CN108615332A - Patch device substrate position sensor sensing and alarm system - Google Patents
Patch device substrate position sensor sensing and alarm system Download PDFInfo
- Publication number
- CN108615332A CN108615332A CN201611144772.8A CN201611144772A CN108615332A CN 108615332 A CN108615332 A CN 108615332A CN 201611144772 A CN201611144772 A CN 201611144772A CN 108615332 A CN108615332 A CN 108615332A
- Authority
- CN
- China
- Prior art keywords
- sensor
- relay
- alarm system
- device substrate
- patch device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 29
- 230000006698 induction Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 230000002159 abnormal effect Effects 0.000 abstract description 2
- 238000012544 monitoring process Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- Safety Devices In Control Systems (AREA)
Abstract
The present invention provides patch device substrate position sensor sensing and alarm system, includes：Sensor I, sensor II, sensor III, relay and two-way driving circuit, the output end of the sensor I is connect with the relay normally open contact, the sensor II, sensor III are also respectively connected on two normally-closed contacts of relay, the two-way driving circuit is also connected on described two normally-closed contacts, and the two-way driving circuit has respectively included：Driver, motor, the induction that the present invention system passes through the sensor I of track end, the whole process that monitoring substrate is moved in track and magazine in time, and detect and feed back the abnormal situation alarm of substrate movement in time and stop motor action, prevent substrate and loses relevant risk.
Description
Technical field
The present invention relates to the glue printing technology of substrate, more particularly to patch device substrate position sensor sensing and
Alarm system.
Background technology
On the chip mounter of chip package, original lamination track has substrate induction system in tail end, only in this point
Carry out substrate and incude material returned success or not, but due to lamination track and to go out magazine be two parts, convergence process there are error,
Cause substrate to be stopped by resistance during being retracted into, since substrate portion is hollow out, and is easily bent after being obstructed, so simple
A single substrate induction point can not thoroughly prevent substrate and be risk of damage to.
Invention content
In view of the above problems, it needs that substrate position sensor sensing and alarm system position are researched and developed and designed again so that
Substrate unusual condition during the material returned is incuded by sensor, and extremely occur after in time arrestment and alarm carry
Show, the present invention provides patch device substrate position sensor sensing and alarm system, using following technical scheme, patch device base
Board position sensor sensing and alarm system include：Sensor I, sensor II, sensor III, relay and two-way drive
Dynamic circuit, the output end of the sensor I are connect with the relay normally open contact, and the sensor II, sensor III also divide
It is not connected on two normally-closed contacts of relay, the two-way driving circuit is also connected to described two normally-closed contacts
On, the two-way driving circuit has respectively included：Driver, motor.
Preferably, the sensor II, III is limit sensors.
Preferably, the sensor I is safety interlock sensor, and the sensor I can be limit sensors.
Preferably, the relay can be the western 24v DC relays of moral power.
Preferably, further include having power supply, the power supply can be 24v DC power supplies, and the power supply is connect with sensor I.
Preferably, the motor is connect with driver, and the driver is connected to the normally-closed contact of relay by conducting wire
On.
Beneficial effects of the present invention：The present invention system monitors substrate in time by the induction of the sensor I of track end
In the whole process that track and magazine move, and the abnormal situation alarm of substrate movement is detected and fed back in time and stops motor
Action, prevents substrate and loses relevant risk.
Description of the drawings
Fig. 1 is the structural schematic diagram that three sensor mounting location relationships can be shown in present patent application；
Connection diagram of Fig. 2 present invention about hardware；
Fig. 3 is the logic timing figure that the present invention works；
In figure, 1, sensor I；2, relay, 2.1, relay normally closed contact I, 2.2 relay normally closed contacts II；3, sensor
Ⅱ；4, I/O interfaces；5, sensor III；6, driver；7, motor；8, track；9, magazine.
Specific implementation mode
It is found that technical solution of the present invention includes shown in Fig. 1, Fig. 2 and Fig. 3：Sensor I, sensor II, sensor
III, relay and two-way driving circuit, the output end of the sensor I are connect with the relay normally open contact, the biography
Sensor II, sensor III are limit sensors, are located at the Y of magazine position, the distant positions of Z-direction, the sensor
II, sensor III is also respectively connected on I, II two normally-closed contact of normally-closed contact of relay, in the two-way driving circuit,
It has been respectively included per road driving circuit：Driver, the motor being connect with driver, the two-way driving circuit are also connected to
On described two normally-closed contacts, it is specifically that two drivers are connected to two of relay by conducting wire and normally closed touch
Point on.
Preferably, the sensor I is safety interlock sensor, and the sensor I can be limit sensors, described
Sensor I is connect with power supply, preferably DC power supply, is powered to it using power supply and is ensured its operating voltage, the sensor I
It is installed on sensor stand, and is set to the end of X-direction track, be specifically the end in track close to magazine, profit
Monitor whether substrate is normally retracted into magazine with sensor I, it, will letter by relay adjustment when sensor I incudes substrate
Number feed back to sensor II and sensor III so that device program receives signal and alarm and lock out action motor, prevents
Substrate loses risk.
Preferably, the relay can be the western 24v DC relays of moral power.
Preferably, the power supply can be 24v DC power supplies.
The principles and effects of present patent application are only illustrated in above-described embodiment, not for limitation this patent Shen
Please.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to present patent application
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of present patent application
It is refreshing to be covered with all equivalent modifications completed under technological thought or change, the claim that asked by this patent.
Claims (6)
1. patch device substrate position sensor sensing and alarm system, include：Sensor I, sensor II, sensor III,
Relay and two-way driving circuit, it is characterised in that：The output end of the sensor I connects with the relay normally open contact
It connects, the sensor II, sensor III are also respectively connected on two normally-closed contacts of relay, the two-way driving circuit
It is connected on described two normally-closed contacts, the two-way driving circuit has respectively included：Driver, motor.
2. patch device substrate position sensor sensing and alarm system according to claim 1, it is characterised in that：The biography
Sensor II, III is limit sensors.
3. according to claim 1, the 2 patch device substrate position sensor sensings and alarm system, it is characterised in that：It is described
Sensor I is safety interlock sensor, and the sensor I can be limit sensors.
4. patch device substrate position sensor sensing and alarm system according to claim 3, it is characterised in that：It is described after
Electric appliance can be the western 24v DC relays of moral power.
5. the patch device substrate position sensor sensing according to claim 1,4 and alarm system, it is characterised in that：Also
Include power supply, the power supply can be 24v DC power supplies, and the power supply is connect with sensor I.
6. patch device substrate position sensor sensing according to claim 1 and alarm system, it is characterised in that：It is described
Motor is connect with driver, and the driver is connected to by conducting wire on the normally-closed contact of relay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611144772.8A CN108615332A (en) | 2016-12-13 | 2016-12-13 | Patch device substrate position sensor sensing and alarm system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611144772.8A CN108615332A (en) | 2016-12-13 | 2016-12-13 | Patch device substrate position sensor sensing and alarm system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108615332A true CN108615332A (en) | 2018-10-02 |
Family
ID=63643750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611144772.8A Pending CN108615332A (en) | 2016-12-13 | 2016-12-13 | Patch device substrate position sensor sensing and alarm system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108615332A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1130260A (en) * | 1994-08-25 | 1996-09-04 | 三星航空产业株式会社 | Loading and unloading device for reticle sheet |
| CN1503340A (en) * | 2002-11-21 | 2004-06-09 | 奥林巴斯株式会社 | Chip check apparatus |
| WO2006115157A1 (en) * | 2005-04-22 | 2006-11-02 | Rorze Corporation | Cassette conveyance system |
| CN1895974A (en) * | 2005-07-15 | 2007-01-17 | 日本电产三协株式会社 | Substrate move-out move-in method and system |
| CN101181958A (en) * | 2007-12-12 | 2008-05-21 | 友达光电股份有限公司 | Substrate transfer-machine and substrate take-in box thereof |
| CN203339131U (en) * | 2013-08-01 | 2013-12-11 | 北京京东方光电科技有限公司 | Substrate transporting device |
| CN203681985U (en) * | 2013-12-12 | 2014-07-02 | 厦门烟草工业有限责任公司 | Transverse cigarette detection device of carton sealing machine |
| CN105428282A (en) * | 2015-12-25 | 2016-03-23 | 桂林斯壮微电子有限责任公司 | Chip mounter with anti-overlapping function |
| CN205273988U (en) * | 2015-04-28 | 2016-06-01 | 河南中烟工业有限责任公司 | Case packer plume conveyer belt anti -clogging device |
| CN106206369A (en) * | 2015-05-29 | 2016-12-07 | 细美事有限公司 | Teaching method and the substrate board treatment of teaching of use method |
-
2016
- 2016-12-13 CN CN201611144772.8A patent/CN108615332A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1130260A (en) * | 1994-08-25 | 1996-09-04 | 三星航空产业株式会社 | Loading and unloading device for reticle sheet |
| CN1503340A (en) * | 2002-11-21 | 2004-06-09 | 奥林巴斯株式会社 | Chip check apparatus |
| WO2006115157A1 (en) * | 2005-04-22 | 2006-11-02 | Rorze Corporation | Cassette conveyance system |
| CN1895974A (en) * | 2005-07-15 | 2007-01-17 | 日本电产三协株式会社 | Substrate move-out move-in method and system |
| CN101181958A (en) * | 2007-12-12 | 2008-05-21 | 友达光电股份有限公司 | Substrate transfer-machine and substrate take-in box thereof |
| CN203339131U (en) * | 2013-08-01 | 2013-12-11 | 北京京东方光电科技有限公司 | Substrate transporting device |
| CN203681985U (en) * | 2013-12-12 | 2014-07-02 | 厦门烟草工业有限责任公司 | Transverse cigarette detection device of carton sealing machine |
| CN205273988U (en) * | 2015-04-28 | 2016-06-01 | 河南中烟工业有限责任公司 | Case packer plume conveyer belt anti -clogging device |
| CN106206369A (en) * | 2015-05-29 | 2016-12-07 | 细美事有限公司 | Teaching method and the substrate board treatment of teaching of use method |
| CN105428282A (en) * | 2015-12-25 | 2016-03-23 | 桂林斯壮微电子有限责任公司 | Chip mounter with anti-overlapping function |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181002 |