CN108666281B - Optical device packaging structure and mobile terminal - Google Patents
Optical device packaging structure and mobile terminal Download PDFInfo
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- CN108666281B CN108666281B CN201810290279.XA CN201810290279A CN108666281B CN 108666281 B CN108666281 B CN 108666281B CN 201810290279 A CN201810290279 A CN 201810290279A CN 108666281 B CN108666281 B CN 108666281B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Abstract
The invention discloses an optical device packaging structure and a mobile terminal, wherein the optical device packaging structure comprises a substrate, a chip, a light-emitting module, a photoelectric sensor, a packaging part and a shading glue layer; the chip is arranged on the substrate, the light-emitting module and the photoelectric sensor are arranged on the chip, the light-emitting module is provided with a light-emitting surface and a light-emitting unit, and the light-emitting unit is arranged on the light-emitting surface; encapsulation portion parcel chip, luminous module and photoelectric sensor, one side that encapsulation portion deviates from the chip is the encapsulation top surface, has the depressed area on the encapsulation top surface, and the depressed area has first adhesive surface, and first adhesive surface is located between luminous module and the photoelectric sensor, and extends to the position that is less than the light emitting area by the position that is higher than the light emitting area when using the installation face to observe as the reference surface, and first adhesive surface coats and is stamped the shading glue film. The mobile terminal comprises the optical device packaging structure. The optical device packaging structure and the mobile terminal provided by the invention can reduce the volume.
Description
Technical Field
The invention relates to the field of electronic equipment, in particular to an optical device packaging structure and a mobile terminal.
Background
With the development of mobile terminals such as smart phones and tablet computers, optical devices such as proximity sensors and ambient light sensors have become standard sensors of mobile terminals. With the increasing integration and portability of the mobile terminal, the thickness of the whole mobile terminal is thinner and thinner, and more internal devices are used, so that the requirement on the miniaturization of the devices is more and more rigorous.
In the related art, in order to prevent crosstalk between a light source of an optical device and a photosensor (e.g., PD, photodiode), a light barrier is usually disposed between the light source and the photosensor for shielding during packaging.
However, due to the limitation of the thickness of the light barrier and the related fixing structure, the optical device packaging structure is bulky and cannot meet the requirement of device miniaturization.
Disclosure of Invention
The embodiment of the invention provides an optical device packaging structure and a mobile terminal, and aims to solve the problem that the packaging structure is large in size.
The embodiment of the invention adopts the following technical scheme:
in a first aspect, an embodiment of the present invention provides an optical device package structure, including a substrate, a chip, a light emitting module, a photosensor, a package portion, and a light shielding adhesive layer;
the substrate is provided with an assembly surface, the chip is arranged on the assembly surface and is electrically connected with the substrate, the chip is provided with an installation surface deviating from the assembly surface, the light-emitting module and the photoelectric sensor are arranged on the installation surface, the light-emitting module is provided with a light-emitting surface and a light-emitting unit, the light-emitting unit is arranged on the light-emitting surface, and the light-emitting surface is higher than the photoelectric sensor when the observation is carried out by taking the installation surface as a reference surface;
encapsulation portion covers the assembly face, and parcel the chip luminous module and photoelectric sensor, encapsulation portion deviates from one side of chip is the encapsulation top surface, the depressed area has on the encapsulation top surface, the depressed area has first viscose face, first viscose face is located luminous module with between the photoelectric sensor, and with when the installation face was observed for the reference surface first viscose face is by being higher than the position of light emitting area extends to being less than the position of light emitting area, first viscose face coats and is stamped the shading glue film.
Preferably, in the optical device package structure, the first adhesive surface is perpendicular to the top surface of the package.
Preferably, among the aforesaid optical device packaging structure, the depressed area still has the second viscose face, the second viscose face is on a parallel with the installation face, the second viscose face includes viscose area and light and sees through the district, light pass through the district with photoelectric sensor is corresponding, the viscose area centers on light sees through the district, the viscose area covers there is the shading glue film.
Preferably, in the optical device package structure, an edge of the light transmitting area is an arc, and the arc takes a center of the photosensor as a circle center.
Preferably, in the optical device packaging structure, the packaging portion is made of a light-transmitting material, and the light-shielding adhesive layer is made of a light-shielding material.
Preferably, in the optical device package structure, the filling portion fills the recessed area and is bonded and fixed to the package portion through the light-shielding adhesive layer, the filling portion is flush with the package top surface, and the filling portion is made of a light-transmitting material.
Preferably, in the optical device packaging structure, a cross section of the packaging portion is L-shaped, the filling portion is a cube or a cuboid, and a shape formed by the filling portion and the packaging portion after the filling portion fills the recessed region is a cube or a cuboid.
Preferably, in the optical device package structure, an arrangement direction of the light emitting module and the photosensor is consistent with an extending direction of the L-shaped horizontal area.
Preferably, in the optical device package structure, the light emitting unit is a light emitting diode or a vertical cavity surface emitting laser.
Preferably, in the optical device packaging structure, the light-shielding adhesive layer is light-shielding adhesive paper.
In a second aspect, an embodiment of the present invention provides a mobile terminal including the optical device package structure.
The embodiment of the invention adopts at least one technical scheme which can achieve the following beneficial effects:
according to the optical device packaging structure and the mobile terminal disclosed by the embodiment of the invention, the first adhesive surface is arranged on the packaging part, and the light-emitting unit and the photoelectric sensor are shielded in a manner of covering the light-shielding adhesive layer on the first adhesive surface, so that the light-shielding structure can break through the thickness limit of the light barrier, and the light-shielding adhesive layer can be used for connecting and fixing other parts, thereby not only saving the related fixing structure of the light barrier, but also simplifying the connecting structure of the leveling part and the packaging part, and further greatly reducing the volume of the packaging structure and meeting the requirement of miniaturization of devices.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic assembled three-dimensional structure diagram of a substrate, a chip, a light-emitting module and a photoelectric sensor according to an embodiment of the present invention;
FIG. 2 is a schematic perspective view of the structure of FIG. 1 after the package is formed;
FIG. 3 is a schematic view of the structure of FIG. 2 after covering the light-shielding adhesive layer;
FIG. 4 is a schematic side cross-sectional view of the structure shown in FIG. 3;
FIG. 5 is a schematic diagram illustrating an overall three-dimensional structure of an optical device package structure formed after filling the filling and leveling portion in the recessed region of the structure shown in FIGS. 3 and 4;
fig. 6 is a side view of the optical device package structure shown in fig. 5.
Description of reference numerals:
10-substrate, 100-assembly surface, 11-chip, 110-mounting surface, 12-light emitting module, 120-light emitting surface, 122-light emitting unit, 13-photoelectric sensor, 14-packaging part, 140-packaging top surface, 142-recessed area, 1420-first adhesive surface, 1422-second adhesive surface, 1422 a-light transmitting area, 1422 b-adhesive area, 15-shading adhesive layer, 16-filling part and 17-metal wire.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
The embodiment of the invention discloses a mobile terminal, such as a smart phone, a tablet computer and the like. An optical device packaging structure is arranged in the mobile terminal. As shown in fig. 1 to 6, the optical device package structure includes a substrate 10, a chip 11, a light emitting module 12, a photosensor 13, a package portion 14, and a light shielding adhesive layer 15. Each portion is described in detail below.
The substrate 10 is a supporting base and a wiring platform, the substrate 10 has an assembly surface 100, and the chip 11 is a control module of an optical device, and may adopt an ASIC (Application Specific Integrated Circuit, chinese name: Application Specific Integrated Circuit) chip.
As shown in fig. 1, when the package is started, the chip 11 is first disposed on the mounting surface 100 and electrically connected to the substrate 10, and the electrical connection may be made by using the metal wire 17 or by using the TSV (Through silicon vias, chinese name) technology. The light emitting module 12 is used for emitting light, and the Photo sensor 13 (for example, PD, a Photo Diode, a chinese name: photodiode) is used for receiving the light emitted by the light emitting module 12 and reflected by an external object, so as to perform proximity judgment or environment judgment.
Specifically, with continued reference to fig. 1, the chip 11 has a mounting surface 110 away from the mounting surface 100, the light emitting module 12 and the photosensor 13 are both disposed on the mounting surface 110, the light emitting module 12 has a light emitting surface 120 and a light emitting unit 122, the light emitting unit 122 is disposed on the light emitting surface 120, and the light emitting surface 120 is located higher than the photosensor 13 when viewed with the mounting surface 110 as a reference surface. In general, the light emitting surface 120 is located at the farthest position of the light emitting module 12 from the mounting surface 110, that is, the side of the light emitting module 12 facing away from the mounting surface 110. At this time, of the light emitted from the light emitting unit 122, only the light emitted toward the photosensor 13 in an obliquely downward direction may cross the photosensor 13. Therefore, a Light Emitting element with a small divergence angle and a good Light concentration, such as an LED (Light Emitting Diode, chinese name) or a VCSEL (Vertical cavity surface Emitting Laser, chinese name), may be considered as the Light Emitting unit 122.
The light module 12 can be adhered to the mounting surface 110 at a predetermined position by adhesion. In the present embodiment, a certain margin is reserved for the reserved position of the light emitting module 12 on the mounting surface 110, so that the position of the light emitting module 12 can be finely adjusted according to the optical performance at a later stage. After the bonding is completed, the light emitting module 12 and the chip 11 may be electrically connected by a metal wire 17 or the like.
After the electrical connection is completed, a sealing process is started to form a sealing portion 14. As shown in fig. 2, the sealing portion 14 covers the mounting surface 100 and encloses the chip 11, the light emitting module 12, and the photosensor 13. Since the light emitting module 12 and the photo sensor 13 are both wrapped by the sealing portion 14, the sealing portion 14 needs to be made of a transparent material so that light can pass through normally.
In the present embodiment, as shown in fig. 2 to fig. 4, a side of the package portion 14 away from the chip 11 is a package top surface 140, the package top surface 140 has a recessed area 142, the recessed area 142 is recessed from the package top surface 140 toward the direction of the chip 11, and the recessed area 142 forms some surfaces forming a certain included angle with the extending direction of the package top surface 140. The first adhesive surface 1420 is disposed between the light emitting module 12 and the photo sensor 13, and when the mounting surface 110 is used as a reference surface, the first adhesive surface 1420 extends from a position higher than the light emitting surface 120 to a position lower than the light emitting surface 120, that is, a light propagation path between the light emitting module 12 and the photo sensor 13 passes through the first adhesive surface 1420. The first adhesive surface 1420 is covered with a light-shielding adhesive layer 15.
Since the light propagation path between the light emitting module 12 and the photo sensor 13 passes through the first adhesive surface 1420, the light is blocked by the light blocking adhesive layer 15 covering the first adhesive surface 1420, so that the light emitted from the light emitting module 12 cannot irradiate the photo sensor 13 to form crosstalk. The light-shielding adhesive layer 15 is essentially an adhesive layer with viscosity and light-shielding performance, and is not a hard component, so that there is no requirement for a forming process, structural strength and the like, and the thickness of the light-shielding adhesive layer 15 can be greatly reduced compared with a light barrier. Considering the molding difficulty of the package portion 14, the bonding difficulty of the light-shielding adhesive layer 15, and the light-shielding effect, the first adhesive surface 1420 is perpendicular to the package top surface 140.
In the current automated production of electronic products, the optical device package structure is usually sucked by the suction cup, and the predetermined position of the installed motherboard needs to have a flat and smooth top surface in order to make the optical device package structure be sucked by the suction cup. In the present application, the recessed area 142 is disposed on the top surface 140 of the package, which results in the top surface not being flat, thereby limiting the suction operation of the suction cup. Although the area of the recessed area 142 can be reduced to a certain extent, the problem cannot be avoided, and the arrangement of the too small recessed area 142 on the light-shielding adhesive layer 15 is also difficult. Therefore, it is preferable to reform a flat top structure.
As shown in fig. 5 and 6, in the present embodiment, a flat filler 16 is provided in order to reform a flat top surface structure. The filling part 16 fills the concave area 142 and is adhered and fixed with the packaging part 14 through the light-shielding glue layer 15, and the filling part 16 is flush with the packaging top surface 140. In this way, the filling part 16 and the packaging part 14 can form a flat top surface for the suction of the suction cup. In addition, the filling part 16 and the packaging part 14 are not fixed by adopting another structure, but are directly fixedly connected through the light-shielding glue layer 15, so that the whole volume of the optical device packaging structure can be very small, the requirement of miniaturization of a device is met, and a gap between the filling part 16 and the packaging part 14 is small and flat.
In addition to covering the first adhesive surface 1420 of the recessed area 142 with the light-shielding adhesive layer 15 for shielding light and adhering, a second adhesive surface 1422 may be formed in the recessed area 142, the second adhesive surface 1422 is parallel to the mounting surface 110, and the second adhesive surface 1422 includes two portions, namely, a light-transmitting area 1422a and an adhesive area 1422b, where the light-transmitting area 1422a corresponds to the photosensor 13, that is, is located above the photosensor 13, so that light can be transmitted from the light-transmitting area 1422a to the photosensor 13, the adhesive area 1422b surrounds the light-transmitting area 1422a, that is, is disposed at the periphery of the light-transmitting area 1422a, and the adhesive area 1422b is also covered with the light-shielding adhesive layer 15. The light-shielding adhesive layer 15 covering the adhesive region 1422b can prevent the oblique light from interfering with the photosensor 13, and can further enhance the connection strength between the filling portion 16 and the sealing portion 14.
In consideration of the uniformity of the incident light angle in all directions of the photosensor 13, the edge of the light transmissive region 1422a may be in the shape of a circular arc centered on the center of the photosensor 13. The specific shape of the light transmissive region 1422a needs to be determined by the second adhesive surface 1422 and the photo sensor 13, for example, when the photo sensor 13 is closer to the first adhesive surface 1420 such that the second adhesive surface 1422 is not enough for the edge of the light transmissive region 1422a to form a complete circular arc, the edge of the light transmissive region 1422a may be stopped at the first adhesive surface 1420 (see fig. 5).
In order to cover the light-shielding adhesive layer 15 on the first adhesive surface 1420 and the second adhesive surface 1422, the light-shielding adhesive layer 15 may be made into a thin light-shielding adhesive paper in advance, and then the light-shielding adhesive paper is attached to the first adhesive surface 1420 and the second adhesive surface 1422, and the redundant portion of the edge and the portion corresponding to the light-transmitting region 1422a are cut off.
The configuration of the recessed area 142 itself is not particularly limited, and any configuration capable of having the first adhesive surface 1420, such as a dimple, channel, notch, etc., is contemplated. Of course, the more complex the configuration of the recessed region 142, the greater the number of surfaces, and the greater the difficulty in assembling the caulk 16. In the present embodiment, the package portion 14 is designed to have an L-shaped cross section, and the filling portion 16 is a cube or a cuboid, which just fills the missing portion of the package portion 14, so that the shape formed by the filling portion 16 and the package portion 14 after filling the recessed region 142 is a cube or a cuboid.
With this configuration, the light emitting module 12 is located in the vertical region of the L-shape, and the photo sensor 13 is located in the horizontal region of the L-shape. In consideration of the light shielding effect, in the present embodiment, the arrangement direction of the light emitting module 12 and the photosensor 13 is the same as the extending direction of the L-shaped horizontal area, and when looking down on the mounting surface 110, the first adhesive surface 1420 is perpendicular to the central connecting line of the light emitting module 12 and the photosensor 13, so that the light shielding effect is more balanced.
The optical device packaging structure and the mobile terminal provided by the embodiment of the invention can greatly reduce the volume of the packaging structure and meet the requirement of miniaturization of devices.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (11)
1. An optical device packaging structure is characterized by comprising a substrate, a chip, a light-emitting module, a photoelectric sensor, a packaging part and a shading glue layer;
the substrate is provided with an assembly surface, the chip is arranged on the assembly surface and is electrically connected with the substrate, the chip is provided with an installation surface deviating from the assembly surface, the light-emitting module and the photoelectric sensor are arranged on the installation surface, the light-emitting module is provided with a light-emitting surface and a light-emitting unit, the light-emitting unit is arranged on the light-emitting surface, and the light-emitting surface is higher than the photoelectric sensor when the observation is carried out by taking the installation surface as a reference surface;
encapsulation portion covers the assembly face, and parcel the chip luminous module and photoelectric sensor, encapsulation portion deviates from one side of chip is the encapsulation top surface, the depressed area has on the encapsulation top surface, the depressed area has first viscose face, first viscose face is located luminous module with between the photoelectric sensor, and with when the installation face was observed for the reference surface first viscose face is by being higher than the position of light emitting area extends to being less than the position of light emitting area, first viscose face coats and is stamped the shading glue film.
2. The optical device package structure of claim 1, wherein the first adhesive surface is perpendicular to the top surface of the package.
3. The optical device package structure of claim 2, wherein the recessed area further comprises a second adhesive surface, the second adhesive surface is parallel to the mounting surface, the second adhesive surface comprises an adhesive area and a light transmission area, the light transmission area corresponds to the photoelectric sensor, the adhesive area surrounds the light transmission area, and the adhesive area is covered with the light-shielding adhesive layer.
4. The optical device package structure of claim 3, wherein the edge of the light transmissive region is a circular arc centered on the center of the photosensor.
5. The optical device package structure according to any one of claims 1 to 4, wherein the package portion is made of a light-transmissive material, and the light-shielding adhesive layer is made of a light-shielding material.
6. The optical device package structure according to claim 5, further comprising a filling portion, wherein the filling portion fills the recessed area and is bonded and fixed to the package portion through the light-shielding adhesive layer, a surface of the filling portion facing away from the chip is flush with a surface of the package top surface covering the light-emitting module, and the filling portion is made of a light-transmitting material.
7. The optical device package structure according to claim 6, wherein the package portion has an L-shaped cross section, the filling portion is a cube or a cuboid, and the filling portion fills the recess and forms a cube or a cuboid with the package portion.
8. The optical device package structure of claim 7, wherein the arrangement direction of the light emitting module and the photoelectric sensor is consistent with the extending direction of the L-shaped horizontal area.
9. The optical device package structure according to any one of claims 1 to 4, wherein the light emitting unit is a light emitting diode or a vertical cavity surface emitting laser.
10. The optical device package structure according to any one of claims 1 to 4, wherein the light-shielding adhesive layer is a light-shielding adhesive tape.
11. A mobile terminal characterized by comprising the optical device package structure of any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810290279.XA CN108666281B (en) | 2018-03-30 | 2018-03-30 | Optical device packaging structure and mobile terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810290279.XA CN108666281B (en) | 2018-03-30 | 2018-03-30 | Optical device packaging structure and mobile terminal |
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| CN108666281A CN108666281A (en) | 2018-10-16 |
| CN108666281B true CN108666281B (en) | 2019-12-27 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343227B (en) * | 2018-11-30 | 2021-05-28 | 维沃移动通信（杭州）有限公司 | Light projection module and optical equipment |
| CN109921278A (en) * | 2019-03-28 | 2019-06-21 | 维沃移动通信有限公司 | Laser projection mould group |
| CN110169765B (en) * | 2019-05-14 | 2023-12-15 | 华为技术有限公司 | Intelligent wearing equipment |
| CN114077016B (en) * | 2020-08-11 | 2023-09-01 | 美国莫列斯有限公司 | Package structure with photonic integrated circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2008028025A (en) * | 2006-07-19 | 2008-02-07 | Canon Inc | Reflecting sensor |
| JP2009097872A (en) * | 2007-10-12 | 2009-05-07 | Sharp Corp | Optical range-finding sensor, object detection device, cleaning toilet seat, and manufacturing method of the optical range-finding sensor |
| CN102403275B (en) * | 2010-09-17 | 2014-01-15 | 深南电路有限公司 | Package on package structure and fabricating method for same |
| CN104568784B (en) * | 2013-10-24 | 2017-08-29 | 日月光半导体制造股份有限公司 | Sensing module and its manufacture method |
| JP5907200B2 (en) * | 2014-03-18 | 2016-04-26 | セイコーエプソン株式会社 | Photodetection unit and biological information detection apparatus |
| TWM537678U (en) * | 2016-09-26 | 2017-03-01 | 金佶科技股份有限公司 | Package structure of fingerprint identification apparatus |
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