CN108777430A - 同轴封装光组件及同轴封装激光器 - Google Patents
同轴封装光组件及同轴封装激光器 Download PDFInfo
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- CN108777430A CN108777430A CN201810959391.8A CN201810959391A CN108777430A CN 108777430 A CN108777430 A CN 108777430A CN 201810959391 A CN201810959391 A CN 201810959391A CN 108777430 A CN108777430 A CN 108777430A
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- light
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- 230000003287 optical effect Effects 0.000 title claims abstract description 93
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000000523 sample Substances 0.000 claims abstract description 18
- 239000004065 semiconductor Substances 0.000 claims description 21
- 239000000919 ceramic Substances 0.000 claims description 17
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 11
- 238000012544 monitoring process Methods 0.000 abstract description 9
- 238000012806 monitoring device Methods 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000035800 maturation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4263—Details of housings characterised by the shape of the housing of the transisitor outline [TO] can type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810959391.8A CN108777430A (zh) | 2018-08-22 | 2018-08-22 | 同轴封装光组件及同轴封装激光器 |
Applications Claiming Priority (1)
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CN201810959391.8A CN108777430A (zh) | 2018-08-22 | 2018-08-22 | 同轴封装光组件及同轴封装激光器 |
Publications (1)
Publication Number | Publication Date |
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CN108777430A true CN108777430A (zh) | 2018-11-09 |
Family
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CN201810959391.8A Pending CN108777430A (zh) | 2018-08-22 | 2018-08-22 | 同轴封装光组件及同轴封装激光器 |
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CN (1) | CN108777430A (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020103277A1 (zh) * | 2018-11-23 | 2020-05-28 | 武汉电信器件有限公司 | 一种高速eml同轴发射组件及其制作方法 |
CN111708514A (zh) * | 2020-08-06 | 2020-09-25 | 世融能量科技有限公司 | 基于光子集成技术的真空涨落量子随机数发生器芯片 |
CN112713493A (zh) * | 2020-12-29 | 2021-04-27 | 华中光电技术研究所(中国船舶重工集团公司第七一七研究所) | 可提高抗热损伤性能的半导体可饱和吸收镜及其制作方法 |
CN113839301A (zh) * | 2021-09-23 | 2021-12-24 | 成都英思嘉半导体技术有限公司 | 高速光信号发射器件的壳体组件及高速光信号发射器件 |
CN113922207A (zh) * | 2021-10-08 | 2022-01-11 | 中国电子科技集团公司第四十四研究所 | 基于量子点激光器及InGaAs探测器的高速高精度线性光耦 |
CN116344471A (zh) * | 2023-05-26 | 2023-06-27 | 四川九州光电子技术有限公司 | 一种to封装结构、载具 |
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CN1519829A (zh) * | 2002-12-26 | 2004-08-11 | 索尼公司 | 半导体集成装置 |
CN1721899A (zh) * | 2004-02-11 | 2006-01-18 | Jds尤尼弗思公司 | 小型光学分组件 |
US20060198404A1 (en) * | 2005-03-07 | 2006-09-07 | Henrichs Joseph R | Optical phase conjugation laser diode |
CN102811097A (zh) * | 2011-05-31 | 2012-12-05 | 深圳新飞通光电子技术有限公司 | Olt模块用单光纤双向光收发一体组件 |
CN104051954A (zh) * | 2014-06-19 | 2014-09-17 | 中国科学院半导体研究所 | 应用于光电子器件光信号监测的光耦合结构 |
CN104285344A (zh) * | 2013-03-26 | 2015-01-14 | 光速株式会社 | 可制作小型的可变波长激光装置 |
CN104350652A (zh) * | 2013-06-10 | 2015-02-11 | 光速株式会社 | 具有波长稳定化装置的激光装置 |
CN104734782A (zh) * | 2013-12-19 | 2015-06-24 | 华为技术有限公司 | 光发射组件及其组装方法 |
CN104917048A (zh) * | 2015-07-06 | 2015-09-16 | 大连藏龙光电子科技有限公司 | 一种小型封装的长距传输dfb激光器 |
WO2017049256A1 (en) * | 2015-09-17 | 2017-03-23 | Elenion Technologies, Llc | Optical paired channel transceiver and system |
CN208608529U (zh) * | 2018-08-22 | 2019-03-15 | 苏州易锐光电科技有限公司 | 同轴封装光组件及同轴封装激光器 |
-
2018
- 2018-08-22 CN CN201810959391.8A patent/CN108777430A/zh active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1519829A (zh) * | 2002-12-26 | 2004-08-11 | 索尼公司 | 半导体集成装置 |
CN1721899A (zh) * | 2004-02-11 | 2006-01-18 | Jds尤尼弗思公司 | 小型光学分组件 |
US20060198404A1 (en) * | 2005-03-07 | 2006-09-07 | Henrichs Joseph R | Optical phase conjugation laser diode |
CN102811097A (zh) * | 2011-05-31 | 2012-12-05 | 深圳新飞通光电子技术有限公司 | Olt模块用单光纤双向光收发一体组件 |
CN104285344A (zh) * | 2013-03-26 | 2015-01-14 | 光速株式会社 | 可制作小型的可变波长激光装置 |
CN104350652A (zh) * | 2013-06-10 | 2015-02-11 | 光速株式会社 | 具有波长稳定化装置的激光装置 |
CN104734782A (zh) * | 2013-12-19 | 2015-06-24 | 华为技术有限公司 | 光发射组件及其组装方法 |
CN104051954A (zh) * | 2014-06-19 | 2014-09-17 | 中国科学院半导体研究所 | 应用于光电子器件光信号监测的光耦合结构 |
CN104917048A (zh) * | 2015-07-06 | 2015-09-16 | 大连藏龙光电子科技有限公司 | 一种小型封装的长距传输dfb激光器 |
WO2017049256A1 (en) * | 2015-09-17 | 2017-03-23 | Elenion Technologies, Llc | Optical paired channel transceiver and system |
CN208608529U (zh) * | 2018-08-22 | 2019-03-15 | 苏州易锐光电科技有限公司 | 同轴封装光组件及同轴封装激光器 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020103277A1 (zh) * | 2018-11-23 | 2020-05-28 | 武汉电信器件有限公司 | 一种高速eml同轴发射组件及其制作方法 |
EP3885807A4 (en) * | 2018-11-23 | 2022-08-31 | Wuhan Telecommunication Devices Co., Ltd. | HIGH SPEED EML COAXIAL TRANSMISSION MODULE AND METHOD OF MAKING IT |
CN111708514A (zh) * | 2020-08-06 | 2020-09-25 | 世融能量科技有限公司 | 基于光子集成技术的真空涨落量子随机数发生器芯片 |
WO2022028078A1 (zh) * | 2020-08-06 | 2022-02-10 | 世融能量科技有限公司 | 基于光子集成技术的真空涨落量子随机数发生器芯片 |
US11853720B2 (en) | 2020-08-06 | 2023-12-26 | Shrong Energy Technology Co., Ltd. | Vacuum fluctuation quantum random number generator chip based on photonic integration technology |
CN112713493A (zh) * | 2020-12-29 | 2021-04-27 | 华中光电技术研究所(中国船舶重工集团公司第七一七研究所) | 可提高抗热损伤性能的半导体可饱和吸收镜及其制作方法 |
CN113839301A (zh) * | 2021-09-23 | 2021-12-24 | 成都英思嘉半导体技术有限公司 | 高速光信号发射器件的壳体组件及高速光信号发射器件 |
CN113922207A (zh) * | 2021-10-08 | 2022-01-11 | 中国电子科技集团公司第四十四研究所 | 基于量子点激光器及InGaAs探测器的高速高精度线性光耦 |
CN116344471A (zh) * | 2023-05-26 | 2023-06-27 | 四川九州光电子技术有限公司 | 一种to封装结构、载具 |
CN116344471B (zh) * | 2023-05-26 | 2023-08-01 | 四川九州光电子技术有限公司 | 一种to封装结构、载具 |
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Effective date of registration: 20240426 Address after: 518000 a1706, Shenzhen national engineering laboratory building, No. 20, Gaoxin South seventh Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen, Guangdong Applicant after: Shenzhen Yingu Jianke Network Co.,Ltd. Country or region after: China Applicant after: Shenzhen Iridium Semiconductor Technology Co.,Ltd. Address before: Room 301A, building 13, Xibei District, Suzhou nano City, No. 99, Jinjihu Avenue, Suzhou Industrial Park, Suzhou, Jiangsu Province Applicant before: SUZHOU YIRUI OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Country or region before: China |
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