CN108728027A - A kind of epoxy resin fluorescent glue and its preparation process and application method - Google Patents
A kind of epoxy resin fluorescent glue and its preparation process and application method Download PDFInfo
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- CN108728027A CN108728027A CN201810418497.7A CN201810418497A CN108728027A CN 108728027 A CN108728027 A CN 108728027A CN 201810418497 A CN201810418497 A CN 201810418497A CN 108728027 A CN108728027 A CN 108728027A
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- epoxy resin
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- 239000003292 glue Substances 0.000 title claims abstract description 49
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 31
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- 239000003085 diluting agent Substances 0.000 claims abstract description 21
- 239000007822 coupling agent Substances 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 13
- 239000012745 toughening agent Substances 0.000 claims abstract description 13
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 12
- 239000004593 Epoxy Substances 0.000 claims abstract description 10
- 238000003860 storage Methods 0.000 claims description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- 239000004952 Polyamide Substances 0.000 claims description 6
- -1 phenolic aldehyde amine Chemical class 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 claims description 4
- 229920002292 Nylon 6 Polymers 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000012856 packing Methods 0.000 claims description 4
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 claims description 3
- 229910002012 Aerosil® Inorganic materials 0.000 claims description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical group C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims description 2
- 238000013329 compounding Methods 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 238000002834 transmittance Methods 0.000 claims description 2
- HSRJKNPTNIJEKV-UHFFFAOYSA-N Guaifenesin Chemical compound COC1=CC=CC=C1OCC(O)CO HSRJKNPTNIJEKV-UHFFFAOYSA-N 0.000 claims 1
- 238000005286 illumination Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000002253 acid Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000007689 inspection Methods 0.000 description 13
- 208000037656 Respiratory Sounds Diseases 0.000 description 6
- 238000001514 detection method Methods 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000010410 dusting Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- HPILSDOMLLYBQF-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COC(CCC)OCC1CO1 HPILSDOMLLYBQF-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000009738 saturating Methods 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to a kind of epoxy resin fluorescent glue and its preparation processes and application method.Including component A and B component, wherein component A is by following parts by weight material composition：75-80 parts of epoxy resin, 1-5 parts of anti-settling agent, 10-15 parts of diluent, 5-20 parts of toughener, 1-3 parts of antifoaming agent, 1-5 parts of coupling agent, 40-60 parts of fluorescent material；B component is by following parts by weight material composition：40-100 parts of epoxy curing agent, 10-20 parts of diluent.The invention discloses epoxy resin is used, for the technique of carrier making fluorescent glue, obtained product physical and chemical performance is superior, and shelf-life and service life fluorescent glue more existing than market are high, and 3 years shelf-lifves or more, service life can reach 5 years.Fluorescent glue adhesive strength produced by the present invention is very high, and with superior acid and alkali-resistance, corrosion resistance.
Description
Technical field
The invention belongs to epoxy resin fluorescent glue preparing technical field, it is related to a kind of epoxy resin fluorescent glue and its prepares work
Skill and application method.
Background technology
There are no the techniques for using epoxy resin to make for carrier fluorescent glue so far, and made from existing production technology
Fluorescent glue is in terms of physical and chemical performance and service life and storage etc. come with some shortcomings.
Invention content
The present invention for fluorescent glue prepare and use etc. there are the problem of, propose a kind of epoxy resin fluorescent glue and
Its preparation process and application method.
In order to achieve the above object, the present invention is realized using following technical solutions：
A kind of epoxy resin fluorescent glue, including component A and B component, wherein component A is by following parts by weight material composition：Epoxy
75-80 parts of resin, 1-5 parts of anti-settling agent, 10-15 parts of diluent, 5-20 parts of toughener, 1-3 parts of antifoaming agent, 1-5 parts of coupling agent are glimmering
40-60 parts of luminescent material；B component is by following parts by weight material composition：40-100 parts of polyamide curing agent, 10-20 parts of diluent.
Preferably, the epoxy resin in the component A is E-51, anti-settling agent is that aerosil or polyamide close
At resin；Diluent is 1,4 butanediol diglycidyl ethers, glycol glycidyl ethers, benzyl glycidyl ether, propylene oxide
Any one or a few in glycidol ether.
Preferably, the toughener is AGE single functionalities diluent, repefral, phthalic acid two
Any one in butyl ester, antifoaming agent are the 7201 of Ai Fu Konas company, and coupling agent is commercially available KH550, fluorescent material YG923
Highlighted luminescent powder.
Preferably, the resin curing agent in the B component is arbitrary in phenolic aldehyde amine, polyamide 6 50 or polyamide 6 51
It is a kind of；Diluent is in aliphatic monocyclic oxygen activity diluent, aromatic monocyclic oxygen activity diluent, multi-epoxy modification diluent
At least one.
The preparation method of epoxy resin fluorescent glue includes the steps that two component of A, B is prepared respectively, wherein prepared by component A
Journey is as follows：
A. the epoxy resin by light transmittance more than 95% stirs compounding at 40 DEG C；
B. anti-settling agent, diluent, toughener, antifoaming agent, coupling agent, fluorescent material are sequentially added in proportion, are stirred 1 hour, are obtained
To mixed material；
C. mixed material is put into three-roll grinder grinding, obtains component A；
D. component A bottle is dispensed and is stored；
B component preparation process is as follows：Curing agent is stirred and heated to 40 DEG C, then bottle packing storage.
Preferably, the metering bottle storage of every bottle of 6-10g of component A, the metering bottle storage of every bottle of 4-5g of B component.
The application method of the above-mentioned obtained fluorescent glue of preparation method, includes the following steps:
（1）It with alcohol washes and will be dried after the position filled being needed to clean out；
（2）The B component of bottle packaging is added in component A and is uniformly mixed, fluorescent glue is obtained；
（3）Fluorescent glue is filled into the phosphor dot for needing to equip, and will be surface-treated smooth；
（4）Solidification 4-24 hours.
Preferably, the step（4）Middle maintenance process is to shift to an earlier date light filling using LED light source or bright light torch to irradiate 20 points
It is more than clock.
Compared with prior art, the advantages and positive effects of the present invention are：
1. the fluorescent glue prepared by the present invention has the following advantages：Disclose the work for using epoxy resin to make fluorescent glue for carrier
Skill, obtained product physical and chemical performance is superior, and shelf-life and service life fluorescent glue more existing than market are high, 3 years shelf-lifves with
On, service life can reach 5 years.
2. fluorescent glue adhesive strength produced by the present invention is very high, and with superior acid and alkali-resistance, corrosion resistance.
Specific implementation mode
To better understand the objects, features and advantages of the present invention, with reference to specific embodiment pair
The present invention is described further.It should be noted that in the absence of conflict, the spy in embodiments herein and embodiment
Sign can be combined with each other.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still, the present invention may be used also
With using implementing different from other modes described here, therefore, the present invention is not limited to the specific of specification is described below
The limitation of embodiment.
Embodiment 1, the present embodiment provides the composition of epoxy resin fluorescent glue and methods of preparation and use.
1. epoxy resin fluorescent glue forms.
Epoxy resin fluorescent glue is made of component A and B component, wherein component A is by following parts by weight material composition：Ring
75 parts of oxygen resin, 1 part of anti-settling agent, 10 parts of diluent, 5 parts of toughener, 1 part of antifoaming agent, 1 part of coupling agent, 40 parts of fluorescent material；B
Component is by following parts by weight material composition：40 parts of epoxy curing agent.Wherein, the model E-51 of epoxy resin, it is anti-settling
Agent is that anti-settling agent is aerosil；Diluent is Isosorbide-5-Nitrae butanediol diglycidyl ether, and toughener is phthalic acid diformazan
Ester, antifoaming agent are the model 7201 of Ai Fu Konas company production, and coupling agent is commercially available KH550, and fluorescent material is highlighted for YG923
Luminescent powder；Epoxy curing agent in B component is phenolic aldehyde amine, polyamide.
2. prepared by fluorescent glue.
A, two components of B prepare then independent bottle and are packaged respectively.Wherein, component A preparation process is as follows：It will be saturating
Epoxy resin of the light rate more than 95% stirs 1 hour under 40 DEG C, 200 revs/min；Anti-settling agent, dilution are sequentially added according to the above ratio
Agent, toughener, antifoaming agent, coupling agent, fluorescent material keep rotating speed constant and stir 1 hour at normal temperatures, obtain mixture
Material；Mixed material is put into three-roll grinder grinding, obtains component A；It is stored after component A bottle is dispensed；
B component preparation process is as follows：Curing agent is slow（100 revs/min）It is stirred and heated to temperature and reaches 40 DEG C, then bottle
Packing storage.
Wherein, the metering bottle storage of every bottle of 6-10g of component A, the metering bottle storage of every bottle of 4-5g of B component.
3. application method.
It with alcohol washes and will be dried after the position filled being needed to clean out；Component A is added in the B component of bottle packaging
In and be uniformly mixed, obtain fluorescent glue；Fluorescent glue is filled into the phosphor dot for needing to equip, and will be surface-treated smooth；It is dry
It 20-24 hours and conserves.Maintenance process is to shift to an earlier date light filling using LED light source or bright light torch to irradiate 30 minutes.
Embodiment 2, the present embodiment provides the composition of epoxy resin fluorescent glue and methods of preparation and use.
1. epoxy resin fluorescent glue forms.
Epoxy resin fluorescent glue is made of component A and B component, wherein component A is by following parts by weight material composition：Ring
75-80 parts of oxygen resin, 1-5 parts of anti-settling agent, 10-15 parts of diluent, 5-20 parts of toughener, 1-3 parts of antifoaming agent, 1-5 parts of coupling agent,
40-60 parts of fluorescent material；B component is by following parts by weight material composition：40-100 parts of epoxy curing agent.Wherein, epoxy
The model E-51 of resin, anti-settling agent are polyamide synthetic resin, and diluent is Isosorbide-5-Nitrae butanediol diglycidyl ether, ethylene glycol
Any one in glycidol ether, benzyl glycidyl ether, propylene oxide glycidol ether.Toughener isAGE single functionalities
Any one in diluent, repefral, dibutyl phthalate, antifoaming agent are Ai Fu Konas company
7201, coupling agent is commercially available KH550, and fluorescent material is that YG923 highlights luminescent powder；Epoxy curing agent in B component is poly-
Amide 651.
2. preparation method.
A, two components of B prepare then independent bottle and are packaged respectively.Wherein, component A preparation process is as follows：It will be saturating
Epoxy resin of the light rate more than 95% stirs 1 hour at 40 DEG C；Anti-settling agent is sequentially added in proportion, diluent, toughener, is disappeared
Infusion, coupling agent, fluorescent material stir 1 hour, obtain mixed material；Mixed material is put into three-roll grinder grinding, is obtained
Component A；Component A bottle is dispensed and is stored；
B component preparation process is as follows：Curing agent is stirred and heated to 40 DEG C, then bottle packing storage.
Wherein, the metering bottle storage of every bottle of 6-10g of component A, the metering bottle storage of every bottle of 4-5g of B component.
3. application method.
It with alcohol washes and will be dried after the position filled being needed to clean out；Component A is added in the B component of bottle packaging
In and be uniformly mixed, obtain fluorescent glue；Fluorescent glue is filled into the phosphor dot for needing to equip, and will be surface-treated smooth；It is dry
It 24 hours and conserves.Maintenance process is to shift to an earlier date light filling using LED light source or bright light torch to irradiate 25 minutes.
Performance detection is carried out to the fluorescent glue prepared in Examples 1 and 2, it is as a result as follows.
1. range estimation：Component A, light green color, no caking are in uniform state after stirring.B component fawn transparency liquid.
2. fluorescent glue product is nontoxic radiationless.
3. the viscosity of fluorescent glue：Quality inspection requirement：600Pa.S-800Pa.S.It is qualified that (1 viscosity 650Pa.S of embodiment is implemented
2 viscosity 655Pa.S of example).
4. after fluorescence adhesive curing, pencil hardness detection.Quality inspection requirement >=2B, qualified (embodiment 1 is 2.5B, embodiment 2
For 2.6B).
5. after fluorescence adhesive curing, impact resistance detection.Quality inspection requirement >=50cm, qualified (embodiment 1 is 82cm, is implemented
Example 2 is 88cm).
6. the adhesive force of fluorescent glue product detects.Quality inspection requires≤3, and qualified (embodiment 1 is 2.2, and embodiment 2 is
2.2)。
7. salt fog resistance（35 DEG C, 96 hours）Detection.Quality inspection requirement：Without blister, fall off, crackle, dusting, no loss of gloss.It closes
Lattice.
8. fluorescent glue afterglow duration detects, luminous intensity attenuation measurement, quality inspection requirement：>=8 hours, that is, best
After twenty minutes, detection light emission luminance decays to vision under dark surrounds to debate light application time（10mcd/ ㎡ or 0.32mcd/
㎡ or more）>=8 hours.Qualified (embodiment 1 is 10 hours, and embodiment 2 is 9.5 hours).
9. drying time when fluorescent glue uses is detected, quality inspection requirement：Surface drying（4 hours）, do solid work（24 hours）, drying
（80 DEG C, 1 hour）.Self-test is qualified
10. heat resistance detects.Quality inspection requirement：Product at 160 DEG C, 2 hours, without blister, fall off, crackle, dusting, no loss of gloss.From
Inspection, it is qualified.
11. resistance to phosphating reaction detection.Quality inspection requirement：Product impregnates 1 hour in 100 DEG C of phosphating solutions, and no blistering takes off
Fall, crackle, dusting, no loss of gloss.Self-test, it is qualified.
12. acid resistance detects.Quality inspection requirement：Product is in 20% dilution heat of sulfuric acid, soak at room temperature 1 hour, no blistering,
Fall off, crackle, dusting, no loss of gloss.Self-test, it is qualified.
13. oil resistivity detects.Quality inspection requirement：Product impregnates 24 hours in 2# preservative oils, without blistering, fall off, crackle, powder
Change, no loss of gloss.Self-test, it is qualified.
14. cold resistance detects.Quality inspection requirement：Product 24 hours in -18 DEG C of environment, without fall off, crackle, dusting, without bright
Aobvious loss of gloss.Self-test, it is qualified.
15. service life detects.3 years this fluorescent glue shelf-lifves, validity period 3-5.
The above described is only a preferred embodiment of the present invention, being not that the invention has other forms of limitations, appoint
What those skilled in the art changed or be modified as possibly also with the technology contents of the disclosure above equivalent variations etc.
It imitates embodiment and is applied to other fields, but it is every without departing from technical solution of the present invention content, according to the technical essence of the invention
To any simple modification, equivalent variations and remodeling made by above example, the protection domain of technical solution of the present invention is still fallen within.
Claims (7)
1. a kind of epoxy resin fluorescent glue, which is characterized in that including component A and B component, wherein component A is by following parts by weight
Material composition：75-80 parts of epoxy resin, 1-5 parts of anti-settling agent, 10-15 parts of diluent, 5-20 parts of toughener, 1-3 parts of antifoaming agent,
1-5 parts of coupling agent, 40-60 parts of fluorescent material；B component is by following parts by weight material composition：Epoxy curing agent 40-100
Part.
2. epoxy resin fluorescent glue according to claim 1, which is characterized in that the epoxy resin in the component A is E-51,
Anti-settling agent is aerosil or polyamide synthetic resin；Diluent is 1,4 butanediol diglycidyl ethers, ethylene glycol shrink
Any one or a few in glycerin ether, benzyl glycidyl ether, propylene oxide glycidol ether.
3. epoxy resin fluorescent glue according to claim 1, which is characterized in that toughener is AGE single functionalities diluent, neighbour
Any one in rutgers, dibutyl phthalate, antifoaming agent are the 7201 of Ai Fu Konas company, coupling agent
For commercially available KH550, fluorescent material is that YG923 highlights luminescent powder.
4. epoxy resin fluorescent glue according to claim 1, which is characterized in that the epoxy curing agent in the B component
For any one in phenolic aldehyde amine, polyamide 6 50 or polyamide 6 51；
The preparation method of any one of Claims 1-4 epoxy resin fluorescent glue, which is characterized in that prepared by component A
Journey is as follows：
A. the epoxy resin by light transmittance more than 95% stirs compounding at 40 DEG C；
B. anti-settling agent, diluent, toughener, antifoaming agent, coupling agent, fluorescent material are sequentially added in proportion, are stirred 1 hour, are obtained
To mixed material；
C. mixed material is put into three-roll grinder grinding, obtains component A；
D. component A bottle is dispensed and is stored；
B component preparation process is as follows：Curing agent is stirred and heated to 40 DEG C, then bottle packing storage.
5. the preparation method of epoxy resin fluorescent glue according to claim 5, which is characterized in that the meter of every bottle of 6-10g of component A
Measure bottle storage, the metering bottle storage of every bottle of 4-5g of B component.
6. the application method of the obtained fluorescent glue of preparation method described in claim 6, which is characterized in that include the following steps:
（1）It with alcohol washes and will be dried after the position filled being needed to clean out；
（2）The B component of bottle packaging is added in component A and is uniformly mixed, fluorescent glue is obtained；
（3）Fluorescent glue is filled into the phosphor dot for needing to equip, and will be surface-treated smooth；
（4）Solidification uses strong illumination after 4-24 hours.
7. the application method of fluorescent glue according to claim 7, it is characterised in that：The step（4）It is middle using LED light source or
Bright light torch irradiates 20 minutes or more.
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| CN201810418497.7A CN108728027A (en) | 2018-05-04 | 2018-05-04 | A kind of epoxy resin fluorescent glue and its preparation process and application method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021135202A1 (en) * | 2020-01-02 | 2021-07-08 | 长安大学 | Energy storage self-luminous epoxy resin mixture for road use and preparation method thereof |
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| JP2009221329A (en) * | 2008-03-14 | 2009-10-01 | Bridgestone Corp | Method for adhering elastomer |
| CN104987849A (en) * | 2015-07-30 | 2015-10-21 | 株洲世林聚合物有限公司 | Epoxy resin AB glue used in high-temperature environment and manufacturing and use methods thereof |
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2018
- 2018-05-04 CN CN201810418497.7A patent/CN108728027A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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