel 511.Specifically, the sliding equipment includes being symmetrically disposed on resigning groove
The sliding unit 530 of 514 two sides, the sliding unit 530 include vertical rails 531 and vertical sliding block, the vertical rails
531 are fixed on the cutting panel 511 of 514 two sides of resigning groove, and the vertical sliding block can vertically sliding rail 531 slide up and down,
The linear reciprocation device is fixed on vertical sliding block.In the cutting process of silicon wafer square rod 800, left and right clamping jaw unit 520 divides
It is not resisted against polycrystalline silicon rod side wall, after clip claw mechanism clamps silicon wafer square rod 800, silicon wafer square rod 800 is simultaneously not switched off, at this time scroll saw
Cutting mechanism 510 also needs to move downward, but the position of polycrystalline silicon rod is fixed, to guarantee being normally carried out for cutting work, just
Needing to be arranged sliding equipment moves downward saw blade cutting mechanism 510, and clip claw mechanism position holding position is constant.
The elevating mechanism is then used to that the decline of saw blade cutting mechanism 510 to be driven to cut silicon wafer square rod 800, band moving-wire
The lifting of saw cut mechanism 510 is completed to return sword.Specifically, the elevating mechanism is installed on the crossbeam of rack 200, elevating mechanism is used
In drive, silicon crystal bar cuts in saw blade cutting mechanism 510.
The double-station rotary table designed in silicon wafer cutting machine of the present invention realizes the position of two clamping stations on workbench
It exchanges, so that a station when carrying out cutting work, does not interfere another station operation of feeding and discharging, bar cutting and loading and unloading are simultaneously
It carries out, cutting area greatly improves production efficiency without waiting for the loading and unloading time；And the anti-chipping cutter device in cutting machine will
Saw blade cutting mechanism and clip claw mechanism combine design, make full use of the displacement of saw blade cutting mechanism, without designing independent clamping jaw
Mobile mechanism, and clip claw mechanism is mounted on the cutting region of cutting panel resigning groove, the clip claw mechanism in cutting process
The barred body for clamping silicon wafer square rod joint-cutting two sides can play the cutting fixed function to silicon wafer square rod, moreover it is possible to prevent silicon wafer side
Stick will be broken when will cut off, so that cutting end face be avoided the case where " chipping ", anti-chipping cutter device operational motion occur
Simply, it is wide to be suitable for range, silicon wafer cutting machine cutting efficiency of the present invention is high, the silicon wafer quality of processing is good, and the market competitiveness is strong.
Fig. 9 and Figure 12 are please referred to, as a preferred embodiment of the present invention, the double-station rotary table 400 is wrapped
Include workbench 410, swing mechanism 420 and driving mechanism 430.
Clamping platform of the workbench 410 as silicon wafer square rod 800, it is enterprising that silicon wafer square rod 800 is fixed on workbench 410
Row cutting processing.Specifically, the tool of workbench 410 is there are two clamping station 411, the clamping station 411 is symmetrically disposed on
The two sides of workbench 410.Workbench 410 be arranged two clamping stations 411 make this workbench 410 may be implemented cutting with up and down
Material work carries out simultaneously, without counteracting.Preferably, two clamping stations 411 are located at workbench 410
Two sides, two workbench 410, which rotate 180 °, may be implemented operating position exchange.
The swing mechanism 420 is used to that workbench 410 to be driven to carry out rotary motion, realizes the exchange of two clamping stations 411,
So that a station when being cut, does not interfere another station operation of feeding and discharging, removes the bar cut and put stick to be cut
Material, bar cutting carry out simultaneously with loading and unloading, and cutting area is without waiting for the loading and unloading time.Specifically, the swing mechanism 420 wraps
Live spindle 421, bearing 422 and rotation gear 423 are included, the bearing 422 and rotation gear 423 are sheathed on live spindle
Outside 421.Preferably, detachable connection method is used between live spindle 421 and workbench 410, the maintenance that both facilitates or
Person's replacement.The workbench 410 can be socketed in outside live spindle 421 or workbench 410 is fixed on live spindle
421 top.In certain other embodiments, the swing mechanism 420 further includes rotary sleeve 424, upper bearing (metal)
Lid 425 and lower ball cover 426, the outside of rotary sleeve 424 socket and live spindle 421, lower ball cover 426 are set to
The bottom end of live spindle 421, upper ball cover 425 are socketed in the live spindle 421 of 410 lower section of workbench.The rotary shaft
Set 424 plays the protective effect to live spindle 421, while more convenient live spindle 421 rotates.Metal (upper lid 426 is right
The position up and down of live spindle 421 is sealed, and prevents oil leakage, while preventing the cutting break flour of silicon wafer square rod 800 from falling
Enter, influences the rotation of live spindle 421.
The driving mechanism 430 provides driving force for driving swing mechanism 420 and workbench 410 to rotate.Tool
Body, the driving mechanism 430 includes telescoping mechanism 431 and driving rack 432, the driving rack 432 and rotation gear 423
Engagement, the telescopic end and driving rack 432 of the telescoping mechanism 431 are fixed, and the collapsing length of the telescopic end is rotation gear
The half of 423 perimeters.In the present embodiment, telescoping mechanism 431 carry out straight reciprocating motion, telescoping mechanism 431 have with
The telescopic rod that driving rack 432 connects, with the flexible end motion of telescopic rod movement drive the driving rack 432 that is secured into
The linear motion of driving rack 432 is converted into revolution fortune by row linear motion, the rotation gear 423 engaged with driving rack 432
It is dynamic, drive live spindle 421 to be rotated.As shown in Figure 10 and Figure 11, Figure 10 and Figure 11 is respectively that telescopic end moves to minimum
When stroke and range, the schematic front view of the present apparatus, 411 working region of clamping station is exchanged at this time.Preferably, control is stretched
The linear motion distance that the collapsing length i.e. telescopic end at contracting end do straight reciprocating motion is two points for rotating 423 perimeter of gear
One of, range or minimum stroke are moved to control telescopic end, live spindle 421 and workbench 410 rotate 180 °,
Realize that the exchange of 410 liang of clamping stations 411 of workbench, that is, two workbench 410 are carried out in cutting region and loading and unloading region
Rotation on position.Specifically, the telescoping mechanism 431 can be with cylinder or hydraulic cylinder.It is replaced using such driving mechanism 430
Traditional mode using servomotor, gear reducer and worm and gear realizes rotary motion, the manufacturing cost of the present apparatus
It substantially reduces, the competitiveness of product in market greatly improves, and applicability is wider.
In the embodiment as shown in Fig. 9 to Figure 12, the double-station rotary table 400 further includes positioning buffer gear,
The positioning buffer gear is used to determine whether in place live spindle 421 to carry out 180 ° of rotation, and in live spindle 421
The impact force driven when being rotated in place to live spindle 421 plays buffer function.Specifically, the positioning buffer gear includes rotation
Turn locating piece 440 and buffer bar 450, the rotational positioning block 440 is fixed in live spindle 421, rotational positioning block 440 and rotation
Turn the linkage of main shaft 421, the buffer bar 450 is two, and two buffer bars 450 are symmetrical arranged along live spindle 421, buffer bar
450 are located on the path that rotational positioning block 440 moves, and move to range and minimum in the telescopic end of telescoping mechanism 431
When stroke, two buffer bars 450 respectively with rotational positioning block 440 against.That is the rotational positioning block in this structure
440 rotate clockwise 180 ° or counterclockwise rotation 180 ° when, rotational positioning block 440 can all touch buffer bar 450, buffer bar
450, for buffering the impact force of 440 motion process of rotational positioning block, prevent vibration from generating loud noise.Using the structure, stretch
When mechanism 431 carries out linear expansion movement, telescopic end pushes rack drives rotation gear 423 to rotate, to drive rotational positioning
Block 440 rotates, and when telescopic end ejection reaches range, rotational positioning block 440 touches buffer bar 450 first, works as rotation
Locating piece 440 illustrates that live spindle 421 is rotated in place when touching buffer bar 450, for avoid cylinder shift onto range or
Impact is generated with rotational positioning block 440 when being reduced to minimum stroke, using 450 flexible contact of buffer bar, avoids impact endurance test shock, is reduced
Equipment attrition extends the service life of double-station rotary table 400.
Figure 13 is please referred to, in the particular embodiment, the buffer bar 450 includes Limit screw 451, spring 452 and top
Bar 453, the Limit screw 451 have accommodating cavity, are provided with spring 452, described 453 one end of mandril and bullet in the accommodating cavity
Spring 452 against, mandril 453 the other end can with rotational positioning block 440 against.In 400 use process of double-station rotary table
In, rotational positioning block 440 is contacted with the mandril 453 of buffer bar 450 first, and 453 compressed spring 452 of mandril utilizes spring 452
The impact force of elastic buffer power decrease rotational positioning block 440.In certain preferred embodiments, the buffer bar 450 further includes
Adjusting nut 454, the adjusting nut 454 are sheathed on the outside of Limit screw 451, adjusting nut 454 and Limit screw 451 it
Between by being threadedly engaged.The setting of the adjusting nut 631 is the position for cooperating Limit screw 451 to adjust entire buffer bar 450
It sets, specifically rotary banking screw 451 makes Limit screw 451 carry out front-rear position adjustment with respect to adjusting nut 631, to guarantee
Rotational positioning block 440 can contact the mandril 453 of buffer bar 450, so that entire buffer bar 450 plays right decrease rotation and determines
The effect of position 440 impact force of block.
Fig. 9 and Figure 14 are please referred to, as a preferred embodiment of the present invention, the driving mechanism 430 further includes rack gear
Fixing seat 470, the rack fixing seat 470 play the role of protecting driving rack 432 and rotate gear 423, and further
It is that driving rack 432 presets motion path by rack fixing seat 470, so that the linear motion of driving rack 432 is more smart
It is really and smooth.Specifically, the rack fixing seat 470 be sheathed on rotation gear 423 outside, and rack fixing seat 470 not with rotation
Rotating disk 423 contacts, and rack gear sliding rail 471 is offered on the rack fixing seat 470, it is sliding that the driving rack 432 is located at rack gear
In rail 471, driving rack 432 is engaged with the rotation gear 423 being located inside rack fixing seat 470.
As a preferred embodiment of the present invention, the rotational positioning block 440 is located inside rack fixing seat 470, institute
It states and offers buffer bar accommodating hole 472 on the side wall of rack fixing seat 470, the adjusting nut 454 of the buffer bar 450 is fixed on
On buffer bar accommodating hole 472.In the present embodiment, the rack fixing seat 470 can also prevent rotational positioning block 440
Shield, and guarantee total aesthetics in appearance, rack fixing seat 470 is convenient also as the support mounting structure of buffer bar 450
The installation of buffer bar 450 is fixed.In certain embodiments, heretofore described double-station rotary table 400 further includes work
Rack 460, installation supporting mechanism of the Working gantry 460 as entire mechanism, Working gantry 460 lift swing mechanism 420
It is raised to certain altitude, facilitates the progress of rotary motion.
As a preferred embodiment of the present invention, the double-station rotary table 400 further includes electromagnetism locked mechanism
480, the electromagnetism locked mechanism 480 is used for after clamping station 411 moves to designated position, is determined live spindle 421
Position locking is prevented when carrying out the cutting work of silicon wafer square rod 800, and workbench 410 shakes, and causes cutting for silicon wafer square rod 800
When face the generation of the case where chipping or even wavy surface, especially telescoping mechanism 431 occurs using cylinder, because gas source is unstable
Live spindle 421 is easily caused to shake, therefore the setting of electromagnetism locked mechanism 480 is very important.Specifically, described
Electromagnetism locked mechanism 480 includes mounting rack 481 and electromagnetism locking lever 482, and the electromagnetism locking lever 482 includes electromagnet and adjusting
Bar, the adjusting rod are fixed on mounting rack 481, and the electromagnet is set to one end of adjusting rod, the electromagnetism locking lever 482
It is two, two electromagnetism locking levers 482 are located on the path of the movement of rotational positioning block 440, transport in the telescopic end of telescoping mechanism 431
When moving range and minimum stroke, the electromagnet of two electromagnetism locking levers 482 is supported with rotational positioning block 440 respectively
It leans on.In the present embodiment, the adjusting rod can enable electromagnet according to the position of actual use situation adjustment electromagnet
Rotational positioning block 440 is enough touched, when the telescopic end of telescoping mechanism 431 moves to range and minimum stroke, is needed
The silicon wafer square rod 800 being fixed in a clamping station 411 is cut, and loading and unloading behaviour is carried out to another clamping station 411
Make, need workbench 410 firm at this time, then being powered to electromagnet so that rotational positioning block 440 is sucked in electromagnet, prevents from rotating
Main shaft 421 shakes, and when needing to switch clamping station 411, makes its demagnetization to electromagnet power-off, enables live spindle 421
Normally make rotating motion.Preferably, in the present embodiment, the setting of buffer bar 450 prevents rotational positioning block 440 to electromagnet
Greater impact is caused, the two is worn, therefore 453 outline of mandril of buffer bar 450 is more than electromagnet, rotational positioning block 440
First to contact mandril 453 can just play due buffer function.Preferably, the adjusting rod include straight-bar portion and be socketed on directly
Bar portion adjusting nut 454, adjusting nut 454 are fixed on mounting rack 481, rotation straight-bar portion make its relative adjustment nut 454 into
Row shift in position, the final setting position for changing electromagnet.
Fig. 9 to Figure 11 is please referred to, as a preferred embodiment of the present invention, the double-station rotary table 400
Clamp system 490 is additionally provided in clamping station 411, the clamp system 490 is set on the side plate of clamping station 411, folder
Tight mechanism 490 is used for silicon crystal bar to be cut.According to the difference of clamping station 411 and clamp system 490, double-station turns round work
Platform 400 had both been capable of clamping circular single crystal silicon rod, was also capable of clamping square polysilicon silicon rod.In the embodiment shown in fig. 9, it is clamped shown in
Station 411 has square groove, and it is suitable for the clamping of square polysilicon silicon rod, the clamp system 490 is to be arranged in clamping station
The telescoping cylinder of 411 sides, the telescopic rod of telescoping cylinder control clamping station 411 by control telescopic rod towards polycrystalline silicon rod side wall
Width, realize clamping to silicon crystal bar, structure adaptability is stronger.
6 and Fig. 7 are please referred to, as a preferred embodiment of the present invention, the clamping jaw unit 520 further includes second straight line
The side wall of reciprocating apparatus 525, the second straight line reciprocating apparatus 525 and balance clamping jaw 523 is fixed, on the positioning clamping jaw 522
It is provided with balance clamping jaw limiting slot 526, is moved left and right in balance clamping jaw limiting slot 526 for band dynamic balance clamping pawl 523.Clamping jaw
The setting of limiting slot limits the space and motion path of balance clamping jaw 523, the peace of more convenient balance clamping jaw 523
Dress.In the present embodiment, displacement clamping jaw 524 and balance clamping jaw 523 pass through first straight line reciprocating apparatus 521 and second straight line respectively
The side wall with trend silicon wafer square rod 800 of reciprocating apparatus 525 is close, to be clamped to polycrystalline silicon rod.Specific displacement clip
Pawl 524 is also mounted on locating clip pawl 522, and first straight line reciprocating apparatus 521 pushes positioning clamping jaw 522 to drive displacement clamping jaw
524 contact against planar polysilicon stick side, positions clamping jaw 522 and displacement clamping jaw 524 in the direction close to polycrystalline silicon rod
It is namely linkage on side-to-side movement direction.Clamping jaw unit 520 is arranged to the structure, so that displacement clamping jaw 524 and balance
Clamping jaw 523 can move alone, and on the one hand to be displaced the silicon crystal bar that clamping jaw 524 can drive cutting to fall in other embodiments
Material movement is used alone displacement clamping jaw 524 and clamps and will cut if on the other hand second straight line reciprocating apparatus 525 breaks down
Disconnected silicon wafer square rod 800 also can largely reduce cutting end face, and there is a situation where chipping generations.
In embodiment as shown in Figure 6 and Figure 7, displacement clamping jaw limiting slot 527 is additionally provided on the positioning clamping jaw 522,
The clamping jaw unit 520 further includes third linear reciprocation device 528, and the third linear reciprocation device 528 is set to locating clip
On the side wall of pawl 522, the telescopic rod and displacement clamping jaw 524 of third linear reciprocation device 528 are fixed, for driving displacement clamping jaw
524 are moved forward and backward in displacement clamping jaw limiting slot 527.As shown in Figure 8 C, in the present embodiment, after the cutting of silicon wafer square rod 800,
Third linear reciprocation device 528 drives displacement clamping jaw 524 in displacement clamping jaw limiting slot 527 along the axial direction of silicon wafer square rod 800
Direction is moved forward and backward, and third linear reciprocation device 528 and first straight line reciprocating apparatus 521310 drive the movement for being displaced clamping jaw 524
Direction is mutually perpendicular to, and third linear reciprocation device 528 acts on the silicon wafer bar for falling cutting from the upper of diamond fretsaw 513
Fang Yikai prevents the displacement release silicon wafer bar of clamping jaw 524 from falling and pounds disconnected diamond fretsaw 513, to protect diamond fretsaw 513.
In the particular embodiment, the linear reciprocation device is any one in cylinder, hydraulic cylinder or linear motor three, excellent
Choosing, linear reciprocation device can use twin shaft cylinder or dual-axle hydraulic cylinder, and the thrust applied is more stable.
In preferred embodiment, it is provided with guiding axis in the displacement clamping jaw limiting slot 527, is socketed with outside the guiding axis
Sliding shaft sleeve, the sliding shaft sleeve and displacement clamping jaw 524 are fixed.In the present embodiment, third linear reciprocation device 528 drives position
Shifting clamping jaw 524 holds the silicon wafer square rod 800 that cutting is fallen and is moved along guiding axis, and the setting of guiding axis will be displaced clamping jaw
524 motion path is preset, and movement is more stable.
Referring to Fig. 1, the clamping cutter unit includes that the first anti-chipping is cut as a preferred embodiment of the present invention
Cut device 500 and the second anti-chipping cutter device 500, the first anti-chipping cutter device 500 and the second anti-chipping cutting dress
It sets 500 to be arranged side by side in the top of double-station rotary table 400, is respectively used to two of silicon crystal bar in cutting clamping station 411
End.In the present embodiment, two anti-chipping cutter devices 500 are arranged in the clamping cutter unit, may be implemented to return from double-station
It changes a job and makees the both ends of the silicon wafer square rod 800 clamped in upper clamping station 411 while being cut, to improve the cutting effect of silicon crystal bar
Rate.Specifically, the saw blade cutting mechanism 510 in the anti-chipping cutter device 500 is ring wire saw cutting mechanism or coiling
Formula saw blade cutting mechanism 510.Wound-rotor type saw blade cutting shown in ring wire saw cutting mechanism 510 or Fig. 4 shown in Fig. 5
Mechanism 510 all can serve as the cutting executing agency of polycrystalline silicon rod, and above two cutting operating mechanism technology is more mature, herein
It does not repeat them here.Preferably, the saw blade cutting mechanism 510 in clamping cutter unit can use ring wire saw cutting mechanism 510, ring
513 cutting mechanism 510 of shape diamond fretsaw when carrying out cutting work, run smoothly, speed it is fast, cutting efficiency is high, quality is good.
In as with the embodiments shown in figures 2 and 3, as a preferred embodiment of the present invention, the cutting machine further includes
Cutting rack 700, the anti-chipping cutter device 500 are fixed on cutting rack 700, and the elevating mechanism includes left column lifting group
Part 310 and right column lifting assembly 320, the both ends of the cutting rack 700 respectively with left column lifting assembly 310 and right column liter
The lifting unit of part 320 of coming down to a lower group is fixed, the left column lifting assembly 310 fortune synchronous with the lifting unit of right column lifting assembly 320
It is dynamic.In the present embodiment, two anti-chipping cutter devices 500 are each attached to cutting to add, are then driven by elevating mechanism
It is lifted or decline, to realize the synchronous cutting of silicon wafer square rod 800.In certain embodiments, the left column lifting assembly
310 and right column lifting assembly 320 can be linear motor, the two synchronization telescope is to drive cutting rack 700 to carry out lifting fortune
It is dynamic.In further embodiments, the left column lifting assembly 310 and right column lifting assembly 320 can be ball-screw,
Dual-output shaft motor is additionally provided on 200 crossbeam of rack, the Dual-output shaft motor can be unified by driving member transmission
The screw rod rotation for driving roll left ballscrew and right ball-screw, to drive two sides nut 631 while move up and down, and then drives
It is gone up and down with the cutting rack 700 that nut 631 is connected.Specifically, the bracket is portal frame, the portal frame includes being set to left and right
The gantry upright post and top cross-bar of two sides, gantry upright post and top cross-bar surround the gantry structure of Jiong word shape, the cutting rack
As the middle beam of portal frame, for installing anti-chipping cutter device 500, and in the left column being arranged along left and right gantry upright post
It under the drive of lifting assembly 310 and right column lifting assembly 320, moves up and down, realizes the cutting to silicon crystal bar.
Referring to Fig. 2, the clamping cutter unit further includes lateral displacement machine as a preferred embodiment of the present invention
Structure 600, the lateral displacement mechanism 600 include first servo motor 610, first ball screw, the second servo motor 620 and the
Two ball screws 630 are arranged with bearing 632, institute outside the nut 631 in the first ball screw, the second ball-screw
The cutting panel 511 for stating the first anti-chipping cutter device 500 and the second anti-chipping cutter device 500 is separately connected the first ball wire
The bearing 632 of 631 outer cover of nut of thick stick, the second ball screw 630, the first servo motor 610 is for driving the first rolling
Nut 631 on ballscrew 630 rotates, and second servo motor 620 is used to drive the nut on the second ball screw 630
631 rotations.In the present embodiment, the anti-chipping cutter device 500 can also carry out the transverse shifting on left and right directions, can
Specified blanking region will be moved to by the silicon wafer bar of clip claw mechanism clamping after cutting, at the recycling for facilitating cutting bar
Reason.Specifically, first servo motor 610 drives feed screw nut 631 to rotate, move left and right it along screw rod, and in order to
Guarantee that feed screw nut 631 rotates and the first anti-chipping cutter device 500 does not rotate, the nut in first ball screw
631 outer covers are equipped with bearing 632.Similarly, the second servo motor 620 drives drives the second anti-chipping to cut by the second ball-screw
Device 500 is cut to move left and right.In actual use, need the first anti-chipping cutter device 500 and the second anti-chipping towards opposite
Direction movement, can be realized on the contrary by first servo motor 610 and 620 rotation direction of the second servo motor.In Fig. 2 institute
In the preferred embodiment shown, first ball screw and the second ball screw 630 can share same root screw rod, as long as keeping two
Anti- chipping cutter device is mobile towards opposite direction respectively.
As a preferred embodiment of the present invention, the clamping cutter unit at least two, the clamping cutting list
Member is uniformly arranged side by side on pedestal 100.At least two clamping cutter units are set, may be implemented to carry out multistation simultaneously
The cutting processing of silicon wafer bar, to further increase cutting processing efficiency.As shown in Figure 1, the clamping cutter unit is three
It is a, include altogether three double-station rotary tables, 400, six anti-chipping cutter devices 500, three silicon crystal bars can be carried out simultaneously
Six end faces of material are cut, and cutting efficiency is high, and the market competitiveness is strong.
It should be noted that being not intended to limit although the various embodiments described above have been described herein
Scope of patent protection of the invention.Therefore, it based on innovative idea of the invention, change that embodiment described herein is carried out and is repaired
Change, or using equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it directly or indirectly will be with
Upper technical solution is used in other related technical areas, is included within scope of patent protection of the invention.
Claims (10)
1. a kind of silicon wafer cutting machine, which is characterized in that the cutting machine includes that pedestal, rack, elevating mechanism and clamping cutting are single
Member；
The rack is set on pedestal；
The clamping cutter unit includes double-station rotary table and anti-chipping cutter device, the double-station rotary table
It is set on pedestal, the anti-chipping cutter device is set to above rotary table；
The anti-chipping cutter device includes saw blade cutting mechanism, clip claw mechanism and sliding equipment；
The saw blade cutting mechanism includes that cutting panel, guide wheel assembly and diamond fretsaw, the guide wheel assembly are installed on cutting
On panel, the diamond fretsaw is laid in the wire casing of guide wheel assembly, and diamond fretsaw can be transported under the drive of guide wheel assembly
It is dynamic, resigning groove is provided on the cutting panel；
The clip claw mechanism includes the clamping jaw unit for being symmetrically disposed on the two sides of resigning groove, and the clamping jaw unit includes first straight
Line reciprocating apparatus, positioning clamping jaw, balance clamping jaw and displacement clamping jaw, the balance clamping jaw and displacement clamping jaw are mounted on positioning clamping jaw
On, balance clamping jaw and displacement clamping jaw have the abutment face towards silicon crystal bar to be cut, and balance clamping jaw is located at displacement clamping jaw
The two sides of diamond fretsaw below resigning groove, telescopic rod one end and the positioning clamping jaw of the linear reciprocation device are fixed；
The sliding equipment includes the sliding unit for being symmetrically disposed on the two sides of resigning groove, and the sliding unit includes vertical sliding
Rail and vertical sliding block, the vertical rails are fixed on the cutting panel of resigning groove two sides, and the vertical sliding block can be vertically
Sliding rail slides up and down, and the linear reciprocation device is fixed on vertical sliding block；
The elevating mechanism is installed on the crossbeam of rack, and elevating mechanism is for driving saw blade cutting mechanism to cut silicon crystal bar.
2. silicon wafer cutting machine according to claim 1, which is characterized in that the double-station rotary table includes work
Platform, swing mechanism and driving mechanism；
For the workbench tool there are two clamping station, the clamping station is symmetrically disposed on the two sides of workbench；
The swing mechanism includes live spindle, bearing and rotation gear, and the bearing and rotation gear are sheathed on rotation master
Outside axis；
The driving mechanism includes telescoping mechanism and driving rack, and the driving rack is engaged with rotation gear, the telescopic machine
The telescopic end of structure is fixed with driving rack, and the collapsing length of the telescopic end is the half for rotating gear perimeter；
The workbench is fixedly connected with live spindle.
3. silicon wafer cutting machine according to claim 2, which is characterized in that the double-station rotary table further includes positioning
Buffer gear, the positioning buffer gear include rotational positioning block and buffer bar, and the rotational positioning block is fixed on live spindle
On, rotational positioning block and live spindle link, and the buffer bar is two, and two buffer bars are symmetrical arranged along live spindle, delay
Jumper bar is located on the path of rotational positioning block movement, moves to range and minimum stroke in the telescopic end of telescoping mechanism
When, two buffer bars respectively with rotational positioning block against.
4. silicon wafer cutting machine according to claim 2, which is characterized in that the double-station rotary table further includes electromagnetism
Locked mechanism, the electromagnetism locked mechanism include mounting rack and electromagnetism locking lever, and the electromagnetism locking lever includes electromagnet and tune
Pole, the adjusting rod are fixed on mounting rack, and the electromagnet is set to one end of adjusting rod, and the electromagnetism locking lever is two
Root, two electromagnetism locking levers are located on the path of rotational positioning block movement, move to range in the telescopic end of telescoping mechanism
And when minimum stroke, the electromagnet of two electromagnetism locking levers respectively with rotational positioning block against.
5. silicon wafer cutting machine according to claim 1, which is characterized in that the clamping jaw unit further includes that second straight line is reciprocal
The side wall of device, the second straight line reciprocating apparatus and balance clamping jaw is fixed, and balance clamping jaw limit is provided on the positioning clamping jaw
Position slot moves left and right in balance clamping jaw limiting slot for band dynamic balance clamping pawl.
6. silicon wafer cutting machine according to claim 5, which is characterized in that be additionally provided with displacement clamping jaw on the positioning clamping jaw
Limiting slot, the clamping jaw unit further include third linear reciprocation device, and the third linear reciprocation device is set to positioning clamping jaw
Side wall on, the telescopic rod of third linear reciprocation device and displacement clamping jaw are fixed, for driving displacement clamping jaw to move clamping jaw limit in place
It is moved forward and backward in the slot of position.
7. silicon wafer cutting machine according to claim 1, which is characterized in that the clamping cutter unit includes the first anti-chipping
Cutter device and the second anti-chipping cutter device, the first anti-chipping cutter device and the second anti-chipping cutter device are set side by side
It is placed in the top of double-station rotary table, is respectively used to the both ends of silicon crystal bar in cutting clamping station.
8. silicon wafer cutting machine according to claim 7, which is characterized in that the cutting machine further includes cutting rack, described anti-
Chipping cutter device is fixed on cutting rack, and the elevating mechanism includes left column lifting assembly and right column lifting assembly, institute
It states lifting unit of the both ends of cutting rack respectively with left column lifting assembly and right column lifting assembly to fix, the left column lifting
The lifting unit of component and right column lifting assembly moves synchronously.
9. silicon wafer cutting machine according to claim 7, which is characterized in that the clamping cutter unit further includes lateral displacement
Mechanism, the lateral displacement mechanism include first servo motor, first ball screw, the second servo motor and the second ball wire
Bar is arranged with bearing, the first anti-chipping cutting dress outside the nut in the first ball screw, the second ball-screw
It sets and is separately connected first ball screw, the nut outer cover of the second ball screw with the cutting panel of the second anti-chipping cutter device
Bearing, for driving the nut on the first ball screw to rotate, second servo motor is used for the first servo motor
The nut on the second ball screw is driven to rotate.
10. -9 described in any item silicon wafer cutting machines according to claim 1, which is characterized in that the clamping cutter unit is at least
It is two, the clamping cutter unit is uniformly arranged side by side on pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810691784.5A CN108858841B (en) | 2018-06-28 | 2018-06-28 | Silicon crystal cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810691784.5A CN108858841B (en) | 2018-06-28 | 2018-06-28 | Silicon crystal cutting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108858841A true CN108858841A (en) | 2018-11-23 |
| CN108858841B CN108858841B (en) | 2023-12-29 |
Family
ID=64296766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810691784.5A Active CN108858841B (en) | 2018-06-28 | 2018-06-28 | Silicon crystal cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108858841B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109648476A (en) * | 2019-01-31 | 2019-04-19 | 青岛高测科技股份有限公司 | A kind of clamping device clamping pole and square rod |
| CN111086116A (en) * | 2019-12-23 | 2020-05-01 | 中国有色桂林矿产地质研究院有限公司 | Annular diamond wire saw cutting device |
| CN113290722A (en) * | 2021-06-22 | 2021-08-24 | 浙江森尼克半导体有限公司 | Wire drawing type cutting machine suitable for semiconductor material |
| CN117341076A (en) * | 2023-12-05 | 2024-01-05 | 江苏宁美新能源有限公司 | Edge cutting equipment for photovoltaic module processing and working method thereof |
| CN117584300A (en) * | 2023-12-07 | 2024-02-23 | 池州首开新材料有限公司 | Monocrystalline silicon piece cutting equipment and cutting method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101249697A (en) * | 2008-03-27 | 2008-08-27 | 海润光伏科技股份有限公司 | Novel edge-collapse proof unfilled corner proof gripper for silicon crystal-bar slicer |
| CN201307367Y (en) * | 2008-11-07 | 2009-09-09 | 亚龙科技集团有限公司 | Directional-rotation dial feeding device |
| JP2011194560A (en) * | 2010-02-23 | 2011-10-06 | Yasunaga Corp | Wire saw device and method for manufacturing wafer using the same |
| CN205522035U (en) * | 2016-01-20 | 2016-08-31 | 青岛高测科技股份有限公司 | A brilliant device that holds in palm for monocrystalline silicon clipper |
| CN106273013A (en) * | 2016-08-09 | 2017-01-04 | 上海日进机床有限公司 | Work piece cut mechanism, work piece cut device and work piece cut method |
| CN206343909U (en) * | 2016-12-20 | 2017-07-21 | 洛阳美锐克机器人科技有限公司 | Gas dynamic triaxial double positioner |
| CN208629699U (en) * | 2018-06-28 | 2019-03-22 | 福州天瑞线锯科技有限公司 | A kind of silicon wafer cutting machine |
-
2018
- 2018-06-28 CN CN201810691784.5A patent/CN108858841B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101249697A (en) * | 2008-03-27 | 2008-08-27 | 海润光伏科技股份有限公司 | Novel edge-collapse proof unfilled corner proof gripper for silicon crystal-bar slicer |
| CN201307367Y (en) * | 2008-11-07 | 2009-09-09 | 亚龙科技集团有限公司 | Directional-rotation dial feeding device |
| JP2011194560A (en) * | 2010-02-23 | 2011-10-06 | Yasunaga Corp | Wire saw device and method for manufacturing wafer using the same |
| CN205522035U (en) * | 2016-01-20 | 2016-08-31 | 青岛高测科技股份有限公司 | A brilliant device that holds in palm for monocrystalline silicon clipper |
| CN106273013A (en) * | 2016-08-09 | 2017-01-04 | 上海日进机床有限公司 | Work piece cut mechanism, work piece cut device and work piece cut method |
| CN206343909U (en) * | 2016-12-20 | 2017-07-21 | 洛阳美锐克机器人科技有限公司 | Gas dynamic triaxial double positioner |
| CN208629699U (en) * | 2018-06-28 | 2019-03-22 | 福州天瑞线锯科技有限公司 | A kind of silicon wafer cutting machine |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109648476A (en) * | 2019-01-31 | 2019-04-19 | 青岛高测科技股份有限公司 | A kind of clamping device clamping pole and square rod |
| CN109648476B (en) * | 2019-01-31 | 2024-05-31 | 青岛高测科技股份有限公司 | Clamping device capable of clamping round bar and square bar |
| CN111086116A (en) * | 2019-12-23 | 2020-05-01 | 中国有色桂林矿产地质研究院有限公司 | Annular diamond wire saw cutting device |
| CN113290722A (en) * | 2021-06-22 | 2021-08-24 | 浙江森尼克半导体有限公司 | Wire drawing type cutting machine suitable for semiconductor material |
| CN113290722B (en) * | 2021-06-22 | 2023-08-18 | 浙江森尼克半导体有限公司 | Wire drawing type cutting machine suitable for semiconductor material |
| CN117341076A (en) * | 2023-12-05 | 2024-01-05 | 江苏宁美新能源有限公司 | Edge cutting equipment for photovoltaic module processing and working method thereof |
| CN117341076B (en) * | 2023-12-05 | 2024-02-23 | 江苏宁美新能源有限公司 | Edge cutting equipment for photovoltaic module processing and working method thereof |
| CN117584300A (en) * | 2023-12-07 | 2024-02-23 | 池州首开新材料有限公司 | Monocrystalline silicon piece cutting equipment and cutting method thereof |
| CN117584300B (en) * | 2023-12-07 | 2024-05-24 | 池州首开新材料有限公司 | Monocrystalline silicon piece cutting equipment and cutting method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108858841B (en) | 2023-12-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108858841A (en) | A kind of silicon wafer cutting machine | |
| CN107530903B (en) | Machine for processing slab material | |
| CN208629699U (en) | A kind of silicon wafer cutting machine | |
| CN107234527B (en) | Glass grinder | |
| US9339909B2 (en) | Working machine for making gears | |
| CN111451882A (en) | Five-axis numerical control grinding machine | |
| JP2006312234A (en) | High-efficiency milling and turning device, and method for particularly processing spectacle lens | |
| TW201424924A (en) | Machine tool | |
| CN108556163A (en) | A kind of anti-chipping cutter device of silicon crystal bar | |
| CN108582531A (en) | A kind of double-station silicon crystal bar cutting rotary table | |
| CN209304296U (en) | A kind of five-shaft numerical control sander | |
| CN103894897A (en) | Coordinate type saw blade base body internal grinding machine | |
| CN106938506A (en) | A kind of fast-clamping clamp of the natural former beautiful processing of suitable complicated shape | |
| CN208629696U (en) | A kind of double-station silicon crystal bar cutting rotary table | |
| JP2015062973A (en) | Machine tool | |
| KR100926342B1 (en) | A combined processing facilities with work of inclination direction | |
| CN208196484U (en) | Mobile phone center Full-automatic polishing machine | |
| CN109228767A (en) | A kind of dynamic pillar automatic loading/unloading glass carving machine and its working method | |
| CN108857696A (en) | Double-station line edging machining center | |
| CN109789465A (en) | Tool and lathe and method for machining plate-like workpieces | |
| CN201989014U (en) | Mechanical hand-type grinding and polishing machine for rhinestone | |
| CN102248206A (en) | Horizontal milling machine with ultrahigh processing speed | |
| CN209036212U (en) | Special-shaped small precision part grinding device | |
| US4019410A (en) | Rotary support for use in a machine tool | |
| CN202006405U (en) | Manipulator type rhinestone grinding and polishing machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |