CN115433929B - Organic solderability copper surface protective agent and preparation method thereof - Google Patents
Organic solderability copper surface protective agent and preparation method thereof Download PDFInfo
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- CN115433929B CN115433929B CN202211118053.4A CN202211118053A CN115433929B CN 115433929 B CN115433929 B CN 115433929B CN 202211118053 A CN202211118053 A CN 202211118053A CN 115433929 B CN115433929 B CN 115433929B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
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- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses an organic weldable copper surface protective agent, which comprises the following components in mass concentration of 0.5-3.0g/L of composite film forming agent; complexing agent 0.1-1.0g/L; 0.1-1.0g/L auxiliary film forming agent; 100-250g/L of diluent; buffer 2-8g/L; the solvent is water; the composite film forming agent is formed by compounding substituted benzimidazole, benzotriazole and mercaptobenzothiazole. The organic solderable protective agent provided by the invention can effectively inhibit the phenomenon of the galvanic and improve the times of reflow soldering performance by the combined action of the composite film forming agent, the mixed organic acid, the complexing agent, the auxiliary film forming agent and the surfactant, and can form a compact organic solderable protective layer on the copper surface so as to effectively protect the copper surface from being oxidized at high temperature.
Description
Technical Field
The invention relates to the technical field of copper surface treatment in the printed circuit board industry, in particular to a protective agent with solderability of a copper surface in a PCB.
Background
Electronic products are continuously developed towards light, thin and miniaturized, and the functions are more various, so that the printed circuit board also needs to be thinned, multilayered and small-hole, and higher precision is achieved. The application and development of Surface Mount Technology (SMT) for electronic circuits has made the PCB industry face a series of changes. The size of the PCB via hole is more miniaturized, and the buried/blind holes and the inner holes of the tray are more used, so that the requirement on the flatness of the PCB surface is more severe, the hot air leveling process used earlier cannot meet the development requirement of the PCB, the electronic product is more required in the aspect of environmental protection, the treatment technology of the surface plating (coating) layer of the PCB needs to be redeveloped, selected and evaluated by taking leadless as a standard, and the hot air leveling process is not in accordance with the environmental protection requirement because of using Sn-Pb solder and is supposed to be eliminated by the lead-free era.
Organic Solderability Preservative (OSP) has also been a widely used technology today. A thin, uniform and compact organic polymer protective film is formed on the surface of copper by a chemical method, so that the purposes of oxidation resistance and no corrosion by soldering flux are achieved. The organic solderability preservative in the prior art CN201910194583 effectively prevents the gold surface from forming an organic film to influence the conductivity thereof by the combined action of the imidazole compound, the mixed organic acid, the complexing agent, the ferric salt, the zinc salt and the like, and simultaneously, the copper surface can form a compact organic solderability preservative to effectively protect the copper surface from being oxidized at high temperature. To meet the current market demands, how to further improve OSP performance, such as film forming quality and high temperature resistance, is a current mainstream research direction and trend.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, further improve the film forming performance of an organic weldable protective agent, and provide the organic weldable copper surface protective agent, and aims to form a stable and compact protective film to effectively protect a copper surface and improve the oxidation resistance and the high temperature resistance.
In order to solve the technical problems, the invention adopts the following technical scheme:
an organic solderability copper surface protective agent comprises the following components in mass concentration: 5-10.0g/L of composite film forming agent, 0.1-1.0g/L of complexing agent, 0.1-1.0g/L of auxiliary film forming agent, 100-250g/L of diluent, 2-8g/L of buffer agent and 0.1-1.0g/L of surfactant, wherein the composite film forming agent is formed by compounding 5-10 parts of (0.5-0.7) of (5-10) substituted benzimidazole, benzotriazole and mercaptobenzothiazole.
Preferably, the substituted benzimidazoles include any one or more of 2- (2, 4-dichlorophenyl) -4- (2, 4-dichlorophenyl) -5-methylimidazole, 2- (4-chlorophenyl) -4- (2, 4-dichlorophenyl) -5-methylimidazole, 2-phenyl-4- (2, 4-dichlorophenyl) -5-methylimidazole, 2- (4-chlorophenyl) -4- (2, 4-dichlorophenyl) -5-methylimidazole, 2, 4-diphenylimidazole, 2-phenyl-4- (2- (4-chlorophenyl)) -4- (2, 4-dichlorophenyl) imidazole, 2-pentylbenzoimidazole, 2- (4-chlorophenyl) benzimidazole, 2- (2, 4-dichlorophenyl) benzimidazole, or 2- (3, 4-dichlorophenyl) benzimidazole.
Preferably, the complexing agent is any one of EDTA, EDTA-2Na and EDTA-4Na.
Preferably, the auxiliary film forming agent is compounded by medium-chain organic acid.
Preferably, the auxiliary film forming agent is compounded by adipic acid, heptanoic acid and lauric acid in a ratio of 2:1:1.
Preferably, the diluent is one or more of formic acid, acetic acid and propionic acid.
Preferably, the buffering agent is one or more of ethylenediamine, ammonia water, triethanolamine and ethanolamine.
Preferably, the surfactant is sophorolipid.
A preparation method of an organic solderability copper surface protective agent is characterized by comprising the following steps: weighing the raw materials according to the proportion, mixing and stirring.
Compared with the prior art, the invention has the advantages that:
1. the invention adds the first generation OSP film forming substance benzotriazole and mercaptobenzothiazole which can be used as copper protective agent into the substituted benzimidazole with trace components, and the film forming quality and performance of the final product are improved.
2. After the surfactant, namely sophorolipid, is added into the organic weldable copper surface protective agent, the stability and film forming performance of the whole system of the active agent can be effectively improved, and the film forming agent is easier to deposit and adhere on the surface of copper due to the high interfacial activity of sophorolipid, so that film forming agent molecules are sequentially attracted to the deposited film forming agent through hydrogen bonds and Van der Waals force, and a thin and compact polymer film is formed.
3. The auxiliary film forming agent is compounded by a plurality of medium-chain organic acids, so that the film forming effect and the performance after film forming are effectively improved.
4. The components of the invention cooperate and act together, which can effectively inhibit the galvanic phenomenon, improve the times of reflow soldering performance, and form a compact organic solderable protective layer on the copper surface, thereby effectively protecting the copper surface from oxidation at high temperature.
Detailed Description
The organic solderability copper protectants provided by the present invention are described below in connection with the examples, but they should not be construed as limiting the scope of the invention.
Example 1
An organic solderability copper surface protective agent comprises the following components in mass concentration: 5g/L of composite film forming agent, 0.1g/L of complexing agent, 0.1g/L of auxiliary film forming agent, 100g/L of diluent, 2g/L of buffer, 0.1g/L of surfactant and water as solvent, wherein the composite film forming agent is formed by compounding benzimidazole, benzotriazole and mercaptobenzothiazole in a ratio of 5:0.5:0.5.
The substituted benzimidazole is specifically selected from 2- (2, 4-dichlorophenyl) -4- (2, 4-dichlorophenyl) -5-methylimidazole, 2- (4-chlorophenyl) -4- (2, 4-dichlorophenyl) -5-methylimidazole, 2-pentylbenzoimidazole and 2- (4-chlorophenyl) benzimidazole, and the components are compounded according to a ratio of 1:1:1:1.
The complexing agent is EDTA.
The auxiliary film forming agent is formed by compounding adipic acid, heptanoic acid and lauric acid in a ratio of 2:1:1.
The diluent is compounded by formic acid and propionic acid in a ratio of 1:1.
The buffer is formed by compounding ethylenediamine and ethanolamine in a ratio of 1:1.
Weighing the raw materials according to the proportion, mixing and stirring.
Example 2
An organic solderability copper surface protective agent comprises the following components in mass concentration: 10g/L of composite film forming agent, 1.0g/L of complexing agent, 1.0g/L of auxiliary film forming agent, 250g/L of diluent, 8g/L of buffering agent, 1.0g/L of surfactant and water as solvent, wherein the composite film forming agent is formed by compounding benzimidazole, benzotriazole and mercaptobenzothiazole in a ratio of 10:0.7:0.7.
The substituted benzimidazole is prepared by compounding 2-phenyl-4- (2, 4-dichlorophenyl) -5-methylimidazole, 2- (4-chlorophenyl) -4- (2, 4-dichlorophenyl) -5-methylimidazole, 2- (2, 4-dichlorophenyl) benzimidazole and 2- (3, 4-dichlorophenyl) benzimidazole according to a ratio of 1:1:1:1.
The complexing agent is EDTA-2Na.
The auxiliary film forming agent is formed by compounding adipic acid, heptanoic acid and lauric acid in a ratio of 2:1:1.
The diluent is formed by compounding acetic acid and propionic acid in a ratio of 1:1.
The buffering agent is formed by compounding ammonia water and triethanolamine in a ratio of 1:1.
Weighing the raw materials according to the proportion, mixing and stirring.
Example 3
An organic solderability copper surface protective agent comprises the following components in mass concentration: 8g/L of composite film forming agent, 0.5g/L of complexing agent, 0.5g/L of auxiliary film forming agent, 200g/L of diluent, 5g/L of buffer, 0.5g/L of surfactant and water as solvent, wherein the composite film forming agent is formed by compounding benzimidazole, benzotriazole and mercaptobenzothiazole in a ratio of 8:0.6:0.6.
The substituted benzimidazole is prepared by specifically selecting 2, 4-diphenyl imidazole, 2-phenyl-4- (2- (4-chlorophenyl)) -4- (2, 4-dichlorophenyl) imidazole, 2-amyl benzimidazole and 2- (4-chlorophenyl) benzimidazole to be compounded in a ratio of 1:1:1:1:1.
The complexing agent is EDTA-4Na.
The auxiliary film forming agent is formed by compounding adipic acid, heptanoic acid and lauric acid in a ratio of 2:1:1.
The diluent is formed by compounding acetic acid and formic acid in a ratio of 1:1.
The buffering agent is formed by compounding ammonia water and triethanolamine in a ratio of 1:1.
Weighing the raw materials according to the proportion, mixing and stirring.
Example 4
An organic solderability copper surface protective agent comprises the following components in mass concentration: 8g/L of composite film forming agent, 0.5g/L of complexing agent, 0.5g/L of auxiliary film forming agent, 200g/L of diluent, 5g/L of buffer, 0.5g/L of surfactant and water as solvent, wherein the composite film forming agent is formed by compounding benzimidazole, benzotriazole and mercaptobenzothiazole in a ratio of 8:0.6:0.6.
The specific selection of the substituted benzimidazole comprises 2- (2, 4-dichlorophenyl) -4- (2, 4-dichlorophenyl) -5-methylimidazole, 2- (4-chlorophenyl) -4- (2, 4-dichlorophenyl) -5-methylimidazole, 2-phenyl-4- (2, 4-dichlorophenyl) -5-methylimidazole and 2- (4-chlorophenyl) -4- (2, 4-dichlorophenyl) -5-methylimidazole which are compounded according to a ratio of 1:1:1:1.
The complexing agent is EDTA-4Na.
The auxiliary film forming agent is formed by compounding adipic acid, heptanoic acid and lauric acid in a ratio of 2:1:1.
The diluent is compounded by formic acid, acetic acid and propionic acid in a ratio of 1:1:1.
The buffering agent is formed by compounding ammonia water and triethanolamine in a ratio of 1:1.
Weighing the raw materials according to the proportion, mixing and stirring.
To further test the performance of the organic solderability copper protectant of the invention, comparative examples 1-9 were set for performance testing.
Comparative example 1
Compared with example 4, the composite film forming agent is replaced by substituted benzimidazole, the specific mass concentration is the same as that of the composite film forming agent of example 4, and the specific composition of the substituted benzimidazole is also the same as that of example 4.
Comparative example 2
In comparison with example 4, the composite film former consists of substituted benzimidazole and benzotriazole in the ratio of 8:1.2, the specific mass concentration is the same as that of the compound film forming agent of the example 4, and the specific composition of the substituted benzimidazole is the same as that of the example 4.
Comparative example 3
In comparison with example 4, the composite film former consists of substituted benzimidazole and mercaptobenzothiazole at a ratio of 8:1.2, the specific mass concentration is the same as that of the compound film forming agent of the example 4, and the specific composition of the substituted benzimidazole is the same as that of the example 4.
Comparative example 4
Compared with the example 4, the composite film forming agent consists of substituted benzimidazole, benzotriazole and mercaptobenzothiazole according to the weight ratio of 10:2:2, the specific mass concentration is the same as that of the compound film forming agent of the example 4, and the specific composition of the substituted benzimidazole is also the same as that of the example 4.
Comparative example 5
The surfactant was omitted compared with example 4, and the other components were the same.
Comparative example 6
In comparison with example 4, the surfactant used trehalose lipids instead of sophorolipids was the same as the other.
Comparative example 7
In comparison to example 4, the auxiliary film former was replaced by a 1:1 mixture of long-chain organic acids and short-chain organic acids, all of which were identical.
Comparative example 8
Compared with the example 4, the auxiliary film forming agent is compounded by adipic acid, heptanoic acid and lauric acid in a ratio of 1:2:2.
Comparative example 9
The organic solderability copper protectant prepared in example 4 of CN201910194583.9 was used.
Performance testing
Example 4 and comparative examples 1-9 were all tested using the following procedure:
the technology is as follows: degreasing, washing with water x 3-microetching, washing with water x 3-copper protection, washing with water x 3-blow drying and drying, and then performing film thickness test:
the operation steps of the OSP film thickness measurement are as follows.
(1) Preparing 5wt% hydrochloric acid membrane solution;
(2) Using the completely same test copper plate to perform OSP treatment;
(3) Putting the film thickness test copper plate passing through the OSP line into a 250mL beaker, adding a film dissolving liquid with a fixed volume of 50mL, and stirring for 3 minutes to completely dissolve the OSP film layer;
(4) Using 5wt% hydrochloric acid solution as a reference solution, the UV instrument was calibrated to have an absorbance value of zero at a fixed wavelength (270 nm) λ;
(5) Pouring the OSP film layer solution into a cuvette of 1cm, placing the cuvette into a sample tank, and recording an absorption value A at the fixed wavelength lambda;
(6) The film thickness was calculated using the formula h=c×a.
TABLE 1 film thickness test results
| Copper plate film thickness (mum) | |
| Example 4 | 0.20 |
| Comparative example 1 | 0.29 |
| Comparative example 2 | 0.30 |
| Comparative example 3 | 0.28 |
| Comparative example 4 | 0.26 |
| Comparative example 5 | 0.31 |
| Comparative example 6 | 0.24 |
| Comparative example 7 | 0.27 |
| Comparative example 8 | 0.32 |
| Comparative example 9 | 0.22 |
The film thickness test results show that the organic solderability copper surface protective agent provided by the invention has smaller thickness compared with the protective film formed in comparative examples 1-9, is equivalent to the protective film thickness in patent CN201910194583.9, is even thinner, and is analyzed because the performance of the selected composite film forming agent is equivalent to that of a single film forming agent, and the organic solderability copper surface protective agent formed by matching with an auxiliary film forming agent and a surfactant is more stable and uniform in solution system, so that the film forming is lighter and thinner.
Oxidation resistance
The treated copper plate was placed in a constant temperature and humidity phase at a set temperature of 60 ℃ and moderately 95%. After 10 days, it was observed whether or not the copper surface was oxidized and discolored.
Heat resistance test
Subjecting the sample plate to the following process
(1) Baking the test plate for 30min at the constant temperature of 120 ℃;
(2) Baking the test plate for 15min at the constant temperature of 150 ℃;
(3) Baking the test plate at a constant temperature of 260 ℃ for 5min;
(4) And (3) baking the test plate at the constant temperature of 288 ℃ for 10s, standing at the constant temperature for 10s, continuously baking the sample plate for 30s, and observing whether the color changes after the sample plate is cooled.
Table 2: oxidation resistance and heat resistance test results
| Oxidation resistance | Heat resistance and resistance to heat | |
| Example 4 | Whether or not | Whether or not |
| Comparative example 1 | Is that | Is that |
| Comparative example 2 | Is that | Is that |
| Comparative example 3 | Is that | Is that |
| Comparative example 4 | Is that | Is that |
| Comparative example 5 | Is that | Is that |
| Comparative example 6 | Slight discoloration | Slight discoloration |
| Comparative example 7 | Is that | Is that |
| Comparative example 8 | Is that | Is that |
| Comparative example 9 | Slight discoloration | Slight discoloration |
The test results of oxidation resistance and heat resistance show that the organic solderability copper surface protective agent has very good oxidation resistance and heat resistance compared with comparative examples 1-9, namely the formed copper surface protective film is more compact, and can effectively resist oxidation, so that the protective performance is better, and the film forming quality is better.
The present invention is not limited to the preferred embodiments, and the patent protection scope of the invention is defined by the claims, and all equivalent structural changes made by the application of the present invention are included in the scope of the invention.
Claims (4)
1. The organic solderability copper surface protective agent is characterized by being prepared from the following components in percentage by mass: 5-10.0g/L of composite film forming agent, 0.1-1.0g/L of complexing agent, 0.1-1.0g/L of auxiliary film forming agent, 100-250g/L of diluent, 2-8g/L of buffer agent, 0.1-1.0g/L of surfactant and water as solvent, wherein the composite film forming agent is formed by compounding (5-10) of substituted benzimidazole, benzotriazole and mercaptobenzothiazole (0.5-0.7) in a ratio of (0.5-0.7);
the substituted benzimidazoles include any one or more combinations of 2- (2, 4-dichlorophenyl) -4- (2, 4-dichlorophenyl) -5-methylimidazole, 2- (4-chlorophenyl) -4- (2, 4-dichlorophenyl) -5-methylimidazole, 2-phenyl-4- (2, 4-dichlorophenyl) -5-methylimidazole, 2, 4-diphenylimidazole, 2-phenyl-4- (2- (4-chlorophenyl)) -4- (2, 4-dichlorophenyl) imidazole, 2-pentylbenzoimidazole, 2- (4-chlorophenyl) benzimidazole, 2- (2, 4-dichlorophenyl) benzimidazole, or 2- (3, 4-dichlorophenyl) benzimidazole;
the auxiliary film forming agent is formed by compounding adipic acid, heptanoic acid and lauric acid in a ratio of 2:1:1;
the surfactant is sophorolipid;
the preparation method of the organic weldable copper surface protective agent comprises the steps of weighing raw materials according to the proportion, mixing and stirring.
2. An organic solderable copper finish protector according to claim 1 wherein: the diluent is one or more of formic acid, acetic acid and propionic acid.
3. An organic solderable copper finish protector according to claim 1 wherein: the buffering agent is one or more of ethylenediamine, ammonia water, triethanolamine and ethanolamine.
4. A method for preparing an organic solderability copper finish protector according to any one of claims 1 to 3, wherein: weighing the raw materials according to the proportion, mixing and stirring.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101974758A (en) * | 2010-11-04 | 2011-02-16 | 西北工业大学 | Water-soluble copper protective agent, preparation method and using method thereof |
| CN108396325A (en) * | 2018-02-27 | 2018-08-14 | 广州天至环保科技有限公司 | A kind of solderable nickel protective agent of water solubility |
| CN111434801A (en) * | 2019-01-15 | 2020-07-21 | 广州天至环保科技有限公司 | Water-based copper protective agent |
| CN113106460A (en) * | 2021-04-15 | 2021-07-13 | 深圳市钝化技术有限公司 | High-temperature-resistant conductive copper alloy protective agent, preparation method and copper alloy passivation method |
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| US20170183783A1 (en) * | 2015-12-29 | 2017-06-29 | Rohm And Haas Electronic Materials Llc | Method for forming organic coating on copper surface |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101974758A (en) * | 2010-11-04 | 2011-02-16 | 西北工业大学 | Water-soluble copper protective agent, preparation method and using method thereof |
| CN108396325A (en) * | 2018-02-27 | 2018-08-14 | 广州天至环保科技有限公司 | A kind of solderable nickel protective agent of water solubility |
| CN111434801A (en) * | 2019-01-15 | 2020-07-21 | 广州天至环保科技有限公司 | Water-based copper protective agent |
| CN113106460A (en) * | 2021-04-15 | 2021-07-13 | 深圳市钝化技术有限公司 | High-temperature-resistant conductive copper alloy protective agent, preparation method and copper alloy passivation method |
Non-Patent Citations (1)
| Title |
|---|
| 印制板镀铜面OSP抗氧化处理与应用;程静;陈良;吴培常;;印制电路信息(第08期);全文 * |
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