CN109922597B - High-reliability broadband horizontal transition structure - Google Patents
High-reliability broadband horizontal transition structure Download PDFInfo
- Publication number
- CN109922597B CN109922597B CN201910215226.6A CN201910215226A CN109922597B CN 109922597 B CN109922597 B CN 109922597B CN 201910215226 A CN201910215226 A CN 201910215226A CN 109922597 B CN109922597 B CN 109922597B
- Authority
- CN
- China
- Prior art keywords
- low frequency
- composite substrate
- frequency composite
- box body
- transmission line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
Abstract
The invention discloses a high-reliability broadband horizontal transition structure, which is characterized by comprising the following components: the device comprises a box body, a soft base material transmission line and a high-low frequency composite substrate; the soft base material transmission line is adhered to the upper surface of the box body and is cascaded with the transmission line on the upper surface of the high-low frequency composite substrate through a plurality of gold wires; the lower surface of the box body is cascaded with the lower surface of the high-low frequency composite substrate through a plurality of gold bands. According to the invention, the lower surface of the box body is electrically connected with the lower surface of the high-low frequency composite substrate through the gold band, so that impedance discontinuity is reduced, low-loss transmission of millimeter wave signals is realized, and the problem that the traditional horizontal transition structure cannot realize low-loss transmission of millimeter wave signals is solved; on the other hand, the soft base material transmission line is not bridged between the box body and the high-low frequency composite substrate, so that the reliability problem caused by the difference of the thermal expansion coefficients between the box body and the high-low frequency composite substrate is solved.
Description
Technical Field
The invention belongs to the field of microwave and millimeter wave circuits, and particularly relates to a high-reliability broadband horizontal transition structure.
Background
In recent years, high-low frequency composite substrate technology can realize high-performance transmission of low-frequency and high-frequency signals on the same substrate, and also has the advantages of easy assembly, good heat dissipation performance and the like, so that the technology is widely applied to microwave assemblies. For such a microwave module, the transmission line of the soft substrate on the box body and the transmission line of the surface layer of the composite substrate usually adopt two interconnection modes as shown in fig. 1.
In fig. 1(a), the soft base material transmission line on the surface of the box body and the high-low frequency composite substrate transmission line on the right side are at the same horizontal height, and the two transmission lines are interconnected through a gold wire or a gold band to realize microwave signal transmission. However, due to the fact that at least 0.1mm of air gap exists between the box body and the composite substrate, the ground plane of the microwave signal is discontinuous, impedance discontinuity is increased, the microwave signal higher than 20GHz is greatly attenuated, low-loss transmission of a higher-frequency signal cannot be achieved, and application limitation is large.
In fig. 1(b), in order to solve the problem that low-loss transmission of millimeter wave signals cannot be achieved in fig. 1(a), a soft base material transmission line shown in fig. 1(b) is usually used to bridge between the box body and the composite substrate, and the bridging manner makes the ground plane between the box body and the composite substrate continuous, so as to transmit millimeter wave signals up to 40 GHz. However, in the horizontal interconnection mode, the circuit chip is bridged between the box body and the composite substrate, and due to the difference of thermal expansion coefficients between the box body and the composite substrate, the flexible substrate transmission line is easy to crack or loosen under the impact condition of high and low temperature, so that the reliability of the product is influenced.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: aiming at the problems of poor millimeter wave transmission performance caused by discontinuous ground planes and poor reliability caused by difference of thermal expansion coefficients of the box body and the composite substrate in the prior art, a high-reliability broadband horizontal transition structure is provided.
The technical scheme adopted by the invention is as follows:
a highly reliable broadband horizontal transition structure comprising: the device comprises a box body, a soft base material transmission line and a high-low frequency composite substrate; the soft base material transmission line is adhered to the upper surface of the box body and is cascaded with the transmission line on the upper surface of the high-low frequency composite substrate through the gold wire; the lower surface of the box body is electrically connected with the lower surface of the high-low frequency composite substrate through a gold belt.
Preferably, the gold wire is connected to the soft base material transmission line and the upper surface of the high-low frequency composite substrate at a position close to the edge.
Preferably, the gold band is connected to the bottom surface of the box body and the high-low frequency composite substrate near the edge.
Preferably, the high-low frequency composite substrate comprises a ground via hole which is connected with the ground plane corresponding to the transmission line on the upper surface and the lower surface.
Preferably, the ground via hole is arranged at one end of the high-low frequency composite substrate close to the box body.
Preferably, the height of the end face of the box body close to the high-low frequency composite substrate is equal to that of the end face of the high-low frequency composite substrate, and when the box body is installed, the height of the end face of the box body close to the high-low frequency composite substrate is consistent with that of the end face of the high-low frequency composite substrate.
Preferably, the soft base material transmission line is made of RT/duroid 5880 base material.
Preferably, the characteristic impedance of the soft base material transmission line is 46 to 54 ohms.
Preferably, the high-low frequency composite substrate is formed by laminating a high-performance millimeter wave core plate and an adhesive film.
Preferably, the characteristic impedance of the top surface transmission line of the high-and-low frequency composite substrate is 46 to 54 ohms.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
according to the invention, the lower surface of the box body is electrically connected with the lower surface of the high-low frequency composite substrate through the gold band, so that impedance discontinuity is reduced, low-loss transmission of millimeter wave signals is realized, and the problem that the traditional horizontal transition structure cannot realize low-loss transmission of millimeter wave signals is solved; on the other hand, the soft base material transmission line is not bridged between the box body and the high-low frequency composite substrate, so that the reliability problem caused by the difference of the thermal expansion coefficients between the box body and the high-low frequency composite substrate is solved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic diagram of a transition structure of the prior art.
FIG. 2 is a graph comparing the performance curves of the gold bands added to the lower surface of the present invention.
Fig. 3 is a schematic cross-sectional view of a high-reliability broadband horizontal transition structure according to the present invention.
Fig. 4 is a schematic top view of a high-reliability broadband horizontal transition structure according to the present invention.
Fig. 5 is a schematic bottom view of a high-reliability broadband horizontal transition structure according to the present invention.
Fig. 6 is a schematic diagram of a specific example of the high-reliability broadband horizontal transition structure of the present invention.
Fig. 7 is a top view of another example of a highly reliable broadband horizontal transition structure of the present invention.
Reference numerals: 1-box body, 2-soft base material transmission line, 3-high and low frequency composite substrate, 4-gold wire, 5-gold belt and 6-grounding via hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a high-reliability broadband horizontal transition structure, which comprises: the device comprises a box body 1, a soft base material transmission line 2 and a high-low frequency composite substrate 3; the soft base material transmission line 2 is adhered to the upper surface of the box body 1 and is in cascade connection with the transmission line on the upper surface of the high-low frequency composite substrate 3 through a gold wire 4; the lower surface of the box body 1 is cascaded with the lower surface of the high-low frequency composite substrate 3 through a gold belt 5. According to the invention, the lower surface of the box body 1 and the lower surface of the high-low frequency composite substrate 3 are electrically connected through the gold band 5, so that impedance discontinuity is reduced, high-efficiency transmission of millimeter wave signals is realized, and the problem that low-loss transmission of millimeter wave signals cannot be realized in the figure 1(a) is solved. The corresponding performance comparison result is shown in fig. 2, the invention can effectively improve the transmission performance of the high frequency band, and the reflection coefficient S11 in the whole DC-40GHz frequency band is less than or equal to-20 dB. On the other hand, the soft base material transmission line 2 of the present invention is not bridged between the box body 1 and the high and low frequency composite substrate 3, and the problem of reliability caused by the difference of thermal expansion coefficients between the box body 1 and the high and low frequency composite substrate 3 as shown in fig. 1(b) is solved.
Preferably, the gold wires 4 are connected to the upper surfaces of the soft base material transmission lines 2 and the high and low frequency composite substrate 3 at positions close to the edges, so that the cascade length of the gold wires 4 is as short as possible.
Preferably, the gold ribbon 5 is connected to the lower surfaces of the case 1 and the high and low frequency composite substrate 3 near the edges, so that the cascade length of the gold ribbon 5 is as short as possible.
Preferably, the high-low frequency composite substrate 3 includes a ground via 6 connecting the reference ground plane and the lower surface corresponding to the transmission line on the upper surface thereof.
Preferably, the ground via 6 is disposed at an end of the high-low frequency composite substrate close to the box, so that the reference ground plane corresponding to the transmission line on the upper surface of the high-low frequency composite substrate 3 is electrically connected to the ground plane on the lower surface, thereby further reducing impedance discontinuity.
Preferably, the height of the end face of the box body 1 close to the high-low frequency composite substrate 3 is equal to that of the end face of the high-low frequency composite substrate 3, and when the box body is installed, the height of the end face of the box body 1 close to the high-low frequency composite substrate 3 is consistent with that of the end face of the high-low frequency composite substrate 3, so that the reliability of the transition structure is improved.
Preferably, the soft base material transmission line is made of RT/duroid 5880 base material.
Preferably, the characteristic impedance of the soft base material transmission line is 46 to 54 ohms.
Preferably, the high-low frequency composite substrate is formed by laminating a high-performance millimeter wave core plate and an adhesive film.
Preferably, the characteristic impedance of the top surface transmission line of the high-and-low frequency composite substrate is 46 to 54 ohms.
The features and properties of the present invention are described in further detail below with reference to examples.
The high-reliability broadband horizontal transition structure manufactured by the invention is shown in figures 3-5:
the characteristic impedance of the soft base material transmission line 2 is 50 ohms, the soft base material transmission line is made of 5880 base materials with dielectric constants of 2.2 and thicknesses of 0.127mm, and radio frequency signal interconnection is achieved through cascade connection of 5 gold wires 4 with the diameter of 25 microns and the transmission line on the upper surface of the high-low frequency composite substrate 3.
The high-low frequency composite substrate 3 is formed by laminating a high-performance millimeter wave core plate CLTE-XT and an adhesive film Fastrise27, and the characteristic impedance of the upper surface transmission line is 50 ohms; the lower surface of the box body 1 is cascaded with the lower surface of the high-low frequency composite substrate 3 through 3 gold bands 5 with the diameter of 500 mu m, so that the ground plane continuity is realized.
The lengths of the gold wires 4 and the gold bands 5 are made as short as possible, performance simulation is carried out by adopting three-dimensional electromagnetic simulation software, and the result is shown in figure 6, the embodiment has good transmission performance in the range of DC-40GHz frequency band, the reflection coefficient S11 is less than or equal to-20 dB, the insertion loss S21 is less than or equal to 1dB, the low-loss transmission requirement of microwave and millimeter wave horizontal transition can be met, and the method has the advantage of high reliability.
In practical application, in order to further ensure the electrical connection of the ground plane, the ground via 6 further includes, as shown in fig. 7, a ground via 6 disposed between the soft base material transmission line 2 and the box body 1, and a ground via 6 disposed between the upper surface transmission line of the high-low frequency composite substrate 3 and the substrate thereof.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A highly reliable broadband horizontal transition structure, comprising: the device comprises a box body, a soft base material transmission line and a high-low frequency composite substrate; the soft base material transmission line is adhered to the upper surface of the box body and is cascaded with the transmission line on the upper surface of the high-low frequency composite substrate through a plurality of gold wires; the lower surface of the box body is electrically connected with the lower surface of the high-low frequency composite substrate through a plurality of gold bands.
2. The highly reliable broadband horizontal transition structure of claim 1, wherein gold wires are connected to the upper surfaces of the soft base material transmission lines and the high and low frequency composite substrate at positions near the edges.
3. The highly reliable broadband horizontal transition structure of claim 1, wherein a gold strap is attached to the bottom surface of the case and the high and low frequency composite substrate near the edges.
4. The highly reliable broadband horizontal transition structure of claim 1, wherein the high and low frequency composite substrate comprises a ground via connecting the reference ground plane and the lower surface corresponding to the transmission line on the upper surface thereof.
5. The highly reliable broadband horizontal transition structure of claim 4, wherein the ground via is disposed at an end of the high and low frequency composite substrate near the box body.
6. The highly reliable broadband horizontal transition structure according to claim 1, wherein the end surface of the box body close to the high-low frequency composite substrate is as high as the end surface of the high-low frequency composite substrate, and when installed, the end surface of the box body close to the high-low frequency composite substrate is as high as the end surface of the high-low frequency composite substrate.
7. The highly reliable broadband horizontal transition structure of claim 1, wherein the soft substrate transmission line is made of RT/duroid 5880 substrate.
8. The highly reliable broadband horizontal transition structure according to claim 1, wherein the characteristic impedance of the soft base material transmission line is 46 to 54 ohms.
9. The highly reliable broadband horizontal transition structure of claim 1, wherein the high and low frequency composite substrate is laminated with a high performance millimeter wave core board adhesive and a bonding film.
10. The highly reliable broadband horizontal transition structure according to claim 1, wherein the characteristic impedance of the upper surface transmission line of the high and low frequency composite substrate is 46 to 54 ohms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910215226.6A CN109922597B (en) | 2019-03-21 | 2019-03-21 | High-reliability broadband horizontal transition structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910215226.6A CN109922597B (en) | 2019-03-21 | 2019-03-21 | High-reliability broadband horizontal transition structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109922597A CN109922597A (en) | 2019-06-21 |
| CN109922597B true CN109922597B (en) | 2020-03-27 |
Family
ID=66965935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910215226.6A Active CN109922597B (en) | 2019-03-21 | 2019-03-21 | High-reliability broadband horizontal transition structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109922597B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112332047B (en) * | 2020-09-30 | 2022-04-01 | 中国电子科技集团公司第十三研究所 | Microwave transmission assembly |
| CN114867197B (en) * | 2022-04-25 | 2023-06-30 | 中国电子科技集团公司第二十九研究所 | Radio frequency substrate interconnection structure and radio frequency electronic equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4893131A (en) * | 1988-06-15 | 1990-01-09 | Smith William J | Mobile or ground mounted arcuate antenna |
| CN1164427A (en) * | 1996-05-06 | 1997-11-12 | 吴崇耀 | Miniature electronic pulse therapeutic health-care instrument |
| CN104041195A (en) * | 2012-10-17 | 2014-09-10 | 华为技术有限公司 | Optoelectronic device |
| CN106532317A (en) * | 2016-10-26 | 2017-03-22 | 北京遥测技术研究所 | Air coaxial output structure for active antenna |
| CN107918111A (en) * | 2017-12-18 | 2018-04-17 | 成都聚利中宇科技有限公司 | High frequency millimeter swash frequency-scan radar receiving and transmitting front end module |
| CN108828326A (en) * | 2018-04-23 | 2018-11-16 | 中国电子科技集团公司第二十九研究所 | A kind of three-dimensional microwave component test device |
| CN208480046U (en) * | 2018-07-30 | 2019-02-05 | 无锡华测电子***有限公司 | A kind of high frequency mixed pressure wiring board of low line loss |
-
2019
- 2019-03-21 CN CN201910215226.6A patent/CN109922597B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4893131A (en) * | 1988-06-15 | 1990-01-09 | Smith William J | Mobile or ground mounted arcuate antenna |
| CN1164427A (en) * | 1996-05-06 | 1997-11-12 | 吴崇耀 | Miniature electronic pulse therapeutic health-care instrument |
| CN104041195A (en) * | 2012-10-17 | 2014-09-10 | 华为技术有限公司 | Optoelectronic device |
| CN106532317A (en) * | 2016-10-26 | 2017-03-22 | 北京遥测技术研究所 | Air coaxial output structure for active antenna |
| CN107918111A (en) * | 2017-12-18 | 2018-04-17 | 成都聚利中宇科技有限公司 | High frequency millimeter swash frequency-scan radar receiving and transmitting front end module |
| CN108828326A (en) * | 2018-04-23 | 2018-11-16 | 中国电子科技集团公司第二十九研究所 | A kind of three-dimensional microwave component test device |
| CN208480046U (en) * | 2018-07-30 | 2019-02-05 | 无锡华测电子***有限公司 | A kind of high frequency mixed pressure wiring board of low line loss |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109922597A (en) | 2019-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10790245B2 (en) | High-frequency ceramic board and high-frequency semiconductor element package | |
| US6674347B1 (en) | Multi-layer substrate suppressing an unwanted transmission mode | |
| JPH0321089B2 (en) | ||
| CN109922597B (en) | High-reliability broadband horizontal transition structure | |
| US6759984B2 (en) | Low-loss printed circuit board antenna structure and method of manufacture thereof | |
| KR20120105264A (en) | Structure of transmission line for data communication, and method for designing of the said line | |
| JPWO2004075336A1 (en) | High frequency circuit | |
| US6417744B1 (en) | Transition between asymmetric stripline and microstrip in cavity | |
| CN111194136B (en) | Ceramic powder filled polytetrafluoroethylene glass cloth mixed pressure multilayer power divider circuit board | |
| JP5361024B2 (en) | Wiring board | |
| WO2023123719A1 (en) | Coplanar waveguide transmission line and design method thereof | |
| JP2002252505A (en) | Wiring board for high frequency | |
| TW202207522A (en) | Planar antenna board | |
| JP4521534B2 (en) | Connection method between boards | |
| JP3619396B2 (en) | High frequency wiring board and connection structure | |
| CN114019619A (en) | Circuit structure integrated by optical device and assembling method | |
| CN210579446U (en) | Circuit board and electronic equipment | |
| US5160904A (en) | Microstrip circuit with transition for different dielectric materials | |
| US6762494B1 (en) | Electronic package substrate with an upper dielectric layer covering high speed signal traces | |
| JPH10107514A (en) | High frequency circuit board | |
| JP2885775B2 (en) | Dual mode microwave millimeter wave integrated circuit package | |
| CN219040692U (en) | Gold wire bonded microwave chip | |
| KR102582702B1 (en) | Ultra-wideband chip interconnect structure to provide the ground | |
| JP2000357763A (en) | High-frequency circuit board | |
| CN111491489B (en) | Printed board assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |