CN108828326B - Three-dimensional microwave assembly testing arrangement - Google Patents
Three-dimensional microwave assembly testing arrangement Download PDFInfo
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- CN108828326B CN108828326B CN201810366871.3A CN201810366871A CN108828326B CN 108828326 B CN108828326 B CN 108828326B CN 201810366871 A CN201810366871 A CN 201810366871A CN 108828326 B CN108828326 B CN 108828326B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0864—Measuring electromagnetic field characteristics characterised by constructional or functional features
- G01R29/0878—Sensors; antennas; probes; detectors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a three-dimensional microwave component testing device, which comprises a radio frequency connector and a low-frequency connector; the radio frequency connector and the low frequency connector are fixedly arranged on the metal frame; the microwave box body is used for realizing the relative fixation between the metal frame and the microwave circuit; the radio frequency connector comprises a metal shell and a first metal pin; the first metal needle is divided into an A1 section metal needle and a B1 section metal needle, and the two sections are connected through a first conductive elastic piece. Compared with the prior art, according to the requirements of three-dimensional microwave component integrated architecture characteristics and electrical performance, high and low frequency signals are vertically interconnected from the bottom to the top of the box body, radio frequency signals can be accurately tested, meanwhile, a tested circuit can be adjusted in the testing process, the testing efficiency and the accuracy are obviously improved, and the problems of three-dimensional microwave component testing efficiency and testing complexity are solved.
Description
Technical Field
The invention relates to a three-dimensional microwave assembly testing device, and relates to the field of microwave testing.
Background
Radio frequency and low-frequency signals of the traditional two-dimensional microwave assembly are input/output from the side wall of the cavity, and testing can be performed by adopting various connectors such as SMA, SMP, micro-rectangle and the like. However, the three-dimensional microwave assembly adopts a three-dimensional structure, has a small longitudinal dimension, is higher in integration level and packaging efficiency than a two-dimensional structure, and is small in size, signals are input/output from the vertical surface of the cavity, and various connectors such as a traditional SMA (surface-mounted memory), an SMP (symmetric multi-processing) and a micro-rectangle cannot be directly tested, so that a new test fixture and a new method are needed to complete the electrical performance test of the tile microwave assembly.
Wangshuai's master thesis "three-dimensional SoC test structure design and optimization method research" mainly expounds the test method of the three-dimensional chip, and does not mention the test of the three-dimensional microwave component. The research on the key technology of testing the three-dimensional integrated circuit mainly researches silicon-based three-dimensional integrated circuit (TSV) in Phihou, Philippine doctor thesis, mainly tests low-frequency signals of chips, and the test method and the test fixture thereof are obviously different from the patent. In the article "three-dimensional stacking SoC test planning research", zhuyikun et al, a three-dimensional stacking SoC test planning method using gwo (grey wolf optimization) is proposed, so that the purpose of minimizing the three-dimensional stacking SoC test time is achieved under the constraint conditions of the maximum test pin number and the maximum available tsv (through silicon vias) number. The algorithm is based on group intelligence, and updates Alpha, Beta and Delta for optimization by implementing operations such as attack and the like, so that three-dimensional stack SoC test is realized. They use a test algorithm to test a single chip.
Disclosure of Invention
The invention aims to provide an efficient three-dimensional microwave component testing device which has the characteristics of facilitating contact type stable testing of high-frequency and low-frequency signals of microwave component density, improving testing efficiency and accuracy and the like.
A three-dimensional microwave component testing device comprises a radio frequency connector and a low frequency connector; the radio frequency connector and the low frequency connector are fixedly arranged on the metal frame, so that array test can be realized; the microwave box body is used for realizing the relative fixation between the metal frame and the microwave circuit; the radio frequency connector comprises a metal shell and a first metal pin; the first metal needle is divided into an A1 section metal needle and a B1 section metal needle, and the two sections are connected through a first conductive elastic piece; the metal shell is internally provided with a sealing material, so that the metal shell is hermetically divided into a first part and a second part; the A1 section metal needle penetrates through the sealing material, one part is positioned in the first part, and the other part is positioned in the second part; and the A1 section metal needle in the first part is not contacted with the metal shell; the section B1 metal needle is not in contact with the metal shell and has a part extending out of the metal shell.
The first insulating support material is fixedly arranged in the second part of the metal shell and wraps the other part of the A1 section metal needle, the first conductive elastic piece and the part of the B1 section metal needle in the metal shell, so that the other part of the A1 section metal needle, the first conductive elastic piece and the B1 section metal needle are supported on one hand, and the other part of the A1 section metal needle, the first conductive elastic piece and the B1 section metal are ensured not to be in contact with the metal shell on the other hand.
The low-frequency connector comprises a second metal needle which is divided into an A2 section metal needle and a B2 section metal needle, and the two sections are connected through a second conductive elastic piece; the insulating support material wraps the second conductive elastic piece, a part of the A2 section metal needle connected with the second conductive elastic piece and a part of the B2 section metal needle connected with the second conductive elastic piece, and plays a supporting role for the A2 section metal needle, the second conductive elastic piece and the B2 section metal needle.
The low-frequency connector comprises more than two second metal needles.
When the low-frequency connector comprises more than two second metal needles, the parts of the more than two A2 section metal needles extending out of the second insulating support material are staggered in length.
The first insulating and supporting material and/or the second insulating and supporting material are/is polytetrafluoroethylene.
The first insulating and supporting material is fixedly arranged with the second part of the metal shell in an interference fit manner.
The sealing material is sealing glass.
The sealing glass is sintered in the metal shell in a high-temperature sintering mode.
The first conductive elastic member and/or the second conductive elastic member are/is a spring.
Compared with the prior art, the invention has the beneficial effects that: according to the three-dimensional microwave assembly integrated architecture characteristic and the electrical performance requirement, high and low frequency signals are vertically interconnected from the bottom to the top of the box body, radio frequency signals can be accurately tested, meanwhile, a tested circuit can be adjusted in the testing process, the testing efficiency and the testing accuracy are remarkably improved, and the problems of the three-dimensional microwave assembly testing efficiency and the testing complexity are solved.
Drawings
Fig. 1 is a schematic top view of a three-dimensional tile microwave assembly testing apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional front view of a three-dimensional tile microwave testing apparatus according to an embodiment of the present invention.
Fig. 3 is a schematic cross-sectional view of an rf connector according to an embodiment of the invention.
Fig. 4 is a schematic cross-sectional view of a low-frequency connector according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Any feature disclosed in this specification (including any accompanying drawings) may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
As shown in fig. 1 and 2, a three-dimensional microwave component testing device comprises a radio frequency connector 1 and a low frequency connector 2; the radio frequency connector 1 and the low frequency connector 2 are fixedly arranged on the metal frame 3, so that array test can be realized; the microwave testing device also comprises a microwave box body 4 which is used for realizing the relative fixation between the metal frame 3 and the microwave circuit and is convenient for realizing the microwave testing of the three-dimensional microwave assembly; as shown in fig. 1, the radio frequency connector 1 comprises a metal housing 15 and a first metal pin; the first metal needle is divided into an A1 section metal needle 11 and a B1 section metal needle two sections 13 which are connected through a first conductive elastic piece 12, so that the B1 section metal needle 13 is convenient for stably realizing elastic contact test with the radio frequency circuit pad 6 under the fixed compression state of the first conductive elastic piece 12; a sealing material 16 is arranged inside the metal shell 15 to hermetically separate the metal shell 15 into a first part and a second part; the A1 section metal needle 11 penetrates through the sealing material 16, one part is positioned in the first part, and the other part is positioned in the second part; and the A1 section metal needle 11 in the first part is not contacted with the metal shell 15; the section B1 metal needle 13 is not in contact with the metal shell 15 and has a part extending out of the metal shell 15.
For the radio frequency connector 1, a sealing material 16 is arranged inside the metal shell 15 to avoid the airtight communication between the two parts inside the metal shell 15; the first conductive elastic piece 12 is arranged between the metal needle 11 at the section A1 and the metal needle at the section B1, so that the metal needle 13 at the section B1 is stably and elastically contacted with the radio frequency circuit pad 6 in a compression state of the first conductive elastic piece 12, the defect that the stable contact can be realized only by welding in the prior art is overcome, and the problems of complex test and inaccurate test of the radio frequency connector in the three-dimensional microwave component test are solved. The radio frequency connector 1 and the low frequency connector 2 are fixedly arranged on the metal frame 3, the metal frame 3 is fixedly arranged on the microwave box body 4, so that the part of the metal needle at the section B1, which extends out of the metal shell 15, is stably and elastically contacted with the radio frequency circuit pad 6 in the microwave box body 4; in addition, low frequency and radio frequency signals can be tested simultaneously. During testing, the metal shell 15 is connected with a testing instrument; the radio frequency connector 1 is used for testing a radio frequency part of the three-dimensional microwave assembly, and the low-frequency connector is used for testing a low-frequency part of the three-dimensional microwave assembly. The radio frequency connector 1 is connected with a radio frequency cable and a vector network analyzer or a signal source to realize high-frequency signal testing; the low-frequency connector 2 is connected with a power supply, so that the test of a low-frequency signal and a power supply signal of the three-dimensional microwave component is realized on one hand, and the power supply of the three-dimensional microwave component is realized on the other hand.
In the scheme of the invention, according to the integrated architecture characteristic and the electrical performance requirement of the three-dimensional microwave assembly, the high-frequency signals are vertically interconnected from the bottom to the top of the box body, so that the radio-frequency signals can be accurately tested, meanwhile, the tested circuit can be adjusted in the testing process, the testing efficiency and the testing accuracy are obviously improved, and the problems of the testing efficiency and the testing complexity of the three-dimensional microwave assembly are solved.
In one embodiment of the present invention, at least two high frequency connectors and/or at least two high frequency connectors are fixedly disposed on the metal frame 3.
As a further improvement and embodiment of the solution of the present invention, as shown in fig. 3, the present invention further includes a first insulating support material 14 fixedly disposed in the second portion of the metal housing 15, and wrapped around another portion of the a1 segment metal pin 11, the first conductive elastic element 12, and a portion of the B1 segment metal pin 13 located in the metal housing, on one hand, supporting another portion of the a1 segment metal pin 11, the first conductive elastic element 12, and the B1 segment metal pin 13, and on the other hand, ensuring that another portion of the a1 segment metal pin 11, the first conductive elastic element 12, and the B1 segment metal 13 do not contact with the metal housing 15.
As an embodiment of the technical solution of the present invention, as shown in fig. 4, the low frequency connector 2 includes a second metal pin, the second metal pin is divided into two sections, i.e., a metal pin 21 at a section a2 and a metal pin 23 at a section B2, and the two sections are connected through a second conductive elastic piece 22, so that the metal pin 23 at the section B2 is convenient for stably achieving an elastic contact test with a microwave low frequency circuit pad when the second conductive elastic piece 22 is in a fixed compression state; the second insulating support material 24 is wrapped on the second conductive elastic piece 22, a part of the A2 section metal needle 21 connected with the second conductive elastic piece and a part of the B2 section metal needle 23 connected with the second conductive elastic piece, and plays a supporting role for the A2 section metal needle 21, the second conductive elastic piece 22 and the B2 section metal needle 23. As shown in fig. 2, the metal frame 3 is fixedly arranged on the microwave box body 4, so that the part of the B2 section metal needle which is not wrapped by the second insulating and supporting material 24 is stably and elastically contacted with the microwave low-frequency circuit pad in the microwave box body 4. During testing, the part of the B1 section metal needle which is not wrapped by the second insulating support material 24 is connected with a testing instrument, so that the testing of the low-frequency part of the three-dimensional microwave assembly is facilitated.
By adopting the test fixture and the test method, the high-low frequency signal test between different functional layers of the three-dimensional tile type microwave component can be realized, the test method is free of welding and free disassembly, the performance of an internal circuit of the microwave component is not influenced, the test frequency can be from DC to 40GHz, and the test efficiency is improved by 80%.
In the scheme of the embodiment, according to the integrated architecture characteristics and the electrical performance requirements of the three-dimensional microwave component, the low-frequency signals are vertically interconnected from the bottom to the top of the box body, the low-frequency signals can be accurately tested, meanwhile, a tested circuit can be adjusted in the testing process, the testing efficiency and the testing accuracy are obviously improved, and the problems of the testing efficiency and the testing complexity of the three-dimensional microwave component are solved.
As an embodiment mode of the present invention, the rf connector 1 is welded on the metal frame 3.
In an embodiment of the invention, the low frequency connector includes two or more second metal pins.
In an embodiment of the present invention, when the low frequency connector 2 includes two or more second metal pins, the portions of the two or more a 2-stage metal pins 21 protruding from the second insulating and supporting material 24 are arranged in a staggered manner. The embodiment shown in fig. 2 and 4 includes two rows of second metal needles, and the portions of the a2 sections of the two rows of second metal needles, which extend out of the second insulating support material, are staggered in length so as to facilitate the connection of the connecting wires of the testing instrument during testing, and avoid knotting of the connecting wires, etc.
As an embodiment of the present invention, the low frequency connector 2 is disposed on the metal frame 3 in an interference fit manner.
As an embodiment of the present invention, as shown in fig. 2, the metal frame is fixedly disposed on the microwave box 10 by screws 5.
As an example of the technical solution of the present invention, the first insulating and supporting material 14 and/or the second insulating and supporting material 24 are teflon, or other insulating and supporting materials that can be easily obtained by those skilled in the art and have both insulating and supporting properties.
In one embodiment of the present invention, the first insulating and supporting material 14 is fixedly disposed in an interference fit with the second portion of the metal housing 15.
In one embodiment of the present invention, the sealing material 16 is sealing glass.
As an embodiment of the invention, the sealing glass is sintered in the metal shell by adopting a high-temperature sintering mode so as to ensure air tightness.
In one embodiment of the present invention, the first conductive elastic member 12 and/or the second conductive elastic member 22 is a spring.
Claims (9)
1. A three-dimensional microwave assembly testing arrangement which characterized in that: the radio frequency connector and the low frequency connector are included; the radio frequency connector and the low frequency connector are fixedly arranged on the metal frame, so that array test can be realized; the microwave box body is used for realizing the relative fixation between the metal frame and the microwave circuit; the radio frequency connector comprises a metal shell and a first metal pin; the first metal needle is divided into an A1 section metal needle and a B1 section metal needle, and the two sections are connected through a first conductive elastic piece; the metal shell is internally provided with a sealing material, so that the metal shell is hermetically divided into a first part and a second part; the A1 section metal needle penetrates through the sealing material, one part is positioned in the first part, and the other part is positioned in the second part; and the A1 section metal needle in the first part is not contacted with the metal shell; the section B1 metal needle is not contacted with the metal shell and has a part extending out of the metal shell;
the low-frequency connector comprises a second metal needle which is divided into an A2 section metal needle and a B2 section metal needle, and the two sections are connected through a second conductive elastic piece; the second insulating support material wraps the second conductive elastic piece, a part of the A2 section metal needle connected with the second conductive elastic piece and a part of the B2 section metal needle connected with the second conductive elastic piece, and plays a supporting role on the A2 section metal needle, the second conductive elastic piece and the B2 section metal needle;
the metal frame is fixedly arranged on the microwave box body, so that the part of the B1 section of metal needle extending out of the metal shell is stably and elastically contacted with a radio frequency circuit pad in the microwave box body, and the metal shell is connected with a test instrument during testing; so that the part of the B2 metal needle which is not wrapped by the second insulating and supporting material stably and elastically contacts with the microwave low-frequency circuit pad in the microwave box body, and the part of the B1 metal needle which is not wrapped by the second insulating and supporting material is connected with a test instrument during testing.
2. The three-dimensional microwave assembly testing device of claim 1, wherein: the first insulating support material is fixedly arranged in the second part of the metal shell and wraps the other part of the A1 section metal needle, the first conductive elastic piece and the part of the B1 section metal needle in the metal shell, so that the other part of the A1 section metal needle, the first conductive elastic piece and the B1 section metal needle are supported on one hand, and the other part of the A1 section metal needle, the first conductive elastic piece and the B1 section metal are ensured not to be in contact with the metal shell on the other hand.
3. The three-dimensional microwave assembly testing device of claim 1, wherein: the low-frequency connector comprises more than two second metal needles.
4. The three-dimensional microwave assembly testing device of claim 3, wherein: when the low-frequency connector comprises more than two second metal needles, the lengths of the parts of the A2 sections of the metal needles of the more than two second metal needles, which extend out of the second insulating support material, are staggered.
5. The three-dimensional microwave assembly testing device of claim 2, wherein: the first insulating and supporting material and/or the second insulating and supporting material are/is polytetrafluoroethylene.
6. The three-dimensional microwave assembly testing device of claim 2 or 5, characterized in that: the first insulating and supporting material is fixedly arranged with the second part of the metal shell in an interference fit manner.
7. The three-dimensional microwave assembly testing device of claim 1, wherein: the sealing material is sealing glass.
8. The three-dimensional microwave assembly testing device of claim 7, wherein: the sealing glass is sintered in the metal shell in a high-temperature sintering mode.
9. The three-dimensional microwave assembly testing device of claim 1, wherein: the first conductive elastic member and/or the second conductive elastic member are/is a spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810366871.3A CN108828326B (en) | 2018-04-23 | 2018-04-23 | Three-dimensional microwave assembly testing arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810366871.3A CN108828326B (en) | 2018-04-23 | 2018-04-23 | Three-dimensional microwave assembly testing arrangement |
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| Publication Number | Publication Date |
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| CN108828326A CN108828326A (en) | 2018-11-16 |
| CN108828326B true CN108828326B (en) | 2020-11-24 |
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| CN201810366871.3A Active CN108828326B (en) | 2018-04-23 | 2018-04-23 | Three-dimensional microwave assembly testing arrangement |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109922597B (en) * | 2019-03-21 | 2020-03-27 | 中国电子科技集团公司第二十九研究所 | High-reliability broadband horizontal transition structure |
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| CN101604808A (en) * | 2009-07-28 | 2009-12-16 | 中航光电科技股份有限公司 | A kind of miniature radio-frequency coaxial connector and contact thereof |
| CN101771223A (en) * | 2010-02-05 | 2010-07-07 | 陕西四菱电子有限责任公司 | On-site combined type rectangular high-low frequency mixed loading connector |
| CN104678230A (en) * | 2015-03-25 | 2015-06-03 | 中国电子科技集团公司第二十九研究所 | Three-dimensional microwave assembly testing device |
| CN204885729U (en) * | 2015-08-31 | 2015-12-16 | 中国电子科技集团公司第四十研究所 | High low frequency of rectangle loads in mixture connector component |
| CN105281085A (en) * | 2015-11-18 | 2016-01-27 | 成都雷电微力科技有限公司 | A radio frequency connector used for tile-type plane sub-arrays |
| CN107017208A (en) * | 2017-04-14 | 2017-08-04 | 中国电子科技集团公司第二十九研究所 | A kind of three-dimensional tile type microwave packaging component |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9444197B2 (en) * | 2012-03-19 | 2016-09-13 | Holland Electronics, Llc | Shielded and multishielded coaxial connectors |
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2018
- 2018-04-23 CN CN201810366871.3A patent/CN108828326B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101604808A (en) * | 2009-07-28 | 2009-12-16 | 中航光电科技股份有限公司 | A kind of miniature radio-frequency coaxial connector and contact thereof |
| CN101771223A (en) * | 2010-02-05 | 2010-07-07 | 陕西四菱电子有限责任公司 | On-site combined type rectangular high-low frequency mixed loading connector |
| CN104678230A (en) * | 2015-03-25 | 2015-06-03 | 中国电子科技集团公司第二十九研究所 | Three-dimensional microwave assembly testing device |
| CN204885729U (en) * | 2015-08-31 | 2015-12-16 | 中国电子科技集团公司第四十研究所 | High low frequency of rectangle loads in mixture connector component |
| CN105281085A (en) * | 2015-11-18 | 2016-01-27 | 成都雷电微力科技有限公司 | A radio frequency connector used for tile-type plane sub-arrays |
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