CN104752851B - A kind of system - Google Patents
A kind of system Download PDFInfo
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- CN104752851B CN104752851B CN201510068387.9A CN201510068387A CN104752851B CN 104752851 B CN104752851 B CN 104752851B CN 201510068387 A CN201510068387 A CN 201510068387A CN 104752851 B CN104752851 B CN 104752851B
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Abstract
It there is provided a system comprising the first printed circuit board (PCB), the second printed circuit board (PCB) and the 3rd printed circuit board (PCB).First connection terminal of the first connector is installed in the first plane of first printed circuit board (PCB).First connection terminal of the second connector is installed in the second plane of first printed circuit board (PCB).Second connection terminal of first connector is installed in the first plane of second printed circuit board (PCB).3rd printed circuit board (PCB) is provided with the second connection terminal of second connector.Second printed circuit board (PCB) is connected to first printed circuit board (PCB) by first connector.First printed circuit board (PCB) is parallel with second printed circuit board (PCB).3rd printed circuit board (PCB) is connected to first printed circuit board (PCB) by second connector.Such scheme helps to reduce the cost of backboard.
Description
Technical field
The present invention relates to electronic technology field, more particularly to a kind of system.
Background technology
Printed circuit board (printed circuit board, PCB) can be used for realizing that electronic component is electrically connected.
In some systems, it is necessary to which the PCB with specific function is plugged on backboard.Backboard can also be real by PCB
It is existing.For example, using for handling the PCB of vision signal and being plugged on PCB as backboard for handling the PCB of audio signal.
As the function that system is provided is stronger and stronger, the quantity as the PCB of the backboard layers for needing to include is more and more, so as to be tool
The PCB for having specific function provides support.However, the increase of the quantity with the layer in the PCB as backboard, the cost of backboard
It can improve therewith.Therefore, the backboard for how designing low cost is important topic.
The content of the invention
A kind of system is provided in the embodiment of the present invention, helps to reduce the cost of backboard.
In order to solve the above-mentioned technical problem, the embodiment of the invention discloses following technical scheme：
In a first aspect, there is provided a system comprising the first printed circuit board (PCB), the second printed circuit board (PCB) and
First connection terminal of the first connector is installed in the 3rd printed circuit board (PCB), the first plane of first printed circuit board (PCB),
First connection terminal of the second connector, second printed circuit are installed in the second plane of first printed circuit board (PCB)
Second connection terminal of first connector is installed, the 3rd printed circuit board (PCB) is provided with described in the first plane of plate
Second connection terminal of the second connector；
Second printed circuit board (PCB) is connected to first printed circuit board (PCB) by first connector, specific next
Say, second printed circuit board (PCB) is connected to installed in described first by second connection terminal of first connector
First connection terminal of first connector on printed circuit board (PCB), first printed circuit board (PCB) and the described second print
Printed circuit board is parallel；
3rd printed circuit board (PCB) is connected to first printed circuit board (PCB) by second connector；
Wherein, first printed circuit board (PCB) includes first layer, and second printed circuit board (PCB) includes the second layer, described the
The layer that three printed circuit board (PCB)s are needed to use when working includes the first layer and the second layer, and the 3rd printed circuit board (PCB) leads to
Cross second connector and the first layer and realize and electrically connect, the 3rd printed circuit board (PCB) by second connector,
Wire and first connector between second connector and the first connector are realized with the second layer to be electrically connected.
According in a first aspect, in the first possible implementation, described first in first printed circuit board (PCB)
The second layer that layer is included in data-signal layer, second printed circuit board (PCB) includes power supply signal layer and data-signal
Layer；
First connector includes data signal connector and power supply signal connector, and second connector includes
Data signal connector and power supply signal connector.
According to the first possible implementation of first aspect, in second of possible implementation, described first
Data-signal layer in printed circuit board (PCB) includes the data-signal layer bag in high-speed data signal layer, second printed circuit board (PCB)
Include high-speed data signal layer and low speed data signals layer；
First connector includes high-speed data signal connector, low speed data signal connector and power supply signal and connected
Connect device.
According to the first possible implementation of first aspect, in the third possible implementation, described first
Data-signal layer in printed circuit board (PCB) includes the data-signal layer bag in high-speed data signal layer, second printed circuit board (PCB)
Include low speed data signals layer；
First connector includes low speed data signal connector and power supply signal connector.
According in a first aspect, the first layer described in the 4th kind of possible implementation in the first printed circuit board (PCB)
Including data-signal layer, the second layer in second printed circuit board (PCB) includes power supply signal layer；
First connector include power supply signal connector, second connector include data signal connector and
Power supply signal connector.
According to the 4th of first aspect the kind of possible implementation, in the 5th kind of possible implementation, described first
Data-signal layer in printed circuit board (PCB) includes high-speed data signal layer and low speed data signals layer；The second connector bag
Include high-speed data signal connector, low speed data signal connector and power supply signal connector.
According to first aspect and any implementation of first aspect, in the 6th kind of possible implementation,
3rd printed circuit board (PCB) is realized to electrically connect with the second layer to be specifically included：
Wire between first connector and the second connector is placed through the envelope of first printed circuit board (PCB)
Fill hole.
According to first aspect and any implementation of first aspect, in the 7th kind of possible implementation,
3rd printed circuit board (PCB) is realized to electrically connect with the second layer to be specifically included：
Wire between first connector and the second connector is located at the layer of first printed circuit board (PCB).
According to first aspect and any implementation of first aspect, in the 8th kind of possible implementation,
Second printed circuit board (PCB) includes multiple printed circuit board (PCB)s, and the second layer is included in multilayer, the multiple printed circuit board (PCB)
Each printed circuit board (PCB) includes at least one layer in the multilayer.
It is the multiple in the 9th kind of possible implementation according to the 8th of first aspect the kind of possible implementation
Printed circuit board (PCB) is located at approximately the same plane.
In the embodiment of the present invention, system includes the first printed circuit board (PCB), the second printed circuit board (PCB) and the 3rd printed circuit
Plate.Wherein, required layer is located at the first printed circuit board (PCB) and the second print respectively when the 3rd printed circuit board (PCB) in system works
In printed circuit board.That is, the first printed circuit board (PCB) and the second printed circuit board (PCB) are all the backboards of the 3rd printed circuit board (PCB).The
One printed circuit board (PCB) need not include the whole of layer required when the 3rd printed circuit board (PCB) works.Second printed circuit board (PCB) need not
The whole of required layer when being worked including the 3rd printed circuit board (PCB).First printed circuit board (PCB) only includes the work of the 3rd printed circuit board (PCB)
A part for Shi Suoxu layer.Second printed circuit board (PCB) need not include the complete of layer required when the 3rd printed circuit board (PCB) works
Portion.Therefore, above-mentioned technical proposal contributes in the quantity and the second printed circuit board (PCB) of the layer in the first printed circuit board (PCB) of reduction
The quantity of layer.The quantity of layer in backboard is fewer, and the cost of backboard is lower.Therefore, above-mentioned technical proposal helps to reduce backboard
Cost.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, for those of ordinary skill in the art
Speech, without having to pay creative labor, can also obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is the system schematic that provides in the embodiment of the present invention；
Fig. 2 is another system schematic for providing in the embodiment of the present invention；
Fig. 3 is another system schematic for providing in the embodiment of the present invention；
Fig. 4-1,4-2,4-3 are the second printed circuit board arrangement schematic diagram for providing in the embodiment of the present invention.
Embodiment
In order that those skilled in the art more fully understand the technical scheme in the embodiment of the present invention, and make of the invention real
Applying the above-mentioned purpose of example, feature and advantage can be more obvious understandable, below in conjunction with the accompanying drawings to technical side in the embodiment of the present invention
Case is described in further detail.
Hereafter the portion of techniques being related in the embodiment of application documents is belonged to and illustrated.If said without opposite
Bright, the layer in embodiment refers to the layer in PCB.For example, PCB can include one layer or multilayer.If PCB only includes one
Layer, the PCB can be one side (single sided) PCB.If PCB only includes two layers, the PCB can be two-sided (double
sided)PCB.When implementing, the layer in embodiment can be specifically layers of copper (copper layer).Layers of copper can be by right
Copper sheet (copper sheet) is etched (etch) and obtained.Copper sheet can be located at the substrate (non-of the insulation in PCB
Conductive substrate) on.For example, the layer in embodiment can be power supply signal layer (power supply
Signal layer) or data-signal layer (data signal layer).The power supply signal layer is used to transmit power supply letter
Number.The data-signal layer is used to transmit data-signal.In addition, being related to connector in embodiment.Connector can be used for connecting
Meet multiple PCB.Connector can be power supply signal connector or data signal connector.Power supply signal connector is used to transmit
Power supply signal.Data signal connector is used to transmit data-signal.Specifically, power supply signal connector can be used for connected
PCB transmission power supply signal.Data signal connector can be used for transmitting data-signal to connected PCB.
Referring to Fig. 1, the embodiments of the invention provide a kind of system.The system prints including the first printed circuit board (PCB) 11, second
The printed circuit board (PCB) 13 of printed circuit board 12 and the 3rd.First connection is installed in first plane of first printed circuit board (PCB) 11
First connection terminal of device 14.First that the second connector 15 is provided with second plane of first printed circuit board (PCB) 11 connects
Connecting terminal.Second connection terminal of first connector 14 is installed in first plane of second printed circuit board (PCB) 12.
3rd printed circuit board (PCB) 13 is provided with the second connection terminal of second connector 15.
Second printed circuit board (PCB) 12 is connected to first printed circuit board (PCB) 11 by first connector.Specifically
For, second printed circuit board (PCB) 12 is connected to installed in institute by second connection terminal of first connector 14
State first connection terminal of first connector 14 on the first printed circuit board (PCB) 11.First printed circuit board (PCB) 11
It is parallel with second printed circuit board (PCB) 12.
3rd printed circuit board (PCB) 13 is connected to first printed circuit board (PCB) 11 by second connector 15.
Wherein, first printed circuit board (PCB) 11 includes first layer, and second printed circuit board (PCB) 12 includes the second layer, institute
Stating the layer needed to use during the work of the 3rd printed circuit board (PCB) 13 includes the first layer and the second layer.The 3rd printing electricity
Road plate 13 realizes and electrically connected that the 3rd printed circuit board (PCB) 13 is by described by second connector 15 with the first layer
Wire and first connector 14 between second connector 15, the connector 14 of second connector 15 and first, with
The second layer realizes electrical connection.
First printed circuit board (PCB) 11 is backboard.Second printed circuit board (PCB) 12 is backboard.It is pointed out that figure
1 be the embodiment of the present invention in system schematic diagram.First printed circuit board (PCB) 11 in schematic diagram, the second printed circuit board (PCB) 12 and
The quantity of 3rd printed circuit board (PCB) 13 is 1,1 and 2 respectively.The quantity of first connector 14 and the second connector 15 is respectively
2 and 2.The present embodiment does not limit the quantity of the object in schematic diagram.For example, when implementing, the 3rd printed circuit board (PCB) 13
Quantity can be 1.The quantity of second connector 15 can be 1.
For ease of understanding, the term being related in said system is illustrated first below.
3rd printed circuit board (PCB) 13 can refer to be used for the printed circuit board (PCB) for realizing certain function in system.For example,
3rd printed circuit board (PCB) 13 can be network board, interface board or master control borad.For example, the 3rd printed circuit board (PCB) 13 can be with
It is the printed circuit board (PCB) in network equipment.The network equipment can be router, the network switch, fire wall, load balancing
Device, base station or data center.When implementing, the 3rd printed circuit board (PCB) 13 can include network processing unit.At the network
Reason device can pass through field programmable gate array (field programmable gate array, FPGA) or special integrated
Circuit (application-specific integrated circuit, ASIC) is realized.In addition, the 3rd printed circuit board (PCB) 13
Quantity can be 1 or the integer more than 1.
First printed circuit board (PCB) 11 and second printed circuit board (PCB) 12 are that the 3rd printed circuit board (PCB) 13 provides the
Three printed circuit board (PCB)s 13 work required layer.In addition, first printed circuit board (PCB) 11 and second printed circuit board (PCB) 12
Connection can also be played a part of, the 3rd printed circuit board (PCB) 13 is supported.By first printed circuit board (PCB) 11 and institute
The second printed circuit board (PCB) 12 is stated for the layer needed for other printed circuit board (PCB)s provide its work, can be by first printed circuit
Plate 11 and second printed circuit board (PCB) 12 are referred to as backboard.Can also be by first printed circuit board (PCB) 11 and described second
Printed circuit board (PCB) 12 is referred to as motherboard.In embodiments of the present invention, the backboard of the 3rd printed circuit board (PCB) 13 includes the first printed circuit
The printed circuit board (PCB) 12 of plate 11 and second.Wherein, the quantity of the first printed circuit board (PCB) 11 can be 1.When the 3rd printing in system
When the quantity of circuit board 13 is the integer more than 1, each 3rd printed circuit board (PCB) 13 is connected with first printed circuit board (PCB) 11.
Second printed circuit board (PCB) 12 can be 1 or the integer more than 1.Between second printed circuit board (PCB) 12 and the first printed circuit board (PCB) 11
Do not include other PCB.Other PCB are contained between 3rd printed circuit board (PCB) 13 and the second printed circuit board (PCB) 12.
First connector 14 can there is provided the first printed circuit board (PCB) 11 and the second print by the mode such as encapsulated holes or surface installation
Between printed circuit board 12 mechanically and electrically.Wherein, in order to realize this physical connection, the first connector 14 can include the
One connection terminal and the second connection terminal.Wherein, it is provided with the first plane (such as the back side) of the first printed circuit board (PCB) 11
The first connection terminal (such as male end) of first connector 14.Accordingly, installed in the first plane of the second printed circuit board (PCB) 12
There is the second connection terminal (such as female end) of first connector 14.So, the second printed circuit board (PCB) 12 can just pass through institute
Second connection terminal of the first connector 14 is stated, described first on first printed circuit board (PCB) 11 is connected to
First connection terminal of connector 14.Wherein, the first connector 14 can have one or more.First printed circuit board (PCB)
11 can be parallel with the second printed circuit board (PCB) 12.First connector 14 can be also used for being delivered in the first printed circuit board (PCB) 11
With the signal between the second printed circuit board (PCB) 12, so as to realize electrical connection between the two.The information type transmitted as needed
Difference, the first connector 14 can include data signal connector and power supply signal connector.
It is further to note that needing the data-signal transmitted to potentially include high-speed data signal and low speed data letter
Number.High-speed data signal and low speed data signal are relative concepts.For example, transmission rate be 1Gbps or 1Gbps with
On data-signal can be high-speed data signal.Transmission rate can be low speed data letter for below 1Gbps data-signal
Number.In addition, switching network cell can be included in high-speed data signal.Control information can be included in low speed data signal and matched somebody with somebody
At least one of confidence breath.Therefore, data signal connector can also be high-speed data signal connector or low speed data
Signal connector.Further, since high-speed data signal connector can be used for transmitting low speed data signal, height can be used only
Fast data signal connector transmitting high speed data signal and low speed data signal.
Second connector 15 can be similar with the first connector 14 in terms of physical arrangement.Second connector 15 is used to realize
Electrical connection between first printed circuit board (PCB) 11 and the 3rd printed circuit board (PCB) 13.After connection, the 3rd printed circuit board (PCB) 13 and first
Can be vertical between printed circuit board (PCB) 11.Certainly, also may be used between the 3rd printed circuit board (PCB) 13 and the first printed circuit board (PCB) 11
With out of plumb.For example, the angle of the 3rd printed circuit board (PCB) 13 and the first printed circuit board (PCB) 11 is acute angle.Other relevant informations can
Referring to the introduction on the first connector 14, to repeat no more here.
First layer in embodiment can be one layer or multilayer.Similar, the second layer in embodiment can also
It is one layer or multilayer.The first layer can be including at least one in power supply signal layer and data-signal layer.It is described
The second layer can be including at least one in power supply signal layer and data-signal layer.Definition in Protel99, print
Layer in brush wiring board can include:Signal Layers (signals layer) and Internal Planes (inner plane).Number
It can be the signals layer when being implemented according to signals layer.Power supply signal layer can be the inner plane when implementing.Its
In, signals layer is used to realize signal wire, and internal electric source/ground plane is used to realize power line/ground wire.3rd printed circuit board (PCB) 13
Quantity and after classification determines, required layer is confirmable when the 3rd printed circuit board (PCB) 13 works.Assuming that the 3rd printing
The quantity of the layer required when working of circuit board 13 is n.In n-layer, n1 layers are located in the first print circuit board 11, and n2 layers are located at the second print
In printed circuit board 12.N1 layers are null set with n2 layers of common factor.Wherein, n1+n2 can be equal to n.Or, in n1+n2 result
More than n.N1 is less than n.N2 is again smaller than n.
Can be that layer required when the 3rd printed circuit board (PCB) 13 is worked according to the convenient principle of wiring is distributed in the first print
The printed circuit board (PCB) of printed circuit board 11 and second.Provided hereinafter specific implementation.
Specific implementation one
In the specific implementation one, the first layer in first printed circuit board (PCB) 11 can include data letter
The second layer in number floor, second printed circuit board (PCB) 12 can include power supply signal layer and data-signal layer.Referring to
Fig. 2, first connector 14 can include data signal connector 141 and power supply signal connector 142.Second connector
Data signal connector 151 and power supply signal connector 152 can also be included.That is, a part of data-signal layer can
To be arranged on the first printed circuit board (PCB) 11, another part data-signal layer and power supply signal layer are arranged in the second printed circuit
On plate 12.Now, in the second printed circuit board (PCB) 12 signal wire and the information of power line transmission is required for by the first connection
Device 14 passes to the first printed circuit board (PCB) 11, then passes to the 3rd printed circuit board (PCB) 13 by the first printed circuit board (PCB) 11, therefore, the
A connector 14 can include at least one of data signal connector 141 and power supply signal connector 142.
Wherein, when implementing, data-signal layer may include high-speed data signal layer and low speed data signal
Layer.Now, distribution of the data-signal layer on the first printed circuit board (PCB) 11 and the second printed circuit board (PCB) 12 can also enter to advance
The refinement of one step.For example, under a kind of optional implementation, the data-signal layer in first printed circuit board (PCB) 11 includes
Data-signal layer in high-speed data signal layer, second printed circuit board (PCB) 12 includes high-speed data signal layer and low speed number
According to signals layer.That is, the first printed circuit board (PCB) 11 is used to arrange a part of high-speed data signal layer, the second printed circuit board (PCB)
The 12 high-speed data signal layer and low speed data signals layer for arranging another part.In this manner, the second printing electricity
Road plate 12 is additionally operable to arrange power supply signal floor.Therefore, the first connector 14 can include high-speed data signal connector, low speed number
According to signal connector and power supply signal connector.Or, under another optional implementation, the first printed circuit board (PCB) 11
Arrangement high-speed data signal layer is can be also used for, the second printed circuit board (PCB) 12 is used to arrange low speed data signals layer.Equally, second
Printed circuit board (PCB) 12 is additionally operable to arrangement power supply signal layer.Now, the first connector 14 can include low speed data signal connector
And power supply signal connector.
Specific implementation two
In the specific implementation two, the first layer in first printed circuit board (PCB) 11 can include data letter
The second layer in number floor, second printed circuit board (PCB) 12 can include power supply signal layer；Now, referring to Fig. 3, first connects
Power supply signal connector 142 can only be included by connecing device, and the second connector then includes data signal connector 151 and power supply signal
Connector 152.Wherein, the data-signal layer in the first printed circuit board (PCB) 11 can include high-speed data signal layer and low speed number
According to signals layer, second connector 15 includes high-speed data signal connector, low speed data signal connector and power supply letter
Number connector.
It should be noted that because power supply signal layer is typically all to be located at the second printed circuit board (PCB) 12, therefore, the second printing
Circuit board can also be connected to the 4th printed circuit board (PCB) by power supply transfer connector, referring to Fig. 3, the 4th printed circuit board (PCB)
For providing system power supply, therefore, also referred to as power supply backplane, system power supply line can be connected to the 4th printing by power module
Circuit board, is that the 3rd printed circuit board (PCB) is powered by the 4th printed circuit board (PCB).On part related to power supply in Fig. 2, Ke Yiyu
It is similar in Fig. 3, repeat no more here.
It is described above several distribution modes of the layer needed to use during the work of the 3rd printed circuit board (PCB).In practical application
In, it can be selected according to actual situation, or other modes of the selection under same idea are realized.It is preferred that, can
It is equal with the quantity of the second layer in the second printed circuit board (PCB) to cause the quantity of the first layer in the first printed circuit board (PCB) 11,
Or it is close.So system cost control can be arrived minimum.
As it was noted above, the 3rd printed circuit board (PCB) 13 only carries out thing with the first printed circuit board (PCB) 11 by the second connector 14
Reason connection, and do not have direct physical connection between the 3rd printed circuit board (PCB) 13 and the second printed circuit board (PCB) 12, that is to say, that
All 3rd printed circuit board (PCB)s 13 are just connected in one of plane of the first printed circuit board (PCB) 11, it is not necessary to the second printing
Circuit board carries out physical connection, can so cause whole system face on the basis of the first printed circuit board (PCB) 11, so can be so as to
In the allowance control of the system of progress.
Above-mentioned implementation also has other advantages except in addition to the advantage in terms of being convenient for allowance control, for example,
The advantage of wherein one side is mainly reflected in：Because the 3rd printed circuit board (PCB) 13 only needs to be connected to the first printed circuit board (PCB) 11
On, it is not necessary to physical connection is carried out with the second printed circuit board (PCB) 12, therefore, whole system can both help frame equipment, also may be used
To make half frame equipment.Wherein, full frame equipment is higher in height, generally there is two layers of the 3rd printed circuit board (PCB)s 13, number of slots
More than or equal to 16, such equipment can only be put in a rack, other equipment are placed without space.Half frame equipment：
Shorter in height, usual only one layer of the 3rd printed circuit board (PCB) 13, number of slots is typically smaller than equal to 10, and rack can be with
Place two such equipment.
Certainly, the 3rd printed circuit board (PCB) 13 in specific works, it is necessary to rely on first layer and the second layer.That is, the 3rd
Printed circuit board (PCB) 13 needs to be electrically connected with first layer and the second layer respectively, to carry out the transmission of signal, and obtains power supply
Energy.Wherein, for the first layer on the first printed circuit board (PCB) 11, the 3rd printed circuit board (PCB) 13 can directly pass through described second
Connector 14 is realized with the first layer and electrically connected.And on the second layer on the second printed circuit board (PCB) 12, the 3rd printing
Circuit board 13 can be connected by second connector 15, first connector 14 and second connector 15 and first
The wire between device 14 is connect, realizes and electrically connects with the second layer.
It is can have wire between first connector 14 and the second connector 15.Intercommunication can be carried out between the two, from
And electrically connected so that being realized between the 3rd printed circuit board (PCB) 13 and the second layer.When implementing, the first connector 14 and second connects
Connecing the wire between device 15 can be accomplished in several ways.For example, under in one way in which, the first connector 14 is with having
It can be attached between second connector 15 of corresponding relation by way of sharing same encapsulated holes, that is to say, that described
Wire between first connector 14 and the second connector 15 can be placed through the encapsulation of first printed circuit board (PCB) 11
Hole.Or, can also be by the wire arrangements between the first connector 14 and the second connector 15 under another implementation
In the first printed circuit board (PCB) 11 in specific layer, that is to say, that now, the first connector 14 and second with corresponding relation
Connector 15 can be without sharing same encapsulated holes, and both physical locations on the first printed circuit board (PCB) 11 can be different
, but can be connected between the two by wire, this wire is located in the first printed circuit board (PCB) 11 in specific layer.Need
It is bright, on a certain layer, after the deployment of specific circuit is completed, there may be some idle regions.It therefore, it can
Aforementioned wire is arranged in these clear areas, the normal work of the layer where wire is not interfered with.
Optionally, in above-mentioned technical proposal, second printed circuit board (PCB) includes multiple printed circuit board (PCB)s, the second layer
Including multilayer, each printed circuit board (PCB) includes at least one layer in the multilayer in the multiple printed circuit board (PCB).
Optionally, in above-mentioned technical proposal, the multiple printed circuit board (PCB) is located at approximately the same plane.
It should be noted that due to when the first printed circuit board (PCB) 11 is connected with the second printed circuit board (PCB) 12, the area of connection
Than larger, the quantity of the first connector 14 also can be relatively more, it is necessary to which contact engaging and separating force can install just relatively difficult than larger.In addition, the
The contact engaging and separating force of a connector 14 may also can by tolerance stack to one than larger numerical value, cause the more difficult control of system tolerance
System.Therefore, in the case where the Area comparison of the second printed circuit board (PCB) 12 is big, it is also designed to the printed circuit board (PCB) of polylith second
12, every piece of second printed circuit board (PCB) 12 can include a part of layer, and pass through the first connector 14 and the first printed circuit board (PCB)
11 connections.So, when installing the second printed circuit board (PCB) 12, the contact engaging and separating force of each second printed circuit board (PCB) 12 just subtracting at double
It is few, it is easy for much when actual installation, and tolerance stack can also be avoided excessive.
When implementing, the second printed circuit board (PCB) 12 can include multiple printed circuit board (PCB)s and (be referred to as polylith second and print electricity
Road plate 12).Connectionless between each printed circuit board 12, the second printed circuit board (PCB) 12 can be with placed side by side.For example, with reference to Fig. 4-
1, two piece of second printed circuit board (PCB), respectively the second printed circuit board (PCB) 121, and the second printed circuit board (PCB) 122, two pieces can be included
Second printed circuit board (PCB) is placed side by side.Or, the mode that two piece of second printed circuit board (PCB) 12 can also be as shown in the Fig. 4-2 is placed.
Furthermore, four piece of second printed circuit board (PCB) can also be included, as shown in Fig. 4-3, can include the second printed circuit board (PCB) 123,124,
125th, 126, etc..
In a word, in system provided in an embodiment of the present invention, following effect can at least be reached：
First, system can include the first printed circuit board (PCB), the second printed circuit board (PCB) and the 3rd printed circuit board (PCB), its
In, the layer required when working of the 3rd printed circuit board (PCB) in system can be distributed in the first printed circuit board (PCB), the second printed circuit
On plate, the number of plies of single printed circuit board is so reduced, is easy to reduce system cost.
Second, it can be attached by connector between printed circuit board (PCB), technique is simple, it is not necessary to use high-precision machine
Tool device is fixed.
3rd, the connector between printed circuit board (PCB) can also play a part of electrical connection, and the 3rd printed circuit board (PCB) can be with
It is connected solely on the first printed circuit board (PCB), it is not necessary to there is direct physical connection between the second printed circuit board (PCB), therefore, make
Whole system can be convenient for allowance control using the first printed circuit board (PCB) as reference plane, also, whole system both can be with
Frame equipment is helped, half frame equipment can also be made.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention described should be defined by scope of the claims.
Claims (10)
1. a kind of printed circuit board system, it is characterised in that the system includes the first printed circuit board (PCB), the second printed circuit board (PCB)
And the 3rd printed circuit board (PCB), the first connection end of the first connector is installed in the first plane of first printed circuit board (PCB)
First connection terminal of the second connector, second printing are installed in son, the second plane of first printed circuit board (PCB)
Second connection terminal of first connector is installed, the 3rd printed circuit board (PCB) is provided with the first plane of circuit board
Second connection terminal of second connector；
Second printed circuit board (PCB) is connected to first printed circuit board (PCB), specifically, institute by first connector
The second printed circuit board (PCB) is stated to be connected to installed in the described first printing by second connection terminal of first connector
First connection terminal of first connector on circuit board, first printed circuit board (PCB) and the described second printing electricity
Road plate is parallel；
3rd printed circuit board (PCB) is connected to first printed circuit board (PCB) by second connector；
Wherein, first printed circuit board (PCB) includes first layer, and second printed circuit board (PCB) includes the second layer, the 3rd print
The layer that printed circuit board is needed to use when working includes the first layer and the second layer, and the 3rd printed circuit board (PCB) passes through institute
State the second connector and the first layer and realize and electrically connect, the 3rd printed circuit board (PCB) passes through second connector, described
Wire and first connector between second connector and the first connector are realized with the second layer to be electrically connected.
2. system according to claim 1, it is characterised in that the first layer in first printed circuit board (PCB) includes
The second layer in data-signal layer, second printed circuit board (PCB) includes power supply signal layer and data-signal layer；
First connector includes data signal connector and power supply signal connector, and second connector includes data
Signal connector and power supply signal connector.
3. system according to claim 2, it is characterised in that the data-signal layer in first printed circuit board (PCB) includes
Data-signal layer in high-speed data signal layer, second printed circuit board (PCB) includes high-speed data signal layer and low speed data
Signals layer；
First connector includes high-speed data signal connector, low speed data signal connector and power supply signal connection
Device.
4. system according to claim 2, it is characterised in that the data-signal layer in first printed circuit board (PCB) includes
Data-signal layer in high-speed data signal layer, second printed circuit board (PCB) includes low speed data signals layer；
First connector includes low speed data signal connector and power supply signal connector.
5. system according to claim 1, it is characterised in that the first layer in first printed circuit board (PCB) includes
The second layer in data-signal layer, second printed circuit board (PCB) includes power supply signal layer；
First connector includes power supply signal connector, and second connector includes data signal connector and power supply
Signal connector.
6. system according to claim 5, it is characterised in that the data-signal layer in first printed circuit board (PCB) includes
High-speed data signal layer and low speed data signals layer；Second connector includes high-speed data signal connector, low speed number
According to signal connector and power supply signal connector.
7. the system according to any one of claim 1 to 6, it is characterised in that the 3rd printed circuit board (PCB) and described the
Two layers are realized that electrical connection is specifically included：
Wire between first connector and the second connector is placed through the encapsulated holes of first printed circuit board (PCB).
8. the system according to any one of claim 1 to 6, it is characterised in that the 3rd printed circuit board (PCB) and described the
Two layers are realized that electrical connection is specifically included：
Wire between first connector and the second connector is located at the layer of first printed circuit board (PCB).
9. the system according to any one of claim 1 to 6, it is characterised in that second printed circuit board (PCB) includes multiple
Printed circuit board (PCB), the second layer, which includes each printed circuit board (PCB) in multilayer, the multiple printed circuit board (PCB), includes the multilayer
In at least one layer.
10. system according to claim 9, it is characterised in that the multiple printed circuit board (PCB) is located at approximately the same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510068387.9A CN104752851B (en) | 2015-02-09 | 2015-02-09 | A kind of system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510068387.9A CN104752851B (en) | 2015-02-09 | 2015-02-09 | A kind of system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104752851A CN104752851A (en) | 2015-07-01 |
| CN104752851B true CN104752851B (en) | 2017-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510068387.9A Active CN104752851B (en) | 2015-02-09 | 2015-02-09 | A kind of system |
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| Country | Link |
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| CN (1) | CN104752851B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204761835U (en) * | 2015-06-10 | 2015-11-11 | 中兴通讯股份有限公司 | One -board |
| CN105449476A (en) * | 2015-12-29 | 2016-03-30 | 广东欧珀移动通信有限公司 | Circuit board connection assembly and mobile terminal |
| CN105843338A (en) * | 2016-03-31 | 2016-08-10 | 乐视控股（北京）有限公司 | Peripheral component interconnect |
| CN108882525A (en) * | 2018-08-24 | 2018-11-23 | 郑州云海信息技术有限公司 | A kind of compression bonding method of pcb board and PCB frontback connection device |
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| CN101953028A (en) * | 2008-02-11 | 2011-01-19 | Z型普拉内公司 | The interconnected set component that is used for printed circuit board (PCB) |
| CN101951340A (en) * | 2010-09-14 | 2011-01-19 | 北京星网锐捷网络技术有限公司 | Backboard, board card and network device |
| CN102307142A (en) * | 2011-08-19 | 2012-01-04 | 中兴通讯股份有限公司 | Back plate system |
| CN202196933U (en) * | 2011-08-23 | 2012-04-18 | 李洋银 | Electric connector |
| CN102610938A (en) * | 2012-03-16 | 2012-07-25 | 四川九洲光电科技股份有限公司 | Circuit board connecting structure and connecting method for circuit board connecting structure |
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|---|---|---|---|---|
| CN101953028A (en) * | 2008-02-11 | 2011-01-19 | Z型普拉内公司 | The interconnected set component that is used for printed circuit board (PCB) |
| CN101951340A (en) * | 2010-09-14 | 2011-01-19 | 北京星网锐捷网络技术有限公司 | Backboard, board card and network device |
| CN102307142A (en) * | 2011-08-19 | 2012-01-04 | 中兴通讯股份有限公司 | Back plate system |
| CN202196933U (en) * | 2011-08-23 | 2012-04-18 | 李洋银 | Electric connector |
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| CN104752851A (en) | 2015-07-01 |
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