CN108831848A - A kind of semiconductor crystal wafer cleaning and drying device - Google Patents
A kind of semiconductor crystal wafer cleaning and drying device Download PDFInfo
- Publication number
- CN108831848A CN108831848A CN201810658927.2A CN201810658927A CN108831848A CN 108831848 A CN108831848 A CN 108831848A CN 201810658927 A CN201810658927 A CN 201810658927A CN 108831848 A CN108831848 A CN 108831848A
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- China
- Prior art keywords
- sink
- cover slot
- fixed
- semiconductor crystal
- crystal wafer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention provides a kind of semiconductor crystal wafer cleaning and drying device,More particularly to semiconductor crystal wafer cleaning technique field,Including equipment body,Sink,Cover slot,The cover slot mobile mechanism being connect with cover slot,Activity is placed on the wafer in sink and places the gaily decorated basket,Upper and lower operating mechanism,IPA bottles and control panel,Sink is fixed on equipment body,Cover slot mobile mechanism is located at the both ends of sink,The outside of sink is fixed with overflow launder,Sink is equipped with the overflow port being connected with overflow launder,Gaily decorated basket fixed frame is further fixed in sink,Resistivity probe interface is additionally provided on sink,Bottom of gullet is equipped with drain valve,Upper and lower operating mechanism includes the mechanical arm drive mechanism of the manipulator in sink and driving manipulator,Mechanical arm drive mechanism is located at the side of cover slot mobile mechanism,IPA bottles inside pipeline and cover slot by being connected,Nitrogen inlet also be connected inside cover slot.The advantages of present invention, which has to make to clean and be dehydrated, to be combined, and is not required to heat, reduction production cost.
Description
Technical field
The invention belongs to semiconductor crystal wafer cleaning technique fields, and in particular to a kind of semiconductor crystal wafer cleaning and drying device.
Background technique
It is main at present still to use sink structure in semiconductor crystal wafer cleaning process, it is cleaned in batch, after cleaning again
It is transferred in drying equipment, dehydration and drying processing is carried out to wafer, during transfer, because various uncertain factors are to clear
Wafer after washing will cause secondary contamination, and need two equipment to complete to clean and dry link, increase equipment purchase with
Manufacturing cost.
The first semiconductor crystal wafer dehydrogenation drying equipment is centrifugal spinner currently on the market, and cardinal principle is by wafer
It is placed on high-speed rotating fixture, the centrifugal force generated by high speed rotation dries the moisture content of crystal column surface, in cooperation hot nitrogen
Gas dries crystal column surface, achieve the purpose that it is finally dry, defect mainly in process, wafer bear it is very big
Centrifugal force, be easy to cause breakage, process can make crystal column surface residual particulate matter or washmarking, reduce the yield of product；
Second of wafer dehydrogenation drying equipment mainly utilizes isopropanol (i.e. IPA) and water infinitely dissolve principle, and wafer is immersed isopropanol
In solution or steam, wafer is separated again with solution then, is dried with hot nitrogen, achievees the effect that dehydration and drying, but the processing
Mode is needed using a large amount of chemical reagent, at high cost, while during the work time, needing to heat isopropanol, fire
Security risk is big.
Therefore, being badly in need of one kind makes to clean and be dehydrated to combine, and is not required to heat, the semiconductor crystal wafer for reducing production cost is clear
Wash drying equipment.
Summary of the invention
In order to solve, the cleaning of existing semiconductor crystal wafer is dry to be easy fragment and contamination, crystal column surface there are wafer and has residual water
There is security risk etc. in trace, process, the object of the present invention is to provide a kind of semiconductor crystal wafer cleaning and drying device,
The advantages of with making cleaning and dehydration combine, be not required to heat, reduce production cost.
The present invention provides the following technical solutions：
A kind of semiconductor crystal wafer cleaning and drying device, including equipment body, sink, cover slot, the lid being connect with the cover slot
Slot mobile mechanism, activity are placed on the wafer in the sink and place the gaily decorated basket, upper and lower operating mechanism, IPA bottles and control panel, institute
It states sink to be fixed on the equipment body, the cover slot mobile mechanism is located at the both ends of the sink, the outside of the sink
It is fixed with overflow launder, the sink is equipped with the overflow port being connected with the overflow launder, is further fixed on the gaily decorated basket in the sink
Fixed frame, is additionally provided on the sink and the consistent resistivity probe interface of the overflow open height, the bottom of gullet connection
Have a water inlet pipe, the bottom of gullet is equipped with drain valve, the operating mechanism up and down include manipulator in the sink and
The mechanical arm drive mechanism of the manipulator is driven, the mechanical arm drive mechanism is located at the side of the cover slot mobile mechanism,
Described IPA bottles by being connected inside pipeline and the cover slot, nitrogen inlet is also connected with inside the cover slot, the control
Panel is fixed on the equipment body, and the mechanical arm drive mechanism is controlled by PLC, and PLC control passes through the control plane
Plate is operated.
Wafer can be placed on the wafer first and placed in the gaily decorated basket by wafer in cleaning, then the wafer is placed
The gaily decorated basket is placed in the sink, and the cover slot is covered above the sink, passed through under the action of the cover slot mobile mechanism
The water inlet pipe makes the sink intake, and enters in the overflow launder after the water of the sink is full from the overflow port, described
Resistivity probe interface is equipped with the resistivity for the water that the resistivity probe test being connected with resistivity tester overflows, and leads to
It crosses resistivity to judge whether to reach cleaning effect, after reaching cleaning effect, link is dehydrated by wafer, first into the cover slot
The mixed gas of nitrogen and IPA vapor is sprayed, cover slot whole space is full of, forms one layer of IPA film, the machine in the water surface
Wafer uniform is hauled out the water surface for being covered with IPA film by tool hand, under molecular tension effect, by hydrone and IPA molecular surface
The different principle of tension, IPA molecule is by hydrone from the surface " removing " of wafer, to achieve the purpose that dehydration, wafer is complete
It is detached from the water surface to enter in the cover slot, the overflow of the sink stops, and the drain valve is opened, and drains with certain speed, simultaneously
Nitrogen continues to spray with IPA mixed gas, and the water surface is kept to cover IPA film, places the gaily decorated basket to the wafer by draining and carries out
Dehydration, after the wafer places the gaily decorated basket disengaging water surface, the sink rapid deflation, the cover slot stops spray IPA vapor,
Nitrogen continues to spray, and into dry link, after confirmation wafer and wafer placement gaily decorated basket drying thoroughly, the manipulator again will
The wafer lifted slowly moves into the wafer and places in the gaily decorated basket, and the cover slot is removed by cover slot mobile mechanism, and dehydration is dry
Dry link is completed.
Preferably, the floor height of the cover slot is consistent with the overhead height of the sink, moves on in the cover slot described
When on sink, it is ensured that the sink is sealing state, prevents nitrogen and IPA vapor from escaping.
Preferably, the isopipe root is equipped with wastewater discharge pipe.The waste water air-exhausting duct can will be in the overflow launder
Waste water discharge.
Preferably, diffuser plate is fixed in the cover slot, the diffuser plate is equipped with several equally distributed disperse mouths,
The side wall of the cover slot is equipped with several first through hole above the disperse mouth, and the outside IPA bottles of is equipped with placing box,
The placing box is equipped with several second through-holes, the described IPA bottles pipe by passing through the first through hole and second through-hole
Road is connected with the cover slot, and the nitrogen inlet also passes through the first through hole and second through-hole is connected with the cover slot
It is logical.
Preferably, the nitrogen inlet is equipped with electrically operated valve, is additionally provided with the time relay on the equipment body, described
The time relay and the electrically operated valve are controlled by PLC.The setting of the electrically operated valve and the time relay can lead to
It crosses the control panel to be configured the drying time after the drained water of the sink, reduces the waste to nitrogen, save the cost.
Preferably, the cover slot mobile mechanism include two pillars being fixed on the equipment body, both ends with it is described
The screw rod of pillar rotation connection covers the sliding block on the screw rod and drives the driving device of the screw rod, the driving device
It is fixed on the equipment body.
Preferably, the equipment body bottom is further fixed on idler wheel.The setting of the idler wheel equipment master easy to remove
Body.
Preferably, the overflow launder is fixedly arranged above cover board.
The beneficial effects of the invention are as follows：
1, cleaning and dehydration are combined together by the present invention, can operation simultaneously, avoid what wafer in process stain from asking
Topic.
2, for the present invention using micro IPA as dehydration mediators, entire technical process reduces fire peace without heat treatment
Full hidden danger reduces production cost.
3, the present invention can be de- dry by the moisture in the wafer pattern grooves with figure.
4, the present invention can be cleaned and dried ultra-thin wafer, prevent damage wafer.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings：
Fig. 1 is structural schematic diagram of the embodiment of the present invention；
Fig. 2 is structural front view of the embodiment of the present invention；
Fig. 3 is schematic diagram of internal structure of the embodiment of the present invention；
Fig. 4 is internal structure main view of the embodiment of the present invention；
Fig. 5 is internal structure right view of the embodiment of the present invention；
Fig. 6 is internal structure top view of the embodiment of the present invention；
In figure label for：1, equipment body；11, idler wheel；2, sink；21, overflow launder；211, wastewater discharge pipe；22, it covers
Plate；23, overflow port；24, gaily decorated basket fixed frame；25, resistivity probe interface；26, drain valve；3, cover slot；31, first through hole；4,
Cover slot mobile mechanism；41, pillar；42, screw rod；43, sliding block；44, driving device；5, wafer places the gaily decorated basket；6, machine is run up and down
Structure；61, manipulator；62, mechanical arm drive mechanism；7, IPA bottles；71, placing box；711, the second through-hole；8, control panel；9, brilliant
Circle.
Specific embodiment
A specific embodiment of the invention is described with reference to the accompanying drawing.
As shown in figures 1 to 6, a kind of semiconductor crystal wafer cleaning and drying device, including equipment body 1, sink 2, cover slot 3 and lid
The cover slot mobile mechanism 4 of the connection of slot 3, activity are placed on the wafer in sink 2 and place the gaily decorated basket 5, upper and lower operating mechanism 6, IPA bottle 7
With control panel 8, sink 2 is fixed on equipment body 1, and the floor height of cover slot 3 is consistent with the overhead height of sink 2, cover slot
Mobile mechanism 4 is located at the both ends of sink 2, and the outside of sink 2 is fixed with overflow launder 21, and overflow launder 21 is fixedly arranged above cover board 22,
21 bottom of overflow launder is equipped with wastewater discharge pipe 211, and sink 2 is equipped with the overflow port 23 being connected with overflow launder 21, goes back in sink 2
It is fixed with gaily decorated basket fixed frame 24, is additionally provided on sink 2 and is visited with the 23 consistent resistivity probe interface 25 of height of overflow port, resistivity
Head interface 25 is equipped with the resistivity probe being connected with resistivity tester, resistivity tester and resistivity probe in figure not
It draws, 2 bottom of sink is connected with water inlet pipe, and water inlet pipe is not drawn into figure, and 2 bottom of sink is equipped with drain valve 26, runs up and down
Mechanism 6 includes the mechanical arm drive mechanism 62 of the manipulator 61 and driving manipulator 61 in sink 2, mechanical arm drive mechanism
62 are located at the side of cover slot mobile mechanism 4, and IPA bottle 7 inside pipeline and cover slot 3 by being connected, and nitrogen inlet is also and in cover slot 3
Portion is connected, and nitrogen is not drawn into nitrogen inlet figure by externally supplying, and control panel 8 is fixed on equipment body 1, manipulator
Driving mechanism 62 is controlled by PLC, and PLC control is operated by control panel 8, and 1 bottom of equipment body is further fixed on idler wheel
11.Manipulator 61 is U-shaped structure, and manipulator 61 is connected with mechanical arm drive mechanism 62, and mechanical arm drive mechanism 62 belongs to existing
There is technology, sees that patent list drives double slide unit transmission mechanism (application numbers：201721163891.8), it is no longer superfluous to its structure at this
It states.
Specifically, being fixed with diffuser plate in cover slot 3, diffuser plate is equipped with several equally distributed disperse mouths, diffuser plate
In cover slot 3, diffuser plate and disperse mouth are all not shown in figure, and the side wall of cover slot 3 is equipped with several be located above disperse mouth
First through hole 31, the outside of IPA bottle 7 is equipped with placing box 71, and placing box 71 is equipped with several second through-holes 711, and IPA bottle 7 passes through
Pipeline across first through hole 31 and the second through-hole 711 is connected with cover slot 3, and nitrogen inlet also passes through first through hole 31 and second
Through-hole 711 is connected with cover slot 3, and nitrogen inlet is equipped with electrically operated valve, is additionally provided with the time relay, time on equipment body 1
Relay and electrically operated valve are controlled by PLC.
Specifically, cover slot mobile mechanism 4 includes two pillars 41 being fixed on equipment body 1, both ends and 41 turns of pillar
The screw rod 42 of dynamic connection covers the sliding block 43 on screw rod 42 and drives the driving device 44 of screw rod 41, and driving device 44 is fixed on
On equipment body 1, motor is may be selected in driving device 44.
Working method of the present invention：Wafer 9 can be placed on wafer first and placed in the gaily decorated basket 5 by wafer 9 in cleaning, then
The wafer placement gaily decorated basket 5 is placed in sink 2, cover slot 3 is covered above sink 2, passed through under the action of cover slot mobile mechanism 4
Water inlet pipe makes sink 2 intake, and enters in overflow launder 21 after the water of sink 2 is full from overflow port 23, resistivity probe interface 25 is pacified
Resistivity equipped with the water that the resistivity probe test being connected with resistivity tester overflows, is judged whether by resistivity
Reach cleaning effect, after reaching cleaning effect, is dehydrated link by wafer, nitrogen and IPA vapor are sprayed first into cover slot 3
Mixed gas forms one layer of IPA film in the water surface, wafer uniform hauling-out is covered with by manipulator 61 full of the whole spaces of cover slot 3
The water surface of IPA film, under molecular tension effect, by the hydrone principle different with IPA molecular surface tension, IPA molecule
By hydrone from the surface " removing " of wafer, to achieve the purpose that dehydration, wafer 9 completely disengages the water surface and enters in cover slot 3, water
The overflow of slot 2 stops, and drain valve 26 is opened, and is drained with certain speed, while nitrogen continues to spray with IPA mixed gas, keeps
The water surface covers IPA film, places the gaily decorated basket 5 to wafer by draining and is carried out dehydrating, after wafer places the disengaging water surface of the gaily decorated basket 5,
2 rapid deflation of sink, cover slot 3 stop spray IPA vapor, and nitrogen continues to spray, and into dry link, confirm wafer 9 and wafer
After placing the drying thoroughly of the gaily decorated basket 5, the wafer 9 lifted slowly is moved into wafer placement again and spent in 5 baskets by manipulator 6, cover slot 3
It is removed by cover slot mobile mechanism 4, dehydration and drying link is completed.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, although referring to aforementioned reality
Applying example, invention is explained in detail, for those skilled in the art, still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features.It is all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of semiconductor crystal wafer cleaning and drying device, which is characterized in that including equipment body, sink, cover slot and the cover slot
The cover slot mobile mechanism of connection, activity are placed on the wafer in the sink and place the gaily decorated basket, upper and lower operating mechanism, IPA bottles and control
Panel processed, the sink are fixed on the equipment body, and the cover slot mobile mechanism is located at the both ends of the sink, the water
The outside of slot is fixed with overflow launder, and the sink is equipped with the overflow port being connected with the overflow launder, also solid in the sink
Surely there is gaily decorated basket fixed frame, be additionally provided on the sink and the consistent resistivity probe interface of the overflow open height, the sink
Bottom is connected with water inlet pipe, and the bottom of gullet is equipped with drain valve, and the operating mechanism up and down includes being located in the sink
Manipulator and the mechanical arm drive mechanism for driving the manipulator, the mechanical arm drive mechanism are located at the cover slot mobile mechanism
Side, described IPA bottles by being connected inside pipeline and the cover slot, nitrogen inlet is also connected with inside the cover slot,
The control panel is fixed on the equipment body, and the mechanical arm drive mechanism is controlled by PLC, and PLC control passes through institute
Control panel is stated to be operated.
2. a kind of semiconductor crystal wafer cleaning and drying device according to claim 1, which is characterized in that the bottom surface of the cover slot
Height is consistent with the overhead height of the sink.
3. a kind of semiconductor crystal wafer cleaning and drying device according to claim 1, which is characterized in that the isopipe root
Equipped with wastewater discharge pipe.
4. a kind of semiconductor crystal wafer cleaning and drying device according to claim 1, which is characterized in that fixed in the cover slot
There is diffuser plate, the diffuser plate is equipped with several equally distributed disperse mouths, and the side wall of the cover slot is equipped with several be located at
First through hole above the disperse mouth, described IPA bottles external equipped with placing box, and it is logical that the placing box is equipped with several second
Hole, described IPA bottles is connected by passing through the pipeline of the first through hole and second through-hole with the cover slot, the nitrogen
Inlet pipe also passes through the first through hole and second through-hole is connected with the cover slot.
5. a kind of semiconductor crystal wafer cleaning and drying device according to claim 1, which is characterized in that on the nitrogen inlet
Equipped with electrically operated valve, the time relay is additionally provided on the equipment body, the time relay passes through with the electrically operated valve
PLC control.
6. a kind of semiconductor crystal wafer cleaning and drying device according to claim 1, which is characterized in that the cover slot moving machine
Structure includes two pillars being fixed on the equipment body, the screw rod at both ends and pillar rotation connection, covers in the silk
The driving device of sliding block and the driving screw rod on bar, the driving device are fixed on the equipment body.
7. a kind of semiconductor crystal wafer cleaning and drying device according to claim 1, which is characterized in that the equipment body bottom
Portion is further fixed on idler wheel.
8. a kind of semiconductor crystal wafer cleaning and drying device according to claim 1, which is characterized in that above the overflow launder
It is fixed with cover board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658927.2A CN108831848A (en) | 2018-06-25 | 2018-06-25 | A kind of semiconductor crystal wafer cleaning and drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658927.2A CN108831848A (en) | 2018-06-25 | 2018-06-25 | A kind of semiconductor crystal wafer cleaning and drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108831848A true CN108831848A (en) | 2018-11-16 |
Family
ID=64138432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810658927.2A Pending CN108831848A (en) | 2018-06-25 | 2018-06-25 | A kind of semiconductor crystal wafer cleaning and drying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108831848A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111081603A (en) * | 2019-11-25 | 2020-04-28 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment and wafer cleaning method |
| CN113053791A (en) * | 2021-04-23 | 2021-06-29 | 上海匠实半导体科技中心 | Nitrogen gas cleaning device |
| CN115031509A (en) * | 2022-05-18 | 2022-09-09 | 扬州思普尔科技有限公司 | Lifting type semiconductor wafer drying device |
| CN117153741A (en) * | 2023-11-01 | 2023-12-01 | 苏州智程半导体科技股份有限公司 | Integrated wafer cleaning and drying equipment |
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| CN103111436A (en) * | 2013-03-25 | 2013-05-22 | 上海旭熠电子技术有限公司 | Atomized isopropyl alcohol substrate drying equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111081603A (en) * | 2019-11-25 | 2020-04-28 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment and wafer cleaning method |
| CN111081603B (en) * | 2019-11-25 | 2024-02-27 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment and wafer cleaning method |
| CN113053791A (en) * | 2021-04-23 | 2021-06-29 | 上海匠实半导体科技中心 | Nitrogen gas cleaning device |
| CN115031509A (en) * | 2022-05-18 | 2022-09-09 | 扬州思普尔科技有限公司 | Lifting type semiconductor wafer drying device |
| CN115031509B (en) * | 2022-05-18 | 2023-06-30 | 扬州思普尔科技有限公司 | Lifting type semiconductor wafer drying device |
| CN117153741A (en) * | 2023-11-01 | 2023-12-01 | 苏州智程半导体科技股份有限公司 | Integrated wafer cleaning and drying equipment |
| CN117153741B (en) * | 2023-11-01 | 2024-01-30 | 苏州智程半导体科技股份有限公司 | Integrated wafer cleaning and drying equipment |
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Application publication date: 20181116 |