CN108817686A - Substrate placing stage and cutter device - Google Patents
Substrate placing stage and cutter device Download PDFInfo
- Publication number
- CN108817686A CN108817686A CN201810720270.8A CN201810720270A CN108817686A CN 108817686 A CN108817686 A CN 108817686A CN 201810720270 A CN201810720270 A CN 201810720270A CN 108817686 A CN108817686 A CN 108817686A
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- China
- Prior art keywords
- laser
- substrate
- groove
- loading end
- placing stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Abstract
The present invention provides a kind of substrate placing stage, may include loading plate, groove and anti-reflection layer.The loading plate has loading end, and the loading end can carry the substrate to be cut by laser.The groove is formed in the loading end, and the distribution of the groove is corresponding with the laser cutting position.The anti-reflection layer is located at the groove surfaces, and the anti-reflection layer is less than the loading end to the reflectivity of laser to the reflectivity of laser.Substrate placing stage of the invention is in the case where the laser energy of groove reflection reduces, laser energy loss required in transmission process can suitably be reduced, shorten the transmission range of laser, reduce the thickness of loading plate, to keep the switching of loading plate more convenient laborsaving, the manufacturing cost for improving cutting efficiency, while there is the loading plate of relatively small thickness to reduce plummer.
Description
Technical field
The present invention relates to display field more particularly to a kind of substrate placing stages and cutter device.
Background technique
Display is the most important terminal output equipment of electronic computer, including circuit part and display device.Wherein, it shows
Show that the performance of device has a major impact the quality of display.In order to improve the performance of display device, preparation process is increasingly
Cause the attention of people.
In the preparation process of display device, the cutting of substrate is an important step.Currently, in cutting, by substrate
It is fixed on the loading plate of plummer, and substrate is cut using laser, to obtain the substrate of target size.However, the mistake
Carrying plate thickness used in journey is big, not only increases manufacturing cost, and the loading plate is not easy to switch, and reduces cutting efficiency.
It should be noted that the information in the invention of above-mentioned background technology part is only used for reinforcing the reason to background of the invention
Solution, therefore may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Summary of the invention
The purpose of the present invention is to provide a kind of substrate placing stage and cutter device, cutting efficiency can be improved, and reduce
Manufacturing cost.
According to an aspect of the present invention, a kind of substrate placing stage, including loading plate, groove and anti-reflection layer are provided.
The loading plate has loading end, and the loading end can carry the substrate to be cut by laser.The groove is formed in institute
Loading end is stated, and the distribution of the groove is corresponding with the laser cutting position.The anti-reflection layer is located at the groove surfaces,
And the anti-reflection layer is less than the loading end to the reflectivity of laser to the reflectivity of laser.
In a kind of exemplary embodiment of the disclosure, the thickness of the anti-reflection layer is greater than laser to the anti-reflection layer
Penetration depth.
In a kind of exemplary embodiment of the disclosure, the anti-reflection layer is metallic diaphragm.
In a kind of exemplary embodiment of the disclosure, the laser is ultraviolet laser, and the material of the loading plate is aluminium,
The metallic diaphragm is copper film layer or golden membranous layer.
In a kind of exemplary embodiment of the disclosure, the thickness of the metallic diaphragm is greater than ultraviolet laser to the metal
The penetration depth of film layer.
In a kind of exemplary embodiment of the disclosure, the metallic diaphragm with a thickness of 20-25nm.
In a kind of exemplary embodiment of the disclosure, the plummer further includes fixed structure, and the fixed structure is used
In the substrate is fixed on the loading end.
In a kind of exemplary embodiment of the disclosure, the fixed structure includes adsorption hole and pneumatic unit.The suction
Attached hole is formed in the loading plate, and an opening of the adsorption hole is located at the loading end.The pneumatic unit is connected to institute
State another opening of adsorption hole.
In a kind of exemplary embodiment of the disclosure, the roughness of the groove surfaces is greater than the coarse of the loading end
Degree.
According to an aspect of the present invention, a kind of cutter device is provided, the cutter device includes described in any of the above-described
Substrate placing stage.
The beneficial effect of the present invention compared with prior art is：
Substrate placing stage provided by the invention include be formed in loading end and groove corresponding with laser cutting position and
Positioned at the anti-reflection layer of groove surfaces, which is less than loading end to the reflectivity of laser to the reflectivity of laser.Right
When substrate carries out cutting operation, substrate is placed in loading end, and laser penetration substrate is transmitted to groove surfaces, and by groove surfaces
Reflection, reaches substrate through transmitting again.Since the reflectivity of anti-reflection layer is small, the laser energy of groove reflection is reduced.It compares
The prior art, in the case where the laser energy of groove reflection reduces, required by can suitably reducing laser in transmission process
Energy loss shortens the transmission range of laser, reduces the depth of groove, and then can reduce the thickness of loading plate, thus
Keep the switching of loading plate more convenient laborsaving, improve cutting efficiency, while there is the loading plate of relatively small thickness to reduce carrying
The manufacturing cost of platform.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
It can the limitation present invention.
Detailed description of the invention
It is described in detail its exemplary embodiment by referring to accompanying drawing, the above and other feature and advantage of the disclosure will become
It obtains more obvious.It should be evident that the accompanying drawings in the following description is only some embodiments of the present disclosure, it is common for this field
For technical staff, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the schematic diagram of substrate placing stage in the related technology；
Fig. 2 is the schematic diagram of one embodiment of substrate placing stage of the disclosure；
Fig. 3 is the schematic diagram of another embodiment of substrate placing stage of the disclosure.
In figure：1, loading plate；2, groove；3, anti-reflection layer；4, substrate；5, adsorption hole；6, loading end.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to example set forth herein；On the contrary, these embodiments are provided so that the disclosure will comprehensively and
Completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Described feature, structure or characteristic
It can be incorporated in any suitable manner in one or more embodiments.In the following description, it provides many specific thin
Section fully understands embodiment of the present disclosure to provide.It will be appreciated, however, by one skilled in the art that this can be practiced
Disclosed technical solution, or can be using other methods etc. without one or more in the specific detail.At it
In the case of it, known solution is not shown in detail or described to avoid fuzzy all aspects of this disclosure.
Term " one ", "the" and " described " to indicate there are one or more elements/component part/etc.；Term " packet
Include " and " having " to indicate the open meaning being included and refer to that the element/component part/in addition to listing waits it
Outside also may be present other element/component part/etc..
In actual production, flexible display device is prepared by building blocks of function required for adding on substrate.
Wherein, the building blocks of function may include thin film transistor (TFT) (TFT) array, anode, Organic Light Emitting Diode (OLED) array and
Cathode.In order to reduce the water oxygen transmitance of substrate, water oxygen barrier layer can also essentially formed.In above-mentioned flexible display device
Preparation process in, need to cut substrate using laser.The light source of laser cutting mainly include carbon dioxide laser and
Ultraviolet laser.As shown in Figure 1, substrate 4 to be placed in the loading plate 1 of plummer in laser cutting process.Laser in order to prevent
Reflection, current design is mostly in the Position Design groove 2 of laser cut line, to prevent the laser of reflection from causing to damage to substrate 4
Wound.In order to make the energy of laser reflection be reduced to substrate 4 ablation threshold hereinafter, the groove 2 of plummer must have it is certain
Depth L1, mostly 8-15mm.Deeper plummer groove 2 certainly will require to increase the thickness H of loading plate 11.With 4 size of substrate
Increase, in order to guarantee band, there are many intensity of the loading plate 1 of cut-in groove 2, the thickness H of loading plate 11It needs further to increase
Add, to cause difficulty to the switching of loading plate 1, increases manufacturing cost simultaneously.
To solve the above-mentioned problems, disclosure embodiment provides a kind of substrate placing stage.As shown in Fig. 2, the substrate is held
Microscope carrier may include loading plate 1, groove 2 and anti-reflection layer 3.Wherein：
The loading plate 1 has loading end 6, and the loading end 6 can carry the substrate 4 to be cut by laser.It is described
Groove 2 is formed in the loading end 6, and the distribution of the groove 2 is corresponding with the laser cutting position.The anti-reflection layer 3
Positioned at 2 surface of groove, and the anti-reflection layer 3 is less than the loading end 6 to the reflectivity of laser to the reflectivity of laser.
For the substrate placing stage that disclosure embodiment provides when carrying out cutting operation to substrate 4, substrate 4 is placed in carrying
Face 6, laser penetration substrate 4 are transmitted to 2 surface of groove, and by 2 surface reflection of groove, are transmitted and reach substrate 4 again, due to
The reflectivity of anti-reflection layer 3 is small, reduces the laser energy of the reflection of groove 2.Compared with prior art, the laser reflected in groove 2
In the case that energy reduces, laser energy loss required in transmission process can be suitably reduced, the transmission of laser is shortened
Distance reduces the depth L of groove 22, and then the thickness H of loading plate 1 can be reduced2, to keep the switching of loading plate 1 more square
Just laborsaving, cutting efficiency is improved, while there is relatively small thickness H2Loading plate 1 reduce the manufacturing cost of plummer.
Each section of substrate placing stage in disclosure embodiment is described in detail below：
As shown in Fig. 2, loading plate 1 is that substrate 4 to be cut by laser provides a supporting role in disclosure embodiment.
Loading plate 1 can be in rectangular slab or circular slab, and disclosure embodiment is not limited.The area of the rectangular slab or circular slab can root
Depending on size according to substrate 4, the size of substrate 4 is bigger, and the area of rectangular slab or circular slab can be bigger.The material of the loading plate 1
It can be aluminium, to reduce the quality of loading plate 1.Certainly, the material of loading plate 1 can also be light material, and the disclosure is implemented
Mode does not enumerate herein.In addition, loading plate 1 can have loading end 6, which can carry to be cut by laser
Substrate 4.Specifically, there is matching area according to the size selection of substrate 4 first when being cut by laser to substrate 4
Aluminium material rectangle loading plate 1, and be horizontally arranged, and loading end 6 is upward, substrate 4 is placed in loading end 6.Loading plate 1 with
Loading end 6 it is opposite can connect support frame on one side, to be provided a supporting role to loading plate 1.
As shown in Fig. 2, in disclosure embodiment, groove 2 can be formed in loading end 6, and the distribution of groove 2 can be with
Laser cutting position is corresponding, so that the laser of cutting substrate 4 can reach groove 2 after passing through substrate 4.Laser passes through substrate 4,
It is transmitted to 2 surface of groove, is re-transmitted to substrate 4 by reflection.Wherein, it by being transmitted twice with after primary event, reaches
The laser energy of substrate 4 reduces.
As shown in Fig. 2, groove 2 can pass through broaching, turning or milling by loading end 6 in disclosure embodiment
Mode processes to be formed, and disclosure embodiment is not limited.Groove 2 can be axis perpendicular to the section of 2 extending direction of groove
Symmetric figure, and the symmetry axis, perpendicular to loading end 6, the section can also be in other shapes in disclosure embodiment.Its
In, which can be rectangle, square, trapezoidal or fan-shaped, and the zhou duicheng tuxing of disclosure embodiment is not limited to
This.For example, as shown in figure 3, the zhou duicheng tuxing be it is trapezoidal, it is trapezoidal high perpendicular to loading end 6, in two trapezoidal bottoms
A longer bottom and loading end 6 are located at same horizontal line, so that groove 2 has biggish opening in loading end 6, it is operation people
The particle that groove 2 is deposited in 4 cutting process of member's cleaning substrate provides convenience.In addition, the development length of groove 2 can be according to base
Depending on the Cutting Length of plate 4, the Cutting Length of substrate 4 is longer, and the development length of groove 2 is bigger.
As shown in Fig. 2, anti-reflection layer 3 can be located at 2 surface of groove, and anti-reflection layer 3 is right in disclosure embodiment
The reflectivity of laser is less than loading end 6 to the reflectivity of laser.Set anti-reflection layer 3 reduces the laser of the reflection of groove 2
Energy, to can suitably contract in the case that the laser energy for reaching substrate 4 after the reflection of groove 2 is less than the ablation threshold of substrate 4
Transmission range of the short laser in groove 2, to reduce the depth L of groove 22.Wherein, the thickness of anti-reflection layer 3, which is greater than, swashs
Light passes through anti-reflection layer 3 to avoid laser, reduces the reflecting effect of anti-reflection layer 3 to the penetration depth of anti-reflection layer 3.
As shown in Fig. 2, anti-reflection layer 3 can be metallic diaphragm in disclosure embodiment.For example, with ultraviolet
When being cut by laser substrate 4,1 material of loading plate used is aluminium, which can be copper film layer or golden membranous layer, so that metal
Film layer is less than reflectivity of the loading end 6 to ultraviolet laser of aluminium material loading plate 1 to the reflectivity of ultraviolet laser.Certainly, the gold
Belonging to film layer can also be other metallic diaphragms with smaller reflectivity, and disclosure embodiment does not enumerate herein.Wherein,
The thickness of metallic diaphragm be greater than ultraviolet laser to the penetration depth of the metallic diaphragm (λ is wavelength, and n is
Refractive index, k are extinction coefficient).When metallic diaphragm be copper film layer when, thickness can be 20-25nm, such as 20nm, 21nm,
The thickness of 22nm, 23nm, 24nm or 25nm, disclosure embodiment are without being limited thereto.When metallic diaphragm is golden membranous layer, thickness
It can be 20-25nm, such as 20nm, 21nm, 22nm, 23nm, 24nm or 25nm, certainly, the thickness of golden membranous layer can also be Jie
Other numerical value between 20nm and 25nm, will not enumerate herein.When use wavelength for 355nm or 343nm it is ultraviolet swash
Light cutting is when being placed in the substrate 4 of aluminium material loading plate (reflectivity 90%), the gold that metallic diaphragm is selected with a thickness of 20-25nm
Film layer or copper film layer (reflectivity can reach 30%), can make the depth L of above-mentioned groove 22It is reduced to 1-5mm, such as 1mm,
2mm, 3mm, 4mm or 5mm, disclosure embodiment are not limited.
As shown in Fig. 2, metallic diaphragm can be by physical vapour deposition (PVD) film technique in groove in disclosure embodiment
2 surfaces are formed, it is, of course, also possible to be formed using other technologies.The physical gas phase deposition technology for example can be vacuum evaporation coating
Film, sputter coating or ion film plating, disclosure embodiment are without being limited thereto.For example, the metal film of disclosure embodiment
Layer is prepared by sputter coating.Under this condition, sputtering is formed by, metal nano film layer is with high purity, compactness is good, thickness
Uniformly, and 2 surface of groove can be firmly incorporated into.Before sputter coating, oxidation processes can be carried out to 2 surface of groove, to improve
The roughness on 2 surface of groove, reduces its reflectivity.
As shown in Fig. 2, the substrate placing stage in disclosure embodiment can also include fixed structure, which can
For substrate 4 to be fixed on loading end 6.Specifically, fixed structure may include that adsorption hole 5 and pneumatic unit (do not show in figure
Out).Wherein, adsorption hole 5 is formed in loading plate 1, and an opening of adsorption hole 5 is located at the loading end 6, so that adsorption hole 5 exists
It is contacted in laser cutting process with substrate 4, another opening of adsorption hole 5 is connect with pneumatic unit.In laser cutting process,
After substrate 4 is placed in loading end 6, starts pneumatic unit, be evacuated pneumatic unit to adsorption hole 5, reduce adsorption hole 5
In air pressure improved in laser cutting process so that substrate 4 is fixed on loading end 6 under the action of external atmospheric pressure
The stability of substrate 4.
As shown in Fig. 2, adsorption hole 5 is formed in loading plate 1, such as can be thick in loading plate 1 in disclosure embodiment
Degree opens up through hole on direction to form adsorption hole 5.Wherein, one of adsorption hole 5 opening is located at loading end 6, adsorption hole 5 it is another
One opening is located at one side opposite with loading end 6 on loading plate 1.The cross section of adsorption hole 5 can be round, square or square
Shape can also be that other shapes, disclosure embodiment are not limited.By taking the adsorption hole 5 with circular cross section as an example,
In the case that the depth of adsorption hole 5 is constant, the diameter of the adsorption hole 5 should ensure that the negative pressure in adsorption hole 5 can be by substrate 4 tightly
It is fixed on loading end 6.It should be noted that the adsorption hole 5 cannot be excessive, to prevent the negative pressure in adsorption hole 5 excessive, to substrate
4 cause to damage.In addition, when adsorption hole 5 is smaller, if 1 thickness H of loading plate2It is larger, the difficulty of processing of adsorption hole 5 can be improved, and
The particle that substrate 4 generates in laser cutting process easily causes the blocking of adsorption hole 5.Disclosure embodiment can reduce carrying
The thickness H of plate 12, the blocking of adsorption hole 5 is not easily led to.In addition, the quantity of adsorption hole 5 can be to be multiple, particular number can root
Depending on size according to substrate 4, the size of substrate 4 is bigger, and the quantity of adsorption hole 5 is settable more, and the adsorption hole 5 is distributed in and holds
Support plate 1.
As shown in Fig. 2, pneumatic unit can be vacuum pump, such as water circulating pump or blade in disclosure embodiment
The vacuum pump of formula vacuum pump, disclosure embodiment is without being limited thereto.Set pneumatic unit is by taking out adsorption hole 5
Substrate 4 not only can be fixed on loading end 6, can also clear up being deposited in adsorption hole 5 in laser cutting process by gas
Grain, avoids the blocking of adsorption hole 5.
It should be understood that above-mentioned fixed structure is merely illustrative, and in disclosure other embodiment, fixed knot
Structure can also be other types, as long as can serve the same role, this will not be detailed here.
Disclosure embodiment also provides a kind of cutter device, and the cutter device includes described in any of the above-described embodiment
Substrate placing stage, at the same time it can also include laser, to generate laser required by cutting substrate, it is, of course, also possible to include
Other components, this will not be detailed here.The substrate placing stage and above embodiment that the cutter device of disclosure embodiment uses
In substrate placing stage it is identical, therefore, beneficial effect having the same, details are not described herein.
Those skilled in the art will readily occur to other embodiments of the present invention after considering specification and practice.This
Application is intended to cover any variations, uses, or adaptations of the invention, these variations, uses, or adaptations are abided by
Follow general principle of the invention and including common knowledge or conventional techniques in the art.Description and embodiments
It is considered only as illustratively, true scope and spirit of the invention are pointed out by the attached claims.
Claims (10)
1. a kind of substrate placing stage, which is characterized in that including：
Loading plate, has loading end, and the loading end can carry the substrate to be cut by laser；
Groove is formed in the loading end, and the distribution of the groove is corresponding with the laser cutting position；
Anti-reflection layer is located at the groove surfaces, and the anti-reflection layer is less than the loading end to sharp to the reflectivity of laser
The reflectivity of light.
2. substrate placing stage according to claim 1, which is characterized in that the thickness of the anti-reflection layer is greater than laser to institute
State the penetration depth of anti-reflection layer.
3. substrate placing stage according to claim 1, which is characterized in that the anti-reflection layer is metallic diaphragm.
4. substrate placing stage according to claim 3, which is characterized in that the laser is ultraviolet laser, the loading plate
Material be aluminium, the metallic diaphragm be copper film layer or golden membranous layer.
5. substrate placing stage according to claim 4, which is characterized in that the thickness of the metallic diaphragm is greater than ultraviolet laser
To the penetration depth of the metallic diaphragm.
6. substrate placing stage according to claim 5, which is characterized in that the metallic diaphragm with a thickness of 20-25nm.
7. substrate placing stage according to claim 1, which is characterized in that the plummer further includes：
Fixed structure, for the substrate to be fixed on the loading end.
8. substrate placing stage according to claim 7, which is characterized in that the fixed structure includes：
Adsorption hole, is formed in the loading plate, and an opening of the adsorption hole is located at the loading end；
Pneumatic unit is connected to another opening of the adsorption hole.
9. substrate placing stage according to claim 1, which is characterized in that the roughness of the groove surfaces is greater than described hold
The roughness of section.
10. a kind of cutter device, which is characterized in that the cutter device includes that the described in any item substrates of claim 1-9 are held
Microscope carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810720270.8A CN108817686A (en) | 2018-07-03 | 2018-07-03 | Substrate placing stage and cutter device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810720270.8A CN108817686A (en) | 2018-07-03 | 2018-07-03 | Substrate placing stage and cutter device |
Publications (1)
| Publication Number | Publication Date |
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| CN108817686A true CN108817686A (en) | 2018-11-16 |
Family
ID=64134249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810720270.8A Pending CN108817686A (en) | 2018-07-03 | 2018-07-03 | Substrate placing stage and cutter device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112192038A (en) * | 2020-09-23 | 2021-01-08 | 湖北三江航天险峰电子信息有限公司 | Large-breadth metal foil-shaped brazing filler metal placing mechanism and laser cutting method using same |
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| CN112192038A (en) * | 2020-09-23 | 2021-01-08 | 湖北三江航天险峰电子信息有限公司 | Large-breadth metal foil-shaped brazing filler metal placing mechanism and laser cutting method using same |
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