CN108827443A - A kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement - Google Patents
A kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement Download PDFInfo
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- CN108827443A CN108827443A CN201810628453.7A CN201810628453A CN108827443A CN 108827443 A CN108827443 A CN 108827443A CN 201810628453 A CN201810628453 A CN 201810628453A CN 108827443 A CN108827443 A CN 108827443A
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- sample
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- acoustic velocity
- chip sample
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H5/00—Measuring propagation velocity of ultrasonic, sonic or infrasonic waves, e.g. of pressure waves
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- General Physics & Mathematics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The invention discloses a kind of lateral sparse target preparation methods for super-pressure acoustic velocity measutement, very thin sample by being superimposed as enough thickness by the preparation method, and it is glued integral, then optical manufacturing and polishing are carried out to the entirety side, the entirety after the polishing is finally carried out processing fragment to use, it can be realized side (through-thickness) polishing treatment of the chip sample of micron order thickness, and error is small, avoid the prior art that chip sample is directly processed and polished, it causes to generate larger defect at sample side and the intersection of its upper and lower two plane, it is unable to satisfy the requirement of experiment of super-pressure acoustic velocity measutement.
Description
Technical field
The present invention relates to super-pressure acoustic velocity measutement fields, and in particular to a kind of for the lateral sparse of super-pressure acoustic velocity measutement
Target preparation method.
Background technique
The response characteristic of material under high pressure for the earth and planetary physics, inertial confinement fusion and first principle
Multiple physical study fields such as modeling are of great significance.In the various characterizations of material response characteristic, the velocity of sound reflects small answer
The propagation characteristic of force-disturbance in the medium carries the various modulus information of material, is material under certain thermodynamic state
A kind of mechanical attribute is research material state equation, constitutive relation, phase transformation (including solid-solid phase-change) and substance composition etc.
Important means.For most of transparent materials, when pressure reaches several Mbar to tens Mbar, the state after shock wave is all
It is fluid state, THE INSULATOR METAL TRANSITION can also occur for dielectric, and the velocity of sound is equivalent to the body velocity of sound, for transparent medium, shock wave
Front shows very high reflectivity, velocity interferometer can directly shock wave speed measure.
In the case where meeting one-dimensional plane Impulsive load, lateral sparse (sound wave) is introduced by the design of target, then shock wave front exists
Sparse side can bend.Shock wave may be implemented using line imaging VISAR (velocity interferometer) system
The speed history measurement of front has become the conventional means in shock dynamics field, but what line imaging VISAR system carried
Other information is but ignored for a long time.When line imaging VISAR object lens parameter f is larger, the small inclination of the surface of emission can make to visit
The light echo for surveying light cannot be introduced into imaging len, lead to the loss of signal, when bending as shock wave, bending part is in image planes
Reflection signal is not had, thus the lateral displacement of the boundary of plane size chain at any time can be measured in record system.The position
It moves data and reflects the process propagated on rear side of shock wave to microvariations, can be directly linked with shock velocity, to obtain main punching
Hit the continuous sonic velocity change curve on adiabat.
Requirement of the above-mentioned technology to Physical Target is very high, mainly to introduce in the transverse direction in shock motion direction sparse
Wave, most straightforward approach are exactly after allowing shock wave to be pierced by from substrate, and a part enters sample, and it is (opposite that a part enters Low ESR
In sample) vacuum：That is sample a part for only covering substrate, sample side thus needs to process perpendicular to base plan
One side is vertical with two planes of chip sample and accurately polishes, the sample of no chipping；For a long time, there is no any systems
Target technology mentioned the polishing treatment that thickness direction is carried out to the thin slice of micron order thickness；Classical optics processing method generally uses
Machine cuts, or be cut by laser to handle the boundary of ultra-thin sample, but this processing method is unable to reach the requirement of experiment.
Summary of the invention
To solve the above-mentioned prior art, there are ultra-thin thickness of sample directions to polish the technical problems such as low precision, and the present invention proposes
A kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement, the preparation method can be realized micron order chip sample
The polishing treatment of thickness direction, and guarantee that flaw size is no more than sample at the side of sample and the intersection of its upper and lower two plane
The 1% of thickness.
The present invention is achieved through the following technical solutions：
A kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement, includes the following steps：
Transparent material is processed into n piece with a thickness of the chip sample of d by step 1；
Step 2, by n piece with a thickness of d the equal preparatory processing of chip sample at 1~2 times of size bigger than sample design value；
N plate sheet sample superposition in above-mentioned steps two Jing Guo preparatory processing is encapsulated into entirety by step 3；
Step 4, packaged n plate sheet sample is whole from intermediate and vertical sample plane direction incision；
Step 5 is ground the side of above-mentioned steps four cut from intermediate and vertical sample plane direction, is thrown
Light processing, and detect whether the side meets the requirements；
Step 6 integrally carries out the n plate sheet sample after processing in step 5 if the side meets the requirements
Fragment processing；It is on the contrary then repeat step 5；
Step 7 takes out the chip sample for leaning on middle position in n plate sheet sample entirety, is cleaned to it, dries behaviour
Make；
Step 8 detects the chip sample after being cleaned, being dried in step 7, carries out if qualified subsequent
It is processed into lateral sparse target, is used for super-pressure acoustic velocity measutement.
Specifically, the encapsulation of n plate sheet sample is fixed as whole specifically include in the step 3：For the thin of hard material
The chip sample that n piece processes is superimposed by piece sample：Glue sticking is used between every two layers, and use can guarantee two sides
Parallel clamp, it is every to increase by one layer of clamping once, n plate sheet sample is finally fixed as entirety；Alternatively, for soft material
Chip sample, then the chip sample that n piece processes is superimposed：Directlying adopt can guarantee that the parallel fixture in two sides will
N plate sheet sample is fixedly clamped as entirety.
Specifically, in the step 6 to n plate sheet sample integrally carry out fragment processing include：For the thin slice of hard material
Chip sample after being processed integrally is put into organic solvent vessel and impregnates by sample, until the glue of encapsulation is completely disengaged；It is right
In the chip sample of soft material, the fixture of the chip sample entirety after being processed is removed.
Specifically, the d is 30~1000 μm, and the n plate sheet thickness of sample uniformity is respectively less than 1%, the depth of parallelism
It is superior to 0.01.
Specifically, being processed in the step 5 to side, including grinding, rough polishing, finishing polish operation.
Specifically, being detected in the step 8 to chip sample, including detected using microscope.
The present invention has the advantage that and beneficial effect：
Lateral sparse target preparation method of the invention, by the way that very thin sample is superimposed as enough thickness, and it is glued
It is integral, optical manufacturing and polishing then are carried out to the entirety side, the entirety after the polishing, which is finally carried out processing fragment, makes
With can be realized side (through-thickness) polishing treatment of the chip sample of micron order thickness, can process at one time more
A sample, and error is small, avoids the prior art that chip sample is directly processed and polished, cause sample side and its above and below
Larger defect is generated at the intersection of two planes, is unable to satisfy the requirement of experiment of super-pressure acoustic velocity measutement.
Detailed description of the invention
Attached drawing described herein is used to provide to further understand the embodiment of the present invention, constitutes one of the application
Point, do not constitute the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is preparation method flow chart of the invention.
Fig. 2 is sample detection figure prepared by preparation method of the invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below with reference to embodiment and attached drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation for explaining only the invention, are not made
For limitation of the invention.
Embodiment
As shown in Figure 1, a kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement, includes the following steps：
Transparent material is processed into n piece with a thickness of the chip sample of d by S01；According to Physical Experiment demand and Laser shock loading energy
Power, thickness d is generally between 30~1000 μm, and for thickness of sample uniformity requirement less than 1%, the depth of parallelism is superior to 0.01.
S02, by n piece with a thickness of d the equal preparatory processing of chip sample at 1~2 times of size bigger than sample design value.
N piece is added the chip sample of hard material (such as the materials such as diamond, quartz, magnesia, magnesium silicate) by S03
The good chip sample of work is superimposed encapsulation one by one, is superimposed in encapsulation process and uses glue sticking between every two layers, and with can guarantee
The parallel clamp in two sides, every superposition is a piece of clamp it is primary, until the chip sample for processing n piece be encapsulated into one it is whole
Body (can dismantle the fixture of this layer after the completion of every layer of encapsulation, can also retain, fixture is identical as specimen material)；Alternatively, for soft
The chip sample of material (such as the organic film materials such as polystyrene, polyethylene), the chip sample that n piece is processed a piece of one
Piece superposition encapsulation：The chip sample that n piece processes is superimposed, directlying adopt can guarantee the parallel clamping plate in two sides by n
Plate sheet sample is fixedly clamped as entirety, and for subsequent processing, (in subsequent processes, clamping plate is always maintained at clamped condition；
Splint material is identical as specimen material).
S04, packaged n plate sheet sample is whole from intermediate and vertical sample plane direction incision, obtain thin slice
The side of sample；
S05 carries out including grinding, rough polishing to the side that the direction of the slave vertical sample plane of above-mentioned steps S04 is cut
With finishing polish process, and detect under the microscope this by processing after side whether meet the requirements；Process as shown in Figure 2 adds
Figure is detected in side after work, carry out data processing (at the side of sample and the intersection of its upper and lower two plane, i.e. attached drawing 2
The ratio between the 1/2 of the sum of width at upward peak and thickness d of sample characterize sample defects) it leans in available sample entirety
Between position the side of chip sample and the intersection of its upper and lower two plane at flaw size be thickness of sample 3.5%, do not surpass
The 4% of thickness of sample is crossed, is met the requirements；
S06, if the side after processing meets the requirements, for the chip sample of hard material, after being processed
Chip sample be integrally put into organic solvent vessel and impregnate, until the glue of encapsulation is completely disengaged (if there is fixture also needs to remove
Fixture)；Alternatively, the fixture of the chip sample entirety after being processed is removed for the chip sample of soft material；It is on the contrary
Then repeat step S05；
S07 takes out the chip sample for leaning on middle position in n plate sheet sample entirety, is cleaned to it, dries operation；
S08 is detected and (is detected using microscope) to the chip sample after being cleaned, dried in step S07,
Following process is carried out if qualified, lateral sparse target is made, be used for super-pressure acoustic velocity measutement；It is unqualified, cast out.
A kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement proposed by the present invention, which can
It realizes the polishing treatment in micron order thin slice thickness of sample direction, and guarantees at the side of sample and the intersection of its upper and lower two plane
Flaw size is no more than the 4% of thickness of sample.
Above-described specific embodiment has carried out further the purpose of the present invention, technical scheme and beneficial effects
It is described in detail, it should be understood that being not intended to limit the present invention the foregoing is merely a specific embodiment of the invention
Protection scope, all within the spirits and principles of the present invention, any modification, equivalent substitution, improvement and etc. done should all include
Within protection scope of the present invention.
Claims (6)
1. a kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement, which is characterized in that include the following steps：
Transparent material is processed into n piece with a thickness of the chip sample of d by step 1；
Step 2, by n piece with a thickness of d the equal preparatory processing of chip sample at 1~2 times of size bigger than sample design value；
N plate sheet sample superposition in above-mentioned steps two Jing Guo preparatory processing is encapsulated into entirety by step 3；
Step 4, packaged n plate sheet sample is whole from intermediate and vertical sample plane direction incision；
Step 5, above-mentioned steps four are ground from the side that intermediate and vertical sample plane direction is cut, polish plus
Work, and detect whether the side meets the requirements；
Step 6 integrally carries out fragment to the n plate sheet sample after processing in step 5 if the side meets the requirements
Processing；It is on the contrary then repeat step 5；
Step 7 takes out the chip sample for leaning on middle position in n plate sheet sample entirety, is cleaned to it, dries operation；
Step 8 detects the chip sample after being cleaned, being dried in step 7, carries out following process if qualified
As lateral sparse target, it to be used for super-pressure acoustic velocity measutement.
2. a kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement according to claim 1, feature exist
In the encapsulation of n plate sheet sample is fixed as whole specifically include in the step 3：For the chip sample of hard material, by n piece
The chip sample processed is superimposed：Glue sticking is used between every two layers, and use can guarantee the parallel fixture folder in two sides
Tightly, every to increase by one layer of clamping once, n plate sheet sample is finally fixed as entirety；Alternatively, for the chip sample of soft material,
Then the chip sample that n piece processes is superimposed：Directlying adopt can guarantee the parallel fixture in two sides by n plate sheet sample
It is fixedly clamped as entirety.
3. a kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement according to claim 1, feature exist
In integrally carrying out fragment processing to n plate sheet sample in the step 6 includes：For the chip sample of hard material, will carry out
Chip sample after processing, which is integrally put into organic solvent vessel, to be impregnated, until the glue of encapsulation is completely disengaged；For soft material
The fixture of chip sample, the chip sample entirety after being processed is removed.
4. a kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement according to claim 1, feature exist
In the d is 30~1000 μm, and the n plate sheet thickness of sample uniformity is respectively less than 1%, and the depth of parallelism is superior to 0.01.
5. a kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement according to claim 1, feature exist
In, in the step 5, side is processed, including grinding, rough polishing, finishing polish operation.
6. a kind of lateral sparse target preparation method for super-pressure acoustic velocity measutement according to claim 1, feature exist
In in the step 8, being detected to chip sample, including detected using microscope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810628453.7A CN108827443B (en) | 2018-06-19 | 2018-06-19 | Preparation method of lateral sparse target for ultrahigh pressure sound velocity measurement |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810628453.7A CN108827443B (en) | 2018-06-19 | 2018-06-19 | Preparation method of lateral sparse target for ultrahigh pressure sound velocity measurement |
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| Publication Number | Publication Date |
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| CN108827443A true CN108827443A (en) | 2018-11-16 |
| CN108827443B CN108827443B (en) | 2020-07-28 |
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| CN201810628453.7A Active CN108827443B (en) | 2018-06-19 | 2018-06-19 | Preparation method of lateral sparse target for ultrahigh pressure sound velocity measurement |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111595876A (en) * | 2020-06-02 | 2020-08-28 | 全球能源互联网研究院有限公司 | Electrolytic clamp and method for preparing EBSD sample of metal sheet |
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| CN203210147U (en) * | 2013-05-04 | 2013-09-25 | 蓝思科技（长沙）有限公司 | Polishing clamp for straight edges of plurality pieces of glasses |
| CN105115795A (en) * | 2015-07-20 | 2015-12-02 | 北京大学 | Preparation method of micron-size sheet transmission electron microscope cross-sectional sample |
| KR20180039517A (en) * | 2016-10-10 | 2018-04-18 | 강흥석 | Laminated sheet grinding apparatus and laminated sheet grinding method |
| CN108044483A (en) * | 2017-12-29 | 2018-05-18 | 广州珠江恺撒堡钢琴有限公司 | Anyhow the automatic polishing machine and its polishing method of side workpiece |
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| CN203210147U (en) * | 2013-05-04 | 2013-09-25 | 蓝思科技（长沙）有限公司 | Polishing clamp for straight edges of plurality pieces of glasses |
| CN105115795A (en) * | 2015-07-20 | 2015-12-02 | 北京大学 | Preparation method of micron-size sheet transmission electron microscope cross-sectional sample |
| KR20180039517A (en) * | 2016-10-10 | 2018-04-18 | 강흥석 | Laminated sheet grinding apparatus and laminated sheet grinding method |
| CN108044483A (en) * | 2017-12-29 | 2018-05-18 | 广州珠江恺撒堡钢琴有限公司 | Anyhow the automatic polishing machine and its polishing method of side workpiece |
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| CN111595876A (en) * | 2020-06-02 | 2020-08-28 | 全球能源互联网研究院有限公司 | Electrolytic clamp and method for preparing EBSD sample of metal sheet |
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| Publication number | Publication date |
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| CN108827443B (en) | 2020-07-28 |
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