CN108681138A - Display base plate and preparation method thereof, display panel - Google Patents
Display base plate and preparation method thereof, display panel Download PDFInfo
- Publication number
- CN108681138A CN108681138A CN201810475602.0A CN201810475602A CN108681138A CN 108681138 A CN108681138 A CN 108681138A CN 201810475602 A CN201810475602 A CN 201810475602A CN 108681138 A CN108681138 A CN 108681138A
- Authority
- CN
- China
- Prior art keywords
- layer
- etched
- barrier layer
- pattern
- hard mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 230000004888 barrier function Effects 0.000 claims abstract description 59
- 238000005530 etching Methods 0.000 claims abstract description 55
- 239000003292 glue Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 26
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 20
- 239000011800 void material Substances 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims description 205
- 239000000463 material Substances 0.000 claims description 28
- 239000012528 membrane Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 5
- 239000002362 mulch Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 8
- 230000000903 blocking effect Effects 0.000 description 21
- 238000010586 diagram Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a kind of display base plate and preparation method thereof, display panels, belong to display technology field.The method includes：It is formed on underlay substrate layer to be etched；On upper formation barrier layer layer to be etched, there are mutually isolated multiple void regions in barrier layer；Coining glue is respectively formed in multiple void regions；Coining glue is imprinted to form imprinted pattern；To imprinted pattern, barrier layer and it is layer to be etched perform etching, to remove imprinted pattern and barrier layer, and formed etch it is layer to be etched after etching pattern.The present invention solves during preparing display base plate, because imprinted pattern, which larger missing occurs, influences the preparation of follow-up WGP the problem of.The present invention is used to prepare display base plate.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of display base plate and preparation method thereof, display panel.
Background technology
With the development of science and technology, the application of display panel is more and more extensive, display panel generally includes display base plate, such as color
Ilm substrate.
The color blocking layer, flat that color membrane substrates generally include underlay substrate and set gradually along the direction far from underlay substrate
Layer and etching wire-grid polarizer (English：Wire Grid Polarizer；Referred to as：WGP).WGP in preparing color membrane substrates
During, usually first one layer of formation is layer to be etched on the flatness layer prepared, imprints glue in upper formation layer to be etched later,
Then it uses impression block to imprint to form imprinted pattern coining glue, is then detached from impression block and by imprinted pattern
Case and it is layer to be etched perform etching, to remove imprinted pattern and by the patterning layer to be etched, to form WGP.
But when the upper formation layer to be etched of surface irregularity imprints glue, the coining glue is carried out using impression block
After coining, it is different from the viscous force layer to be etched to be formed by the pattern of different zones in imprinted pattern, and is being detached from making ide
, can be layer to be etched with being detached from together with impression block with the smaller pattern of viscous force layer to be etched in imprinted pattern during plate,
And that surrounding pattern can be pulled to be detached from together during disengaging is layer to be etched for the pattern, to cause imprinted pattern larger
The missing of range influences the preparation of follow-up WGP.
Invention content
This application provides a kind of display base plate and preparation method thereof, display panels.It can solve making in the related technology
During standby display base plate, because imprinted pattern, which larger missing occurs, influences the preparation of follow-up WGP the problem of, the technical side
Case is as follows：
On the one hand, a kind of preparation method of display base plate is provided, the method includes：
It is formed on underlay substrate layer to be etched；
On the upper formation barrier layer layer to be etched, there are mutually isolated multiple void regions in the barrier layer；
Coining glue is respectively formed in the multiple void region；
The coining glue is imprinted to form imprinted pattern；
To the imprinted pattern, the barrier layer and it is described it is layer to be etched perform etching, to remove the imprinted pattern
With the barrier layer, and formed etch it is described it is layer to be etched after etching pattern.
Optionally, before the upper formation barrier layer layer to be etched, the method further includes：It is described it is layer to be etched on
Form hard mask layer；
It is described on the upper formation barrier layer layer to be etched, including：In the hard mask layer far from described layer to be etched
Side forms the barrier layer；
To the imprinted pattern, the barrier layer and it is described it is layer to be etched perform etching, including：
To the imprinted pattern, the barrier layer, the hard mask layer and it is described it is layer to be etched perform etching, with removal
The imprinted pattern and the barrier layer are thinned the hard mask layer, and form the etching pattern；
Remove the hard mask layer.
Optionally, coining glue is respectively formed in the multiple void region, including：
The coining glue is respectively formed in the multiple void region by the way of inkjet printing.
Optionally, the coining glue is imprinted to form imprinted pattern, including：
The mode of nano impression is used to imprint to form the imprinted pattern coining glue.
Optionally, the material layer to be etched is metal, and the etching pattern is metallic wire grid polarizer WGP.
Optionally, the display base plate is color membrane substrates.
Optionally, the protective mulch on the etching pattern.
Optionally, the material layer to be etched is aluminium, and the material on the barrier layer is resin, the material of the hard mask layer
Matter is silica, and the material of the protective layer is silicon nitride.
On the other hand, a kind of display base plate is provided, the display base plate is made of the above method.
Another aspect, provides a kind of display panel, and the display panel includes：Above-mentioned display base plate.
The advantageous effect that technical solution provided by the present application is brought is：
It should be understood that above general description and following detailed description is merely exemplary, this can not be limited
Application.Due to formed imprint glue during, it is mutually isolated in barrier layer later first on upper formation barrier layer layer to be etched
Multiple void regions in be respectively formed coining glue, to form mutually isolated coining glue.Therefore in use impression block to this
Mutually isolated coining glue can form mutually isolated imprinted pattern after being imprinted, in the mistake for being detached from the impression block
Imprinted pattern can be avoided large range of missing occur in journey, and then can avoid influencing the preparation of follow-up WGP.
Description of the drawings
In order to illustrate more clearly of the embodiment of the present invention, attached drawing needed in embodiment description will be made below
Simply introduce, it should be apparent that, drawings in the following description are only some embodiments of the invention, common for this field
For technical staff, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is a kind of preparation method flow chart of display base plate provided in an embodiment of the present invention；
Fig. 2 is the preparation method flow chart of another display base plate provided in an embodiment of the present invention；
Fig. 3 is provided in an embodiment of the present invention a kind of to form method flow diagram layer to be etched on underlay substrate；
Fig. 4 is a kind of structural schematic diagram of the color blocking layer formed on underlay substrate provided in an embodiment of the present invention；
Fig. 5 is a kind of structural schematic diagram of the flatness layer formed in color blocking layer provided in an embodiment of the present invention；
Fig. 6 is a kind of structural schematic diagram layer to be etched formed on flatness layer provided in an embodiment of the present invention；
Fig. 7 is a kind of structural schematic diagram of hard mask layer in upper formation layer to be etched provided in an embodiment of the present invention；
Fig. 8 is a kind of structural schematic diagram on the barrier layer formed on hard mask layer provided in an embodiment of the present invention；
Fig. 9 is a kind of structural schematic diagram of coining glue formed over the barrier layer provided in an embodiment of the present invention；
Figure 10 is a kind of structural schematic diagram of imprinted pattern provided in an embodiment of the present invention；
Figure 11 is a kind of structural schematic diagram for the hard mask layer being exposed in etching gas provided in an embodiment of the present invention；
Figure 12 is the structure of a kind of imprinted pattern being etched provided in an embodiment of the present invention, barrier layer and hard mask layer
Schematic diagram；
Figure 13 is a kind of structural schematic diagram for the hard mask layer being etched provided in an embodiment of the present invention；
Figure 14 is a kind of structural schematic diagram layer to be etched being exposed in etching gas provided in an embodiment of the present invention；
Figure 15 is a kind of hard mask layer being etched provided in an embodiment of the present invention and structural schematic diagram layer to be etched；
Figure 16 is a kind of structural schematic diagram of hard mask layer and etching pattern provided in an embodiment of the present invention；
Figure 17 is a kind of etching pattern schematic diagram provided in an embodiment of the present invention；
Figure 18 is a kind of structural schematic diagram of color membrane substrates provided in an embodiment of the present invention.
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the application
Example, and the principle together with specification for explaining the application.
Specific implementation mode
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with attached drawing to the present invention make into
It is described in detail to one step, it is clear that the described embodiments are only some of the embodiments of the present invention, rather than whole implementation
Example.Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts
All other embodiment, shall fall within the protection scope of the present invention.
The application of display panel is more and more extensive, and display panel generally includes display base plate, such as color membrane substrates.Color membrane substrates
Including underlay substrate, and along the direction color blocking layer, flatness layer and the WGP that set gradually far from underlay substrate.It is color preparing
During WGP in ilm substrate, need to make on underlay substrate it is layer to be etched, and in the upper formation imprinted pattern layer to be etched
Case, and the imprinted pattern formed is susceptible to large range of missing, to influence the preparation of follow-up WGP.
Fig. 1 is a kind of preparation method flow chart of display base plate provided in an embodiment of the present invention, as shown in Figure 1, the display
The preparation method of substrate may include：
Step 101, formed on underlay substrate it is layer to be etched.
Step 102, on upper formation barrier layer layer to be etched.
There are mutually isolated multiple void regions in the barrier layer.
Step 103 is respectively formed coining glue in multiple void regions.
Step 104 imprints to form imprinted pattern coining glue.
Step 105, to imprinted pattern, barrier layer and it is layer to be etched perform etching, to remove imprinted pattern and barrier layer,
And formed etch it is layer to be etched after etching pattern.
In conclusion in the preparation method of display base plate provided in an embodiment of the present invention, due to forming coining glue
In the process, first on upper formation barrier layer layer to be etched, shape is distinguished in multiple void regions mutually isolated in barrier layer later
At coining glue, to form mutually isolated coining glue.Therefore it is pressed using the impression block coining glue mutually isolated to this
Mutually isolated imprinted pattern can be formed after print, to imprinted pattern be avoided to go out during being detached from the impression block
Existing large range of missing, and then can avoid influencing the preparation of follow-up WGP.
Fig. 2 is the preparation method flow chart of another display base plate provided in an embodiment of the present invention, optionally, the display base
Plate can be color membrane substrates, as shown in Fig. 2, the preparation method of the display base plate may include：
Step 201, formed on underlay substrate it is layer to be etched.
As shown in figure 3, step 201 may include：
Step 2011 forms color blocking layer on underlay substrate.
As shown in figure 4, the color blocking layer formed on underlay substrate 00, which may include black matrix 011, red color
Stop block 012, green color blocking block 013 and blue color blocking block 014, and a red color resistance block 012, two is illustrated only in Fig. 4
Green color blocking block 013 and two blue color blocking blocks 014.And red color resistance block 012, green color blocking block 013 and blue color blocking
The thickness of block 014 can be all different.Optionally, red color resistance block 012, green color blocking block 013 and blue color blocking block 014
Thickness can also be identical, and the embodiment of the present invention is not construed as limiting this.
Step 2012 forms flatness layer in color blocking layer.
It is exemplary, flatness layer 02 as shown in Figure 5 can be formed in color blocking layer in step 2012.Optionally, this is flat
Smooth layer 02 can be upper layer covering (English：Over Coating；Referred to as：OC) layer.Exemplary, the material of the flatness layer 02 can be with
For organic silica gel, optionally, the material of flatness layer 02 can also be other materials, such as acrylic resin, the embodiment of the present invention
This is not construed as limiting.
Step 2013, formed on flatness layer it is layer to be etched.
It is exemplary, as shown in FIG. 6 layer to be etched 03 can be formed on flatness layer in step 2013.Optionally, should
Material layer to be etched can be metal (such as aluminium).Optionally, which can also be nonmetallic (such as graphite),
The embodiment of the present invention is not construed as limiting this.
Step 202, in upper formation hard mask layer layer to be etched.
It is exemplary, upper it can form hard mask layer 04 as shown in Figure 7 layer to be etched in step 202.
Optionally, the material of the hard mask layer can be silica, and the material of the hard mask layer can also be other materials
Matter, such as aluminium oxide, the embodiment of the present invention are not construed as limiting this.
Step 203 forms barrier layer in hard mask layer far from side layer to be etched.
It is exemplary, blocking as shown in Figure 8 can be formed far from side layer to be etched in hard mask layer in step 203
Layer 05, there are mutually isolated multiple void regions 051 on the barrier layer 05.Optionally, the material on the barrier layer 05 can be tree
Fat, the material on the barrier layer 05 can also be other materials, such as metal oxide, and the embodiment of the present invention is not construed as limiting this.
It should be noted that when forming the barrier layer, one layer of blocking material layers can be first formed on underlay substrate 00,
Later, a patterning processes may be used to handle the blocking material layers, to form barrier layer 05.It should be noted that
Carrying out processing to blocking material layers using a patterning processes includes：A layer photoresist is coated in blocking material layers, is then adopted
Photoresist is exposed with mask, photoresist is made to form complete exposure region and non-exposed area, later use developing process into
Row processing, makes the photoresist of complete exposure region be removed, and the photoresist of non-exposed area retains, and is stopping later to complete exposure region
Corresponding region in material layers performs etching, and the photoresist that non-exposed area is removed after etching can be obtained barrier layer 05.
Step 204 is respectively formed coining glue in multiple void regions.
Exemplary, the mode that inkjet printing may be used in step 204 is respectively formed in multiple void regions such as Fig. 9
Shown in imprint glue 06.Optionally, it can also be engraved in step 204 multiple using other modes (such as by the way of slot coated)
Coining glue 06 is formed in empty region, the embodiment of the present invention is not construed as limiting this.
Step 205 imprints to form imprinted pattern coining glue.
Optionally, the mode that nano impression may be used in step 205 imprints to form such as Figure 10 coining glue
Shown in imprinted pattern 07.It is exemplary, impression block may be used in step 205, coining glue is imprinted to form coining
Pattern 07 can be detached from the impression block later.
Since in step 204, coining glue is formed in multiple void regions mutually isolated in barrier layer 05 namely shape
At mutually isolated coining glue, and after the coining glue for using impression block mutually isolated to this in step 205 imprints,
Mutually isolated imprinted pattern 07 can be formed.Therefore, it during being detached from the impression block, is detached from impression block
Pattern can not drive large range of pattern around it to be detached from hard mask layer 04 together, so as to avoid imprinted pattern 07 from occurring
Large range of missing.
Step 206, to imprinted pattern, barrier layer, hard mask layer and it is layer to be etched perform etching, to remove imprinted pattern
And barrier layer, be thinned hard mask layer, and formed etch it is layer to be etched after etching pattern.
It is exemplary, in step 206, dry carving technology may be used to imprinted pattern, barrier layer, hard mask layer and to be etched
Erosion layer performs etching.And using dry carving technology to imprinted pattern, barrier layer, hard mask layer and the mistake layer to be etched performed etching
Journey can be as shown in Figure 11 to Figure 16.
It should be noted that in use dry carving technology to imprinted pattern, barrier layer, hard mask layer and progress layer to be etched
When etching, first by imprinted pattern, barrier layer, hard mask layer and layer to be etched it can be placed on closed container (Figure 11 to Figure 16
It is to show) in, etching gas (Figure 11 to Figure 16 is not shown) can be passed through into the closed container later, so that the quarter
Erosion gas is to imprinted pattern, barrier layer, hard mask layer and layer to be etched performs etching.
As shown in figure 11, after being passed through etching gas, which performs etching imprinted pattern 07 and barrier layer 05,
Imprinted pattern 07 and barrier layer 05 is thinned, and hard mask layer 04 is exposed in etching gas.
Then, as shown in figure 12, etching gas performs etching imprinted pattern 07, barrier layer 05 and hard mask layer 04,
So that the pattern in imprinted pattern 07 is transferred to hard mask layer 04, until imprinted pattern 07 and barrier layer 05 are removed, at this time firmly
Mask layer 04 can be as shown in figure 13.
Then, as shown in figure 14, etching gas etch hard mask layer 04, hard mask layer 04 is thinned, and will be layer to be etched
03 is exposed in etching gas.
Later, as shown in figure 15, etching gas etches the hard mask layer 04 and layer to be etched 03, is covered firmly with continuing to be thinned this
Mold layer 04, and the mask pattern in hard mask layer 04 is made to be transferred to layer to be etched 03, until forming etching as shown in figure 16
Pattern 08.Optionally, which can be WGP.
Step 207, removal hard mask layer.
It is exemplary, the hard mask layer 04 in Figure 16 can be removed in step 207, so that etching pattern 08 such as Figure 17
It is shown.
Step 208, the protective mulch on etching pattern.
It is exemplary, it in a step 208 can be in 08 protective mulch 09 of etching pattern as shown in figure 17, to be formed as schemed
Color membrane substrates shown in 18.Optionally, the material of the protective layer can be silicon nitride, and the material of the protective layer can also be other
Material, such as calcium oxide, the embodiment of the present invention are not construed as limiting this.The protective layer 09 is for protecting etching pattern 08, to avoid this
Etching pattern 08 is damaged when being hit by the external world.
It should be noted that in embodiments of the present invention, in etching gas etch hard mask layer and process layer to be etched
In, only with after forming etching pattern, the hard mask layer on etching pattern is not etched also for gas etching completely.It is optional
, etching gas etch hard mask layer and it is layer to be etched during, after forming etching pattern, hard on etching pattern being covered
The mold layer gas that can also be etched etches completely, at this point it is possible to omit step 207.
In addition, during preparing the display base plate, can not also at this time may be used in upper formation hard mask layer layer to be etched
To omit step 202, and in step 203 can be on upper formation barrier layer to be etched, and can save to hard in step 206
The process that mask layer performs etching, and can be omitted step 207.
In conclusion in the preparation method of display base plate provided in an embodiment of the present invention, due to forming coining glue
In the process, first on upper formation barrier layer layer to be etched, shape is distinguished in multiple void regions mutually isolated in barrier layer later
At coining glue, to form mutually isolated coining glue.Therefore it is pressed using the impression block coining glue mutually isolated to this
Mutually isolated imprinted pattern can be formed after print, to imprinted pattern be avoided to go out during being detached from the impression block
Existing large range of missing, and then can avoid influencing the preparation of follow-up WGP.
The embodiment of the present invention additionally provides a kind of display base plate, which may be used preparation shown in fig. 1 or fig. 2
Preparation method shown in method flow diagram is formed.The exemplary display base plate can be color membrane substrates shown in Figure 18.
The embodiment of the present invention additionally provides a kind of display panel, which may include above-mentioned display base plate.Example
, which can be：Liquid crystal display panel, Electronic Paper, mobile phone, tablet computer, television set, display, laptop, number
Any products or component with display function such as code photo frame, navigator, wearable display equipment.
It should be noted that the preparation method embodiment of display base plate provided in an embodiment of the present invention, display base plate are implemented
Example and display panel embodiment can be referred to mutually, and it is not limited in the embodiment of the present invention.The embodiment of the present invention provides
The sequencing of embodiment of the method step can suitably be adjusted, step also according to circumstances can accordingly be increased and decreased, and be appointed
What those familiar with the art in the technical scope disclosed by the present invention, all answer by the method that can readily occur in variation
It is included within the scope of the present invention, therefore repeats no more.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the present invention
Its embodiment.This application is intended to cover the present invention any variations, uses, or adaptations, these modifications, purposes or
Person's adaptive change follows the general principle of the present invention and includes the common knowledge in the art that the present invention does not invent
Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are wanted by right
It asks and points out.
It should be understood that the invention is not limited in the precision architectures for being described above and being shown in the accompanying drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is limited only by the attached claims.
Claims (10)
1. a kind of preparation method of display base plate, which is characterized in that the method includes：
It is formed on underlay substrate layer to be etched；
On the upper formation barrier layer layer to be etched, there are mutually isolated multiple void regions in the barrier layer；
Coining glue is respectively formed in the multiple void region；
The coining glue is imprinted to form imprinted pattern；
To the imprinted pattern, the barrier layer and it is described it is layer to be etched perform etching, to remove the imprinted pattern and institute
State barrier layer, and formed etch it is described it is layer to be etched after etching pattern.
2. according to the method described in claim 1, it is characterized in that,
Before the upper formation barrier layer layer to be etched, the method further includes：In the upper formation hard mask layer to be etched
Layer；
It is described on the upper formation barrier layer layer to be etched, including：In the hard mask layer far from the side layer to be etched
Form the barrier layer；
To the imprinted pattern, the barrier layer and it is described it is layer to be etched perform etching, including：
To the imprinted pattern, the barrier layer, the hard mask layer and it is described it is layer to be etched perform etching, described in removal
Imprinted pattern and the barrier layer are thinned the hard mask layer, and form the etching pattern；
Remove the hard mask layer.
3. method according to claim 1 or 2, which is characterized in that be respectively formed coining in the multiple void region
Glue, including：
The coining glue is respectively formed in the multiple void region by the way of inkjet printing.
4. method according to claim 1 or 2, which is characterized in that imprinted the coining glue to form imprinted pattern
Case, including：
The mode of nano impression is used to imprint to form the imprinted pattern coining glue.
5. according to the method described in claim 1, it is characterized in that,
The material layer to be etched is metal, and the etching pattern is metallic wire grid polarizer WGP.
6. according to the method described in claim 1, it is characterized in that,
The display base plate is color membrane substrates.
7. according to the method described in claim 2, it is characterized in that, after the removal hard mask layer, the method
Further include：
The protective mulch on the etching pattern.
8. the method according to the description of claim 7 is characterized in that the material layer to be etched be aluminium, the barrier layer
Material is resin, and the material of the hard mask layer is silica, and the material of the protective layer is silicon nitride.
9. a kind of display base plate, which is characterized in that the display base plate is made of any method of claim 1 to 8.
10. a kind of display panel, which is characterized in that the display panel includes：Display base plate described in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810475602.0A CN108681138A (en) | 2018-05-17 | 2018-05-17 | Display base plate and preparation method thereof, display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810475602.0A CN108681138A (en) | 2018-05-17 | 2018-05-17 | Display base plate and preparation method thereof, display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108681138A true CN108681138A (en) | 2018-10-19 |
Family
ID=63806610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810475602.0A Pending CN108681138A (en) | 2018-05-17 | 2018-05-17 | Display base plate and preparation method thereof, display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108681138A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110579903A (en) * | 2019-10-17 | 2019-12-17 | 京东方科技集团股份有限公司 | array substrate, manufacturing method thereof, liquid crystal display panel and display device |
| WO2021082981A1 (en) * | 2019-11-01 | 2021-05-06 | 京东方科技集团股份有限公司 | Nano-pattern manufacturing method, nano-imprinted substrate, and display substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160077265A1 (en) * | 2012-07-26 | 2016-03-17 | Samsung Display Co., Ltd. | Polarizer, method of manufacturing the polarizer, display panel having the polarizer and display apparatus having the display panel |
| US20160077264A1 (en) * | 2014-09-16 | 2016-03-17 | Samsung Display Co. Ltd. | Patterning method and method of manufacturing wire grid polarizer using the same |
| CN105789118A (en) * | 2016-04-14 | 2016-07-20 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method thereof |
| US9400346B2 (en) * | 2014-02-07 | 2016-07-26 | Samsung Display Co., Ltd. | Manufacturing method of reflective polarizer plate and display device including the same |
-
2018
- 2018-05-17 CN CN201810475602.0A patent/CN108681138A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160077265A1 (en) * | 2012-07-26 | 2016-03-17 | Samsung Display Co., Ltd. | Polarizer, method of manufacturing the polarizer, display panel having the polarizer and display apparatus having the display panel |
| US9400346B2 (en) * | 2014-02-07 | 2016-07-26 | Samsung Display Co., Ltd. | Manufacturing method of reflective polarizer plate and display device including the same |
| US20160077264A1 (en) * | 2014-09-16 | 2016-03-17 | Samsung Display Co. Ltd. | Patterning method and method of manufacturing wire grid polarizer using the same |
| CN105789118A (en) * | 2016-04-14 | 2016-07-20 | 京东方科技集团股份有限公司 | Display substrate and manufacturing method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110579903A (en) * | 2019-10-17 | 2019-12-17 | 京东方科技集团股份有限公司 | array substrate, manufacturing method thereof, liquid crystal display panel and display device |
| CN110579903B (en) * | 2019-10-17 | 2023-04-14 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method thereof, liquid crystal display panel and display device |
| US11822178B2 (en) | 2019-10-17 | 2023-11-21 | Boe Technology Group Co., Ltd. | Array substrate, fabrication method thereof, liquid crystal display panel and display device |
| WO2021082981A1 (en) * | 2019-11-01 | 2021-05-06 | 京东方科技集团股份有限公司 | Nano-pattern manufacturing method, nano-imprinted substrate, and display substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5256572B2 (en) | Printing method | |
| US7887997B2 (en) | Manufacturing method for conducting films on two surfaces of transparent substrate of touch control circuit | |
| CN104777665B (en) | The preparation method of black matrix" | |
| TW586149B (en) | Graytone mask producing method | |
| CN108649052A (en) | A kind of array substrate and preparation method thereof, display device | |
| US5463484A (en) | Method for manufacturing laminated U V-sensitive color filters for liquid crystal displays | |
| CN108681138A (en) | Display base plate and preparation method thereof, display panel | |
| TWI328526B (en) | Pattern transcription device and method of fabricating cliche for the same | |
| JP2007058179A (en) | Method for manufacturing printing plate | |
| CN103487984A (en) | Color film substrate, display panel and manufacturing method of color film substrate | |
| CN107369777A (en) | A kind of oled substrate and preparation method thereof, display device | |
| JP5256573B2 (en) | Printing method | |
| JP5090265B2 (en) | Printing plate manufacturing method, printing plate and reverse printing method | |
| CN105911628B (en) | A kind of wire grid polarizer structures, display base plate motherboard and production method | |
| CN108062001A (en) | The patterning method of film layer, wire grating polarization structure and preparation method thereof | |
| WO2013071675A1 (en) | Fast aligning protector and fast film pasting method | |
| JP2000035582A (en) | Spacer forming method | |
| JP2006231827A (en) | Manufacturing method for intaglio | |
| CN106526957B (en) | Color membrane substrates and its manufacturing method, display panel | |
| JP2008207374A (en) | Resin mold and manufacturing method of printing plate utilizing the same | |
| CN109031742B (en) | Manufacturing method of display substrate, display substrate and display device | |
| JP2007065624A (en) | Method for manufacturing printing plate | |
| CN108196394A (en) | Color membrane substrates and preparation method thereof, display panel and display device | |
| KR20160065656A (en) | Cliche for off set printing and method for preparing the same | |
| JP4250448B2 (en) | Double-sided exposure method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181019 |
|
| RJ01 | Rejection of invention patent application after publication |