CN108620704A - Grasping system and welding method - Google Patents
Grasping system and welding method Download PDFInfo
- Publication number
- CN108620704A CN108620704A CN201710160007.3A CN201710160007A CN108620704A CN 108620704 A CN108620704 A CN 108620704A CN 201710160007 A CN201710160007 A CN 201710160007A CN 108620704 A CN108620704 A CN 108620704A
- Authority
- CN
- China
- Prior art keywords
- locating slot
- fixture
- circuit board
- grasping system
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of grasping systems, including：Pedestal；At least a set of clamping device is mounted on the pedestal.It includes the first fixture often to cover the clamping device, is formed on first fixture suitable for accommodating the first locating slot with locating circuit board.When first fixture is mounted on the pedestal, the bottom surface of first locating slot and the horizontal surface of the pedestal at more than zero degree and less than the first angle of degree so that the circuit board being located in first locating slot relative to the pedestal horizontal surface at an inclination angle.In the present invention, since circuit board can be obliquely held in a predetermined position place by grasping system, so that the solder flux melted in welding can automatically flow downward along inclined circuit board, improve the mobility of solder flux, to which the coverage rate of solder flux can be improved, and the surface of the solder joint after welding can be made smooth, to improve welding quality.
Description
Technical field
The present invention relates to a kind of grasping systems, more particularly to one kind being suitable for clamping circuit board and will weld on the circuit board
Conducting wire grasping system.Moreover, it relates to a kind of welding method being welded to conducting wire on circuit board.
Background technology
In electronic device manufacturing field, it is often necessary to which conducting wire to be welded on the weld pad of circuit board.To ensure welding quality,
Before welding, it needs the end conductor of conducting wire being aligned with the weld pad on circuit board, and tightly by the end conductor of conducting wire
It is pressed against on the weld pad of circuit board.In welding, the solder flux being arranged at weld pad can be heated by iron soldering iron so that solder flux is molten
Melt, to be welded together the end conductor of conducting wire with the weld pad on circuit board by solder flux.
But in the prior art, in welding, circuit board is typically horizontal positioned.Therefore, in welding, melting
Solder flux be not easy to flow, this can reduce the coverage rate of solder flux, cause the end conductor of conducting wire that cannot all be welded to circuit board
Weld pad on, reduce welding quality.Further, since the solder flux of melting is not easy to flow, the solder joint after welding is also resulted in
Surface irregularity, further reduced welding quality.
Invention content
The purpose of the present invention aims to solve the problem that at least one aspect of the above-mentioned problems in the prior art and defect.
A purpose according to the present invention, provides a kind of grasping system, can circuit board be obliquely maintained to predetermined
At position so that the solder flux melted in welding can automatically flow downward along inclined circuit board, improve the mobility of solder flux.
According to an aspect of the present invention, a kind of grasping system is provided, including：Pedestal；At least a set of clamping device, peace
On the pedestal.Often cover the clamping device include the first fixture, be formed on first fixture suitable for accommodate and
First locating slot of locating circuit board.When first fixture is mounted on the pedestal, the bottom surface of first locating slot
With the horizontal surface of the pedestal at more than zero degree and less than the first angle of degree, so that being located in first locating slot
In circuit board relative to the pedestal horizontal surface at an inclination angle.
The embodiment of an exemplary according to the present invention, it further includes the second fixture often to cover the clamping device, described
It is formed on second fixture suitable for accommodating the second locating slot with positioning lead；When second fixture is mounted on the pedestal
When, the bottom surface of second locating slot is with the horizontal surface of the pedestal at more than zero degree and less than the second angle of degree.
The embodiment of another exemplary according to the present invention, the sum of first angle and second angle are equal to
Degree, that is, when first fixture and second fixture are mounted on the pedestal, the bottom surface of first locating slot and institute
State the plane perpendicular of the second locating slot.
The end conductor of the embodiment of another exemplary according to the present invention, the conducting wire is curved relative to the conducting wire
Folding degree；When the circuit board and the conducting wire are respectively positioned in first locating slot and second locating slot, institute
The end conductor for stating conducting wire is aligned with the weld pad on the circuit board, and is sticked on the surface of the weld pad.
The embodiment of another exemplary according to the present invention, first fixture include the first jig main body, and described the
A positioning groove is formed on the inclined side of first jig main body.
The embodiment of another exemplary according to the present invention, second fixture include：Second jig main body, described
Two locating slots are formed on the inclined side of second jig main body；And lid, it is pivotally connected to second fixture
Main body can rotate between the open and the closed positions, wherein when the lid is in the closed position, can will lead
Wire clamp is held and is fixed in second locating slot.
The embodiment of another exemplary according to the present invention, second fixture further include：Locking device is arranged in institute
It states on the second jig main body, is suitable for the cover lock in the closed position.
One end of the embodiment of another exemplary according to the present invention, the lid is pivotally connected to second folder
Has one end of main body；The other end in second jig main body is arranged in the locking device, suitable for being locked in the lid
On the other end.
The embodiment of another exemplary according to the present invention, the locking device include：Locking piece is pivotally connected to
Second jig main body, can rotate between locked and unlocked positions；And spring, it is arranged in second jig main body
On, it is suitable for the locking piece pushing tow to the latched position, when the lid is rotated to the closed position, the bullet
Spring is by the locking piece pushing tow to the latched position, thus by the cover lock in the closed position.
The embodiment of another exemplary according to the present invention, when the lid is rotated to the closed position, institute
Spring push is stated on one end of the locking piece so that the other end of the other end pressing of the locking piece in the lid
On, thus by the cover lock in the closed position.
The embodiment of another exemplary according to the present invention, when the application on one end of the locking piece and the spring
When the opposite pressing force of the jacking force of application, the locking piece can be rotated to the unlocked position so that the locking piece with
The lid separation.
The embodiment of another exemplary according to the present invention, the grasping system further include supporting rack, second folder
Tool is supported on support frame as described above with being inclined by.
The embodiment of another exemplary according to the present invention, the end conductor of the conducting wire second fixture from
Under the action of weight, it is compressed on the surface of the weld pad, and the circuit board is maintained in first locating slot.
The embodiment of another exemplary according to the present invention has row's weld pad on the circuit board, and described second is fixed
Position slot is suitable for accommodating and one row's conducting wire of positioning, and the row conducting wire is suitable for being soldered on row's weld pad of the circuit board.
The embodiment of another exemplary according to the present invention is formed with a row V on the bottom surface of second locating slot
Shape or U-shaped groove, for positioning the row conducting wire.
According to another aspect of the present invention, a kind of method being welded to conducting wire on circuit board, including following step are provided
Suddenly：
S100：Grasping system as claimed in claim is provided；
S200：Circuit board and conducting wire are clamped and are located in respectively in first locating slot and second locating slot；
S300：Solder flux on heater circuit plate so that solder flux melts, to by the solder flux by the end of the conducting wire
Conductor is welded on the weld pad of the circuit board,
Wherein, in welding, the solder flux of melting can under the action of self-weight, along the circuit being inclined on the pedestal
The surface of plate flows downward.
In the embodiment of aforementioned each exemplary according to the present invention, since grasping system can be by circuit board obliquely
It is held in a predetermined position place so that the solder flux melted in welding can automatically flow downward along inclined circuit board, improve weldering
The mobility of agent to which the coverage rate of solder flux can be improved, and can make the surface of solder joint after welding smooth, to carry
High welding quality.
By the description made for the present invention of below with reference to attached drawing, other objects and advantages of the present invention will be aobvious and easy
See, and can help that complete understanding of the invention will be obtained.
Description of the drawings
Fig. 1 shows the stereoscopic schematic diagram of the grasping system of the embodiment of an exemplary according to the present invention；
Fig. 2 shows the stereoscopic schematic diagram of the first fixture of grasping system shown in FIG. 1, wherein circuit board positions not yet
Into the first locating slot；
Fig. 3 shows the stereoscopic schematic diagram of the first fixture of grasping system shown in FIG. 1, wherein circuit board is positioned
Into the first locating slot；
Fig. 4 shows the stereoscopic schematic diagram of the second fixture of grasping system shown in FIG. 1, wherein conducting wire navigates to not yet
In second locating slot；
Fig. 5 shows the stereoscopic schematic diagram of the second fixture of grasping system shown in FIG. 1, wherein conducting wire has been positioned to
In second locating slot, but lid is not closed；
Fig. 6 shows the stereoscopic schematic diagram of the second fixture of grasping system shown in FIG. 1, wherein conducting wire has been positioned to
In second locating slot, and lid is closed；With
Fig. 7 shows the longitudinal sectional view of grasping system shown in FIG. 1.
Specific implementation mode
Below with reference to the embodiments and with reference to the accompanying drawing the technical solutions of the present invention will be further described.Illustrating
In book, same or analogous drawing reference numeral indicates same or analogous component.Following reference attached drawings are to embodiment of the present invention
Illustrate to be intended to explain the present general inventive concept of the present invention, and is not construed as a kind of limitation to the present invention.
In addition, in the following detailed description, for ease of explaining, elaborating many concrete details to provide to present disclosure
The comprehensive understanding of embodiment.It should be apparent, however, that one or more embodiments without these specific details can also
It is carried out.In other cases, well known construction and device is diagrammatically embodied to simplify attached drawing.
General technical design according to the present invention, provides a kind of grasping system, including：Pedestal；At least a set of folder
Device is held, is mounted on the pedestal.It includes the first fixture often to cover the clamping device, is formed on first fixture suitable
In the first locating slot of receiving and locating circuit board.When first fixture is mounted on the pedestal, first positioning
The horizontal surface of the bottom surface of slot and the pedestal is at more than zero degree and less than the first angle of degree, so that being located in described the
Circuit board in a positioning groove relative to the pedestal horizontal surface at an inclination angle.
Fig. 1 shows the stereoscopic schematic diagram of the grasping system of the embodiment of an exemplary according to the present invention.
As shown in Figure 1, in the illustrated embodiment, which includes mainly pedestal 1 and at least a set of clamping device
2.At least a set of clamping device 2 is mounted on the horizontal surface of pedestal 1.In the illustrated embodiment, two are equipped on pedestal 1
Cover clamping device 2.It is of course also possible to which a set of, three sets or more set clamping devices 2 are equipped on pedestal 1 as needed.
Fig. 2 shows the stereoscopic schematic diagram of the first fixture 100 of grasping system shown in FIG. 1, wherein circuit board 10 is not yet
It navigates in the first locating slot 111；Fig. 3 shows the stereoscopic schematic diagram of the first fixture 100 of grasping system shown in FIG. 1, wherein
Circuit board 10 has been positioned in the first locating slot 111.
As shown in Figure 1, Figure 2 and Figure 3, in the illustrated embodiment, often set clamping device 2 includes the first fixture 100.Such as figure
Shown in 2 and Fig. 3, it is formed on the first fixture 100 suitable for accommodating the first locating slot 111 with locating circuit board 10.
As shown in Figure 1, Figure 2 and Figure 3, in the illustrated embodiment, when the first fixture 100 is mounted on pedestal 1, first
The bottom surface 111a of locating slot 111 and the horizontal surface of pedestal 1 are at the first angle more than zero degree and less than 90 degree, so that fixed
Circuit board 10 of the position in the first locating slot 111 relative to pedestal 1 horizontal surface at an inclination angle.
Fig. 4 shows the stereoscopic schematic diagram of the second fixture 200 of grasping system shown in FIG. 1, wherein conducting wire 20 is fixed not yet
In position to the second locating slot 211；Fig. 5 shows the stereoscopic schematic diagram of the second fixture 200 of grasping system shown in FIG. 1, wherein leads
Line 20 has been positioned in the second locating slot 211, but lid 220 is not closed.
As shown in Figure 1, Figure 4 and Figure 5, in the illustrated embodiment, often set clamping device 2 further includes the second fixture 200.
It is formed on second fixture 200 suitable for accommodating the second locating slot 211 with positioning lead 20.When the second fixture 200 is mounted on base
When on seat 1, the bottom surface 211a of the second locating slot 211 is with the horizontal surface of pedestal 1 at the second folder more than zero degree and less than 90 degree
Angle.
Fig. 7 shows the longitudinal sectional view of grasping system shown in FIG. 1.
In one embodiment of the invention, as shown in Figure 1 and Figure 7, the sum of the first angle and the second angle are equal to 90 degree,
That is, as shown in fig. 7, when the first fixture 100 and the second fixture 200 are mounted on pedestal 1, the bottom surface of the first locating slot 111
111a is vertical with the bottom surface 211a of the second locating slot 211.
As shown in figure 5 and figure 7, in the illustrated embodiment, the end conductor 21 of conducting wire 20 is bent relative to conducting wire 20
90 degree.As shown in fig. 7, when circuit board 10 and conducting wire 20 are respectively positioned in the first locating slot 111 and the second locating slot 211
When, the end conductor 21 of conducting wire 20 is aligned with the weld pad 11 on circuit board 10, and is sticked on the surface of weld pad 11.
As shown in Figures 2 and 3, in the illustrated embodiment, the first fixture 100 includes the first jig main body 110.First is fixed
Position slot 111 is formed on the inclined side of the first jig main body 110.
Fig. 6 shows the stereoscopic schematic diagram of the second fixture 200 of grasping system shown in FIG. 1, wherein conducting wire 20 is determined
In position to the second locating slot 211, and lid 220 is closed.
As shown in Figures 4 to 6, in the illustrated embodiment, the second fixture 200 includes mainly 210 He of the second jig main body
Lid 220.Second locating slot 211 is formed on the inclined side of the second jig main body 210.Lid 220 is pivotally connected to
Second jig main body 210 rotates between open position that can be shown in Fig. 5 and closed position shown in fig. 6.
As shown in fig. 6, when lid 220 is in the close position, can conducting wire 20 be clamped and is fixed on the second locating slot 211
In.
As shown in Figures 4 to 6, in the illustrated embodiment, the second fixture 200 further includes locking device 230,233, the lock
Determine device 230,233 to be arranged on the second jig main body 210, suitable for lid 220 is locked in closed position.
As shown in Figures 4 to 6, in the illustrated embodiment, one end 221 of lid 220 is pivotally connected to the second fixture
One end of main body 210.The other end in the second jig main body 210 is arranged in locking device 230,233, suitable for being locked in lid 220
The other end 222 on.
As shown in Figures 4 to 6, in the illustrated embodiment, locking device 230,233 includes mainly locking piece 230 and bullet
Spring 233.Locking piece 230 is pivotally connected to the second jig main body 210, can rotate between locked and unlocked positions.Bullet
Spring 233 is arranged on the second jig main body 210, is suitable for 230 pushing tow of locking piece to latched position.When lid 220 is rotated to
When closed position, spring 233 is by 230 pushing tow of locking piece to latched position, to which lid 220 is locked in closed position.
As shown in Figures 4 to 6, in the illustrated embodiment, when lid 220 is rotated to closed position, spring 233 pushes up
It pushing away on one end of locking piece 230 231 so that the other end 232 of locking piece 230 presses on the other end 222 of lid 220,
To which lid 220 is locked in closed position.
As shown in Figures 4 to 6, in the illustrated embodiment, when the application on one end of locking piece 230 231 and spring 233
When the opposite pressing force of the jacking force of application, locking piece 230 can be rotated to unlocked position so that locking piece 230 and lid 220
Separation.
As shown in Figure 1 and Figure 7, in the illustrated embodiment, grasping system further includes supporting rack 300.Second fixture, 200 quilt
It is obliquely supported on supporting rack 300.Therefore, the end conductor 21 of conducting wire 20 can under the action of the dead weight of the second fixture 200,
It is compressed on the surface of weld pad 11, and circuit board 10 is maintained in the first locating slot 111.In this way, it will be that may not need
One fixture 100 provides one and is used to circuit board 10 being maintained in the first locating slot 111, additional pressing plate, so as to
Simplify the structure of grasping system.
As shown in Figure 3 and Figure 5, in the illustrated embodiment, there is row's weld pad 11 on circuit board 10.Second locating slot
211 are suitable for accommodating and position row's conducting wire 20.One row's conducting wire 20 is suitable for being soldered on row's weld pad 11 of circuit board 10.
Although not shown, in one embodiment of the invention, can be formed on the bottom surface 211a of the second locating slot 211
There are row's V-arrangement or U-shaped groove, for positioning row's conducting wire 20.
In the embodiment of another exemplary of the present invention, also discloses and a kind of conducting wire 20 is welded on circuit board 10
Method, include the following steps：
S100：Aforesaid clip system is provided；
S200：Circuit board 10 and conducting wire 20 are clamped and are located in respectively the first locating slot 111 and the second locating slot 211
In；
S300：Solder flux on heater circuit plate 10 so that solder flux melts, to by solder flux by the end conductor of conducting wire 20
21 are welded on the weld pad 11 of circuit board 10.
In welding, in above mentioned steps S3 00, since circuit board 10 is obliquely arranged on the horizontal surface of pedestal 1,
Therefore, the solder flux of melting can flow downward along the surface for the circuit board 10 being inclined on pedestal 1 under the action of self-weight.
In this manner it is possible to improve the mobility of solder flux, to which the coverage rate of solder flux can be improved, and the table of the solder joint after welding can be made
Face is smooth, to improve welding quality.
It will be understood to those skilled in the art that embodiment described above is all exemplary, and this field
Technical staff can make improvements, the rushing in terms of not recurring structure or principle of the structure described in various embodiments
It can be freely combined in the case of prominent.
Although in conjunction with attached drawing, the present invention is described, and embodiment disclosed in attached drawing is intended to preferred to the present invention
Embodiment illustrates, and should not be understood as a kind of limitation to the present invention.
Although some embodiments of this present general inventive concept have been shown and have illustrated, those of ordinary skill in the art will manage
Solution can make a change these embodiments in the case of the principle and spirit without departing substantially from this present general inventive concept, of the invention
Range is limited with claim and their equivalent.
It should be noted that word " comprising " is not excluded for other element or steps, word "a" or "an" is not excluded for multiple.Separately
Outside, the range that any element label of claim should not be construed as limiting the invention.
Claims (16)
1. a kind of grasping system, including：
Pedestal (1)；With
At least a set of clamping device (2) is mounted on the pedestal (1),
It is characterized in that：
It includes the first fixture (100) often to cover the clamping device (2), is formed on first fixture (100) suitable for accommodating
With the first locating slot (111) of locating circuit board (10)；
When first fixture (100) is mounted on the pedestal (1), the bottom surface (111a) of first locating slot (111)
Horizontal surface with the pedestal (1) is at the first angle more than zero degree and less than 90 degree, so that being located in described first
Circuit board (10) in locating slot (111) relative to the pedestal (1) horizontal surface at an inclination angle.
2. grasping system according to claim 1, it is characterised in that：
It further includes the second fixture (200) often to cover the clamping device (2), is formed on second fixture (200) suitable for holding
It receives and the second locating slot of positioning lead (20) (211)；
When second fixture (200) is mounted on the pedestal (1), the bottom surface (211a) of second locating slot (211)
Horizontal surface with the pedestal (1) is at the second angle more than zero degree and less than 90 degree.
3. grasping system according to claim 2, it is characterised in that：
The sum of first angle and second angle are equal to 90 degree, that is, when first fixture (100) and second folder
When having (200) on the pedestal (1), bottom surface (111a) and second locating slot of first locating slot (111)
(211) bottom surface (211a) is vertical.
4. grasping system according to claim 2 or 3, it is characterised in that：
The end conductor (21) of the conducting wire (20) is bent 90 degree relative to the conducting wire (20)；
Determine in first locating slot (111) and described second when the circuit board (10) and the conducting wire (20) are respectively positioned
When in position slot (211), the end conductor (21) of the conducting wire (20) is aligned with the weld pad (11) on the circuit board (10), and is pasted
On the surface for leaning against the weld pad (11).
5. grasping system according to claim 4, it is characterised in that：
First fixture (100) includes the first jig main body (110), and first locating slot (111) is formed in described first
On the inclined side of jig main body (110).
6. grasping system according to claim 5, which is characterized in that second fixture (200) includes：
Second jig main body (210), second locating slot (211) are formed in the inclined of second jig main body (210)
On side；With
Lid (220) is pivotally connected to second jig main body (210), can turn between the open and the closed positions
It is dynamic,
Wherein, when the lid (220) is in the closed position, it is fixed conducting wire (20) can be clamped and is fixed on described second
In position slot (211).
7. grasping system according to claim 6, which is characterized in that second fixture (200) further includes：
Locking device (230,233) is arranged on second jig main body (210), is suitable for the lid (220) being locked in
The closed position.
8. grasping system according to claim 7, it is characterised in that：
One end (221) of the lid (220) is pivotally connected to one end of second jig main body (210)；
The other end in second jig main body (210) is arranged in the locking device (230,233), suitable for being locked in the lid
On the other end (222) of sub (220).
9. grasping system according to claim 8, which is characterized in that the locking device (230,233) includes：
Locking piece (230) is pivotally connected to second jig main body (210), can be between locked and unlocked positions
Rotation；With
Spring (233) is arranged on second jig main body (210), is suitable for the locking piece (230) pushing tow to the lock
Positioning is set,
When the lid (220) is rotated to the closed position, the spring (233) is by the locking piece (230) pushing tow
To the latched position, to which the lid (220) is locked in the closed position.
10. grasping system according to claim 9, it is characterised in that：
When the lid (220) is rotated to the closed position, spring (233) pushing tow is in the locking piece (230)
One end (231) on so that the other end of the other end (232) of the locking piece (230) pressing in the lid (220)
(222) on, to which the lid (220) is locked in the closed position.
11. grasping system according to claim 10, it is characterised in that：
When the pressing opposite with the jacking force that the spring (233) applies of the application on one end of the locking piece (230) (231)
When power, the locking piece (230) can be rotated to the unlocked position so that the locking piece (230) and the lid (220)
Separation.
12. grasping system according to claim 6, it is characterised in that：
The grasping system further includes supporting rack (300), and second fixture (200) is supported on support frame as described above with being inclined by
(300) on.
13. grasping system according to claim 12, it is characterised in that：
The end conductor (21) of the conducting wire (20) is compressed in described under the action of the dead weight of second fixture (200)
On the surface of weld pad (11), and the circuit board (10) is maintained in first locating slot (111).
14. grasping system according to claim 4, it is characterised in that：
There is row's weld pad (11), second locating slot (211) is suitable for accommodating and one row of positioning leads on the circuit board (10)
Line (20), the row conducting wire (20) are suitable for being soldered on row's weld pad (11) of the circuit board (10).
15. grasping system according to claim 14, it is characterised in that：
It is formed with row's V-arrangement or U-shaped groove on the bottom surface (211a) of second locating slot (211), for positioning described one
Arrange conducting wire (20).
16. a kind of being welded to the method on circuit board by conducting wire, include the following steps：
S100：Grasping system as claimed in claim 4 is provided；
S200：Circuit board (10) and conducting wire (20) are clamped and are located in respectively first locating slot (111) and described second
In locating slot (211)；
S300：Solder flux on heater circuit plate (10) so that solder flux melts, to by the solder flux by the conducting wire (20)
End conductor (21) is welded on the weld pad (11) of the circuit board (10),
Wherein, in welding, the solder flux of melting can under the action of self-weight, along the circuit being inclined on the pedestal (1)
The surface of plate (10) flows downward.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710160007.3A CN108620704B (en) | 2017-03-17 | 2017-03-17 | Clamping system and welding method |
| PCT/EP2018/056585 WO2018167232A1 (en) | 2017-03-17 | 2018-03-15 | Fixing system and method of soldering wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710160007.3A CN108620704B (en) | 2017-03-17 | 2017-03-17 | Clamping system and welding method |
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| Publication Number | Publication Date |
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| CN108620704A true CN108620704A (en) | 2018-10-09 |
| CN108620704B CN108620704B (en) | 2021-02-02 |
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| CN201710160007.3A Active CN108620704B (en) | 2017-03-17 | 2017-03-17 | Clamping system and welding method |
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| CN (1) | CN108620704B (en) |
| WO (1) | WO2018167232A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110142480A (en) * | 2019-05-21 | 2019-08-20 | 格力电器（武汉）有限公司 | Fixed device |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111853566B (en) * | 2020-07-28 | 2023-11-21 | 安徽蓝锐电子科技有限公司 | Wire separating device |
| CN112894050A (en) * | 2020-12-29 | 2021-06-04 | 昆山信方达电子有限公司 | 5G filter welding set |
| CN113038733B (en) * | 2021-03-10 | 2023-04-14 | 梁健玲 | Welding equipment for assembling printed circuit board |
| CN115430878A (en) * | 2022-09-06 | 2022-12-06 | 江西弘耀达通讯有限公司 | Be used for assembling workshop circuit board welding set |
| CN115255548B (en) * | 2022-09-15 | 2023-06-23 | 深圳市艾贝特电子科技有限公司 | Circuit board welding fixture and operation method thereof |
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| US20140076956A1 (en) * | 2012-09-20 | 2014-03-20 | Tyco Electronics Corporation | Soldering machine and method of soldering |
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| CN1216212A (en) * | 1997-01-23 | 1999-05-05 | 罗姆股份有限公司 | Printed board, mfg. method therefor and structure for connecting conductor elements to printed board |
| JPH11104820A (en) * | 1997-09-30 | 1999-04-20 | Pentel Kk | Positioning jig for soldering |
| CN101765333A (en) * | 2009-11-05 | 2010-06-30 | 海洋王照明科技股份有限公司 | Circuit board welding tool |
| US20130186941A1 (en) * | 2012-01-24 | 2013-07-25 | Apple Inc. | Induction bonding |
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| CN205834548U (en) * | 2016-05-30 | 2016-12-28 | 白云飞 | A kind of welding tooling |
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| CN110142480A (en) * | 2019-05-21 | 2019-08-20 | 格力电器（武汉）有限公司 | Fixed device |
Also Published As
| Publication number | Publication date |
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| CN108620704B (en) | 2021-02-02 |
| WO2018167232A1 (en) | 2018-09-20 |
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