CN108848629A - A kind of hole electricity PCB production technology - Google Patents
A kind of hole electricity PCB production technology Download PDFInfo
- Publication number
- CN108848629A CN108848629A CN201810596068.9A CN201810596068A CN108848629A CN 108848629 A CN108848629 A CN 108848629A CN 201810596068 A CN201810596068 A CN 201810596068A CN 108848629 A CN108848629 A CN 108848629A
- Authority
- CN
- China
- Prior art keywords
- hole
- dry film
- bottom copper
- production technology
- 3mil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
Abstract
The invention discloses a kind of hole electricity PCB production technologies, include the following steps：A. corresponding PCB board material sawing sheet selected according to the bottom copper and base material thickness of actual requirement, drill out through-hole；B. conductive film is set on the base material part in through-hole；C. the bottom copper outside through-hole edge 3mil of adjusting the distance does dry film processing, that is, sticks the first dry film；D. hole is electric, i.e., one layer of electro-coppering is electroplated on the bottom copper on the inside of the first dry film and on the inside of through-hole；E. it decorporates the first dry film and nog plate, is ground to bottom copper stock removal less than or equal to 2um；F. two dry films processing, away from through-hole edge 3mil with inner part and other do not need moment part and stick the second dry film；G. by etching solution to through step f, treated that PCB board material is etched, and the second dry film of decorporating after etching.Through the invention, the copper layer thickness on pcb board route can be done thinner, only to do finer route, reduced the rejection rate of precise circuit, improved yields.
Description
Technical field
The present invention relates to pcb board production technical fields, more particularly to a kind of hole electricity PCB production technology.
Background technique
The route production of traditional PCB is divided into positive method and negative film method, this secondary aperture electricity is suitable for negative film method.The route of negative film method
Production process is：Sawing sheet → drilling → heavy copper → plate electricity → dry film → circuit etching → moves back film, the plate that this method is worked it out
Due to needing to be electroplated on the copper of bottom to have the function that through-hole is connected to, so the copper layer thickness on route can not do thin, lead to
Often need to accomplish 30um or more, thick layers of copper can not accomplish that fine route, line width/line gap accomplish 2mil/2mil substantially
It is exactly the limit, doing more accurate route rejection rate will surge, and yields is very low.Therefore, it is necessary to change to the prior art
Into and optimization.
Summary of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of hole electricity PCB production technologies, to reduce waste product
Rate.
The technical solution adopted by the present invention to solve the technical problems is：
A kind of hole electricity PCB production technology, includes the following steps：
A. corresponding PCB board material sawing sheet selected according to the bottom copper and base material thickness of actual requirement, drill out through-hole；
B. conductive film is set on the base material part in through-hole；
C. the bottom copper outside through-hole edge 3mil of adjusting the distance does dry film processing, that is, sticks the first dry film；
D. hole is electric, i.e., one layer of electro-coppering is electroplated on the bottom copper on the inside of the first dry film and on the inside of through-hole；
E. it decorporates the first dry film and nog plate, is ground to bottom copper stock removal less than or equal to 2um；
F. two dry films processing, away from through-hole edge 3mil with inner part and other do not need moment part and stick the
Two dry films；
G. by etching solution to treated that PCB board material is etched through step f, and second is decorporated after etching
Dry film.
Further, the thickness of electro-coppering is greater than or equal to 18um in step d.
Further, nog plate uses the abrasive band 800# water mill in step e, and plate face ailhead is removed before nog plate, adjusts nog plate thickness
Degree, and first plate is checked.
Further, in step f away from through-hole edge 3mil with inner part and other do not need the second of moment part
The distance between dry film is arranged according to the thickness of bottom copper.
Further, the etching solution in step g is acid solution.
It is of the invention effective to be：Through the invention, the copper layer thickness on pcb board route can be done thinner, with production
Finer route reduces the rejection rate of precise circuit, improves yields.
Detailed description of the invention
Fig. 1 is process flow chart of the invention；
Fig. 2 is the position view of conductive film in the present invention；
Fig. 3 is the position view of the first dry film and electro-coppering in the present invention；
Fig. 4 is the PCB board material structural schematic diagram in the present invention after nog plate；
Fig. 5 is the position view of the second dry film in the present invention；
Fig. 6 is that etching is completed and sloughs the PCB board material structural schematic diagram after the second dry film in the present invention.
Specific embodiment
Present invention will be further explained below with reference to the attached drawings and examples.
Referring to figs. 1 to Fig. 6, a kind of hole electricity PCB production technology of the invention includes the following steps：A. according to actual requirement
Bottom copper and base material thickness select corresponding PCB board material sawing sheet, drill out through-hole 1；B. it is arranged on the base material part in through-hole 1 and leads
Electrolemma 2 does not have to electroless copper plating to guarantee there is conductive layer in through-hole 1, prevent conductive film 2 it is subsequent make the dry film when oxidation, de-
Falling leads to having no copper in the holes；C. the bottom copper outside 1 edge 3mil of through-hole of adjusting the distance does dry film processing, that is, sticks the first dry film 3；D. hole
One layer of electro-coppering 4 is electroplated that is, on the bottom copper of 3 inside of the first dry film and on the inside of through-hole 1 in electricity, and the thickness of electro-coppering 4 is greater than or waits
In 18um；E. it decorporates the first dry film 3 and nog plate, is ground to bottom copper stock removal less than or equal to 2um；Nog plate uses the abrasive band 800# water
It grinds, plate face ailhead is removed before nog plate, adjusts nog plate thickness, and first plate is checked, it is accurate to ensure to adjust；F. two times it is dry
Film processing, away from 1 edge 3mil of through-hole with inner part and other do not need moment part and stick the second dry film 5；Two parts
The distance between the second dry film 5, i.e. line width is arranged according to the thickness of bottom copper, since the bottom copper for needing to etch is very thin, the bottom 18um
The line width of the PCB board material of copper may be provided at 1mil, and the distance between adjacent lines are that line gap is also disposed at 1mil；The line of the bottom 12um copper
Wide and line gap may be provided at 0.5mil and 0.5mil.G. by etching solution to through step f, treated that PCB board material is lost
It carves, and the second dry film 5 of decorporating after etching, etching solution is acid solution.
Through the above steps, what the copper layer thickness on route can be done is thinner, to make finer route, reduces
The rejection rate of precise circuit improves yields.
The above only better embodiment of the invention, but the present invention is not limited to above-described embodiments, if its with
Any same or similar means reach technical effect of the invention, should all fall under the scope of the present invention.
Claims (5)
1. a kind of hole electricity PCB production technology, it is characterised in that：Include the following steps：
A. corresponding PCB board material sawing sheet selected according to the bottom copper and base material thickness of actual requirement, drill out through-hole (1)；
B. conductive film (2) are set on the base material part in through-hole (1)；
C. the bottom copper outside through-hole (1) edge 3mil of adjusting the distance does dry film processing, that is, sticks the first dry film (3)；
D. one layer of electro-coppering (4) is electroplated in hole electricity that is, on the bottom copper on the inside of the first dry film (3) and on the inside of through-hole (1)；
E. it decorporates the first dry film (3) and nog plate, is ground to bottom copper stock removal less than or equal to 2um；
F. two dry films processing, away from through-hole (1) edge 3mil with inner part and other do not need moment part and stick the
Two dry films (5)；
G. by etching solution to through step f, treated that PCB board material is etched, and the second dry film of decorporating after etching
(5)。
2. a kind of hole electricity PCB production technology according to claim 1, it is characterised in that：The thickness of electro-coppering (4) in step d
Degree is greater than or equal to 18um.
3. a kind of hole electricity PCB production technology according to claim 1, it is characterised in that：Nog plate uses 800# sand in step e
Plate face ailhead is removed with water mill, before nog plate, adjusts nog plate thickness, and first plate is checked.
4. a kind of hole electricity PCB production technology according to claim 1, it is characterised in that：Away from through-hole (1) side in step f
Edge 3mil is set with inner part and other the distance between second dry films (5) for not needing moment part according to the thickness of bottom copper
It sets.
5. a kind of hole electricity PCB production technology according to claim 1, it is characterised in that：Etching solution in step g is acid
Property solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810596068.9A CN108848629A (en) | 2018-06-11 | 2018-06-11 | A kind of hole electricity PCB production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810596068.9A CN108848629A (en) | 2018-06-11 | 2018-06-11 | A kind of hole electricity PCB production technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108848629A true CN108848629A (en) | 2018-11-20 |
Family
ID=64211555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810596068.9A Pending CN108848629A (en) | 2018-06-11 | 2018-06-11 | A kind of hole electricity PCB production technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108848629A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1109924A (en) * | 1994-03-28 | 1995-10-11 | 美克株式会社 | Plating surface of unconductor |
| CN101029409A (en) * | 2006-11-24 | 2007-09-05 | 江苏工业学院 | Pretreatment and pretreatment solution for direct porous metallizing printing IC board |
| CN102883558A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Manufacturing method of single plating hole copper |
| CN103491710A (en) * | 2013-09-09 | 2014-01-01 | 莆田市龙腾电子科技有限公司 | Process for processing two-sided and multilayer circuit board |
| CN104018196A (en) * | 2013-02-28 | 2014-09-03 | 武汉孟鼎电化学技术有限公司 | Direct plating method for printed circuit board free of chemical plating |
| CN104105354A (en) * | 2013-04-15 | 2014-10-15 | 上海嘉捷通电路科技有限公司 | Method of manufacturing high-aperture ratio fine printed circuit board |
| CN107231752A (en) * | 2017-06-20 | 2017-10-03 | 广州美维电子有限公司 | It is a kind of to reduce the pcb board boring method for electroplating copper thickness below |
| CN107278056A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of technique for printed circuit board Organic Conductive Films hole metallization |
-
2018
- 2018-06-11 CN CN201810596068.9A patent/CN108848629A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1109924A (en) * | 1994-03-28 | 1995-10-11 | 美克株式会社 | Plating surface of unconductor |
| CN101029409A (en) * | 2006-11-24 | 2007-09-05 | 江苏工业学院 | Pretreatment and pretreatment solution for direct porous metallizing printing IC board |
| CN102883558A (en) * | 2012-10-17 | 2013-01-16 | 无锡江南计算技术研究所 | Manufacturing method of single plating hole copper |
| CN104018196A (en) * | 2013-02-28 | 2014-09-03 | 武汉孟鼎电化学技术有限公司 | Direct plating method for printed circuit board free of chemical plating |
| CN104105354A (en) * | 2013-04-15 | 2014-10-15 | 上海嘉捷通电路科技有限公司 | Method of manufacturing high-aperture ratio fine printed circuit board |
| CN103491710A (en) * | 2013-09-09 | 2014-01-01 | 莆田市龙腾电子科技有限公司 | Process for processing two-sided and multilayer circuit board |
| CN107278056A (en) * | 2016-04-08 | 2017-10-20 | 东莞市斯坦得电子材料有限公司 | A kind of technique for printed circuit board Organic Conductive Films hole metallization |
| CN107231752A (en) * | 2017-06-20 | 2017-10-03 | 广州美维电子有限公司 | It is a kind of to reduce the pcb board boring method for electroplating copper thickness below |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181120 |