CN108746637A - Aluminium silicon/aluminium silicon carbide gradient composites and preparation method thereof - Google Patents
Aluminium silicon/aluminium silicon carbide gradient composites and preparation method thereof Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
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- B22F3/15—Hot isostatic pressing
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Abstract
The present invention relates to a kind of aluminium silicon/aluminium silicon carbide gradient composites and preparation method thereof.Aluminium silicon/aluminium silicon carbide gradient composites of the present invention are by an at least alusil alloy layer and the gradient composites that at least an aluminum silicon carbide composite material layer is constituted；Wherein, by weight percentage, the alusil alloy layer contains silicon 22~50%, and surplus is aluminium；By volume percentage, the aluminum silicon carbide composite material layer contains silicon carbide 40~65%, and surplus is aluminum or aluminum alloy.Aluminium silicon/aluminium silicon carbide gradient composites of the present invention have the advantages that thermal conductivity height, high mechanical strength, density is small, performance is controllable, is easily worked, is of low cost, has good comprehensive performance, the indices requirement that disclosure satisfy that Electronic Packaging, is particularly suitable for use as electronic package material.
Description
Technical field
The present invention relates to technical field of composite materials, more particularly to a kind of aluminium silicon/aluminium silicon carbide gradient composites and
Preparation method.
Background technology
Electronic package material is for carrying electronic device and its phase interconnection line, playing mechanical support, sealed environment protection, letter
Number transmit, heat dissipation and shielding the effects that basis material.There are many type of electronic package material, traditional Metal Substrate or ceramic electrical
Sub- encapsulating material includes mainly Cu, Al, Ti, Kovar, W/Cu, Mo/Cu, Al/SiC, Al2O3, AlN etc..With hyundai electronics system
It unites and develops to directions such as miniaturization, lightweight, high working frequency, high power density, multi-functional and high reliability, traditional electronics
Encapsulating material can not be competent in matched coefficients of thermal expansion, lightweight and airtight welding etc..
Studies have shown that the crash rate of electronic device increased dramatically with the rising of operating temperature：Substantially operating temperature
10 DEG C are often improved, the service life of GaAs or Si semiconductor devices will decline one third.The heat dissipation and cooling of electronic device are usually adopted
It is realized with heat sink, radiator and electronic package material.Research and develop the electronic seal with high heat conductance and good comprehensive performance
Package material and component become a key technology in Electronic Packaging field and influence the development of electronics industry.
Metal-base composites is swollen by the good heat conduction of metallic matrix and the lower heat of plastically deformed performance and reinforcement
Swollen coefficient and higher intensity organically combine, and it is controllable in very large range to obtain the performances such as thermal conductivity and coefficient of thermal expansion
Electronic package material, to realize and the encapsulation of various chips and baseplate material.Therefore, new metal-base composites is developed
It is expected to that increasing Electronic Packaging requirement can be met.
Invention content
Based on this, the object of the present invention is to provide a kind of aluminium silicon/aluminium silicon carbide gradient composites, with thermal conductivity
Rate height, high mechanical strength, density is small, performance is controllable, is easily worked, advantage of low cost.
The technical solution adopted by the present invention is as follows：
A kind of aluminium silicon/aluminium silicon carbide gradient composites are answered with an at least aluminium silicon carbide by an at least alusil alloy layer
The gradient composites that condensation material layer is constituted；Wherein, by weight percentage, the alusil alloy layer contains silicon 22~50%,
Surplus is aluminium；By volume percentage, the aluminum silicon carbide composite material layer contains silicon carbide 40~65%, and surplus is aluminium or aluminium
Alloy.
Wherein, alusil alloy is made of aluminum substrate (Al) and silicon phase (Si), also referred to as Al/Sip composite materials, combines aluminium
The superperformance of matrix and silicon phase, have thermal conductivity compared with high, coefficient of thermal expansion is controllable, specific strength is high, density it is small (<2.7g/
cm3), easy to process and plating the features such as, and the content of silicon and aluminium in the earth's crust is respectively 27.7% and 8.1%, and content is very
It is abundant, so alusil alloy is of low cost, and it is environmentally safe, it is harmless, facilitate recycling.Aluminium as a result,
Silicon alloy disclosure satisfy that hyundai electronics encapsulate requirement to the mechanics of materials, ermal physics and processing performance, Aeronautics and Astronautics, electronics,
The fields such as communication have a extensive future.
Aluminium silicon carbide (AlSiC) is the abbreviation of aluminum-base silicon carbide particulate reinforced composite, it fully combines silicon carbide
The different advantages of ceramics and metallic aluminium, the coefficient of thermal expansion to match with high-termal conductivity, with chip, density are small, light-weight, with
And high rigidity and high-flexural strength.
Although there is alusil alloy good comprehensive performance, its thermal conductivity mutually to be limited with silicon by aluminum substrate, highest
Thermal conductivity is less than the thermal conductivity 237W/mK of fine aluminium；Although aluminium silicon carbide has higher thermal conductivity and intensity, it adds
Work, plating performance are poor, seriously hinder its popularization and application in terms of resistance encapsulation.
The present invention organically combines alusil alloy and aluminium silicon carbide, constitutes the aluminium silicon with multilayered and graded structure/aluminium carbonization
Silicon gradient composites achieve the purpose that learn from other's strong points to offset one's weaknesses, and on the one hand utilize the high intensity and high-modulus of aluminum silicon carbide composite material,
There is provided good mechanical performance for electronic device, on the other hand give full play to alusil alloy easy processing, can plating, can Laser Welding
The advantages that connecing, is conducive to be processed into encapsulating housing with complex shape, and packaging protection is provided for high power density electronic device.
And according to the coefficient of thermal expansion and thermal conductivity of material, select the alusil alloy suitable for silicone content and the aluminium suitable for carborundum content
Silicon carbide carries out compound.In addition, the aluminium silicon/aluminium silicon carbide Electronic Packaging gradient composites also have the characteristics that light weight
(density is less than 3g/cm3)。
The gradient-structure of the aluminium silicon/aluminium silicon carbide gradient composites can be carried out each according to actual use demand
Kind design, by adjusting the gradient number of plies, each layer of composition proportion (silicone content, aluminium silicon carbide composite wood in alusil alloy layer
Carborundum content in the bed of material), the weight ratio of alusil alloy layer and aluminium silicon carbide layer or thickness proportion etc., have not to obtain
With the composite material of performance.Therefore, the aluminium silicon/aluminium silicon carbide gradient composites have good controllability, can be according to envelope
Reload request, using standard machinery processing obtain with specific shape and size encapsulating housing, and can carry out coating surface and
Laser welding realizes level Hermetic Package.
Aluminium silicon/aluminium silicon carbide gradient composites of the present invention had both retained the high heat conductance and high intensity of aluminium silicon carbide,
Make full use of aluminium silicon workability, can plating, can laser welding the advantages of, with thermal conductivity height, high mechanical strength, density
It is small, performance is controllable, is easily worked, advantage of low cost, have good comprehensive performance, disclosure satisfy that the items of Electronic Packaging
Index request is particularly suitable for use as electronic package material, such as the encapsulating material of high power density microelectronics and microwave device,
And the military service performance of material can be further increased by the optimization design of gradient-structure.
Further, the alusil alloy layer is made of aluminum substrate and the silicon particle being uniformly distributed in aluminum substrate, described
Aluminum silicon carbide composite material layer is by Al-7Si-0.3Mg-0.3Mg alloy substrates and is uniformly distributed in Al-7Si-0.3Mg-0.3Mg
Silicon-carbide particle composition in alloy substrate.Matrix using Al-7Si-0.3Mg as aluminum silicon carbide composite material layer, can
Ensure that material has good thermal conductivity, and there can be preferable interfacial wettability with silicon carbide, to obtain good boundary
Face bond strength.
Further, the size of the silicon-carbide particle in the aluminum silicon carbide composite material layer is 10~70 microns, to carry
The volume fraction of high silicon carbide, optional different grain size are matched.
Further, the aluminium silicon/aluminium silicon carbide gradient composites are carbonized by two layers of alusil alloy layer and one layer of aluminium
Silicon composite layer is constituted；Wherein, the weight percent of the aluminium in two layers of alusil alloy layer is respectively 27% and 50%, institute
The percent by volume for stating the aluminium in aluminum silicon carbide composite material layer is 50%；The aluminium alloy layer containing aluminium 50%, which is located at, contains aluminium
Between 27% aluminium alloy layer and aluminum silicon carbide composite material layer.
Another object of the present invention is to provide a kind of preparation method of aluminium silicon/aluminium silicon carbide gradient composites, the systems
Preparation Method includes the following steps：
(1) by weight percentage, be 22~50% using silicone content, surplus is the proportioning of aluminium, prepares alusil alloy powder；
(2) volume percentage is pressed, using carborundum content be 40~65%, surplus is the proportioning of aluminum or aluminum alloy, is prepared
The mixed-powder of aluminium and silicon carbide；
(3) alusil alloy powder made from step (1) is pre-pressed into alusil alloy green compact, by aluminium made from step (2)
It is pre-pressed into aluminium silicon carbide green compact with the mixed-powder of silicon carbide；It, will be obtained at least one according to designed gradient-structure
Alusil alloy green compact is packed into mold at least one aluminium silicon carbide green compact, re-compacted at gradient green compact；
(4) hot pressed sintering or hot isostatic pressing are carried out to gradient green compact made from step (3), obtains aluminium silicon/aluminium silicon carbide ladder
Spend composite material.
The present invention is pre- by way of cold pressing at low pressures by the mixed-powder of alusil alloy powder, aluminium and silicon carbide respectively
It is pressed into green compact, further according to the structure design of gradient composites, by cold pressing mode to obtained alusil alloy green compact and aluminium
Silicon carbide green compact is suppressed, and molding gradient green compact is obtained, and is finally carried out hot pressed sintering or hot isostatic pressing to gradient green compact, is obtained
Obtain fine and close, the uniform gradient composites of microstructure.The process of the preparation method is simple, easily controllable and realize, aluminium
Silicon alloy layer and aluminum silicon carbide composite material layer be all by compression moulding, and to gradient green compact carry out hot pressed sintering or heat etc. it is quiet
Pressure, realizes integrated sintering densification, not only reduces preparation section, improves production efficiency, and forming temperature is relatively low can
It avoids forming fragile transition zone between alusil alloy and aluminium silicon carbide, improves the performance of gradient composites entirety.
Further, step (1) includes：Fine aluminium ingot and monocrystalline silico briquette are subjected to dispensing, melting according to the ratio, then carry out aerosol
Change powder processed, atomizing pressure is 0.7~1.2MPa, and the particle that size is more than 74 microns is removed through screening after powder cooling obtained,
Obtain alusil alloy powder.The screening can remove the coarse large-size particle of tissue, and large-size particle is avoided to reduce material
Compactness, to ensure material property.
Further, step (2) includes：By silicon carbide powder and Al-7Si-0.3Mg-0.3Mg alloy powders according to the ratio into
Then row dispensing uses mechanical mixture 6 hours, and add 0.1~0.2% alcohol and mixed, and obtains the mixed of aluminium and silicon carbide
Close powder.
Further, in step (3), the pre-stamped condition to alusil alloy powder is：Precompressed pressing pressure be 100~
160MPa, dwell time are 20 seconds；Pre-stamped condition to the mixed-powder of aluminium and silicon carbide is：Precompressed pressing pressure be 120~
200MPa, dwell time are 20 seconds；It is to alusil alloy green compact and the pressing conditions of aluminium silicon carbide green compact：Pressing pressure is 250
~300MPa, dwell time are 20 seconds.If precompressed pressing pressure is too low, material can not be molded, right if precompressed pressing pressure is too high
Equipment requirement is high, it is big that mold is lost, and by the restriction of above-mentioned pressure limit, can ensure that material is smoothly molded, and protects simultaneously
Press device.
Further, in step (4), the treatment conditions that hot pressed sintering is carried out to gradient green compact are：Hot pressed sintering temperature 550
DEG C, sintering pressure 45MPa, soaking time 60 minutes.In order to ensure material property, takes sintering pressure smaller, be used in combination slightly higher
Temperature so that material is reached densification.
Further, in step (4), the treatment conditions that hot isostatic pressing is carried out to gradient green compact are：Hip temperature is
540 DEG C, sintering pressure 120MPa, soaking time is 120 minutes.In order to ensure material property, take sintering pressure smaller, and
Material is set to reach densification with slightly higher temperature.
In order to better understand and implement, the invention will now be described in detail with reference to the accompanying drawings.
Description of the drawings
Fig. 1 is the preparation flow figure of aluminium silicon/aluminium silicon carbide gradient composites of the present invention；
Fig. 2 is the photomacrograph of aluminium silicon/aluminium silicon carbide gradient composites made from embodiment 1；
Fig. 3 is the fracture apperance figure of Al-27%Si alloys made from embodiment 1；
Fig. 4 is the fracture apperance figure of Al-50%Si alloys made from embodiment 1；
Fig. 5 is the fracture apperance figure of Al60%SiC composite materials made from embodiment 1.
Specific implementation mode
Aluminium silicon/aluminium silicon carbide gradient composites of the present invention are carbonized by an at least alusil alloy layer and an at least aluminium
Silicon composite layer is constituted；Wherein, by weight percentage, the alusil alloy layer contains silicon 22~50%, and surplus is aluminium；It presses
Volume percentage, the aluminum silicon carbide composite material layer contain silicon carbide 40~65%, and surplus is aluminum or aluminum alloy.
Specifically, the alusil alloy layer is made of aluminum substrate and silicon particle, and the silicon particle size is tiny and uniformly divides
It is distributed in aluminum substrate.The aluminum silicon carbide composite material layer is by Al-7Si-0.3Mg-0.3Mg alloy substrates and silicon-carbide particle group
At the silicon-carbide particle is uniformly distributed in Al-7Si-0.3Mg-0.3Mg alloy substrates, and and Al-7Si-0.3Mg-
0.3Mg alloy substrates form good interface cohesion.As further preferred, the carbonization in the aluminum silicon carbide composite material layer
The size of silicon particle is 10~70 μm.
The gradient-structure of the aluminium silicon/aluminium silicon carbide gradient composites can be carried out each according to actual use demand
Kind design, by adjusting the gradient number of plies, each layer of composition proportion (silicone content, aluminium silicon carbide composite wood in alusil alloy layer
Carborundum content in the bed of material), the weight ratio of alusil alloy layer and aluminium silicon carbide layer or thickness proportion etc., have not to obtain
With the composite material of performance.Therefore, the aluminium silicon/aluminium silicon carbide gradient composites have good controllability, can root
It is processed into encapsulating housing with complex shape according to drawing, and by coating surface and laser welding, realizes level Hermetic Package.
As shown in Figure 1, after completing gradient-structure design, aluminium silicon/aluminium silicon carbide gradient composites are prepared according to the following steps：
(1) alusil alloy powder is prepared.It is as follows：
Select fine aluminium ingot and monocrystalline silico briquette as raw material, by weight percentage, with silicone content be 22~50%, surplus is
Fine aluminium ingot and monocrystalline silico briquette are carried out dispensing, then the fine aluminium ingot for preparing weight are sent into medium frequency induction melting furnace by the proportioning of aluminium
Melting is carried out, the tundish crucible of the medium frequency induction melting furnace uses resistance heating, and preheating temperature is protected between 700~900 DEG C
The warm time is 30min.Medium frequency induction melting furnace is first warming up to 780~860 DEG C and is completely melt fine aluminium ingot, be then brought rapidly up to
1200~1500 DEG C, the monocrystalline silico briquette for preparing weight is added, 5~15min is sufficiently stirred, dropped after monocrystalline silico briquette is completely melt
Temperature carries out slag making to 850~1100 DEG C, using flux (30%NaCl+47%KCl+23% ice crystals complex salt), and uses six
Chlorohexane degasification, alloy melting keep the temperature 10~15min in favor of the homogenization of alloy melt later.
Gas-atomized powder is carried out to the alusil alloy obtained by melting, atomization gas is argon gas or nitrogen, atomizing pressure 0.7
~1.2MPa.It after powder cooling obtained, is sieved using mechanical device, particle of the removal more than 74 μm obtains the conjunction of aluminium silicon
Bronze end.
(2) mixed-powder of aluminium and silicon carbide is prepared.It is as follows：
It is 150~400 μm of silicon-carbide particle and Al-7Si-0.3Mg-0.3Mg alloy powders as raw material to select size.
By volume percentage, the proportioning that with carborundum content be 40~65%, surplus is Al-7Si-0.3Mg-0.3Mg alloys, by carbon
Silicon carbide particle carries out dispensing according to the ratio with Al-7Si-0.3Mg-0.3Mg alloy powders, then uses mechanical mixture 6 hours, and adds
Add weight is that 0.1~0.2% alcohol of mixed-powder gross weight is mixed, and prevents powder from detaching, obtains aluminium and silicon carbide
Mixed-powder.
(3) alusil alloy powder made from step (1) is pressed into alusil alloy green compact.By aluminium made from step (2) and
The mixed-powder of silicon carbide is pressed into aluminium silicon carbide green compact.According to designed gradient-structure, by least one aluminium silicon obtained
Alloy green compact is packed into mold at least one aluminium silicon carbide green compact, re-compacted at gradient green compact.
Pressing conditions to alusil alloy powder is：Precompressed pressing pressure is 100~160MPa, dwell time 20s, green compact
A diameter of 30-0.1mm。
Pressing conditions to the mixed-powder of aluminium and silicon carbide is：Precompressed pressing pressure is 120~200MPa, and the dwell time is
20s, green compact a diameter of 30-0.1mm.The aluminium silicon carbide green compact suppressed is sent into 6 hours dry in 60 DEG C of vacuum drying chambers.
It is to alusil alloy green compact and the pressing conditions of aluminium silicon carbide green compact：Precompressed pressing pressure is 250~300MPa, pressurize
Time is 20 seconds, green compact a diameter of 30+0.1mm。
(4) hot pressed sintering or hot isostatic pressing are carried out to gradient green compact made from step (3), obtains aluminium silicon/aluminium silicon carbide ladder
Spend composite material.
The treatment conditions of hot pressed sintering are：550 DEG C, sintering pressure 45MPa, soaking time 60min of hot pressed sintering temperature,
Hot pressing die uses high-purity high-strength graphite.
Before hot isostatic pressing, gradient green compact is sealed in fine aluminium jacket, vacuumizes rear soldering and sealing.The treatment conditions of hot isostatic pressing
For：Hip temperature is 540 DEG C, sintering pressure 120MPa, soaking time 120min.
After hot pressed sintering or hot isostatic pressing, the gradient composites microscopic structure of gained is uniform, interfacial structure is good, and
And good metallurgical binding is formed between each layer.
Embodiment 1
Aluminium silicon/aluminium silicon carbide gradient composites of the present embodiment design, are by two layers of alusil alloy layer and one layer of aluminium carbon
SiClx composite layer is constituted；Wherein, the weight percent of the aluminium in two layers of alusil alloy layer is respectively 27% and 50%,
The percent by volume of aluminium in the aluminum silicon carbide composite material layer is 60%；The aluminium alloy layer containing aluminium 50%, which is located at, contains aluminium
It is compound to obtain Al27%Si-Al50%Si-Al60%SiC between 27% aluminium alloy layer and aluminum silicon carbide composite material layer
Three layers of gradient-structure of material.
The present embodiment prepares aluminium silicon/aluminium silicon carbide gradient composites and is as follows：
(1) select fine aluminium ingot and monocrystalline silico briquette as raw material, respectively with 27:73 and 1:1 two kinds of weight proportions are by fine aluminium ingot
Dispensing is carried out with monocrystalline silico briquette.The fine aluminium ingot for preparing weight is sent into medium frequency induction melting furnace again and carries out melting, the intermediate frequency sense
The tundish crucible of smelting furnace is answered to use resistance heating, preheating temperature is between 700~900 DEG C, soaking time 30min.In
Frequency induction melting furnace is first warming up to 780~860 DEG C and is completely melt fine aluminium ingot, is then brought rapidly up to 1200~1500 DEG C, then
It is corresponding that the monocrystalline silico briquette for preparing weight is added, it is sufficiently stirred 5~15min, it is cooled to 850 after monocrystalline silico briquette is completely melt~
1100 DEG C, slag making is carried out using flux (30%NaCl+47%KCl+23% ice crystals complex salt), and remove using hexachlorethane
Gas, alloy melting keep the temperature 10~15min in favor of the homogenization of alloy melt later, then obtain containing aluminium 27% respectively and contain aluminium
50% two parts of alusil alloys.
Gas-atomized powder is carried out respectively to two parts of alusil alloys obtained by melting, atomization gas is argon gas or nitrogen, atomization
Pressure is 0.9~1.2MPa.After two parts of powder cooling obtained, mechanical device is respectively adopted and is sieved, removal is more than 74 μm
Particle, obtain two parts of alusil alloy powder respectively containing aluminium 27% and containing aluminium 50%.
(2) size is selected to be used as original for 10~70 μm of silicon-carbide particle and Al-7Si-0.3Mg-0.3Mg alloy powders
Material.With 3:Silicon-carbide particle and Al-7Si-0.3Mg-0.3Mg alloy powders are carried out dispensing by 2 volume proportion, then use machine
Tool mixes 6 hours, and adds 0.1~0.2% alcohol that weight is mixed-powder gross weight and mixed, and prevents powder from detaching,
Obtain the mixed-powder of aluminium and silicon carbide.
(3) step (1) two parts of alusil alloy powder obtained containing aluminium 27% and containing aluminium 50% are suppressed respectively, is pressed
Condition processed is：Precompressed pressing pressure is 100~160MPa, dwell time 20s, green compact a diameter of 30-0.1Mm then obtains containing aluminium
27% alusil alloy green compact (Al-27%Si alloys) and the alusil alloy green compact (Al-50%Si alloys) containing aluminium 50%.
The mixed-powder of aluminium and silicon carbide made from step (2) is pressed into aluminium silicon carbide green compact, pressing conditions is：Precompressed
Pressing pressure is 120~200MPa, dwell time 20s, green compact a diameter of 30-0.1mm.The aluminium silicon carbide green compact suppressed
(Al60%SiC composite materials) is sent into 6 hours dry in 60 DEG C of vacuum drying chambers.
According to three layers of gradient-structure of Al27%Si-Al50%Si-Al60%SiC composite materials, obtained aluminium will be contained
27% alusil alloy green compact is sequentially packed into mold containing 50% alusil alloy green compact of aluminium and aluminium silicon carbide green compact, is then pressed into ladder
Green compact is spent, pressing conditions is：Precompressed pressing pressure is 250~300MPa, and the dwell time is 20 seconds, green compact a diameter of 30+0.1mm。
(4) hot pressed sintering or hot isostatic pressing are carried out to gradient green compact made from step (3), obtains aluminium silicon/aluminium silicon carbide ladder
Spend composite material.Aluminium silicon/aluminium silicon carbide gradient composites of gained are sealed in fine aluminium jacket, vacuumize rear soldering and sealing.
If carrying out hot pressed sintering, treatment conditions are：550 DEG C, sintering pressure 45MPa of hot pressed sintering temperature, soaking time
60min, hot pressing die use high-purity high-strength graphite.
If mechanical energy hot isostatic pressing, treatment conditions are：Hip temperature is 540 DEG C, sintering pressure 120MPa, heat preservation
Time is 120min.
Referring to Fig. 2, in Fig. 2 vernier caliper be clamped be aluminium silicon made from the present embodiment/aluminium silicon carbide graded composite material
Material, the material have three layers of gradient-structure of Al27%Si-Al50%Si-Al60%SiC composite materials；Wherein, Al-27%Si
The fracture apperance of alloy is as shown in Figure 3, it is seen that microscopic structure is uniform, and the fracture apperance of Al-50%Si alloys is as shown in figure 4, can
See that microscopic structure is uniform, the fracture apperance of Al60%SiC composite materials is as shown in Figure 5, it is seen that microscopic structure is uniform.
The present embodiment is to the gradient design of composite material mainly according to coefficient of thermal expansion, thermal conductivity and processing performance, aluminium silicon
During there is alloy good processing performance, aluminum silicon carbide composite material there is high intensity and high-modulus, Al50%Si alloys to be used as
Between transition zone be in order to reduce coefficient of thermal expansion mismatch caused by thermal stress.Each layer thickness will be divided according to actual needs
Match.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.
Claims (10)
1. a kind of aluminium silicon/aluminium silicon carbide gradient composites, it is characterised in that：It is by an at least alusil alloy layer and an at least aluminium
The gradient composites that composite material of silicon carbide layer is constituted；Wherein, by weight percentage, the alusil alloy layer contains silicon 22
~50%, surplus is aluminium；By volume percentage, the aluminum silicon carbide composite material layer contains silicon carbide 40~65%, surplus
For aluminum or aluminum alloy.
2. aluminium silicon/aluminium silicon carbide gradient composites according to claim 1, it is characterised in that：The alusil alloy layer
It is made of aluminum substrate and the silicon particle being uniformly distributed in aluminum substrate, the aluminum silicon carbide composite material layer is by Al-7Si-
0.3Mg-0.3Mg alloy substrates and the silicon-carbide particle composition being uniformly distributed in Al-7Si-0.3Mg-0.3Mg alloy substrates.
3. aluminium silicon/aluminium silicon carbide gradient composites according to claim 2, it is characterised in that：The aluminium silicon carbide is multiple
The size of silicon-carbide particle in condensation material layer is 10~70 microns.
4. according to claim 1-3 any one of them aluminium silicon/aluminium silicon carbide gradient composites, it is characterised in that：It is by two
Layer alusil alloy layer and one layer of aluminum silicon carbide composite material layer are constituted；Wherein, the weight of the aluminium in two layers of alusil alloy layer
Percentage is respectively 27% and 50%, and the percent by volume of the aluminium in the aluminum silicon carbide composite material layer is 50%；It is described to contain
The aluminium alloy layer of aluminium 50% is between the aluminium alloy layer containing aluminium 27% and aluminum silicon carbide composite material layer.
5. a kind of preparation method of aluminium silicon/aluminium silicon carbide gradient composites, it is characterised in that：Include the following steps：
(1) by weight percentage, be 22~50% using silicone content, surplus is the proportioning of aluminium, prepares alusil alloy powder；
(2) press volume percentage, using carborundum content be 40~65%, surplus is the proportioning of aluminum or aluminum alloy, prepare aluminium and
The mixed-powder of silicon carbide；
(3) alusil alloy powder made from step (1) is pre-pressed into alusil alloy green compact, by aluminium and carbon made from step (2)
The mixed-powder of SiClx is pre-pressed into aluminium silicon carbide green compact；According to designed gradient-structure, by least one aluminium silicon obtained
Alloy green compact is packed into mold at least one aluminium silicon carbide green compact, re-compacted at gradient green compact；
(4) hot pressed sintering or hot isostatic pressing are carried out to gradient green compact made from step (3), it is multiple obtains aluminium silicon/aluminium silicon carbide gradient
Condensation material.
6. the preparation method of aluminium silicon/aluminium silicon carbide gradient composites according to claim 5, it is characterised in that：Step
(1) include：Fine aluminium ingot and monocrystalline silico briquette are subjected to dispensing, melting according to the ratio, then carry out gas-atomized powder, atomizing pressure 0.7
~1.2MPa obtains alusil alloy powder through particle of the screening removal size more than 74 microns after powder cooling obtained.
7. the preparation method of aluminium silicon/aluminium silicon carbide gradient composites according to claim 5, it is characterised in that：Step
(2) include：Silicon carbide powder and Al-7Si-0.3Mg-0.3Mg alloy powders are subjected to dispensing according to the ratio, it is then mixed using machinery
It closes 6 hours, and adds 0.1~0.2% alcohol and mixed, obtain the mixed-powder of aluminium and silicon carbide.
8. the preparation method of aluminium silicon/aluminium silicon carbide gradient composites according to claim 5, it is characterised in that：Step
(3) in, the pre-stamped condition to alusil alloy powder is：Precompressed pressing pressure is 100~160MPa, and the dwell time is 20 seconds；It is right
The pre-stamped condition of the mixed-powder of aluminium and silicon carbide is：Precompressed pressing pressure is 120~200MPa, and the dwell time is 20 seconds；It is right
Alusil alloy green compact and the pressing conditions of aluminium silicon carbide green compact are：Pressing pressure is 250~300MPa, and the dwell time is 20 seconds.
9. the preparation method of aluminium silicon/aluminium silicon carbide gradient composites according to claim 5, it is characterised in that：Step
(4) in, the treatment conditions that hot pressed sintering is carried out to gradient green compact are：550 DEG C, sintering pressure 45MPa of hot pressed sintering temperature is protected
60 minutes warm time.
10. the preparation method of aluminium silicon/aluminium silicon carbide gradient composites according to claim 5, it is characterised in that：Step
(4) in, the treatment conditions that hot isostatic pressing is carried out to gradient green compact are：Hip temperature is 540 DEG C, and sintering pressure is
120MPa, soaking time are 120 minutes.
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