CN108774606A - A kind of cleaning agent and preparation method for removing printed wiring board bloom residue - Google Patents
A kind of cleaning agent and preparation method for removing printed wiring board bloom residue Download PDFInfo
- Publication number
- CN108774606A CN108774606A CN201810619808.6A CN201810619808A CN108774606A CN 108774606 A CN108774606 A CN 108774606A CN 201810619808 A CN201810619808 A CN 201810619808A CN 108774606 A CN108774606 A CN 108774606A
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- Prior art keywords
- parts
- cleaning agent
- residue
- bloom
- wiring board
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims abstract description 81
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims abstract description 59
- HKCNCNXZAZPKDZ-UHFFFAOYSA-N (4,4-difluorocyclohexa-1,5-dien-1-yl)-phenylmethanone Chemical class C1=CC(F)(F)CC=C1C(=O)C1=CC=CC=C1 HKCNCNXZAZPKDZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- PQHYOGIRXOKOEJ-UHFFFAOYSA-N 2-(1,2-dicarboxyethylamino)butanedioic acid Chemical compound OC(=O)CC(C(O)=O)NC(C(O)=O)CC(O)=O PQHYOGIRXOKOEJ-UHFFFAOYSA-N 0.000 claims abstract description 21
- IPWBXORAIBJDDQ-UHFFFAOYSA-N methyl 2-hexyl-3-oxocyclopentane-1-carboxylate Chemical compound CCCCCCC1C(C(=O)OC)CCC1=O IPWBXORAIBJDDQ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920002385 Sodium hyaluronate Polymers 0.000 claims abstract description 19
- 229940010747 sodium hyaluronate Drugs 0.000 claims abstract description 19
- YWIVKILSMZOHHF-QJZPQSOGSA-N sodium;(2s,3s,4s,5r,6r)-6-[(2s,3r,4r,5s,6r)-3-acetamido-2-[(2s,3s,4r,5r,6r)-6-[(2r,3r,4r,5s,6r)-3-acetamido-2,5-dihydroxy-6-(hydroxymethyl)oxan-4-yl]oxy-2-carboxy-4,5-dihydroxyoxan-3-yl]oxy-5-hydroxy-6-(hydroxymethyl)oxan-4-yl]oxy-3,4,5-trihydroxyoxane-2- Chemical compound [Na+].CC(=O)N[C@H]1[C@H](O)O[C@H](CO)[C@@H](O)[C@@H]1O[C@H]1[C@H](O)[C@@H](O)[C@H](O[C@H]2[C@@H]([C@@H](O[C@H]3[C@@H]([C@@H](O)[C@H](O)[C@H](O3)C(O)=O)O)[C@H](O)[C@@H](CO)O2)NC(C)=O)[C@@H](C(O)=O)O1 YWIVKILSMZOHHF-QJZPQSOGSA-N 0.000 claims abstract description 19
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 8
- 150000002500 ions Chemical group 0.000 abstract description 3
- 230000002421 anti-septic effect Effects 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 23
- 229960001760 dimethyl sulfoxide Drugs 0.000 description 15
- 238000004140 cleaning Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 8
- 235000019441 ethanol Nutrition 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- YCIXWYOBMVNGTB-UHFFFAOYSA-N 3-methyl-2-pentylcyclopent-2-en-1-one Chemical compound CCCCCC1=C(C)CCC1=O YCIXWYOBMVNGTB-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000004702 methyl esters Chemical class 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 101100256637 Drosophila melanogaster senju gene Proteins 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical group C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012085 test solution Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/266—Esters or carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/268—Carbohydrates or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/28—Organic compounds containing halogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- C11D2111/22—
Abstract
The invention discloses a kind of cleaning agents and preparation method for removing printed wiring board bloom residue.The cleaning agent includes the component of following parts by weight：22-35 parts of dihydrojasmonate, 15-22 parts of iminodisuccinic acid, 7-15 parts of catechol, 5-10 parts of 4,4- difluoro benzophenones, 6-11 parts of Sodium Hyaluronate, 5-13 parts of dimethyl sulfoxide (DMSO).The cleaning agent of the present invention can effectively remove bloom residue on wiring board, have excellent removal ability for rosin residual and ion residues, removal rate is up to 99% or more；And its antiseptic property greatly enhances, and can prevent phenomena such as the corroding that change colour；Preparation method is simple, is conducive to produce, be worthy to be popularized.
Description
Technical field
It is specifically a kind of for removing printed wiring board bloom residue the present invention relates to electron chemistry field of material technology
Cleaning agent and preparation method.
Background technology
Pcb board, i.e. printed circuit board, also known as printed circuit board are cut into certain size using insulation board as base material, up to
Attached less there are one conductive patterns, and are furnished with hole (such as component hole, fastener hole, plated through-hole), are used for replacing previous device electronics
The chassis of component, and realize the interconnection between electronic component.
After the cleaning of electronics and IT products pcb board welding at present, some are remained similar to bloom residue in plate face, this is PCB
Plate cleaning for a long time unsolved problem and solvent type pcb board cleaning agent fail break through the problem of.Bloom residue category
When rosin or other organic residues are using rosin tree esters scaling powder and solder(ing) paste dress connection welding wiring board, in high-temperature soldering
Under the conditions of, PCB surface can often generate white rosin acid salt residue, and halide and organic acid in water-soluble flux
Comparision contents it is high, there is stronger acidity, when high-temperature soldering on wiring board solder joint and pad chemical reaction occurs and generates
The metal halide salt of white, these white residues are that cleaning rear board whitens to form the main of the bloom for being not easy to remove
Reason.These substances not only influence complete machine cleannes and also result in use environment pollution.Climate changes, and temperature, which increases, reduces humidity
It influences, in the operation of pcb board circuit, it is possible to produce parameter, insulation resistance declines between circuit spacing, or generates electromigration.Especially
It makes the rapid growth of tin content between solder joint bonding wire under high temperature salt mist environment, causes short circuit, influences complete machine and uses essence
Degree and reliability lead to not work normally.Existing rinse product is also difficult to clean off this kind of bloom class residue.This is not only
Cause the unqualified electric property that can more importantly influence wiring board of wiring board appearance, some leaning solvent acid values are high,
Temperature is high, and Reusability butt welding point has corrosion, this is electronic material welding field urgent problem.
Invention content
The purpose of the present invention is to provide a kind of cleaning agent and preparation sides for removing printed wiring board bloom residue
Method, to solve the problems mentioned in the above background technology.
To achieve the above object, the present invention provides the following technical solutions：
A kind of cleaning agent for removing printed wiring board bloom residue, the cleaning agent includes following parts by weight
Component：22-35 parts of dihydrojasmonate, 15-22 parts of iminodisuccinic acid, 7-15 parts of catechol, 4,4- difluoros two
5-10 parts of Benzophenone, 6-11 parts of Sodium Hyaluronate, 5-13 parts of dimethyl sulfoxide (DMSO).
As a further solution of the present invention：The cleaning agent includes the component of following parts by weight：Dihydro jasmone acid
26-33 parts of methyl esters, 17-20 parts of iminodisuccinic acid, 9-12 parts of catechol, 7-9 parts of 4,4- difluoro benzophenones, hyalomitome
Sour sodium 8-10 parts, 8-11 parts of dimethyl sulfoxide (DMSO).
As a further solution of the present invention：The cleaning agent includes the component of following parts by weight：Dihydro jasmone acid
31 parts of methyl esters, 18 parts of iminodisuccinic acid, 11 parts of catechol, 8 parts of 4,4- difluoro benzophenones, 9 parts of Sodium Hyaluronate, two
10 parts of methyl sulfoxide.
A kind of preparation method for removing the cleaning agent of printed wiring board bloom residue includes the following steps：
(1) dihydrojasmonate, 4,4- difluoro benzophenones and Sodium Hyaluronate are mixed, mixture 5-8 is added
70% ethanol solution of times quality, is placed at 55-70 DEG C and is stirred to react 15-30min；
(2) catechol is mixed with the water of its 3-5 times of quality, is placed at 75-80 DEG C and stirs evenly to get catechol
Solution；
(3) iminodisuccinic acid is mixed with dimethyl sulfoxide (DMSO), is placed at 60-70 DEG C and stirs evenly；
(4) step (1) gains are mixed with step (3) gains, is placed at 58-65 DEG C and is stirred to react 20-30min；
(5) step (2) gains are mixed with step (4) gains, are placed at 50-60 DEG C and are stirred to react 10-20min,
To obtain the final product.
As a further solution of the present invention：Step (1) by dihydrojasmonate, 4,4- difluoro benzophenones and thoroughly
Bright matter acid sodium mixing, is added 70% ethanol solution of 7 times of quality of mixture, is placed at 60 DEG C and is stirred to react 22min.
As a further solution of the present invention：Step (2) mixes catechol with the water of its 4 times of quality, is placed in 78 DEG C
Under stir evenly to get catechol solution.
As a further solution of the present invention：Step (3) mixes iminodisuccinic acid with dimethyl sulfoxide (DMSO), is placed in 65
It is stirred evenly at DEG C.
As a further solution of the present invention：Step (4) mixes step (1) gains with step (3) gains, is placed in
It is stirred to react 24min at 60 DEG C.
As a further solution of the present invention：Step (5) mixes step (2) gains with step (4) gains, is placed in
Be stirred to react at 57 DEG C 16min to get.
Compared with prior art, the beneficial effects of the invention are as follows：
The cleaning agent of the present invention can effectively remove bloom residue on wiring board, have for rosin residual and ion residues
Excellent removal ability, removal rate is up to 99% or more；And its antiseptic property greatly enhances, can prevent discoloration corrode phenomena such as send out
It is raw；Preparation method is simple, is conducive to produce, be worthy to be popularized.
Specific implementation mode
The technical solution of this patent is described in more detail With reference to embodiment.
Embodiment 1
A kind of cleaning agent for removing printed wiring board bloom residue, the cleaning agent includes following parts by weight
Component：22 parts of dihydrojasmonate, 15 parts of iminodisuccinic acid, 7 parts of catechol, 5 parts of 4,4- difluoro benzophenones,
6 parts of Sodium Hyaluronate, 5 parts of dimethyl sulfoxide (DMSO).
A kind of preparation method for removing the cleaning agent of printed wiring board bloom residue includes the following steps：(1) will
Dihydrojasmonate, 4,4- difluoro benzophenones and Sodium Hyaluronate mixing, are added 70% ethyl alcohol of 5 times of quality of mixture
Solution is placed at 55 DEG C and is stirred to react 15min；(2) catechol is mixed with the water of its 3 times of quality, is placed at 75 DEG C and stirs
Uniformly to get catechol solution；(3) iminodisuccinic acid is mixed with dimethyl sulfoxide (DMSO), is placed at 60 DEG C and stirs evenly；
(4) step (1) gains are mixed with step (3) gains, is placed at 58 DEG C and is stirred to react 20min；(5) by step (2) institute
Object mixed with step (4) gains, be placed at 50 DEG C be stirred to react 10min to get.
Embodiment 2
A kind of cleaning agent for removing printed wiring board bloom residue, the cleaning agent includes following parts by weight
Component：35 parts of dihydrojasmonate, 22 parts of iminodisuccinic acid, 15 parts of catechol, 4,4- difluoro benzophenones 10
Part, 11 parts of Sodium Hyaluronate, 13 parts of dimethyl sulfoxide (DMSO).
A kind of preparation method for removing the cleaning agent of printed wiring board bloom residue includes the following steps：(1) will
Dihydrojasmonate, 4,4- difluoro benzophenones and Sodium Hyaluronate mixing, are added 70% ethyl alcohol of 8 times of quality of mixture
Solution is placed at 70 DEG C and is stirred to react 30min；(2) catechol is mixed with the water of its 5 times of quality, is placed at 80 DEG C and stirs
Uniformly to get catechol solution；(3) iminodisuccinic acid is mixed with dimethyl sulfoxide (DMSO), is placed at 70 DEG C and stirs evenly；
(4) step (1) gains are mixed with step (3) gains, is placed at 65 DEG C and is stirred to react 30min；(5) by step (2) institute
Object mixed with step (4) gains, be placed at 60 DEG C be stirred to react 20min to get.
Embodiment 3
A kind of cleaning agent for removing printed wiring board bloom residue, the cleaning agent includes following parts by weight
Component：31 parts of dihydrojasmonate, 18 parts of iminodisuccinic acid, 11 parts of catechol, 4,4- difluoro benzophenones 8
Part, 9 parts of Sodium Hyaluronate, 10 parts of dimethyl sulfoxide (DMSO).
A kind of preparation method for removing the cleaning agent of printed wiring board bloom residue includes the following steps：(1) will
Dihydrojasmonate, 4,4- difluoro benzophenones and Sodium Hyaluronate mixing, are added 70% ethyl alcohol of 7 times of quality of mixture
Solution is placed at 60 DEG C and is stirred to react 22min.(2) catechol is mixed with the water of its 4 times of quality, is placed at 78 DEG C and stirs
Uniformly to get catechol solution.(3) iminodisuccinic acid is mixed with dimethyl sulfoxide (DMSO), is placed at 65 DEG C and stirs evenly.
(4) step (1) gains are mixed with step (3) gains, is placed at 60 DEG C and is stirred to react 24min.(5) by step (2) institute
Object mixed with step (4) gains, be placed at 57 DEG C be stirred to react 16min to get.
Embodiment 4
A kind of cleaning agent for removing printed wiring board bloom residue, the cleaning agent includes following parts by weight
Component：26 parts of dihydrojasmonate, 17 parts of iminodisuccinic acid, 9 parts of catechol, 7 parts of 4,4- difluoro benzophenones,
8 parts of Sodium Hyaluronate, 8 parts of dimethyl sulfoxide (DMSO).
A kind of preparation method for removing the cleaning agent of printed wiring board bloom residue includes the following steps：(1) will
Dihydrojasmonate, 4,4- difluoro benzophenones and Sodium Hyaluronate mixing, are added 70% ethyl alcohol of 6 times of quality of mixture
Solution is placed at 57 DEG C and is stirred to react 23min；(2) catechol is mixed with the water of its 3.5 times of quality, is placed at 78 DEG C and stirs
It mixes uniformly to get catechol solution；(3) iminodisuccinic acid is mixed with dimethyl sulfoxide (DMSO), is placed at 66 DEG C and stirs
It is even；(4) step (1) gains are mixed with step (3) gains, is placed at 61 DEG C and is stirred to react 23min；(5) by step (2)
Gains are mixed with step (4) gains, be placed at 53 DEG C be stirred to react 14min to get.
Embodiment 5
A kind of cleaning agent for removing printed wiring board bloom residue, the cleaning agent includes following parts by weight
Component：33 parts of dihydrojasmonate, 20 parts of iminodisuccinic acid, 12 parts of catechol, 4,4- difluoro benzophenones 9
Part, 10 parts of Sodium Hyaluronate, 11 parts of dimethyl sulfoxide (DMSO).
A kind of preparation method for removing the cleaning agent of printed wiring board bloom residue includes the following steps：(1) will
Dihydrojasmonate, 4,4- difluoro benzophenones and Sodium Hyaluronate mixing, are added 70% second of 7.6 times of quality of mixture
Alcoholic solution is placed at 66 DEG C and is stirred to react 27min；(2) catechol is mixed with the water of its 4.3 times of quality, is placed at 77 DEG C
It stirs evenly to get catechol solution；(3) iminodisuccinic acid is mixed with dimethyl sulfoxide (DMSO), is placed at 68 DEG C and stirs
Uniformly；(4) step (1) gains are mixed with step (3) gains, is placed at 62 DEG C and is stirred to react 26min；(5) by step
(2) gains are mixed with step (4) gains, be placed at 58 DEG C be stirred to react 17min to get.
Comparative example 1
Unlike implementation 3, dihydrojasmonate is not added in raw material.
Comparative example 2
Unlike implementation 3,4,4- difluoro benzophenones are not added in raw material.
Comparative example 3
Unlike implementation 3, dihydrojasmonate and 4,4- difluoro benzophenones are not added in raw material.
Experimental example
1, cleaning performance appraisal procedure：Detected PCB is cleaned below by IPC-SA-61 (Post-Solder Semi-
The later half aqueous solvent of Aqueous Cleaning Handbook solderings cleans handbook) regulation technique D carries out welding test.
Solder flux used and SMT tin creams are：Scaling powder model：EF8000, supplier：U.S. Alpha Alpha；Tin
Paste type number：M705-GRN360-K2-V, supplier：Senju lives in Japan thousand.
Assess content：
A rosin residual quantities, range estimation and touch.
State of blush after B cleanings, the plate after cleaning are observed after humidity is 85% and 85 DEG C of processing for 24 hours.
C ion residues object contents, are detected by the standard of IPC standard IPC-TM-650 2.3.26 (ionic pollution degree).
The ranking method of A：0 grade remains without rosin；1 grade locally has minute quantity rosin residual at pcb board edge or pad；
2 grades have apparent rosin residue.
The ranking method of B：0 grade without state of blush；1 grade locally has minute quantity to whiten feelings at the edge of pcb board or pad
Condition；2 grades have the apparent residue that whitens.
The performances evaluation method of C：Qualified pcb board data after cleaning are less than 1.50ug/cm2。
2, the appraisal procedure of environmental corrosion performance
1) high temperature and humidity is tested
According to the method for IPC-TM-650 2.6.15 (scaling powder remnant), the copper PCB that covers of oxide film dissolving will be gone to impregnate
After cleaning agent, at a temperature of 40 ± 3 DEG C and under 93 ± 5% relative humidity, taken out after placing 10 days, observation copper film surface
The discolorations such as corrosion condition, i.e. greening, obfuscation.
2) salt spray resistance is tested
In 500ml beakers, 300ml cleaning agents are poured into, the metal testing plate of copper or aluminium is allowed to be immersed in test solution entirely, each beaker
In, the test piece of 2 same materials is only put, 60 DEG C of processing 5min take out test piece.It is dry after distilled water rinsed clean.By national standard
GBT 10125-1997《Artificial atmosphere corrosion test salt spray test》Carry out salt spray test 8h, the corrosion on observation metal testing plate surface
Situation.
Metal corrosion test rating scale：0 grade：Surface is without significant change；1 grade：Surface slightly uniformly changes colour or loss of gloss；2
Grade：The uneven discoloration in surface, loss of gloss, local spottiness；3 grades：Surface serious discoloration or corrosion.
According to the appraisal procedure of cleaning performance appraisal procedure and environmental corrosion performance to embodiment 1-5 and comparative example 1-3 into
Row performance detection, the results are shown in Table 1.
Table 1
The better embodiment of this patent is explained in detail above, but this patent is not limited to above-mentioned embodiment party
Formula, one skilled in the relevant art within the scope of knowledge, can also be under the premise of not departing from this patent objective
It makes a variety of changes.
Claims (9)
1. a kind of cleaning agent for removing printed wiring board bloom residue, which is characterized in that the cleaning agent includes following
The component of parts by weight：22-35 parts of dihydrojasmonate, 15-22 parts of iminodisuccinic acid, 7-15 parts of catechol,
5-10 parts of 4,4- difluoro benzophenones, 6-11 parts of Sodium Hyaluronate, 5-13 parts of dimethyl sulfoxide (DMSO).
2. the cleaning agent according to claim 1 for removing printed wiring board bloom residue, which is characterized in that described
Cleaning agent includes the component of following parts by weight：26-33 parts of dihydrojasmonate, 17-20 parts of iminodisuccinic acid, neighbour
9-12 parts of benzenediol, 7-9 parts of 4,4- difluoro benzophenones, 8-10 parts of Sodium Hyaluronate, 8-11 parts of dimethyl sulfoxide (DMSO).
3. the cleaning agent according to claim 1 for removing printed wiring board bloom residue, which is characterized in that described
Cleaning agent includes the component of following parts by weight：31 parts of dihydrojasmonate, 18 parts of iminodisuccinic acid, catechol
11 parts, 8 parts of 4,4- difluoro benzophenones, 9 parts of Sodium Hyaluronate, 10 parts of dimethyl sulfoxide (DMSO).
4. a kind of preparation side as described in any one of claims 1-3 for removing the cleaning agent of printed wiring board bloom residue
Method, which is characterized in that include the following steps：
（1）Dihydrojasmonate, 4,4- difluoro benzophenones and Sodium Hyaluronate are mixed, 5-8 times of matter of mixture is added
70% ethanol solution of amount, is placed at 55-70 DEG C and is stirred to react 15-30min；
（2）Catechol is mixed with the water of its 3-5 times of quality, be placed at 75-80 DEG C stir evenly it is molten to get catechol
Liquid；
（3）Iminodisuccinic acid is mixed with dimethyl sulfoxide (DMSO), is placed at 60-70 DEG C and stirs evenly；
（4）By step（1）Gains and step（3）Gains mix, and are placed at 58-65 DEG C and are stirred to react 20-30min；
（5）By step（2）Gains and step（4）Gains mix, be placed at 50-60 DEG C be stirred to react 10-20min to get.
5. the preparation method as claimed in claim 4 for removing the cleaning agent of printed wiring board bloom residue, feature
It is, step（1）Dihydrojasmonate, 4,4- difluoro benzophenones and Sodium Hyaluronate are mixed, 7 times of mixture is added
70% ethanol solution of quality is placed at 60 DEG C and is stirred to react 22min.
6. the preparation method as claimed in claim 4 for removing the cleaning agent of printed wiring board bloom residue, feature
It is, step（2）Catechol is mixed with the water of its 4 times of quality, be placed at 78 DEG C stir evenly it is molten to get catechol
Liquid.
7. the preparation method as claimed in claim 4 for removing the cleaning agent of printed wiring board bloom residue, feature
It is, step（3）Iminodisuccinic acid is mixed with dimethyl sulfoxide (DMSO), is placed at 65 DEG C and stirs evenly.
8. the preparation method as claimed in claim 4 for removing the cleaning agent of printed wiring board bloom residue, feature
It is, step（4）By step（1）Gains and step（3）Gains mix, and are placed at 60 DEG C and are stirred to react 24min.
9. the preparation method as claimed in claim 4 for removing the cleaning agent of printed wiring board bloom residue, feature
It is, step（5）By step（2）Gains and step（4）Gains mix, be placed at 57 DEG C be stirred to react 16min to get.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810619808.6A CN108774606A (en) | 2018-06-14 | 2018-06-14 | A kind of cleaning agent and preparation method for removing printed wiring board bloom residue |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810619808.6A CN108774606A (en) | 2018-06-14 | 2018-06-14 | A kind of cleaning agent and preparation method for removing printed wiring board bloom residue |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103952243A (en) * | 2014-04-18 | 2014-07-30 | 北京朝铂航科技有限公司 | Cleaning agent capable of effectively eliminating white frost residue on circuit board |
| CN104845768A (en) * | 2015-05-12 | 2015-08-19 | 深圳市美克科技有限公司 | Neutral water base cleaning agent combination for circuit board |
| US20170362539A1 (en) * | 2016-06-15 | 2017-12-21 | The Procter & Gamble Company | Liquid Laundry Detergent |
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2018
- 2018-06-14 CN CN201810619808.6A patent/CN108774606A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103952243A (en) * | 2014-04-18 | 2014-07-30 | 北京朝铂航科技有限公司 | Cleaning agent capable of effectively eliminating white frost residue on circuit board |
| CN104845768A (en) * | 2015-05-12 | 2015-08-19 | 深圳市美克科技有限公司 | Neutral water base cleaning agent combination for circuit board |
| US20170362539A1 (en) * | 2016-06-15 | 2017-12-21 | The Procter & Gamble Company | Liquid Laundry Detergent |
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| 温辉梁等: "<<医药中间体产品生产技术>>", 31 May 2005, 江西科学技术出版社 * |
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Application publication date: 20181109 |