CN108746637B - Aluminum silicon/aluminum silicon carbide gradient composite material and preparation method thereof - Google Patents
Aluminum silicon/aluminum silicon carbide gradient composite material and preparation method thereof Download PDFInfo
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Abstract
The invention relates to an aluminum silicon/aluminum silicon carbide gradient composite material and a preparation method thereof. The aluminum-silicon/aluminum-silicon carbide gradient composite material is a gradient composite material consisting of at least one aluminum-silicon alloy layer and at least one aluminum-silicon carbide composite material layer; wherein, the aluminum-silicon alloy layer contains 22-50% of silicon and the balance of aluminum according to weight percentage; the aluminum silicon carbide composite material layer contains 40-65% of silicon carbide and the balance of aluminum or aluminum alloy in percentage by volume. The aluminum silicon/aluminum silicon carbide gradient composite material has the advantages of high thermal conductivity, high mechanical strength, small density, adjustable performance, easy processing and low cost, has good comprehensive performance, can meet various index requirements of electronic packaging, and is particularly suitable for serving as an electronic packaging material.
Description
Technical Field
The invention relates to the technical field of composite materials, in particular to an aluminum silicon/aluminum silicon carbide gradient composite material and a preparation method thereof.
Background
The electronic packaging material is a base material used for bearing electronic devices and interconnection thereof, and has the functions of mechanical support, sealed environment protection, signal transmission, heat dissipation, shielding and the like. The electronic packaging materials are various, and the traditional metal-based or ceramic electronic packaging materials mainly comprise Cu, Al, Ti, Kovar, W/Cu, Mo/Cu, Al/SiC and Al2O3AlN and the like. With the development of modern electronic systems toward miniaturization, light weight, high operating frequency, high power density, multiple functions, high reliability, etc., the conventional electronic packaging materials have been insufficient in terms of thermal expansion coefficient matching, light weight, hermetic welding, etc.
Studies have shown that the failure rate of electronic devices increases dramatically with increasing operating temperature: basically, for every 10 ℃ increase in operating temperature, the lifetime of a GaAs or Si semiconductor device will decrease by one third. Heat dissipation and cooling of electronic devices are typically accomplished using heat sinks, heat spreaders, and electronic packaging materials. Research and development of electronic packaging materials and components having high thermal conductivity and good overall performance have become a key technology in the field of electronic packaging and have affected the development of the electronic industry.
The metal matrix composite organically combines the good heat conduction and plastic deformation performance of the metal matrix and the lower thermal expansion coefficient and higher strength of the reinforcement body, and obtains the electronic packaging material with controllable performances such as heat conductivity, thermal expansion coefficient and the like in a large range, thereby realizing the packaging with various chips and substrate materials. Therefore, the development of new metal matrix composites is expected to meet the increasing electronic packaging requirements.
Disclosure of Invention
Based on the above, the present invention provides an aluminum silicon/aluminum silicon carbide gradient composite material, which has the advantages of high thermal conductivity, high mechanical strength, low density, controllable performance, easy processing and low cost.
The technical scheme adopted by the invention is as follows:
an aluminum-silicon/aluminum-silicon carbide gradient composite material is a gradient composite material consisting of at least one aluminum-silicon alloy layer and at least one aluminum-silicon carbide composite material layer; wherein, the aluminum-silicon alloy layer contains 22-50% of silicon and the balance of aluminum according to weight percentage; the aluminum silicon carbide composite material layer contains 40-65% of silicon carbide and the balance of aluminum or aluminum alloy in percentage by volume.
Wherein, the aluminum-silicon alloy consists of an aluminum matrix (Al) and a silicon phase (Si), also called Al/Sip composite material, integrates the good performances of the aluminum matrix and the silicon phase, and has the advantages of higher thermal conductivity, controllable thermal expansion coefficient, high specific strength and small density (Al/Sip composite material)<2.7g/cm3) The silicon and aluminum alloy has the characteristics of easy processing and plating, and the like, and the contents of silicon and aluminum in the earth crust are respectively 27.7 percent and 8.1 percent, and the content is very rich, so the cost of the aluminum-silicon alloy is low, the environment is not polluted, the aluminum-silicon alloy is harmless to human bodies, and the aluminum-silicon alloy is convenient to recycle. Therefore, the aluminum-silicon alloy can meet the requirements of modern electronic packaging on material mechanical, thermophysical and technological propertiesThe method has wide application prospect in the fields of aviation, aerospace, electronics, communication and the like.
The aluminum silicon carbide (AlSiC) is a short term for aluminum-based silicon carbide particle reinforced composite material, fully combines different advantages of silicon carbide ceramics and metal aluminum, and has high thermal conductivity, thermal expansion coefficient matched with a chip, small density, light weight, high hardness and high bending strength.
Although aluminum-silicon alloys have a good combination of properties, their thermal conductivity is limited by the aluminum matrix and the silicon phase, with the highest thermal conductivity being less than the thermal conductivity 237W/m · K of pure aluminum; although aluminum silicon carbide has high thermal conductivity and strength, the aluminum silicon carbide has poor processing and plating performances, and the popularization and application of the aluminum silicon carbide in the aspect of resistance packaging are seriously hindered.
The aluminum-silicon alloy and the aluminum-silicon carbide are organically combined to form the aluminum-silicon/aluminum-silicon carbide gradient composite material with a multilayer gradient structure, so that the aim of making up for deficiencies is fulfilled, on one hand, the high strength and high modulus of the aluminum-silicon carbide composite material are utilized to provide good mechanical properties for electronic devices, on the other hand, the advantages of easy processing, plating, laser welding and the like of the aluminum-silicon alloy are fully exerted, the aluminum-silicon alloy is beneficial to processing into a packaging shell with a complex shape, and the packaging protection is provided for high-power-density electronic devices. And according to the thermal expansion coefficient and the thermal conductivity of the material, the aluminum-silicon alloy with proper silicon content and the aluminum-silicon carbide with proper silicon carbide content are selected for compounding. In addition, the aluminum silicon/aluminum silicon carbide electronic packaging gradient composite material also has the characteristic of light weight (the density is less than 3 g/cm)3)。
The gradient structure of the aluminum-silicon/aluminum-silicon carbide gradient composite material can be variously designed according to actual use requirements, and composite materials with different properties can be obtained by adjusting the number of gradient layers, the component proportion of each layer (the silicon content in the aluminum-silicon alloy layer, the silicon carbide content in the aluminum-silicon carbide composite material layer), the weight proportion or the thickness proportion of the aluminum-silicon alloy layer and the aluminum-silicon carbide layer, and the like. Therefore, the aluminum silicon/aluminum silicon carbide gradient composite material has good controllability, can obtain a packaging shell with a specific shape and a specific size by adopting common machining according to the packaging requirements, and can carry out surface plating and laser welding to realize airtight packaging.
The aluminum-silicon/aluminum-silicon carbide gradient composite material not only retains the high thermal conductivity and high strength of aluminum-silicon carbide, but also fully utilizes the advantages of easy processability, plateability and laser welding of aluminum-silicon, has the advantages of high thermal conductivity, high mechanical strength, small density, adjustable performance, easy processing and low cost, has good comprehensive performance, can meet various index requirements of electronic packaging, is particularly suitable for serving as an electronic packaging material, such as a packaging material of high-power density microelectronics and a microwave device, and the like, and can further improve the service performance of the material through the optimization design of a gradient structure.
Further, the aluminum-silicon alloy layer consists of an aluminum matrix and silicon particles uniformly distributed in the aluminum matrix, and the aluminum-silicon carbide composite material layer consists of an Al-7Si-0.3Mg-0.3Mg alloy matrix and silicon carbide particles uniformly distributed in the Al-7Si-0.3Mg-0.3Mg alloy matrix. The Al-7Si-0.3Mg is used as the matrix of the aluminum silicon carbide composite material layer, so that the material has good thermal conductivity and good interface wettability with silicon carbide, and thus good interface bonding strength is obtained.
Further, the size of the silicon carbide particles in the aluminum silicon carbide composite material layer is 10-70 microns, and in order to improve the volume fraction of the silicon carbide, different particle sizes can be selected for proportioning.
Further, the aluminum-silicon/aluminum-silicon carbide gradient composite material is composed of two aluminum-silicon alloy layers and one aluminum-silicon carbide composite material layer; wherein the weight percentages of the aluminum in the two aluminum-silicon alloy layers are respectively 27% and 50%, and the volume percentage of the aluminum in the aluminum-silicon carbide composite material layer is 50%; the aluminum alloy layer containing 50% of aluminum is positioned between the aluminum alloy layer containing 27% of aluminum and the aluminum silicon carbide composite material layer.
Another object of the present invention is to provide a method for preparing an aluminum-silicon/aluminum-silicon carbide gradient composite material, which comprises the following steps:
(1) preparing aluminum-silicon alloy powder according to the weight percentage by proportioning 22-50% of silicon and the balance of aluminum;
(2) preparing mixed powder of aluminum and silicon carbide according to the proportion that the content of silicon carbide is 40-65% and the balance is aluminum or aluminum alloy in percentage by volume;
(3) pre-pressing the aluminum-silicon alloy powder prepared in the step (1) into an aluminum-silicon alloy green compact, and pre-pressing the mixed powder of aluminum and silicon carbide prepared in the step (2) into an aluminum-silicon carbide green compact; according to the designed gradient structure, at least one prepared aluminum-silicon alloy pressed compact and at least one prepared aluminum-silicon carbide pressed compact are placed into a die and then pressed into a gradient pressed compact;
(4) and (4) carrying out hot-pressing sintering or hot isostatic pressing on the gradient pressed compact prepared in the step (3) to obtain the aluminum-silicon/aluminum-silicon carbide gradient composite material.
The invention respectively pre-presses the aluminum-silicon alloy powder and the mixed powder of aluminum and silicon carbide into pressed compacts in a cold pressing mode under low pressure, then presses the obtained aluminum-silicon alloy pressed compacts and aluminum-silicon carbide pressed compacts in the cold pressing mode according to the structural design of the gradient composite material to obtain formed gradient pressed compacts, and finally carries out hot-pressing sintering or hot isostatic pressing on the gradient pressed compacts to obtain the gradient composite material with compact and uniform microstructure. The preparation method has simple procedures, is easy to control and realize, the aluminum-silicon alloy layer and the aluminum-silicon carbide composite material layer are formed by pressing, and the gradient pressed compact is subjected to hot pressing sintering or hot isostatic pressing, so that the integrated sintering densification is realized, the preparation procedures are reduced, the production efficiency is improved, the forming temperature is low, a fragile transition layer can be prevented from being formed between the aluminum-silicon alloy and the aluminum-silicon carbide, and the integral performance of the gradient composite material is improved.
Further, the step (1) comprises: the preparation method comprises the steps of proportioning and smelting a pure aluminum ingot and a monocrystalline silicon block according to a ratio, then carrying out gas atomization for preparing powder, wherein the atomization pressure is 0.7-1.2 MPa, and removing particles with the size larger than 74 microns through screening after the prepared powder is cooled to obtain aluminum-silicon alloy powder. Screening can remove the bulky jumbo size granule of tissue, avoids jumbo size granule to reduce material compactness to guarantee material performance.
Further, the step (2) comprises: the preparation method comprises the steps of proportioning silicon carbide powder and Al-7Si-0.3Mg-0.3Mg alloy powder according to a ratio, mechanically mixing for 6 hours, and adding 0.1-0.2% of alcohol for mixing to obtain mixed powder of aluminum and silicon carbide.
Further, in the step (3), the pre-pressing conditions for the aluminum-silicon alloy powder are as follows: prepressing pressure is 100-160 MPa, and pressure maintaining time is 20 seconds; the pre-pressing conditions for the mixed powder of aluminum and silicon carbide were: prepressing at 120-200 MPa for 20 s; the pressing conditions of the aluminum-silicon alloy green compact and the aluminum-silicon carbide green compact are as follows: the pressing pressure is 250-300 MPa, and the pressure maintaining time is 20 seconds. If the pre-pressing pressure is too low, the material cannot be molded, and if the pre-pressing pressure is too high, the requirement on equipment is high, the loss of a mold is large, and through the limitation of the pressure range, the smooth molding of the material can be ensured, and meanwhile, the pressing equipment is protected.
Further, in the step (4), the processing conditions for performing hot-pressing sintering on the gradient pressed compact are as follows: the hot-pressing sintering temperature is 550 ℃, the sintering pressure is 45MPa, and the heat preservation time is 60 minutes. To ensure material properties, a lower sintering pressure is used and the material is densified at a slightly higher temperature.
Further, in the step (4), the hot isostatic pressing treatment conditions for the gradient compact are as follows: the hot isostatic pressing temperature is 540 ℃, the sintering pressure is 120MPa, and the heat preservation time is 120 minutes. To ensure material properties, a lower sintering pressure is used and the material is densified at a slightly higher temperature.
For a better understanding and practice, the invention is described in detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a flow chart of the preparation of the Al-Si/Al-SiC gradient composite material of the present invention;
FIG. 2 is a photomicrograph of the aluminum-silicon/aluminum-silicon carbide gradient composite prepared in example 1;
FIG. 3 is a fracture morphology plot of the Al-27% Si alloy made in example 1;
FIG. 4 is a fracture morphology plot of the Al-50% Si alloy made in example 1;
FIG. 5 is a fracture morphology plot of the Al 60% SiC composite made in example 1.
Detailed Description
The aluminum-silicon/aluminum-silicon carbide gradient composite material is composed of at least one aluminum-silicon alloy layer and at least one aluminum-silicon carbide composite material layer; wherein, the aluminum-silicon alloy layer contains 22-50% of silicon and the balance of aluminum according to weight percentage; the aluminum silicon carbide composite material layer contains 40-65% of silicon carbide and the balance of aluminum or aluminum alloy in percentage by volume.
Specifically, the aluminum-silicon alloy layer is composed of an aluminum matrix and silicon particles, and the silicon particles are fine in size and uniformly distributed in the aluminum matrix. The aluminum silicon carbide composite material layer consists of an Al-7Si-0.3Mg-0.3Mg alloy matrix and silicon carbide particles, wherein the silicon carbide particles are uniformly distributed in the Al-7Si-0.3Mg-0.3Mg alloy matrix and form good interface bonding with the Al-7Si-0.3Mg-0.3Mg alloy matrix. More preferably, the size of the silicon carbide particles in the aluminum silicon carbide composite material layer is 10-70 μm.
The gradient structure of the aluminum-silicon/aluminum-silicon carbide gradient composite material can be variously designed according to actual use requirements, and composite materials with different properties can be obtained by adjusting the number of gradient layers, the component proportion of each layer (the silicon content in the aluminum-silicon alloy layer, the silicon carbide content in the aluminum-silicon carbide composite material layer), the weight proportion or the thickness proportion of the aluminum-silicon alloy layer and the aluminum-silicon carbide layer, and the like. Therefore, the aluminum silicon/aluminum silicon carbide gradient composite material has good controllability, can be processed into a packaging shell with a complex shape according to a drawing, and realizes airtight packaging through surface plating and laser welding.
As shown in fig. 1, after the design of the gradient structure is completed, the aluminum-silicon/aluminum-silicon carbide gradient composite material is prepared according to the following steps:
(1) and preparing aluminum-silicon alloy powder. The method comprises the following specific steps:
selecting a pure aluminum ingot and a monocrystalline silicon block as raw materials, proportioning the pure aluminum ingot and the monocrystalline silicon block according to the weight percentage by taking the silicon content as 22-50% and the balance as aluminum, feeding the proportioned pure aluminum ingot into a medium-frequency induction smelting furnace for smelting, wherein a tundish crucible of the medium-frequency induction smelting furnace is heated by adopting a resistor, the preheating temperature is 700-900 ℃, and the heat preservation time is 30 min. The method comprises the steps of heating a medium-frequency induction smelting furnace to 780-860 ℃ to completely melt a pure aluminum ingot, then quickly heating to 1200-1500 ℃, adding a single crystal silicon block with a prepared weight, fully stirring for 5-15 min, cooling to 850-1100 ℃ after the single crystal silicon block is completely melted, slagging by using a flux (30% of NaCl, 47% of KCl and 23% of cryolite composite salt), degassing by using hexachlorohexane, and preserving heat for 10-15 min after alloy smelting so as to be beneficial to homogenization of an alloy melt.
And carrying out gas atomization on the aluminum-silicon alloy obtained by smelting to prepare powder, wherein the atomization gas is argon or nitrogen, and the atomization pressure is 0.7-1.2 MPa. And (3) cooling the prepared powder, and screening by adopting a mechanical device to remove particles larger than 74 mu m to obtain the aluminum-silicon alloy powder.
(2) A mixed powder of aluminum and silicon carbide was prepared. The method comprises the following specific steps:
silicon carbide particles with the size of 150-400 mu m and Al-7Si-0.3Mg-0.3Mg alloy powder are selected as raw materials. According to the volume percentage, silicon carbide particles and Al-7Si-0.3Mg-0.3Mg alloy powder are proportioned according to the proportion that the silicon carbide content is 40-65% and the balance is Al-7Si-0.3Mg-0.3Mg alloy, then mechanical mixing is adopted for 6 hours, and alcohol with the weight of 0.1-0.2% of the total weight of the mixed powder is added for mixing, so that the powder separation is prevented, and the mixed powder of aluminum and silicon carbide is obtained.
(3) And (2) pressing the aluminum-silicon alloy powder prepared in the step (1) into an aluminum-silicon alloy green compact. And (3) pressing the mixed powder of the aluminum and the silicon carbide prepared in the step (2) into an aluminum silicon carbide green compact. And (3) according to a designed gradient structure, filling at least one prepared aluminum-silicon alloy pressed compact and at least one prepared aluminum-silicon carbide pressed compact into a die, and pressing into the gradient pressed compact.
The pressing conditions for the aluminum-silicon alloy powder are as follows: the prepressing pressure is 100-160 MPa, the pressure maintaining time is 20s, and the diameter of the pressed blank is 30-0.1mm。
The pressing conditions for the mixed powder of aluminum and silicon carbide were: the prepressing pressure is 120-200 MPa, the pressure maintaining time is 20s, and the diameter of a pressed blank is 30-0.1mm. And (3) feeding the pressed aluminum silicon carbide green compact into a vacuum drying oven at 60 ℃ for drying for 6 hours.
The pressing conditions of the aluminum-silicon alloy green compact and the aluminum-silicon carbide green compact are as follows: the prepressing pressure is 250-300 MPa, the pressure maintaining time is 20 seconds, and the diameter of a pressed blank is 30+0.1mm。
(4) And (4) carrying out hot-pressing sintering or hot isostatic pressing on the gradient pressed compact prepared in the step (3) to obtain the aluminum-silicon/aluminum-silicon carbide gradient composite material.
The processing conditions of hot-pressing sintering are as follows: the hot-pressing sintering temperature is 550 ℃, the sintering pressure is 45MPa, the heat preservation time is 60min, and the hot-pressing die adopts high-purity high-strength graphite.
Before hot isostatic pressing, the gradient pressed compact is sealed in a pure aluminum sheath, and sealing and welding are carried out after vacuum pumping. The treatment conditions for hot isostatic pressing were: the hot isostatic pressing temperature is 540 ℃, the sintering pressure is 120MPa, and the heat preservation time is 120 min.
After hot pressing sintering or hot isostatic pressing, the obtained gradient composite material has uniform microstructure and good interface structure, and good metallurgical bonding is formed between the layers.
Example 1
The aluminum-silicon/aluminum-silicon carbide gradient composite material designed in the embodiment is composed of two aluminum-silicon alloy layers and one aluminum-silicon carbide composite material layer; wherein the weight percentages of the aluminum in the two aluminum-silicon alloy layers are respectively 27% and 50%, and the volume percentage of the aluminum in the aluminum-silicon carbide composite material layer is 60%; the aluminum alloy layer containing 50% of aluminum is positioned between the aluminum alloy layer containing 27% of aluminum and the aluminum silicon carbide composite material layer, so that a three-layer gradient structure of Al 27% Si-Al 50% Si-Al 60% SiC composite material is obtained.
The specific steps for preparing the aluminum-silicon/aluminum-silicon carbide gradient composite material in the embodiment are as follows:
(1) pure aluminum ingots and monocrystalline silicon blocks are selected as raw materials, and the pure aluminum ingots and the monocrystalline silicon blocks are mixed according to the weight ratio of 27:73 and 1:1 respectively. And then, feeding the pure aluminum ingot with the matched weight into a medium-frequency induction smelting furnace for smelting, wherein a tundish crucible of the medium-frequency induction smelting furnace is heated by adopting a resistor, the preheating temperature is 700-900 ℃, and the heat preservation time is 30 min. The method comprises the steps of heating a medium-frequency induction smelting furnace to 780-860 ℃ to completely melt a pure aluminum ingot, rapidly heating to 1200-1500 ℃, correspondingly adding a single crystal silicon block with the prepared weight, fully stirring for 5-15 min, cooling to 850-1100 ℃ after the single crystal silicon block is completely melted, slagging by using a flux (30% of NaCl, 47% of KCl and 23% of cryolite composite salt), degassing by using hexachlorohexane, and preserving heat for 10-15 min after alloy smelting to facilitate homogenization of an alloy melt, so that two aluminum-silicon alloys containing 27% of aluminum and 50% of aluminum are obtained.
And respectively carrying out gas atomization on the two parts of aluminum-silicon alloy obtained by smelting to prepare powder, wherein the atomization gas is argon or nitrogen, and the atomization pressure is 0.9-1.2 MPa. And (3) after the two prepared powders are cooled, respectively screening by adopting a mechanical device, and removing particles larger than 74 mu m to obtain two parts of aluminum-silicon alloy powder containing 27% of aluminum and 50% of aluminum.
(2) Silicon carbide particles with the size of 10-70 mu m and Al-7Si-0.3Mg-0.3Mg alloy powder are selected as raw materials. The silicon carbide particles and the Al-7Si-0.3Mg-0.3Mg alloy powder are mixed according to the volume ratio of 3:2, then mechanical mixing is adopted for 6 hours, and alcohol with the weight being 0.1-0.2% of the total weight of the mixed powder is added for mixing, so that powder separation is prevented, and the mixed powder of aluminum and silicon carbide is obtained.
(3) Respectively pressing the two parts of aluminum-silicon alloy powder containing 27% of aluminum and 50% of aluminum prepared in the step (1), wherein the pressing conditions are as follows: the prepressing pressure is 100-160 MPa, the pressure maintaining time is 20s, and the diameter of the pressed blank is 30-0.1mm, an aluminum-silicon alloy compact containing 27% of aluminum (Al-27% Si alloy) and an aluminum-silicon alloy compact containing 50% of aluminum (Al-50% Si alloy) were obtained.
Pressing the mixed powder of the aluminum and the silicon carbide prepared in the step (2) into an aluminum silicon carbide green compact, wherein the pressing conditions are as follows: the prepressing pressure is 120-200 MPa, the pressure maintaining time is 20s, and the diameter of a pressed blank is 30-0.1mm. The pressed aluminum silicon carbide compact (Al 60% SiC composite) was dried in a vacuum oven at 60 ℃ for 6 hours.
According to the three-layer gradient structure of the Al 27% Si-Al 50% Si-Al 60% SiC composite material, the prepared aluminum-27% aluminum-silicon alloy pressed compactAnd sequentially loading the aluminum-silicon alloy pressed compact containing 50% of aluminum and the silicon aluminum carbide pressed compact into a die, and pressing into a gradient pressed compact under the following pressing conditions: the prepressing pressure is 250-300 MPa, the pressure maintaining time is 20 seconds, and the diameter of a pressed blank is 30+0.1mm。
(4) And (4) carrying out hot-pressing sintering or hot isostatic pressing on the gradient pressed compact prepared in the step (3) to obtain the aluminum-silicon/aluminum-silicon carbide gradient composite material. The obtained aluminum silicon/aluminum silicon carbide gradient composite material is sealed in a pure aluminum sheath, and is sealed and welded after being vacuumized.
If hot-pressing sintering is carried out, the treatment conditions are as follows: the hot-pressing sintering temperature is 550 ℃, the sintering pressure is 45MPa, the heat preservation time is 60min, and the hot-pressing die adopts high-purity high-strength graphite.
If the mechanical energy is hot isostatic pressing, the treatment conditions are as follows: the hot isostatic pressing temperature is 540 ℃, the sintering pressure is 120MPa, and the heat preservation time is 120 min.
Referring to fig. 2, the vernier caliper in fig. 2 holds the aluminum-silicon/aluminum-silicon carbide gradient composite material prepared in this embodiment, which has a three-layer gradient structure of Al 27% Si-Al 50% Si-Al 60% SiC composite material; wherein, the fracture morphology of the Al-27% Si alloy is shown in figure 3, the visible microstructure is uniform, the fracture morphology of the Al-50% Si alloy is shown in figure 4, the visible microstructure is uniform, and the fracture morphology of the Al 60% SiC composite material is shown in figure 5, the visible microstructure is uniform.
The gradient design of the composite material in the embodiment is mainly based on the thermal expansion coefficient, the thermal conductivity and the process performance, the aluminum-silicon alloy has good processing performance, the aluminum-silicon carbide composite material has high strength and high modulus, and the Al 50% Si alloy is used as the intermediate transition layer to reduce the thermal stress caused by the mismatch of the thermal expansion coefficient. The thickness of each layer is distributed according to actual needs.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (7)
1. An aluminum silicon/aluminum silicon carbide gradient composite material is characterized in that: is a gradient composite material consisting of two aluminum-silicon alloy layers and one aluminum-silicon carbide composite material layer; the aluminum in the two aluminum-silicon alloy layers accounts for 27% and 50% in weight percentage respectively, and the aluminum in the aluminum-silicon carbide composite material layer accounts for 60% in volume percentage; the aluminum alloy layer containing 50% of aluminum is positioned between the aluminum alloy layer containing 27% of aluminum and the aluminum silicon carbide composite material layer;
the aluminum-silicon alloy layer consists of an aluminum matrix and silicon particles uniformly distributed in the aluminum matrix, and the aluminum-silicon carbide composite material layer consists of an Al-7Si-0.3Mg alloy matrix and silicon carbide particles uniformly distributed in the Al-7Si-0.3Mg alloy matrix;
the preparation method of the aluminum-silicon/aluminum-silicon carbide gradient composite material comprises the following steps:
(1) preparing two parts of aluminum-silicon alloy powder containing 27% of aluminum and 50% of aluminum according to the weight ratio of 27:73 to 1:1 of aluminum to silicon;
(2) mixing silicon carbide powder and Al-7Si-0.3Mg alloy powder according to the volume ratio, then mechanically mixing for 6 hours, adding 0.1-0.2% alcohol, and mixing to prepare mixed powder containing 60% of aluminum and silicon carbide;
(3) respectively pre-pressing the two parts of the aluminum-silicon alloy powder prepared in the step (1) into two aluminum-silicon alloy pressed compacts containing 27% of aluminum and 50% of aluminum, and pre-pressing the mixed powder of the aluminum and the silicon carbide prepared in the step (2) into an aluminum-silicon carbide pressed compact; according to a designed gradient structure, sequentially filling the prepared aluminum-silicon alloy pressed compact containing 27% of aluminum, aluminum-silicon alloy pressed compact containing 50% of aluminum and silicon aluminum carbide pressed compact into a die, and pressing into a gradient pressed compact;
(4) and (4) carrying out hot-pressing sintering or hot isostatic pressing on the gradient pressed compact prepared in the step (3) to obtain the aluminum-silicon/aluminum-silicon carbide gradient composite material.
2. The aluminum silicon/aluminum silicon carbide gradient composite of claim 1, wherein: the size of the silicon carbide particles in the aluminum silicon carbide composite material layer is 10-70 microns.
3. A preparation method of an aluminum silicon/aluminum silicon carbide gradient composite material is characterized by comprising the following steps: the method comprises the following steps:
(1) preparing two parts of aluminum-silicon alloy powder containing 27% of aluminum and 50% of aluminum according to the weight ratio of 27:73 to 1:1 of aluminum to silicon;
(2) mixing silicon carbide powder and Al-7Si-0.3Mg alloy powder according to the volume ratio, then mechanically mixing for 6 hours, adding 0.1-0.2% alcohol, and mixing to prepare mixed powder containing 60% of aluminum and silicon carbide;
(3) respectively pre-pressing the two parts of the aluminum-silicon alloy powder prepared in the step (1) into two aluminum-silicon alloy pressed compacts containing 27% of aluminum and 50% of aluminum, and pre-pressing the mixed powder of the aluminum and the silicon carbide prepared in the step (2) into an aluminum-silicon carbide pressed compact; according to a designed gradient structure, sequentially filling the prepared aluminum-silicon alloy pressed compact containing 27% of aluminum, aluminum-silicon alloy pressed compact containing 50% of aluminum and silicon aluminum carbide pressed compact into a die, and pressing into a gradient pressed compact;
(4) and (4) carrying out hot-pressing sintering or hot isostatic pressing on the gradient pressed compact prepared in the step (3) to obtain the aluminum-silicon/aluminum-silicon carbide gradient composite material.
4. The method for preparing the aluminum silicon/aluminum silicon carbide gradient composite material according to claim 3, characterized in that: the step (1) comprises the following steps: the preparation method comprises the steps of proportioning and smelting a pure aluminum ingot and a monocrystalline silicon block according to a ratio, then carrying out gas atomization for preparing powder, wherein the atomization pressure is 0.7-1.2 MPa, and removing particles with the size larger than 74 microns through screening after the prepared powder is cooled to obtain aluminum-silicon alloy powder.
5. The method for preparing the aluminum silicon/aluminum silicon carbide gradient composite material according to claim 3, characterized in that: in the step (3), the pre-pressing conditions for the aluminum-silicon alloy powder are as follows: prepressing pressure is 100-160 MPa, and pressure maintaining time is 20 seconds; the pre-pressing conditions for the mixed powder of aluminum and silicon carbide were: prepressing at 120-200 MPa for 20 s; the pressing conditions of the aluminum-silicon alloy green compact and the aluminum-silicon carbide green compact are as follows: the pressing pressure is 250-300 MPa, and the pressure maintaining time is 20 seconds.
6. The method for preparing the aluminum silicon/aluminum silicon carbide gradient composite material according to claim 3, characterized in that: in the step (4), the processing conditions for hot-pressing sintering of the gradient pressed compact are as follows: the hot-pressing sintering temperature is 550 ℃, the sintering pressure is 45MPa, and the heat preservation time is 60 minutes.
7. The method for preparing the aluminum silicon/aluminum silicon carbide gradient composite material according to claim 3, characterized in that: in the step (4), the hot isostatic pressing treatment conditions for the gradient pressed compact are as follows: the hot isostatic pressing temperature is 540 ℃, the sintering pressure is 120MPa, and the heat preservation time is 120 minutes.
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| CN110272281A (en) * | 2019-01-21 | 2019-09-24 | 西安明科微电子材料有限公司 | A kind of two-phase composite material and preparation method thereof |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004064151A2 (en) * | 2003-01-13 | 2004-07-29 | Koninklijke Philips Electronics N.V. | Electronic device and method of manufacturing a substrate |
| CN101973144A (en) * | 2010-09-15 | 2011-02-16 | 中国人民解放军国防科学技术大学 | Layered aluminium-silica-alumina-silicon carbide composite material capable of laser welding and preparation method thereof |
| CN102114541A (en) * | 2009-12-30 | 2011-07-06 | 北京有色金属研究总院 | Preparation process of high volume fraction silicon particle enhanced aluminum based composite material |
| CN102534297A (en) * | 2010-12-16 | 2012-07-04 | 北京有色金属研究总院 | Alloy material with thermal expansion coefficient in gradient change and preparation method thereof |
| CN102676883A (en) * | 2011-12-19 | 2012-09-19 | 河南科技大学 | Silicon carbide reinforced aluminum-based composite material and preparation method thereof |
| CN103367270A (en) * | 2013-07-11 | 2013-10-23 | 中国人民解放军国防科学技术大学 | Aluminum silicon carbide composite material with laser welding layer and preparing method of aluminum silicon carbide composite material |
| CN103966543A (en) * | 2014-05-13 | 2014-08-06 | 中国人民解放军国防科学技术大学 | Aluminum-silicon/aluminum-silicon carbide composite material, preparation method thereof and electronic packaging device |
| CN104651663A (en) * | 2015-01-19 | 2015-05-27 | 中南大学 | Double-layer titanium aluminum/aluminum silicon composite material as well as preparation method and application thereof |
| CN105803293A (en) * | 2014-12-31 | 2016-07-27 | 北京有色金属研究总院 | Silicon carbide and silicon particle reinforced aluminum-copper based composite material and preparation method thereof |
| CN106914625A (en) * | 2017-01-19 | 2017-07-04 | 中南大学 | A kind of titanium/aluminium functionally gradient material (FGM) and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105483454B (en) * | 2015-12-28 | 2017-08-04 | 北京有色金属研究总院 | A kind of preparation method of stratiform aluminum matrix composite used for electronic packaging |
-
2018
- 2018-06-26 CN CN201810668511.9A patent/CN108746637B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004064151A2 (en) * | 2003-01-13 | 2004-07-29 | Koninklijke Philips Electronics N.V. | Electronic device and method of manufacturing a substrate |
| CN102114541A (en) * | 2009-12-30 | 2011-07-06 | 北京有色金属研究总院 | Preparation process of high volume fraction silicon particle enhanced aluminum based composite material |
| CN101973144A (en) * | 2010-09-15 | 2011-02-16 | 中国人民解放军国防科学技术大学 | Layered aluminium-silica-alumina-silicon carbide composite material capable of laser welding and preparation method thereof |
| CN102534297A (en) * | 2010-12-16 | 2012-07-04 | 北京有色金属研究总院 | Alloy material with thermal expansion coefficient in gradient change and preparation method thereof |
| CN102676883A (en) * | 2011-12-19 | 2012-09-19 | 河南科技大学 | Silicon carbide reinforced aluminum-based composite material and preparation method thereof |
| CN103367270A (en) * | 2013-07-11 | 2013-10-23 | 中国人民解放军国防科学技术大学 | Aluminum silicon carbide composite material with laser welding layer and preparing method of aluminum silicon carbide composite material |
| CN103966543A (en) * | 2014-05-13 | 2014-08-06 | 中国人民解放军国防科学技术大学 | Aluminum-silicon/aluminum-silicon carbide composite material, preparation method thereof and electronic packaging device |
| CN105803293A (en) * | 2014-12-31 | 2016-07-27 | 北京有色金属研究总院 | Silicon carbide and silicon particle reinforced aluminum-copper based composite material and preparation method thereof |
| CN104651663A (en) * | 2015-01-19 | 2015-05-27 | 中南大学 | Double-layer titanium aluminum/aluminum silicon composite material as well as preparation method and application thereof |
| CN106914625A (en) * | 2017-01-19 | 2017-07-04 | 中南大学 | A kind of titanium/aluminium functionally gradient material (FGM) and preparation method thereof |
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