CN108712846B

CN108712846B - Safe heat radiation structure of electronic equipment

Info

Publication number: CN108712846B
Application number: CN201810530331.4A
Authority: CN
Inventors: 郑树春; 范月华; 郑菲
Original assignee: Maanshan Anhuizhi Electronic Technology Co ltd
Current assignee: Maanshan Anhuizhi Electronic Technology Co ltd
Priority date: 2018-05-29
Filing date: 2018-05-29
Publication date: 2022-03-25
Anticipated expiration: 2038-05-29
Also published as: CN108712846A

Abstract

The invention discloses a safe heat dissipation structure of electronic equipment, which comprises an insulating bottom plate, a heating element, a heat dissipation cover, a shell, a heat dissipation pipeline, an air inlet fan and a ventilation fan, wherein the heating element and the heat dissipation cover are arranged at the upper end of the insulating bottom plate, side cover plates are symmetrically embedded into two sides of the heat dissipation cover, a thermal fuse is arranged at the lower end of each side cover plate, a heat insulation cushion layer is arranged at the lower end of the insulating bottom plate, heat conduction filling is arranged in the heat dissipation cover, heat dissipation fins are arranged on the heat dissipation cover, the shell is arranged above the insulating bottom plate, the heat dissipation pipeline is arranged on the shell, a ventilation opening is arranged at the lower end of the heat dissipation pipeline, and the air inlet fan and the ventilation fan are respectively arranged in the heat dissipation pipeline. The heat insulation cushion layer is adopted to isolate the temperature diffusion of the heating element, so that the heat is promoted to move directionally, and the internal components of the electronic equipment are protected; heat is dissipated through the heat conduction filling, the heat dissipation cover and the heat dissipation fins, and directional airflow is formed by adding the air inlet fan and the ventilation fan to take away heat; the high-temperature lower side cover plate is opened for ventilation, so that the device is safer.

Description

Safe heat radiation structure of electronic equipment

Technical Field

The invention relates to an accessory of electronic equipment, in particular to a safe heat dissipation structure of the electronic equipment.

Background

With the increasingly stronger configuration performance and smaller size of the heat dissipation structure of electronic equipment such as a smart phone and a flat panel, the performance requirements of the configured electronic components (such as a CPU, a memory and the like) are also increasingly higher. Moreover, the electronic components generate a large amount of heat during operation (particularly, full-load operation), and if the heat is not dissipated in time, the stability, the service life, and the like of the electronic components are greatly affected.

At present, a PCB (printed circuit board) is generally used as a chassis of an electronic component in a heat dissipation structure of an electronic device, a plurality of electronic components electrically connected with each other are arranged on the PCB, each of the electronic components is covered with a metal shielding case for avoiding signal interference, and the heat dissipation mode is as follows: the heat emitted by the electronic components is conducted to the metal shielding cover through air to realize heat dissipation. However, the heat conduction performance of air is poor, so that heat is difficult to conduct to the metal shielding case in time and is dissipated, and thus local heat of the heat dissipation structure of the electronic device is serious. In addition, the metal shielding case has a poor heat dissipation effect, so that heat cannot be uniformly dispersed out of the metal shielding case, and if abnormal heating is caused by excessive calculation amount in many conventional electronic elements, the heat cannot be conducted in time, and the metal shielding case is easily damaged.

Disclosure of Invention

The present invention is directed to a safety heat dissipation structure of an electronic device, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the invention provides the following technical scheme:

a safe heat dissipation structure of electronic equipment comprises an insulating bottom plate, a heating element, a heat dissipation cover, a shell, heat dissipation pipelines, an air inlet fan and a ventilation fan, wherein the heating element is horizontally embedded at the upper end of the insulating bottom plate, a heat insulation cushion layer is attached to the lower end of the insulating bottom plate, the heat dissipation cover is welded at the periphery of the heating element at the upper end of the insulating bottom plate, side cover plates are symmetrically embedded at two sides of the heat dissipation cover, a thermal fuse is welded between the lower end of each side cover plate and the upper end of the insulating bottom plate, a heat conduction filler is filled at the periphery of the heating element in the heat dissipation cover, heat dissipation fins are vertically embedded at the upper end of the heat dissipation cover, the shell is arranged above the insulating bottom plate, the heat dissipation pipelines are correspondingly arranged on the shell and two sides of the heat dissipation cover in a penetrating manner, the lower ends of the heat dissipation pipelines are provided with ventilation openings, and the ventilation openings are formed by a plurality of sets of willow-shaped holes which are distributed in a circular shape, the air inlet fan and the ventilation fan are connected with the lower end of the heat dissipation pipeline in a rotating mode and rotate in the heat dissipation pipeline, the air inlet fan blows air to the heat dissipation cover from top to bottom after being electrified, and the ventilation fan exhausts air from bottom to top.

As a further scheme of the invention: the heat insulation cushion layer is made of heat insulation cotton paper.

As a further scheme of the invention: the heat dissipation cover is a stainless steel shield.

As a further scheme of the invention: the side cover plate upper end through torsion spring with the heat exchanger upper end rotates to be connected, is located the left side the side cover plate clockwise rotates the perk under the torsion spring effect, is located the right side the side cover plate anticlockwise rotates the perk under the torsion spring effect.

As a further scheme of the invention: the thermal fuse body is matched with the heat dissipation cover, the side cover plate and the insulating bottom plate to form a closed space.

As a further scheme of the invention: the heat conducting filling adopts heat conducting glue.

As a further scheme of the invention: the radiating fins are horizontally distributed with multiple groups and made of copper foil materials.

As a further scheme of the invention: the lower end of the heat dissipation pipeline is closed, and the upper end of the heat dissipation pipeline is open.

Compared with the prior art, the invention has the beneficial effects that: when the heating element is powered on to operate, a large amount of heat is generated, the heat is transmitted to the heat dissipation cover through the heat conduction filling and is dissipated out through the heat dissipation fins, the heat of the heating element can be prevented from being transmitted and diffused to other areas in the electronic equipment from the lower part due to the addition of the heat insulation cushion layer, harmful effects caused by high temperature are avoided, the heating element can be effectively protected, meanwhile, the directional transmission of the heat is ensured, and the rapid cooling is facilitated; at the moment, the air inlet fan and the ventilation fan are started, the air inlet fan blows air to the heat dissipation cover, external air is filtered by the filter cloth and then blows air to the heat dissipation fins on the heat dissipation cover from the ventilation opening, heat can be taken away, the ventilation fan exhausts air from bottom to top, high-temperature airflow can be discharged to the outer side of the shell, and therefore the air inlet fan and the ventilation fan are matched to form directional flow of the airflow, the heat can be taken away quickly, and heat dissipation and cooling are achieved efficiently; when the piece that generates heat runs into the unusual heat dissipation of special case, the heat can't be in time filled outside transmission through the heat conduction, and the temperature risees fast in the heat exchanger that looses this moment, and hot fuse-link body breaks under the high temperature, and the side cover plate can rotate to both sides respectively under torsion spring drives like this, and the air current of directional flow can directly get into through the cover that looses in like this, and the piece that generates heat is avoided damaging in high-efficient heat dissipation, improves the life of product.

Drawings

Fig. 1 is a schematic structural diagram of a safety heat dissipation structure of an electronic device.

Fig. 2 is a schematic structural diagram of a heat dissipation cover in a safety heat dissipation structure of an electronic device.

Fig. 3 is a schematic structural diagram of a vent in a secure heat dissipation structure of an electronic device.

In the figure: 1-insulating bottom plate, 2-heating element, 3-heat insulation cushion layer, 4-heat dissipation cover, 41-side cover plate, 42-thermal fuse, 5-heat conduction filling, 6-heat dissipation plate, 7-shell, 8-heat dissipation pipeline, 81-ventilation opening, 82-filter cloth, 83-air inlet fan and 84-ventilation fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 3, in an embodiment of the present invention, a safe heat dissipation structure of an electronic device includes an insulating base plate 1, a heat generating element 2, a heat dissipation cover 4, a housing 7, a heat dissipation pipeline 8, an air intake fan 83, and a ventilation fan 84, the heat generating element 2 is horizontally embedded at an upper end of the insulating base plate 1, the heat generating element 2 is a heat generating electronic component, a heat insulation cushion layer 3 is attached to a lower end of the insulating base plate 1, the heat insulation cushion layer 3 is made of heat insulation cotton paper, so that the heat of the heat generating element 2 can be prevented from being arbitrarily diffused to affect other areas when the heat generating element 2 works, the heat of the heat generating element 2 can have a fixed transfer direction due to the increase of the heat insulation cushion layer 3, so as to facilitate effective control, the heat dissipation cover 4 is welded to a periphery of the heat generating element 2 at the upper end of the insulating base plate 1, the heat dissipation cover 4 is a stainless steel cover, and side cover plates 41 are symmetrically embedded in two sides of the heat dissipation cover 4, the upper end of the side cover plate 41 is connected with the upper end of the heat dissipation cover 4 through a torsion spring in a rotating manner, the side cover plate 41 on the left side is tilted clockwise under the action of the torsion spring, the side cover plate 41 on the right side is tilted counterclockwise under the action of the torsion spring, a thermal fuse 42 is welded between the lower end of the side cover plate 41 and the upper end of the insulation base plate 1, the thermal fuse 42 is matched with the heat dissipation cover 4, the side cover plate 41 and the insulation base plate 1 to form a closed space, the heat dissipation cover 4 is internally provided with a heat conduction filler 5 in the periphery of the heating element 2, the heat conduction filler 5 adopts a heat conduction glue, the heat in the heating element 2 is transferred to the heat dissipation cover 4 through the heat conduction filler 5 for diffusion, the upper end of the heat dissipation cover 4 is vertically embedded with heat dissipation fins 6, and the heat dissipation fins 6 are horizontally distributed with a plurality of groups, the radiating fins 6 are made of copper foil, the radiating fins 6 can promote the radiating efficiency of the radiating cover 4, the shell 7 is arranged above the insulating base plate 1, radiating pipelines 8 are correspondingly arranged on the shell 7 and on two sides of the radiating cover 4 in a penetrating manner, the lower end of each radiating pipeline 8 is closed, the upper end of each radiating pipeline is open, the lower end of each radiating pipeline 8 is provided with a vent 81 in a penetrating manner, each vent 81 is a plurality of groups of willow leaf-shaped holes which are distributed in a circular manner, the upper end of each radiating pipeline 8 is embedded with filter cloth 82, an air inlet fan 83 is connected and arranged in the radiating pipeline 8 on the left side, a ventilating fan 84 is connected and arranged in the radiating pipeline 8 on the right side, control circuits of the air inlet fan 83 and the ventilating fan 84 are connected with a fixed circuit, the air inlet fan 83 and the ventilating fan 84 are connected with the lower end of the radiating pipeline 8 in a rotating manner and rotate in the radiating pipeline 8, the air intake fan 83 blows air to the heat dissipation cover 4 from top to bottom after being electrified, and the ventilation fan 84 exhausts air from bottom to top, so that air convection is formed to take away heat.

The working principle of the invention is as follows: when the heating element 2 is powered on to operate, a large amount of heat is generated, the heat is transmitted to the heat dissipation cover 4 through the heat conduction filling 5 and dissipated out through the heat dissipation fins 6, the heat of the heating element 2 can be prevented from being transmitted and diffused to other areas in the electronic equipment from the lower part due to the addition of the heat insulation cushion layer 3, and harmful effects caused by high temperature are avoided, so that the heating element 2 can be effectively protected, the directional transmission of the heat is ensured, and quick, safe and effective quick cooling is facilitated; at this time, the air inlet fan 83 and the ventilation fan 84 are started, the air inlet fan 83 blows air to the heat dissipation cover 4, external air is filtered by the filter cloth 82 and then blown to the heat dissipation fins 6 on the heat dissipation cover 4 from the ventilation opening 81, heat can be taken away, the ventilation fan 84 exhausts air from bottom to top, high-temperature airflow can be discharged to the outer side of the shell 7, and therefore the air inlet fan 83 and the ventilation fan 84 are matched to form directional airflow, heat can be taken away quickly, and heat dissipation and cooling are achieved efficiently; when a 2 that generates heat runs into the unusual heat dissipation of special case, the heat can't in time fill 5 outside transmissions through heat conduction, and the temperature risees fast in heat exchanger 4 this moment, and hot fuse-link 42 breaks under the high temperature, and side cover plate 41 can rotate to both sides respectively under torsion spring drives like this, and the air current of directional flow can directly get into through in heat exchanger 4 that generates heat, and the high-efficient heat dissipation is avoided generating heat and is damaged, improves the life of product.

The standard parts used in the invention can be purchased from the market, the special-shaped parts can be customized according to the description of the specification and the accompanying drawings, the specific connection mode of each part adopts conventional means such as bolts, rivets, welding and the like mature in the prior art, the machines, the parts and equipment adopt conventional models in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, so that the detailed description is omitted.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A safe heat dissipation structure of electronic equipment comprises an insulating bottom plate (1), a heating part (2), a heat dissipation cover (4), a shell (7), a heat dissipation pipeline (8), an air inlet fan (83) and a ventilation fan (84), and is characterized in that the upper end of the insulating bottom plate (1) is horizontally embedded with the heating part (2), the lower end of the insulating bottom plate (1) is provided with a heat insulation cushion layer (3) in an attaching manner, the upper end of the insulating bottom plate (1) is positioned at the periphery of the heating part (2) and is welded with the heat dissipation cover (4), two sides of the heat dissipation cover (4) are symmetrically embedded with side cover plates (41), a thermal fuse (42) is welded between the lower end of each side cover plate (41) and the upper end of the insulating bottom plate (1), the heat dissipation cover (4) is positioned at the periphery of the heating part (2) and is filled with a heat conduction filler (5), and the upper end of the heat dissipation cover (4) is vertically embedded with heat dissipation fins (6), a shell (7) is arranged above the insulating bottom plate (1), heat dissipation pipelines (8) correspondingly penetrate through the shell (7) and the two sides of the heat dissipation cover (4), a ventilation opening (81) penetrates through the lower end of each heat dissipation pipeline (8), the ventilation openings (81) are a plurality of groups of willow leaf-shaped holes which are circularly distributed, filter cloth (82) is embedded at the upper end of each heat dissipation pipeline (8), an air inlet fan (83) is connected and arranged in the left heat dissipation pipeline (8), a ventilation fan (84) is connected and arranged in the right heat dissipation pipeline (8), control circuits of the air inlet fan (83) and the ventilation fan (84) are connected with a fixed circuit, the air inlet fan (83) and the ventilation fan (84) are connected with the lower end of the heat dissipation pipeline (8) in a rotating mode and rotate in the heat dissipation pipeline (8), the air inlet fan (83) blows air to the heat dissipation cover (4) from top to bottom after being electrified, and the ventilation fan (84) exhausts air from top to bottom;

the thermal fuse link (42) is matched with the heat dissipation cover (4), the side cover plate (41) and the insulating bottom plate (1) to form a closed space; left side cover plate (41) upper end through a torsion spring with the left side upper end rotation of heat dissipation cover (4) is connected, the right side cover plate (41) upper end through another torsion spring with the right side upper end rotation of heat dissipation cover (4) is connected, and when generating heat piece (2) met unusual heat dissipation, thermal link (42) high temperature is cracked down, is located left like this side cover plate (41) clockwise rotation perk under the torsion spring effect, is located the right side cover plate (41) anticlockwise rotation perk under the torsion spring effect.

2. The safe heat dissipation structure of electronic equipment according to claim 1, wherein the thermal insulation cushion layer (3) is made of thermal insulation cotton paper.

3. The safe heat dissipation structure of electronic equipment according to claim 1, wherein the heat dissipation cover (4) is a stainless steel shield.

4. The safe heat dissipation structure of electronic equipment according to claim 1, wherein the heat conductive filler (5) is made of heat conductive glue.

5. The safe heat dissipation structure of electronic equipment according to claim 1, wherein the heat dissipation fins (6) are distributed horizontally in multiple groups, and the heat dissipation fins (6) are made of copper foil.

6. The structure of claim 1, wherein the lower end of the heat dissipation pipe (8) is closed and the upper end is open.