CN108766698A - Sputter the manufacturing method of copper 0R resistors - Google Patents
Sputter the manufacturing method of copper 0R resistors Download PDFInfo
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- CN108766698A CN108766698A CN201810615596.4A CN201810615596A CN108766698A CN 108766698 A CN108766698 A CN 108766698A CN 201810615596 A CN201810615596 A CN 201810615596A CN 108766698 A CN108766698 A CN 108766698A
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- layer
- copper
- insulating substrate
- layers
- sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The manufacturing method for sputtering copper 0R resistors, in the back up backplate (2) of insulating substrate (1), and is burnt into, and last layer layers of copper (3) is plated in the mode of the front sputtering of insulating substrate (1)；Transverse scribes line on insulating substrate 1 fractures insulating substrate (1) substrate (6) into strips, carries out side sputtering to each strip substrate (6) using vacuum sputtering stove, forms lateral conduction layer (7)；Plating forms one layer of nickel layer (9) on positive layers of copper (3) electrodes of 0R resistance semi-finished product (8), backplate (2) and lateral conduction layer (7), then it again in one layer of tin layers (10) of the electroplating surface of nickel layer (9), and forms finished product after over cleaning and drying and sputters copper 0R resistance.Using the technique for sputtering layers of copper in insulating substrate front full wafer, surface electrode and resistive layer is set to be integrally formed structure, it is more suitable for bulk production, it is good to sputter the vacuum coating surface uniformity formed, film layer structure is fine and close, and capability and performance is relatively low compared with stable and manufacturing cost, and resistive surface heat-sinking capability is strong, small product size is small, effectively improves prouctiveness and significantly reduces manufacturing cost.
Description
Technical field
The present invention relates to IPC classification H01C resistors electronic devices and its structure improved technologies of manufacturing method, especially
Sputter the manufacturing method of copper 0R resistors.
Background technology
0R resistor Zero-ohm resistors.The resistance that resistance value is 0, there is no the practical significances of circuit, it is therefore an objective to be put on PCB
One resistance position when so as to post debugging, facilitates change resistance value.It cannot be connected with printed circuit for 2 points in board design
It connects, is often connected with cross-line in front, this is frequently seen in common plate, in order to allow automatic placement machine and the normal work of automatism card machine
Make, cross-line is replaced with zero resistance.
The resistance in 0 Europe probably has following function：1. being used as wire jumper.Both beautiful in this way, installation is also convenient for.2.
In the hybrid circuits such as number and simulation, often require that two ground separate, and single-point connects.We can use the electricity in 0 Europe
It hinders to connect the two ground, rather than is directly connected together.
It is less that Patents documents are disclosed.
Fudan University discloses a kind of CuSiO electricity standby based on sputtering copper in Chinese patent application 200910197210.3
Resistance type memory and preparation method thereof.The resistor-type memory include under top electrode, copper electrode and be arranged in the top electrode
And the CuSiO storage mediums under the copper between electrode, wherein, electrode is electrode under sputtering copper, the sputtering copper under the copper
Lower electrode surface layer is silicified processing to form CuSi compound buffer layers, and the CuSi compound buffers layer is by oxidation processes with shape
At the CuSiO storage mediums.The CuSiO storage mediums it is functional, can especially make memory have low resistance state resistance more
Consistency is more preferable between high, each unit, and the memory is easy to integrated with copper-connection backend process, reduces manufacturing cost.
Vishay Dale Electronics Inc. provides a kind of metal beam-type resistance in Chinese patent application 201210472650.7
Device (10).This metal strip resistor includes metal strip (18), forms resistive element and without using independent substrate
In the case of for metal strip resistor provide bearing.First terminal and the second opposite end are coated with metal strip.First terminal and
Each of second opposite end is upper to have coating (28).Also metal strip is coated between first terminal and the second opposite end
Insulating materials (20).The present invention provides a kind of method for forming metal strip resistor, wherein metal strip is not having
Metal strip resistor offer bearing is given in the case of using independent substrate.This method includes that insulating materials is applied to metal
Item；Application image maps technique to form the conductive pattern for being coated with resistance material, wherein conductive pattern include first terminal and
Second opposite end；Conductive pattern is electroplated；And adjust the resistance of metal strip.
In the prior art, typical 0R resistors processing procedure includes：
1, using tailored version printing machine, a pair of of backside conductive layer is formed using printing at the back side of each substrate, and done
It is dry.
2 and a pair of of surface conductive layer and resistive layer are formed in the front printing of the substrate, and be dried, completed
After the backside conductive layer, surface conductive layer and resistive layer, it is burnt into.
3, it after the firing for completing the resistive layer, i.e., republishes to form a glassivation on the resistive layer, go forward side by side
Row is dry and is burnt into.
4, a upper external protection and label layer are republished on glassivation, and are dried and are burnt into.
5, sequentially substrate is fractureed along each longitudinal broken line using special board, several strip substrates is formed, under automatic
Expect in special fixture.
6, side sputtering is carried out to strip substrate using special board, forms side electrode, to make front electrode and the back of the body
Face electrode is interconnected.
7, by each strip substrate, transversely broken line fractures, and forms multiple resistance unit individuals.
8, the single body of the resistance is put into the electroplated cylinder of electroplating bath and electroplated cylinder is made to rotate, electricity is carried out in a manner of barrel plating
Plating makes resistance unit body not stop making contact with the electrode pearl clipped wire in electroplated cylinder, and will be plated on resistance unit body electrode
After nickel layer and tin, that is, form a resistance.
There are disadvantages for above-mentioned manufacturing method：Silver paste is used to carry out the printing of front side conductive layer and resistive layer for raw material,
Firing is thicker, and dosage is bigger, and cost of material is also high, will certainly bring the increase of manufacturing cost in this way.
Invention content
The object of the present invention is to provide the manufacturing methods of sputtering copper 0R resistors to have under the premise of ensureing product quality
Effect ground improves production method, improves production efficiency and reduces manufacturing cost.
The purpose of the present invention will be realized by following technical measures：Sputter the specific packet of the manufacturing method of copper 0R resistors
Include following steps：
A. an insulating substrate is prepared, in the front and back of the insulating substrate with being uniformly correspondingly formed clathrate longitudinal indentation
Line and transverse scribes line；
B. in the back up backplate of insulating substrate, which is located on longitudinal line of weakness, and is burnt into；
C. the front of insulating substrate is cleaned with pure water, and be dried；
D. last layer layers of copper is plated in the mode of the front sputtering of insulating substrate；
E. the 3 printed thereon layer protective layer of layers of copper generated in sputtering, after protective layer is dried, then in protective layer
One label layer of upper printing, then be dried and be burnt into；
F. the transverse scribes line on insulating substrate fractures insulating substrate substrate into strips, and each strip substrate is passed through
Special board is stacked in jig；
G. it uses vacuum sputtering stove to carry out side sputtering to each strip substrate, forms lateral conduction layer；
H. by each strip substrate, line of weakness fractures to form independent 0R resistance semi-finished product along longitudinal direction；
I. 0R resistance semi-finished product are put into the electro-plating roller of electroplating bath, electro-plating roller is made to be rotated with setting speed, set
Fixed electric current and under the conditions of the time makes on positive layers of copper electrode, backplate and the lateral conduction layer 7 of 0R resistance semi-finished product electricity
Plating forms one layer of nickel layer, then again in one layer of tin layers of the electroplating surface of nickel layer, and finished product sputtering is formed after over cleaning and drying
Copper 0R resistance.
Especially, there is layers of copper in insulating substrate front, the middle side part matcoveredn in layers of copper, and there is mark in side on the protection layer
Layer, at the insulating substrate back side, left and right outer ledge has backplate, has side to lead respectively on insulating substrate left and right side outer wall
Electric layer, lateral conduction layer connect layers of copper and backplate, have nickel layer in layers of copper, backplate and lateral conduction layer outer surface,
There are tin layers on the surface of nickel layer.
Advantages of the present invention and effect：Using insulating substrate front full wafer sputter layers of copper technique, make surface electrode and
Resistive layer is integrally formed structure, is more suitable for bulk production, and the vacuum coating surface uniformity for sputtering formation is good, film layer
Compact structure, capability and performance are relatively low compared with stable and manufacturing cost, and resistive surface heat-sinking capability is strong, and small product size is small, effectively carries
High prouctiveness simultaneously significantly reduces manufacturing cost.
Description of the drawings
Fig. 1 is the insulating substrate schematic diagram after step a described in embodiment 1；
Fig. 2 is the insulating substrate schematic rear view after step b described in embodiment 1；
Fig. 3 is the insulating substrate front schematic view after step c described in embodiment 1；
Fig. 4 is the insulating substrate front schematic view after step d described in embodiment 1；
Fig. 5 is the insulating substrate front schematic view after step e described in embodiment 1；
Fig. 6 is the strip substrate schematic diagram after step f described in embodiment 1；
Fig. 7 is the strip substrate schematic diagram after step g described in embodiment 1；
Fig. 8 is the 0R resistance semi-finished product schematic diagrames after step h described in embodiment 1；
Fig. 9 is the 0R resistance semi-finished product schematic diagrames after step i described in embodiment 1；
Figure 10 is the sectional view of 0R resistance described in embodiment 1.
Reference numeral includes：
Insulating substrate 1, backplate 2, layers of copper 3, protective layer 4, label layer 5, strip substrate 6, lateral conduction layer 7,0R electricity
Hinder semi-finished product 8, nickel layer 9, tin layers 10.
Specific implementation mode
Sputtering copper 0R resistor structures in the present invention include：Insulating substrate 1, backplate 2, layers of copper 3, protective layer 4, mark
Know layer 5, lateral conduction layer 7, nickel layer 9 and tin layers 10.
In the present invention, as shown in Figure 10, there is layers of copper 3 in 1 front of insulating substrate, the middle side part matcoveredn 4 in layers of copper 3,
There is label layer 5 in 4 upside of protective layer, and at 1 back side of insulating substrate, left and right outer ledge has backplate 2, left and right in insulating substrate 1
There is lateral conduction layer 7 on the outer wall of side respectively, lateral conduction layer 7 connects layers of copper 3 and backplate 2, in layers of copper 3,2 and of backplate
7 outer surface of lateral conduction layer has nickel layer 9, has tin layers 10 on the surface of nickel layer 9.
The invention will be further described with reference to the accompanying drawings and examples.
Embodiment 1：On the basis of use direction, as shown in attached drawing 1-10, the tool of the manufacturing method of copper 0R resistors is sputtered
Body includes the following steps：
A. an insulating substrate 1 is prepared, longitudinal direction is carved with being uniformly correspondingly formed clathrate in the front and back of the insulating substrate 1
Trace line and transverse scribes line；
B. in the back up backplate 2 of insulating substrate 1, which is located on longitudinal line of weakness, and is burnt
At；
C. the front of insulating substrate 1 is cleaned with pure water, and be dried；
D. last layer layers of copper 3 is plated in the mode of the front sputtering of insulating substrate 1；
E. the 3 printed thereon layer protective layer 4 of layers of copper generated in sputtering, after protective layer 4 is dried, then is being protected
A label layer 5 is printed on layer 4, then is dried and is burnt into；
F. the transverse scribes line on insulating substrate 1 fractures insulating substrate 1 substrate 6 into strips, and by each strip substrate 6
It is stacked in jig by special board；
G. it uses vacuum sputtering stove to carry out side sputtering to each strip substrate 6, forms lateral conduction layer 7；
H. by each strip substrate 6, line of weakness fractures to form independent 0R resistance semi-finished product 8 along longitudinal direction；
I. 0R resistance semi-finished product 8 are put into the electro-plating roller of electroplating bath, electro-plating roller is made to be rotated with setting speed, set
Fixed electric current and under the conditions of the time, makes on 3 electrode of positive layers of copper, backplate 2 and the lateral conduction layer 7 of 0R resistance semi-finished product 8
Plating forms one layer of nickel layer 9, then again in one layer of tin layers 10 of the electroplating surface of nickel layer 9, and is formed after over cleaning and drying
Finished product sputters copper 0R resistance.
Claims (2)
1. sputtering the manufacturing method of copper 0R resistors, which is characterized in that specifically include following steps：
A. an insulating substrate (1) is prepared, longitudinal direction is carved with being uniformly correspondingly formed clathrate in the front and back of the insulating substrate (1)
Trace line and transverse scribes line；
B. in the back up backplate (2) of insulating substrate (1), which is located on longitudinal line of weakness, and carries out
Firing；
C. the front of insulating substrate (1) is cleaned with pure water, and be dried；
D. last layer layers of copper (3) is plated in the mode of the front sputtering of insulating substrate (1)；
E. layers of copper (3) the printed thereon layer protective layer (4) generated in sputtering, after protective layer (4) is dried, then is being protected
A label layer (5) is printed on sheath (4), then is dried and is burnt into；
F. the transverse scribes line on insulating substrate 1 fractures insulating substrate (1) substrate (6) into strips, and by each strip substrate
(6) it is stacked in jig by special board；
G. it uses vacuum sputtering stove to carry out side sputtering to each strip substrate (6), forms lateral conduction layer (7)；
H. by each strip substrate (6), line of weakness fractures to form independent 0R resistance semi-finished product (8) along longitudinal direction；
I. 0R resistance semi-finished product (8) are put into the electro-plating roller of electroplating bath, electro-plating roller is made to be rotated with setting speed, set
Electric current and under the conditions of the time, make positive layers of copper (3) electrode, backplate (2) and the lateral conduction layer of 0R resistance semi-finished product (8)
(7) plating forms one layer of nickel layer (9) on, then again in one layer of tin layers (10) of the electroplating surface of nickel layer (9), and through over cleaning and
Finished product is formed after drying sputters copper 0R resistance.
2. the manufacturing method of sputtering copper 0R resistors as described in claim 1, which is characterized in that insulating substrate (1) front has
Layers of copper (3), the middle side part matcoveredn (4) in layers of copper (3) have label layer (5), in insulating substrate (1) on the upside of protective layer (4)
The left and right outer ledge in the back side has backplate (2), has lateral conduction layer (7) respectively on insulating substrate (1) left and right side outer wall,
Lateral conduction layer (7) connects layers of copper (3) and backplate (2), layers of copper (3), backplate (2) and lateral conduction layer (7) outside
There is nickel layer (9) in side surface, has tin layers (10) on the surface of nickel layer (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810615596.4A CN108766698A (en) | 2018-06-14 | 2018-06-14 | Sputter the manufacturing method of copper 0R resistors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810615596.4A CN108766698A (en) | 2018-06-14 | 2018-06-14 | Sputter the manufacturing method of copper 0R resistors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108766698A true CN108766698A (en) | 2018-11-06 |
Family
ID=64022371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810615596.4A Withdrawn CN108766698A (en) | 2018-06-14 | 2018-06-14 | Sputter the manufacturing method of copper 0R resistors |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108766698A (en) |
-
2018
- 2018-06-14 CN CN201810615596.4A patent/CN108766698A/en not_active Withdrawn
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Application publication date: 20181106 |