CN108603078A - Adhesive film and its manufacturing method, bonding agent band and adhesive film spool - Google Patents
Adhesive film and its manufacturing method, bonding agent band and adhesive film spool Download PDFInfo
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- CN108603078A CN108603078A CN201780008489.9A CN201780008489A CN108603078A CN 108603078 A CN108603078 A CN 108603078A CN 201780008489 A CN201780008489 A CN 201780008489A CN 108603078 A CN108603078 A CN 108603078A
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- China
- Prior art keywords
- adhesive film
- adhesive layer
- conductive
- bonding agent
- conductive adhesive
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/04—Kinds or types
- B65H75/08—Kinds or types of circular or polygonal cross-section
- B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
Abstract
The present invention provides adhesive film (1), in a mode, the adhesive film (1) is that the first non-conductive adhesive layer (2), the conductive adhesive layer (3) containing electroconductive particle (5) and the second non-conductive adhesive layer (4) stack gradually, and the thickness T1 of the first non-conductive adhesive layer (2) and the thickness T of conductive adhesive layer (3) meets following formula (1).T1 ＜ T ... (1).
Description
Technical field
The present invention relates to adhesive film and its manufacturing method, bonding agent band and adhesive film spools.
Background technology
In the past, as there will be the connected component of multiple electrodes to be electrically connected to each other, the company of circuit connecting body is manufactured
Material is connect, is used anisotropic conductive film (ACF (Anisotropic Conductive Film)).Anisotropic conductive film is
The semiconductor elements such as IC, LSI, encapsulation are connected on the substrates such as printed wiring board, LCD glass substrates, flexible printed board
Whens equal, to keep the opposite mutual conducting state of electrode, and the mode of the adjacent mutual insulation of electrode is kept to be electrically connected
The connecting material for connecing and being mechanically fixed.In addition, as connecting material, other than anisotropic conductive film, it is also known that non-conductive
Film (NCF (Non-Conductive film)) etc..
Connecting material is such as comprising containing the bonding agent ingredient thermosetting resin and the root in anisotropic conductive film
According to the electroconductive particle that needs coordinate, on the base materials such as polyethylene terephthalate (PET) film, the shape as adhesive layer
As membranaceous.Further, for adhesive film, membranaceous master is cut into the band-like of the width suitable for purposes sometimes, it will
The band is wound in core and coiling body is made, and the state of the spool obtained by thus uses (referring for example to patent document 1).
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2003-34468 bulletins
Invention content
Problems to be solved by the invention
However, in the case where IC etc. will be driven to be connected to LCD module using connecting material, to electricity in original connecting material
The mutual connection of road component effectively make the part contributed be whole approximately half of of LCD module hereinafter, but from operating efficiency and
It sets out in terms of equipment investment, typically integrally pastes connecting material throughout LCD module first, then, carry out the peace of driving IC etc.
Dress.However, in recent years, for the purpose of the manufacturing cost for reducing LCD, being reduced the trend of the usage amount of connecting material.In this regard, just
Studying following technology：In the case that COF, FPC etc. are connected to LCD module, connecting material is pasted in the sides COF or FPC first
Later, it is installed on LCD module side, to reduce the usage amount of connecting material, cost of implementation is cut down.
On the other hand, using have fine circuit LCD module in the case of, between circuit short circuit and electric conductivity
From the perspective of the capturing efficiency of particle, it is expected that using by non-conductive adhesive layer and containing the conduction of electroconductive particle
Property the formation of this two layers of adhesive layer connecting materials.In general, two layers composition connecting materials formed on base material it is non-conductive
Property adhesive layer, and conductive adhesive layer is further formed to obtain on the non-conductive adhesive layer.However, using
When first pasting the process of connecting material of two layers of composition in the sides COF or FPC, the face of non-conductive adhesive layer side can be towards LCD
Module side is pasted, therefore is generated and be cannot get sufficient connection performance this problem.
The inventors of the present invention to solve the above-mentioned problems, have studied using the connection for first pasting two layers of composition in the sides COF or FPC
After material, when being installed on the process of LCD module, conductive adhesive layer is formed on base material first, in the electric conductivity
It is further formed non-conductive adhesive layer on adhesive layer and obtains two layers of connecting material constituted.However, in this case,
It was found that when circuit is connected from connecting material peeling base when, it may occur that conductive adhesive layer is transferred to the phenomenon that base material (institute
Call adhesion (blocking) phenomenon).In case of adhesion phenomenon, it is likely that can not match in the precalculated position on being connected component
The conductive adhesive of necessary amount is set, the connection reliability (be electrically connected or be mechanically fixed) of interconnecting piece becomes inadequate.
The present invention is proposed in view of above-mentioned actual conditions, its purpose is to provide conductive adhesive layer and non-is led
While electrical adhesive layer, the generation of adhesion phenomenon can be inhibited, and can obtain in the manufacture for circuit connecting body
Obtain adhesive film and its manufacturing method, the bonding agent band and adhesive film spool of excellent connection reliability.
The method used for solving the problem
In the present invention, as a mode, a kind of adhesive film is provided, is the first non-conductive adhesive layer, contains
The conductive adhesive layer of electroconductive particle and the second non-conductive adhesive layer stack gradually, and first is non-conductive viscous
The thickness T of the thickness T1 and conductive adhesive layer that connect oxidant layer meet following formula (1).
T1 ＜ T ... (1)
In the present invention, as another way, a kind of manufacturing method of adhesive film is provided, has following processes：By
One non-conductive adhesive layer, the conductive adhesive layer containing electroconductive particle and the second non-conductive adhesive layer are successively
The process for being laminated to obtain adhesive film, the thickness T1 of the first non-conductive adhesive layer and the thickness T of conductive adhesive layer
Meet following formula (1).
T1 ＜ T ... (1)
The average grain diameter r of T1 and electroconductive particle preferably satisfies following formula (2).
T1≤0.8×r…(2)
The thickness T2 of the non-conductive adhesive layers of T1 and second preferably satisfies following formula (3).
T1≤T2…(3)
In the present invention, as another way, a kind of adhesive film is provided, is the adhesive film containing electroconductive particle,
Have successively on the thickness direction of adhesive film there is no the first non-conductive areas of electroconductive particle, there are electric conductivity grains
The conductive region of son and the second non-conductive areas there is no electroconductive particle, the first non-conductive areas is in adhesive film
Thickness direction on length L1 and length L of the conductive region on the thickness direction of adhesive film meet following formula (4).
L1 ＜ L ... (4)
The average grain diameter r of L1 and electroconductive particle preferably satisfies following formula (5).
L1≤0.8×r…(5)
The length L2 of L1 and the second non-conductive areas on the thickness direction of adhesive film preferably satisfies following formula (6).
L1≤L2…(6)
In the present invention, as another way, a kind of bonding agent band is provided, have band-like base material and is arranged in base
Above-mentioned adhesive film in the one side of material.
In the present invention, as another way, a kind of adhesive film spool is provided, has above-mentioned bonding agent band and volume
It is wound with the core of bonding agent band.
The effect of invention
In accordance with the invention it is possible to provide while conductive adhesive layer and non-conductive adhesive layer, it can
Inhibit the generation of adhesion phenomenon, and the bonding of excellent connection reliability can be obtained in the manufacture for circuit connecting body
Agent film and its manufacturing method, bonding agent band and adhesive film spool.
Description of the drawings
Fig. 1 is the schematic cross-section for an embodiment for indicating adhesive film.
Fig. 2 is the schematic cross-section for the other embodiment for indicating adhesive film.
Fig. 3 is the stereogram for an embodiment for indicating adhesive film spool.
Fig. 4 is the amplification schematic cross-section of the bonding agent band in adhesive film spool shown in Fig. 3.
Fig. 5 is the schematic cross-section of an embodiment of the manufacturing method of indication circuit connector.
Specific implementation mode
Hereinafter, embodiments of the present invention are described in detail on one side with reference to attached drawing on one side, but the present invention is unlimited
In following embodiments.In addition, in the description of the drawings, enclosing identical symbol to identical element, the repetitive description thereof will be omitted.
In addition, for the sake of the convenience of attached drawing, the dimensional ratios of attached drawing and the content of explanation are not necessarily consistent.
[adhesive film (first embodiment)]
Fig. 1 is the schematic cross-section for the adhesive film for indicating that first embodiment is related to.As shown in Figure 1, adhesive film 1 is
First non-conductive adhesive layer 2, conductive adhesive layer 3 and the second non-conductive adhesive layer 4 stack gradually.
First and second non-conductive adhesive layers 2,4 are made of bonding agent ingredient 2a, 4a respectively.Constitute first and second
Bonding agent ingredient 2a, 4a of non-conductive adhesive layer 2,4 can be the same or different each other.
As bonding agent ingredient 2a, 4a, as long as carrying out cured ingredient by heat or light, so that it may, can be widely used
To use such as epoxy bonding agent or acrylic acid series bonding agent.The viewpoint of heat resistance and excellent moisture resistance from solidfied material goes out
Hair, bonding agent ingredient 2a, 4a are preferably the ingredient of bridging property.Wherein, from can with the short time cure and connection operation it is good,
Cementability is also excellent etc. to set out, and preferably contains viscous as the epoxy of principal component as the epoxy resin of thermosetting resin
Connect agent.In addition, from compared with epoxy bonding agent, such as in setting adhesive film on base material come in the case of bonding agent band is made
(being described in detail later) can inhibit bonding agent ingredient to from the aspect of the transfer of base material, preferably epoxy bonding agent.As bonding
Agent ingredient 2a, 4a can also use such radically curing system bonding agent recorded in such as International Publication No. 98/44067.
As the concrete example of epoxy bonding agent, it can enumerate that (such as weight average molecular weight is containing high molecular expoxy resin
10000~100000), solid epoxy or liquid epoxy resin or these epoxy resin through carbamate, polyester,
The modified epoxy of the modified gained such as acrylic rubber, nitrile rubber (NBR), synthetic linear polyamide is as principal component
Bonding agent.In epoxy bonding agent, other than above-mentioned epoxy resin, it can further contain curing agent, catalyst, coupling
The additives such as agent, filler.
As the concrete example of acrylic acid series bonding agent, can enumerate containing with acrylic acid, acrylate, methacrylate and
At least one of acrylonitrile is bonding agent of the acrylic resin (homopolymer or copolymer) of monomer component as principal component.
In acrylic acid series bonding agent, other than above-mentioned acrylic resin, can further contain curing agent, catalyst, coupling agent,
The additives such as filler.
In the case where circuit member is connected to each other, produced from the difference by the linear expansion coefficient between two circuit members is inhibited
From the perspective of the warpage of raw circuit member, bonding agent ingredient 2a, 4a preferably comprise the abirritation for playing internal stress
Ingredient.Specifically, bonding agent ingredient 2a, 4a preferably comprise acrylic rubber, elastomer components etc..
Conductive adhesive layer 3 contains bonding agent ingredient 3a and electroconductive particle 5.Bonding agent ingredient 3a can with as structure
The bonding agent ingredient illustrated at bonding agent ingredient 2a, 4a of the above-mentioned first and second non-conductive adhesive layers 2,4 is identical,
Furthermore, it is possible to constitute the first and second non-conductive adhesive layers 2,4 bonding agent ingredient 2a, 4a it is respectively identical can not also
Together.
Electroconductive particle 5 is scattered in bonding agent ingredient 3a.As electroconductive particle 5, can enumerate Au, Ag, Pt, Ni, Cu,
W, the metallics such as Sb, Sn, scolding tin, conductive carbon particle etc..Or electroconductive particle 5 can also be by dielectric glass
The particles such as glass, ceramics, plastics as core, be used in combination above-mentioned metal or conductive carbon by the core it is coating obtained from coating electric conductivity grain
Son.Electroconductive particle 5 can be its surface by insulating layer it is coating made of insulation-coated electroconductive particle.The electricity adjacent from raising
From the perspective of extremely mutual insulating properties, in conductive adhesive layer 3, other than electroconductive particle 5, can further it contain
Insulating properties particle.
Relative to 100 parts by volume for the bonding agent ingredient 3a that conductive adhesive layer 3 is included, electroconductive particle 5 contains
Amount for example, 0.1~30 parts by volume, preferably 0.1~10 parts by volume.If content is more than or equal to 0.1 parts by volume, have
The tendency that opposed interelectrode connection resistance reduces can inhibit adjacent electricity if it is less than or equal to 30 parts by volume
The short circuit of interpolar.
In adhesive film 1, the thickness T1 of the first non-conductive adhesive layer 2 and thickness T of conductive adhesive layer 3 is full
Sufficient following formula (1).
T1 ＜ T ... (1)
It is excellent from the viewpoint of better in terms of the capturing efficiency of the electroconductive particle 5 when circuit connects about T1 and T
Be full 0.9 × T of sufficient T1 ＜, more preferably meets T1 0.8 × T of ＜, further preferably meets the relational expression of 0.7 × T of T1 ＜.
In adhesive film 1, the average grain diameter of thickness T1 and electroconductive particle 5 about the first non-conductive adhesive layer 2
The capturing efficiency of r, the electroconductive particle 5 when being connected from circuit are excellent, excellent from the perspective of capable of further decreasing connection resistance
The sufficient following formula that is full (2).
T1≤0.8×r…(2)
About T1 and r, from the same viewpoint, more preferably meet the relational expression of T1≤0.7 × r.
In adhesive film 1, the non-conductive adhesive layer of thickness T1 and second about the first non-conductive adhesive layer 24
Thickness T2, the excellent viewpoint of fillibility from the space circuit member when being connected with circuit between the transferability of circuit member
It sets out, preferably satisfies following formula (3).
T1≤T2…(3)
About T1 and T2, from the same viewpoint, more preferably meet T1≤0.5 × T2, further preferably meet T1≤
0.4 × T2 particularly preferably meets the relational expression of T1≤0.3 × T2.
In the thickness of the non-conductive adhesive layer of the first non-conductive adhesive layer 2, conductive adhesive layer 3 or the second 4
In the case of non-uniform, the maximum value of the thickness of each layer is set to thickness T1, thickness T or thickness T2.
The average grain diameter of electroconductive particle is such as given a definition in the present invention.That is, by scanning electron microscope (SEM) with 3000
Observation electroconductive particle image again, randomly chooses multiple electroconductive particles.At this point, in order to precisely determine average grain diameter,
Preferably select the electroconductive particle more than or equal to 30.Maximum diameter and most path are measured for selected electroconductive particle,
The square root of the maximum diameter and the product of most path is set as to the grain size of electroconductive particle.Will in this way operate and calculate grain size divided by
Value is defined as average grain diameter obtained from the particle number measured.
It is preferred that the thickness T of the thickness T1 of the first non-conductive adhesive layer 2, conductive adhesive layer 3, second non-conductive
The thickness T2 of adhesive layer 4 and the average grain diameter r of electroconductive particle 5 meet above-mentioned relation respectively, their specific thickness or
Average grain diameter is not particularly limited.
The thickness T1 of first non-conductive adhesive layer 2 can be to be greater than or be equal to 0.5 μm, or be greater than or equal to 1 μ
M, for example, can be less than or equal to 2.5 μm, or be less than or equal to 2 μm.
The thickness T of conductive adhesive layer 3 can be greater than or be equal to 1.5 μm, or be greater than or equal to 2 μm, such as
Can be less than or equal to 4 μm, or be less than or equal to 3.5 μm.
The thickness T2 of second non-conductive adhesive layer 4 can be to be greater than or be equal to 5 μm, or be greater than or equal to 7 μm,
Such as can be less than or equal to 10 μm, or be less than or equal to 9 μm.
The average grain diameter r of electroconductive particle 5 can be to be greater than or be equal to 2 μm, or be greater than or equal to 3 μm, such as can
Think and be less than or equal to 5 μm, or is less than or equal to 4 μm.
Adhesive film 1 can also be in the face with 3 opposite side of conductive adhesive layer of the first non-conductive adhesive layer 2
On or the face with 3 opposite side of conductive adhesive layer of the second non-conductive adhesive layer 4 on, be further equipped with base material (not
Diagram).The thickness of base material can be such as 4~200 μm.
Base material can be for example by polyethylene terephthalate, polyethylene naphthalate, poly- M-phthalic acid
Glycol ester, polybutylene terephthalate (PBT), polyolefin, poly- acetic acid esters, makrolon, polyphenylene sulfide, polyamide, ethylene-
The base material of the formation such as vinyl acetate copolymer, polyvinyl chloride, Vingon, synthetic rubber system, liquid crystal polymer.For base
The face Nian Jie with the non-conductive adhesive layer of the first or second of material, can also implement demoulding processing.
[adhesive film (second embodiment)]
Fig. 2 is the schematic cross-section for the adhesive film for indicating that second embodiment is related to.As shown in Fig. 2, adhesive film 11
Contain bonding agent ingredient 11a and electroconductive particle 5.Adhesive film 11 has successively on the thickness direction of adhesive film 11 not to be deposited
Electroconductive particle 5 the first non-conductive areas R1, there are the conductive region R of electroconductive particle 5 and be not present electric conductivity
Second non-conductive areas R2 of particle 5.
Bonding agent ingredient 11a can be same as bonding agent ingredient 2a, 3a, 4a illustrated in above-mentioned first embodiment
Bonding agent ingredient, electroconductive particle 5 can be similarly led with the electroconductive particle 5 illustrated in above-mentioned first embodiment
Conductive particles.Bonding agent ingredient 11a can be whole with uniform ingredient in adhesive film 11, can also be according to adhesive film 11
Position and have different ingredients.For example, bonding agent ingredient 11a can be in the first non-conductive areas R1, conductive region R
And second non-conductive areas R2 respectively have different ingredients.
Conductive region R is defined as the region between the first tangent plane and the second tangent plane, first tangent plane be
It is contacted with electroconductive particle 5 and the plane substantially parallel with the surface 11b of the first non-conductive areas sides R1 of adhesive film 11
In, be present in apart from surface 11b be the shortest distance at plane, second tangent plane be contacted with electroconductive particle 5,
And it is present in apart from the table in substantially parallel plane with the surface 11c of the second non-conductive areas sides R2 of adhesive film 11
Face 11c is the plane at the shortest distance.
First non-conductive areas R1 is defined as, from the first tangent plane towards the first non-conductive areas of adhesive film 11
Region that the surface 11b of the sides R1 extends on the thickness direction of adhesive film 11, other than conductive region R.
Second non-conductive areas R2 is defined as, from the second tangent plane towards the second non-conductive areas of adhesive film 11
Region that the surface 11c of the sides R2 extends on the thickness direction of adhesive film 11, other than conductive region R.
In adhesive film 11, the length L of the length L1 and conductive region R of the first non-conductive areas R1 meet following formula
(4)。
L1 ＜ L ... (4)
It is excellent from the viewpoint of better in terms of the capturing efficiency of the electroconductive particle 5 when circuit connects about L1 and L
Be full 0.9 × L of sufficient L1 ＜, more preferably meets L1 0.8 × L of ＜, further preferably meets the relational expression of 0.7 × L of L1 ＜.
In adhesive film 11, the average grain diameter r of length L1 and electroconductive particle 5 about the first non-conductive areas R1,
The capturing efficiency of electroconductive particle 5 when being connected from circuit is excellent, from the perspective of capable of further decreasing connection resistance, preferably
Meet following formula (5).
L1≤0.8×r…(5)
About L1 and r, from the same viewpoint, more preferably meet the relational expression of L1≤0.7 × r.
In adhesive film 11, the length of length L1 and the second non-conductive areas R2 about the first non-conductive areas R1
L2, from the viewpoint of the fillibility in the space circuit member when being connected with circuit between the transferability of circuit member is excellent,
Preferably satisfy following formula (6).
L1≤L2…(6)
About L1 and L2, from the same viewpoint, more preferably meet L1≤0.5 × L2, further preferably meet L1≤
0.4 × L2 particularly preferably meets the relational expression of L1≤0.3 × L2.
It is preferred that the length L of the length L1 of the first non-conductive areas R1, conductive region R, the second non-conductive areas R2
Length L2 and the average grain diameter r of electroconductive particle 5 respectively meet above-mentioned relation, their specific length or average grain diameter is not
It is particularly limited.
The length L1 of first non-conductive areas R1 can be to be greater than or be equal to 0.5 μm, or be greater than or equal to 1 μm,
It can be e.g., less than or equal to 2.5 μm, or be less than or equal to 2 μm.
The length L of conductive region R can be to be greater than or be equal to 1.5 μm, or be greater than or equal to 2 μm, can be for
4 μm such as less than or equal to, or it is less than or equal to 3.5 μm.
The length L2 of second non-conductive areas R2 can be to be greater than or be equal to 5 μm, or be greater than or equal to 7 μm, can
Think e.g., less than or equal to 10 μm, or is less than or equal to 9 μm.
Adhesive film 11 can further have in the first non-conductive areas R1 in conductive region R opposite side
It is standby there are the region of electroconductive particle or there is no the regions of electroconductive particle.
[manufacturing method of adhesive film]
About the adhesive film 1,11 that above-mentioned first and second embodiment is related to, such as by non-conductive viscous by first
Oxidant layer 2, the conductive adhesive layer 3 containing electroconductive particle 5 and the second non-conductive adhesive layer 4 is connect to stack gradually to obtain
.
Specifically, for example, first, using laminating machine etc. by the first non-conductive adhesive layer 2 and conductive adhesive
3 stacking of layer obtains laminated body, then, similarly operates, in the further stacking the of 3 side of conductive adhesive layer of the laminated body
Two non-conductive adhesive layers 4, so as to obtain adhesive film 1,11.Alternatively, first, electric conductivity is glued using laminating machine etc.
It connects oxidant layer 3 and the second non-conductive adhesive layer 4 is laminated to obtain laminated body, then, similarly operate, in leading for the laminated body
The first non-conductive adhesive layer 2 is further laminated in electrical 3 side of adhesive layer, to can also obtain adhesive film 1,11.
Each layer of first non-conductive adhesive layer 2, conductive adhesive layer 3 and the second non-conductive adhesive layer 4
Such as it makes by the following method.First, bonding agent ingredient 2a, 4a or bonding agent ingredient 3a and electroconductive particle 5 is made to dissolve
Coating liquid is modulated in solvent.Then, which is coated on the surface by demoulding processing of such as base material, for example
Active temperature (e.g., less than or equal to 100 DEG C) less than or equal to the curing agent contained by bonding agent ingredient 2a, 3a, 4a carries out
It is dry, solvent is removed, to obtain each layer.Solvent can be aromatic hydrocarbon series solvent, oxygen-containing series solvent etc..The boiling point of solvent can
Think and be less than or equal to 150 DEG C, or 60~150 DEG C or 70~130 DEG C.
The thickness T1 of the first non-conductive adhesive layer 2 used in the manufacturing method, the thickness of conductive adhesive layer 3
Degree T, the thickness T2 of the second non-conductive adhesive layer 4 and the average grain diameter r of electroconductive particle 5 preferably respectively meet above-mentioned the
The relationships such as formula (1), (2), (3) illustrated in one embodiment.
[bonding agent band and adhesive film spool]
Fig. 3 is the stereogram for an embodiment for indicating adhesive film spool.As shown in figure 3, adhesive film is rolled up
Axis 21 has the core 22 of tubular and the discoid side plate 23 that is respectively set of axial both ends of the surface in core 22.It is rolling up
The outer surface 22a of core 22 is wound with the bonding agent band 24 of strip, and thus bonding agent band 24 becomes coiling body.Bonding agent band 24 has
Band-like base material 25 and the adhesive film 26 being set in the one side of the base material 25.The inner surface of core 22 becomes axis hole 22b,
The axis hole 22b is used to be installed on the rotary shaft of used compression bonding apparatus when such as circuit connection.The sight excellent from operability
Point sets out, and the outer diameter of core 22 is such as 4~15cm.
Fig. 4 is the amplification schematic cross-section of the bonding agent band 24 in adhesive film spool 21 shown in Fig. 3.Such as Fig. 4 (a)
Shown, bonding agent band 24A in one embodiment, has band-like base material 25 and as being set to the one of the base material 25
The adhesive film 1 that the first embodiment of adhesive film 26 on face is related to.
As shown in Fig. 4 (b), in other embodiments, bonding agent with 24B has band-like base material 25 and as setting
The adhesive film 11 that the second embodiment for the adhesive film 26 being placed in the one side of the base material 25 is related to.
The length of base material 25 is such as 1~400m, preferably 50~300m.The thickness of base material 25 is such as 4~200 μm,
Preferably 20~100 μm.The width of base material 25 is preferably of same size with adhesive film 1,11, or than adhesive film 1,11
Width is wide, specifically, for example, 0.5~30mm, preferably 0.5~3.0mm.Length, the thickness and width of base material 25 are unlimited
In above range.
As base material 25, can be used for example by polyethylene terephthalate, polyethylene naphthalate, poly- isophthalic
Naphthalate, polybutylene terephthalate (PBT), polyolefin, poly- acetic acid esters, makrolon, polyphenylene sulfide, polyamide,
The formation such as vinyl-vinyl acetate copolymer, polyvinyl chloride, Vingon, synthetic rubber system, liquid crystal polymer it is band-like
Base material.The material for constituting base material 25 is without being limited thereto.For the bonding plane of base material 25 and adhesive film 26, can also implement at demoulding
Reason.
As long as the width of adhesive film 26 is adjusted according to usage, for example, 0.5~5mm, preferably 0.5
~3.0mm.
For adhesive film spool 21, due in base material 25 of the bonding agent with 24A, 24B and conductive adhesive layer 3
Between or base material 25 of the bonding agent with 24A, 24B and conductive region R between be provided with the first non-conductive adhesive layer 2 or
First non-conductive areas R1, therefore when removing adhesive film 26 to be used for circuit connection from base material 25, can inhibit to lead
The electrical transfer (adhesion phenomenon) of adhesive layer 3 or conductive region R to base material 25.
In addition, in the above-described embodiment, bonding agent band 24 is used in the form of adhesive film spool 21, but bonding agent
(desired size, the form of shape can also be cut into advance) in the form of such as monolithic with 24 to use.
[circuit connecting body and its manufacturing method]
For using circuit connecting body of the above-mentioned bonding agent band 24 to manufacture to illustrate.Fig. 5 is indication circuit connector
Manufacturing method an embodiment schematic cross-section.
First, as shown in Fig. 5 (a), preparation has the first circuit board 31 and is formed in the master of the first circuit board 31
First circuit member 33 of the first circuit electrode 32 on the 31a of face.Then, so that the first circuit electrode of the first circuit member 33
32 modes opposed with the non-conductive adhesive layer 4 of second of bonding agent with 24A, bonding agent is loaded on the first circuit member 33
Band 24A.
As the concrete example of the first circuit member 33, FPC substrates, COF substrates etc. can be enumerated.These circuit members it is general and
Speech has multiple circuit electrodes.First circuit electrode 32 can be by being selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum and indium tin oxygen
One or more of compound (ITO) is constituted.The material of multiple first circuit electrodes 32 can be mutually identical
It can also be different.
In addition, in the case of stating adhesive film spool 21 in use, as long as example, in the rotary shaft of compression bonding apparatus
Adhesive film spool 21 is installed, so that second non-conductive adhesive layer 4 of the bonding agent with 24A and the first circuit member 33
The opposed mode of first circuit electrode 32, after adhesive film spool 21 pulls out bonding agent band 24A, by bonding agent band 24A
Predetermined length is cut into, is placed on the first circuit member 33.
Next, pressurizeing along the first circuit member of arrow A and B direction pair 33 and bonding agent band 24A, adhesive film 26 is faced
When be connected to the first circuit member 33.As long as pressure at this time does not bring the first circuit member 33 range of damage, just not
It is particularly limited, preferably such as 0.1~30.0MPa.When interim connection, it can pressurize while heating.Heating at this time
As long as the substantially not cured temperature of temperature adhesive film 1, preferably such as 50~100 DEG C.Pressurization (and heating) is excellent
Choosing carries out 0.1~2 second.
Next, as shown in Fig. 5 (b), preparation has second circuit substrate 34 and is formed in second circuit substrate 34
The second circuit component 36 of second circuit electrode 35 on interarea 34a.Then, by bonding agent the base material 25 with 24A from bonding agent
After film 1 is removed, in a manner of keeping the first circuit electrode 32 opposed with second circuit electrode 35, by the first circuit member 33 and glue
Agent film 1 is connect to be placed on second circuit component 36.
As the concrete example of second circuit component 36, LCD module etc. can be enumerated.Second circuit electrode 35 can be by being selected from
One or more of gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum and indium tin oxide (ITO) are constituted.Multiple presence
The material of second circuit electrode 35 can mutually identical can also be different.
Then, it heats on one side, the edge directions arrow C and D are by entire pressurisation.As long as heating temperature bonding agent at this time
Bonding agent ingredient 2a, 3a, 4a of film 1 can cured temperature, preferably 60~180 DEG C, more preferably 70~170 DEG C,
Further preferably 80~160 DEG C.If heating temperature is more than or equal to 60 DEG C, it is able to maintain that curing rate appropriate,
If it is less than or equal to 180 DEG C, undesirable side reaction can be inhibited.Heating time is preferably 0.1~180 second, more excellent
It is selected as 0.5~180 second, further preferably 1~180 second.
The condition of above-mentioned connection is according to the purposes and adhesive film of the circuit connecting body obtained and the kind of circuit member
Class suitably selects.It is the feelings that cured bonding agent ingredient is carried out by light in bonding agent ingredient 2a, 3a, 4a of adhesive film 1
Under condition, as long as in connection to 1 suitable radiation active ray of adhesive film or energy-ray.As active ray, can lift
Go out ultraviolet light, visible light, infrared ray etc..As energy-ray, electron ray, X-ray, gamma-rays, microwave etc. can be enumerated.
In this way operate, cured by bonding agent ingredient 2a, 3a, 4a, to formed containing bonding agent ingredient 2a, 3a,
The solidfied material 37 of 4a and the interconnecting piece 38 of electroconductive particle 5, obtain such circuit connecting body 39 shown in Fig. 5 (c).That is, circuit
Connector 39 has the first circuit member 33, second circuit component 36 and is set to the first circuit member 33 and second circuit structure
Interconnecting piece 38 between part 36.In circuit connecting body 39, the first circuit electrode 32 is with second circuit electrode 35 via electric conductivity grain
Son 5 and be electrically connected.That is, both electroconductive particle 5 and the first and second circuit electrode 32,35 are in direct contact, therefore the first He
Connection resistance between second circuit electrode 32,35 is sufficiently reduced, and can be realized between the first and second circuit electrodes 32,35
Good electrical connection.On the other hand, since solidfied material 37 has electrical insulating property, it is hereby ensured that the first adjacent circuit electrodes
32 each other with 35 mutual insulating properties of second circuit electrode.Therefore, in the circuit connecting body 39, the first and second circuit electrodes
32, the electric current between 35 is logical becomes smooth, can fully play function possessed by circuit member 33,36.
In the manufacturing method of circuit connecting body 39 described above, due to first in FPC substrates, COF substrates etc. first
Adhesive film 1 is connected on circuit member 33 temporarily, therefore connection is Nian Jie temporarily on the second circuits such as LCD module component 36 with elder generation
The case where agent film 1, is compared, and can the usage amount of adhesive film 1 be suppressed to minimum limit, can reduce manufacturing cost.In addition,
It is viscous less than electric conductivity due to the use of the thickness of the first non-conductive adhesive layer 2 in the manufacturing method of the circuit connecting body 39
The adhesive film 1 of the thickness of oxidant layer 3 is connect, therefore when the first and second circuit members 33,36 are connected to each other, electroconductive particle
5 are easy to be trapped between the first and second circuit electrodes 32,35, can realize good electrical connection.
In the above-described embodiment, the bonding agent band 24A for having the adhesive film 1 that first embodiment is related to has been used to make
For bonding agent band, but the bonding agent band 24B for having the adhesive film 11 that second embodiment is related to can also be used as bonding
Agent band.
Embodiment
Hereinafter, the present invention is illustrated by embodiment in further detail, but the present invention is not limited to these Examples.
(embodiment 1)
[synthesis of urethane acrylate]
By 400 mass parts of polycaprolactone glycol of weight average molecular weight 800,131 mass parts of acrylic acid 2- hydroxy propyl esters, conduct
0.5 mass parts of dibutyl tin dilaurate of catalyst and 1.0 mass parts of Hydroquinone monomethylether as polymerization inhibitor stir on one side
50 DEG C are heated on one side to be mixed.Then, 222 mass parts of isophorone diisocyanate are added dropwise, further stir one on one side
While being warming up to 80 DEG C to carry out urethane reaction.Confirming the reactivity of isocyanate group becomes more than or equal to 99%
Afterwards, reaction temperature is reduced, urethane acrylate is obtained.
[modulation of polyester urethane resin]
Respectively used as the terephthalic acid (TPA) of dicarboxylic acids, the propylene glycol as glycol, 4,4 '-two as isocyanates
Methylenebis phenyl isocyanate, makes terephthalic acid (TPA)/propylene glycol/4, the molar ratio of 4 '-methyl diphenylene diisocyanates be
1.0/1.3/0.25 or 1.0/2.0/0.25, modulation two kinds of polyester urethane Resin As, B.Make each polyester urethane tree
Fat is dissolved in a manner of as 20 mass % in methyl ethyl ketone.Using coating unit by the first and second of each polyester urethane resin
Ketone solution coating is in the PET film to 80 μm of thickness being surface-treated on one side, at 70 DEG C, carries out 10 minutes hot air dryings
It is dry, to obtain the film that thickness is 35 μm.For each film, using wide area measurement of dynamic viscoelasticity device, with tensile load 5g, frequency
Rate 10Hz measures the temperature dependency of elasticity modulus.The glass transition temperature of thus obtained polyester urethane resin is
Polyester urethane Resin A：105 DEG C, polyester urethane resin B：70℃.
[making of the first non-conductive adhesive layer]
As free-radical polymerised substance, 20 mass parts of above-mentioned urethane acrylate, bis- (acryloxies are used
Ethyl) isocyanuric acid ester (ProductName：M-325, Toagosei Co., Ltd's system) 20 mass parts, dihydroxymethyl tristane dipropyl
Olefin(e) acid ester (ProductName：DCP-A, Kyoeisha Chemical Co., Ltd.'s system) 10 mass parts and 2- methacryloxyethyl acid phosphorus
Acid esters (ProductName：P-2M, Kyoeisha Chemical Co., Ltd.'s system) 1 mass parts use peroxidating as free radical initiator
Benzoyl (ProductName：Nyper BMT-K, Japan Oil Co's system) 3 mass parts.By these each ingredients and in toluene/methyl ethyl ketone
50 mass parts of solution of 23 mass % obtained by=50/50 in the mixed solvent dissolved polyester carbamate resins B are mixed
It closes, stirring, obtains resin solution.The resin solution is coated on to the thickness to being surface-treated on one side using coating unit
The PET film of 50 μm of degree carries out 10 minutes heated-air dryings at 70 DEG C, is glued with the non-conductive of 2 μm of thickness to obtain PET film
Meet the laminated body PA (width 15cm, length 80m) of oxidant layer A (the first non-conductive adhesive layer).
[making of conductive adhesive layer]
As free-radical polymerised substance, 25 mass parts of above-mentioned urethane acrylate, bis- (acryloxies are used
Ethyl) isocyanuric acid ester (ProductName：M-325, Toagosei Co., Ltd's system) 15 mass parts and 2- methacryloxy second
Base phosphate ester acid (ProductName：P-2M, Kyoeisha Chemical Co., Ltd.'s system) 1 mass parts make as free radical initiator
With benzoyl peroxide (ProductName：Nyper BMT-K40, Japan Oil Co's system) 3 mass parts.By these each ingredients and polyester
20 mass % methyl ethyl ketone solutions, 60 mass parts of carbamate resins A are mixed, are stirred, and binder resin solution is obtained.
On the other hand, the nickel layer of 0.1 μm of thickness is set on the surface of polystyrene particle, is further arranged in the outside of the nickel layer thick
The layer gold of 0.04 μm of degree obtains electroconductive particle (20% modulus of elasticity in comperssion (K values) of 3 μm of average grain diameter：500Kgf/mm2)。
So that the electroconductive particle is disperseed 3 volume % relative to binder resin solution, is coated on using coating unit to carrying out on one side
The PET film of 50 μm of the thickness of surface treatment carries out 10 minutes heated-air dryings at 70 DEG C, obtains leading for 3 μm of PET film and thickness
The laminated body PB (width 15cm, length 80m) of electrical adhesive layer B.
[making of the second non-conductive adhesive layer]
As free-radical polymerised substance, 20 mass parts of above-mentioned urethane acrylate, bis- (acryloxies are used
Ethyl) isocyanuric acid ester (ProductName：M-325, Toagosei Co., Ltd's system) 20 mass parts, dihydroxymethyl tristane dipropyl
Olefin(e) acid ester (ProductName：DCP-A, Kyoeisha Chemical Co., Ltd.'s system) 10 mass parts and 2- methacryloxyethyl acid phosphorus
Acid esters (ProductName：P-2M, Kyoeisha Chemical Co., Ltd.'s system) 1 mass parts use peroxidating as free radical initiator
Benzoyl (ProductName：Nyper BMT-K, Japan Oil Co's system) 3 mass parts.By these each ingredients and in toluene/methyl ethyl ketone
50 mass parts of solution of 23 mass % obtained by=50/50 in the mixed solvent dissolved polyester carbamate resins B are mixed
It closes, stirring, obtains resin solution.Using coating unit, which is coated on the thickness to being surface-treated on one side
The PET film of 50 μm of degree carries out 10 minutes heated-air dryings at 70 DEG C, obtains the non-conductive bonding agent of 8 μm of PET film and thickness
The laminated body PC (width 15cm, length 70m) of layer C (the second non-conductive adhesive layer).
[making of adhesive film]
Keep obtained laminated body PA and laminated body PB mutual with non-conductive adhesive layer A and conductive adhesive layer B
The mode faced is bonded, and uses laminating machine (ProductName：RISTON, model：HRL, Dupont corporation, roller pressure：Only spring carries
Lotus, roll temperature：40 DEG C, speed：50cm/ minutes) it is laminated.Then, the PET film of the sides stripping conductive adhesive layer B, obtains
It is sequentially laminated with laminated body PAB (width 15cm, the length of PET film, non-conductive adhesive layer A and conductive adhesive layer B
70m)。
Then, make obtained laminated body PAB and laminated body PC with conductive adhesive layer B and non-conductive adhesive layer
The opposed facing modes of C are bonded, and use laminating machine (ProductName：RISTON, model：HRL, Dupont corporation, roller pressure：Only
Spring load, roll temperature：40 DEG C, speed：50cm/ minutes) it is laminated.Then, the sides non-conductive adhesive layer C are removed
PET film obtains PET film (base material) and is sequentially laminated with non-conductive adhesive layer A, conductive adhesive layer B and non-conductive
The laminated body PABC (width 15cm, length 60m) of the adhesive film of adhesive layer C.
The end face of obtained laminated body PABC is observed using scanning electron microscope (SEM), it is as described below respectively
Measure the length of the length L of conductive region, the length L1 and the second non-conductive areas R2 of the first non-conductive areas R1
L2。
First, in laminated body PABC, the region (conductive region) between the first tangent plane and the second tangent plane is measured
Length as L, first tangent plane be contacted with electroconductive particle and with the boundary of PET film and non-conductive adhesive layer A
Face (is line on SEM image.It is same below.) in substantially parallel plane, it is at the shortest distance to be present in apart from the interface
Plane, second tangent plane be contacted with electroconductive particle and with the sides non-conductive adhesive layer C of laminated body PABC
In the substantially parallel plane in surface, it is the plane at the shortest distance to be present in apart from the surface.
In addition, the surface for measuring the sides non-conductive adhesive layer A from the first tangent plane towards laminated body PABC is being laminated
The length in the region (the first non-conductive areas) other than the conductive region extended on the thickness direction of body PABC is as L1.
In addition, the surface for measuring the sides non-conductive adhesive layer C from the second tangent plane towards laminated body PABC is being laminated
The length in the region (the second non-conductive areas) other than the conductive region extended on the thickness direction of body PABC is as L2.
As a result, L=3 μm, L1=2 μm, L2=8 μm.
[making of adhesive film spool]
The laminated body PABC of acquisition is cut into the band-like of 1.0mm wide, bonding agent band is made, in internal diameter 40mm, outer diameter
To make bonding agent film surface wind 50m in the way of inside in the plastics core (width 1.7mm) of 48mm, obtains adhesive film and use
Spool.
(embodiment 2)
In the making of conductive adhesive layer, the nickel layer of 0.2 μm of thickness is set on the surface of polystyrene particle, into
The layer gold of 0.04 μm of thickness is arranged in the outside of the nickel layer in one step, obtains electroconductive particle (the 20% compression bullet of 4 μm of average grain diameter
Property modulus (K values)：410Kgf/mm2), also, the thickness of conductive adhesive layer is made to be 4 μm, it is in addition to this, same with embodiment 1
It operates to sample, obtains the laminated body of base material and adhesive film (14 μm of thickness).Operate similarly with example 1, measure L, L1 and
L2, the result is that L=4 μm, L1=2 μm, L2=8 μm.In addition, the laminated body is cut into the band-like viscous to be made of width 1.0mm
Agent band is connect, is operated similarly with example 1, adhesive film spool is obtained.
(embodiment 3)
It is 2.5 μm to make the thickness of the first non-conductive adhesive layer, and it is 8 μ to make the thickness of the second non-conductive adhesive layer
M is operated similarly to Example 2 in addition to this, obtains the laminated body of base material and adhesive film (14.5 μm of thickness).With implementation
Example 1 similarly operates, and L, L1 and L2 is measured, the result is that L=4 μm, L1=2.5 μm, L2=8 μm.In addition, the laminated body is cut
Bonding agent band is made in band-like at width 1.0mm, operates similarly with example 1, and obtains adhesive film spool.
(embodiment 4)
It is 2 μm to make the thickness of the first non-conductive adhesive layer, and it is 10 μm to make the thickness of the second non-conductive adhesive layer,
In addition to this, it operates similarly with example 1, obtains the laminated body of base material and adhesive film (15 μm of thickness).It is same with embodiment 1
It operates to sample, L, L1 and L2 is measured, the result is that L=3 μm, L1=2 μm, L2=10 μm.In addition, the laminated body is cut into width
Bonding agent band is made in the band-like of 1.0mm, operates similarly with example 1, and obtains adhesive film spool.
(embodiment 5)
It is 2.5 μm to make the thickness of the first non-conductive adhesive layer, and it is 10 μ to make the thickness of the second non-conductive adhesive layer
M is operated similarly with example 1 in addition to this, obtains the laminated body of base material and adhesive film (14.5 μm of thickness).With implementation
Example 1 similarly operates, and L, L1 and L2 is measured, the result is that L=3 μm, L1=2.5 μm, L2=10 μm.In addition, by the stacking type
It is cut into the band-like of width 1.0mm and bonding agent band is made, operate similarly with example 1, obtain adhesive film spool.
(comparative example 1)
As free-radical polymerised substance, 20 mass parts of above-mentioned urethane acrylate, bis- (acryloxies are used
Ethyl) isocyanuric acid ester (ProductName：M-325, Toagosei Co., Ltd's system) 15 mass parts and 2- methacryloxy second
Base phosphate ester acid (ProductName：P-2M, Kyoeisha Chemical Co., Ltd.'s system) 1 mass parts make as free radical initiator
With benzoyl peroxide (ProductName：Nyper BMT-K40, Japan Oil Co's system) 3 mass parts.By these each ingredients and polyester
20 mass % methyl ethyl ketone solutions, 60 mass parts of carbamate resins A are mixed, are stirred, and resin solution is obtained.Another party
The nickel layer of 0.1 μm of thickness is arranged in face on the surface of polystyrene particle, and thickness 0.04 further is arranged in the outside of the nickel layer
μm layer gold, obtain 3 μm of average grain diameter electroconductive particle (20% modulus of elasticity in comperssion (K values)：500Kgf/mm2).This is set to lead
Conductive particles disperse 3 volume % relative to binder resin solution, are coated on using coating unit to having carried out at surface on one side
The PET film of 50 μm of the thickness of reason carries out 10 minutes heated-air dryings at 70 DEG C, and the electric conductivity for obtaining 3 μm of PET film and thickness is viscous
Meet the laminated body PB ' (width 15cm, length 70m) of oxidant layer B '.
As free-radical polymerised substance, 20 mass parts of above-mentioned urethane acrylate, bis- (acryloxies are used
Ethyl) isocyanuric acid ester (ProductName：M-325, Toagosei Co., Ltd's system) 20 mass parts, dihydroxymethyl tristane dipropyl
Olefin(e) acid ester (ProductName：DCP-A, Kyoeisha Chemical Co., Ltd.'s system) 10 mass parts and 2- methacryloxyethyl acid phosphorus
Acid esters (ProductName：P-2M, Kyoeisha Chemical Co., Ltd.'s system) 1 mass parts use peroxidating as free radical initiator
Benzoyl (ProductName：Nyper BMT-K, Japan Oil Co's system) 3 mass parts.By these each ingredients and in toluene/methyl ethyl ketone
50 mass parts of solution of 23 mass % obtained by=50/50 in the mixed solvent dissolved polyester carbamate resins B are mixed
It closes, stirring, obtains resin solution.The resin solution is coated on to the thickness to being surface-treated on one side using coating unit
50 μm of PET film carries out 10 minutes heated-air dryings at 70 DEG C, obtains the non-conductive adhesive layer of 12 μm of PET film and thickness
The laminated body PC ' (width 15cm, length 70m) of C '.
Make obtained laminated body PB ' and laminated body PC ' so that conductive adhesive layer B ' and non-conductive adhesive layer
The opposed facing modes of C ' are bonded, and use laminating machine (ProductName：RISTON, model：HRL, Dupont corporation, roller pressure：Only
Spring load, roll temperature：40 DEG C, speed：50cm/ minutes) it is laminated.Then, the sides non-conductive adhesive layer C ' are removed
PET film obtains PET film (base material) and the layer by conductive adhesive layer B ' and non-conductive adhesive layer C ' bonding agent formed
Stack PB ' C ' (width 15cm, length 60m).It operates similarly with example 1, L and L2 is measured, the result is that L=3 μm, L2=12
μm.The laminated body of acquisition is cut into the band-like of width 1.0mm wide bonding agent band is made, in internal diameter 40mm, outer diameter 48mm
To make bonding agent film surface wind 50m in the way of inside in plastics core (width 1.7mm), adhesive film spool is obtained.
(comparative example 2)
In the making of conductive adhesive layer, the nickel layer of 0.2 μm of thickness is set on the surface of polystyrene particle, into
The layer gold of 0.04 μm of thickness is arranged in the outside of the nickel layer in one step, obtains electroconductive particle (the 20% compression bullet of 4 μm of average grain diameter
Property modulus (K values)：410Kgf/mm2), also, the thickness of conductive adhesive layer is made to be 4 μm, it is in addition to this, same with comparative example 1
It operates to sample, obtains the laminated body of base material and adhesive film (16 μm of thickness).It operates similarly with example 1, measures L and L2,
The result is that L=4 μm, L2=8 μm.In addition, the laminated body, which is cut into the band-like of width 1.0mm, is made bonding agent band, with than
It is similarly operated compared with example 1, obtains adhesive film spool.
(comparative example 3)
It is 4 μm to make the thickness of the first non-conductive adhesive layer, and it is 6 μm to make the thickness of the second non-conductive adhesive layer,
In addition to this, it operates similarly with example 1, obtains the laminated body of base material and adhesive film (13 μm of thickness).It is same with embodiment 1
It operates to sample, L, L1 and L2 is measured, the result is that L=3 μm, L1=4 μm, L2=6 μm.In addition, the laminated body is cut into width
Bonding agent band is made in the band-like of 1.0mm, operates similarly with example 1, and obtains adhesive film spool.
(comparative example 4)
It is 4 μm to make the thickness of the first non-conductive adhesive layer, and it is 6 μm to make the thickness of the second non-conductive adhesive layer,
In addition to this, it operates similarly to Example 2, obtains the laminated body of base material and adhesive film (14 μm of thickness).It is same with embodiment 1
It operates to sample, L, L1 and L2 is measured, the result is that L=4 μm, L1=4 μm, L2=6 μm.In addition, the laminated body is cut into width
Bonding agent band is made in the band-like of 1.0mm, operates similarly with example 1, and obtains adhesive film spool.
(reference example)
In comparative example 1, after laminated body PB ' and laminated body PC ' laminations, instead of the sides conductive adhesive layer C '
PET film and the PET film for removing the sides conductive adhesive layer B ' operates in the same manner as comparative example 1 in addition to this, obtain base material with
The laminated body of adhesive film (15 μm of thickness).It operates similarly with example 1, L and L2 is measured, the result is that L=3 μm, L2=12 μ
m.In addition, the laminated body, which is cut into the band-like of width 1.0mm, is made bonding agent band, operate in the same manner as comparative example 1, obtains
Adhesive film spool.
Whether there is or not the evaluation ＞ of adhesion by ＜
In 30 DEG C of (humidity：40~60%RH) thermostat in, keep adhesive film spool horizontal, place that (24 was small in 1 day
When).Then, using Compression and Expansion testing machine (ProductName：STA-1150, Co., Ltd. O's rientec systems), with 1m/ minutes speed
Degree pulls out bonding agent band until terminal part.The case where adhesive film midway is peeled off from PET film is evaluated as " having " adhesion, will be bonded
The case where agent film does not peel off from PET film and can pull out bonding agent band is evaluated as "None" adhesion.It will be evaluation result is shown in table 1,2
In.
The making ＞ of ＜ circuit connecting bodies
It will be loaded by the bonding agent film surface of embodiment and each bonding agent band (width 1.0mm, length 3cm) of comparative example acquisition
In 40 μm of spacing, 8 μm of thickness the FPC substrates with 500 tin plating copper circuits on, in this state, at 70 DEG C, with 1MPa plus
Heat pressurization removes PET film after 1 second, to which adhesive film to be connect with FPC substrates temporarily.Then, it is applied in the ITO of thickness 1.1mm
Mounting adhesive film and FPC substrates on layer glass substrate (15 Ω), at 50 DEG C, being pressurizeed 0.5 second with 0.5MPa, it is temporarily solid to carry out
It is fixed.The glass substrate that FPC substrates have been fixed temporarily by adhesive film is set to formal compression bonding apparatus, by 200 μm of silicon of thickness
Rubber is as fender, using heating tool (heat tool), from FPC substrate-sides at 170 DEG C, is pressurizeed 5 seconds with 3MPa heating,
It is attached in the entire width 1.0mm of adhesive film, obtains circuit connecting body.In addition, only for reference example, it first will bonding
Agent film is temporarily attached to ITO coated glass substrates, and FPC substrates are then temporarily fixed on adhesive film.In addition to this, using with
Above-described embodiment and the identical condition of comparative example obtain circuit connecting body.
The measurement ＞ of ＜ connection resistance
About each circuit connecting body of making, multimeter (device name is utilized：TR6845, Co., Ltd.'s Advantest systems)
Measure the resistance value between the adjacent circuit of the FPC substrates comprising interconnecting piece.The resistance between adjacent circuit different at 30 is measured, is made
Resistance value is found out for their average value.It will be evaluation result is shown in table in 1,2.
The measurement ＞ of ＜ bonding forces
About each circuit connecting body of making, the interarea by FPC substrates with peeling rate 50mm/ minutes relative to the substrate
(90 degree of strippings) is vertically stretched, to carry out the measurement of bonding force.It will be evaluation result is shown in table in 1,2.
[table 1]
[table 2]
As shown in table 1, it in Examples 1 to 5, does not all stick together, in addition, obtaining good connection resistance and gluing
Relay.
As shown in table 2, in Comparative Examples 1 and 2, adhesion all has occurred and (therefore, does not implement to connect resistance and bonding force
Evaluation).On the other hand, non-conductive adhesive layer is formed on base material, and further on the non-conductive adhesive layer
It is formed in the adhesive film (reference example) of common two layers of composition of conductive adhesive layer, does not stick together, connection electricity
The evaluation result of resistance and bonding force is also good.In addition, in comparative example 3,4, the rising of connection resistance is observed.
By that can confirm above, according to the present invention, such as FPC substrate-sides can be pasted on, and the generation of adhesion can be inhibited,
And excellent connection reliability can be obtained for manufacturing circuit connecting body.
Symbol description
1,11,26 ... adhesive film, 2 ... first non-conductive adhesive layers, 3 ... conductive adhesive layers, 4 ... second is non-
Conductive adhesive layer, 5 ... electroconductive particles, 21 ... adhesive film spools, 22 ... core, 24,24A, 24B ... bonding agent
Band, 25 ... base materials, R ... conductive regions, the first non-conductive areas R1 ..., the second non-conductive areas R2 ....
Claims (11)
1. a kind of adhesive film, be the first non-conductive adhesive layer, the conductive adhesive layer containing electroconductive particle and
Second non-conductive adhesive layer stacks gradually,
The thickness T1 of the first non-conductive adhesive layer and thickness T of the conductive adhesive layer meets following formula (1),
T1 ＜ T ... (1).
2. the average grain diameter r of adhesive film according to claim 1, the T1 and the electroconductive particle meets following formula
(2),
T1≤0.8×r…(2)。
3. adhesive film according to claim 1 or 2, the thickness T2 of the T1 and the described second non-conductive adhesive layer
Meet following formula (3),
T1≤T2…(3)。
4. a kind of adhesive film is the adhesive film containing electroconductive particle,
Have successively on the thickness direction of the adhesive film there is no the first non-conductive areas of the electroconductive particle,
The second non-conductive areas there are the conductive region of the electroconductive particle and there is no the electroconductive particle,
Length L1 of first non-conductive areas on the thickness direction of the adhesive film exists with the conductive region
Length L on the thickness direction of the adhesive film meets following formula (4),
L1 ＜ L ... (4).
5. the average grain diameter r of adhesive film according to claim 4, the L1 and the electroconductive particle meets following formula
(5),
L1≤0.8×r…(5)。
6. adhesive film according to claim 4 or 5, the L1 is with second non-conductive areas in the bonding agent
Length L2 on the thickness direction of film meets following formula (6),
L1≤L2…(6)。
7. a kind of bonding agent band, has：
Band-like base material, and
The adhesive film according to any one of claims 1 to 6 being arranged in the one side of the base material.
8. a kind of adhesive film spool, has：
Bonding agent band described in claim 7, and
It is wound with the core of the bonding agent band.
9. a kind of manufacturing method of adhesive film, has following processes：
By the first non-conductive adhesive layer, the conductive adhesive layer containing electroconductive particle and the second non-conductive bonding agent
Layer stacks gradually and the process that obtains adhesive film,
The thickness T1 of the first non-conductive adhesive layer and thickness T of the conductive adhesive layer meets following formula (1),
T1 ＜ T ... (1).
10. the manufacturing method of adhesive film according to claim 9, the average grain diameter of the T1 and the electroconductive particle
R meets following formula (2),
T1≤0.8×r…(2)。
11. the manufacturing method of adhesive film according to claim 9 or 10,
The thickness T2 of the T1 and the described second non-conductive adhesive layer meet following formula (3),
T1≤T2…(3)。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210037588.2A CN114262577A (en) | 2016-01-29 | 2017-01-17 | Adhesive tape, method for producing same, and reel for adhesive film |
| CN202210037591.4A CN114196334A (en) | 2016-01-29 | 2017-01-17 | Adhesive tape, method for producing same, and reel for adhesive film |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016015470 | 2016-01-29 | ||
| JP2016-015470 | 2016-01-29 | ||
| PCT/JP2017/001366 WO2017130789A1 (en) | 2016-01-29 | 2017-01-17 | Adhesive film, production process therefor, adhesive tape, and reel for adhesive film |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210037591.4A Division CN114196334A (en) | 2016-01-29 | 2017-01-17 | Adhesive tape, method for producing same, and reel for adhesive film |
| CN202210037588.2A Division CN114262577A (en) | 2016-01-29 | 2017-01-17 | Adhesive tape, method for producing same, and reel for adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108603078A true CN108603078A (en) | 2018-09-28 |
Family
ID=59397691
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210037591.4A Pending CN114196334A (en) | 2016-01-29 | 2017-01-17 | Adhesive tape, method for producing same, and reel for adhesive film |
| CN202210037588.2A Pending CN114262577A (en) | 2016-01-29 | 2017-01-17 | Adhesive tape, method for producing same, and reel for adhesive film |
| CN201780008489.9A Pending CN108603078A (en) | 2016-01-29 | 2017-01-17 | Adhesive film and its manufacturing method, bonding agent band and adhesive film spool |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210037591.4A Pending CN114196334A (en) | 2016-01-29 | 2017-01-17 | Adhesive tape, method for producing same, and reel for adhesive film |
| CN202210037588.2A Pending CN114262577A (en) | 2016-01-29 | 2017-01-17 | Adhesive tape, method for producing same, and reel for adhesive film |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6988482B2 (en) |
| KR (1) | KR20180111858A (en) |
| CN (3) | CN114196334A (en) |
| TW (1) | TWI750149B (en) |
| WO (1) | WO2017130789A1 (en) |
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- 2017-01-17 CN CN202210037591.4A patent/CN114196334A/en active Pending
- 2017-01-17 WO PCT/JP2017/001366 patent/WO2017130789A1/en active Application Filing
- 2017-01-17 CN CN202210037588.2A patent/CN114262577A/en active Pending
- 2017-01-17 JP JP2017564179A patent/JP6988482B2/en active Active
- 2017-01-17 CN CN201780008489.9A patent/CN108603078A/en active Pending
- 2017-01-17 KR KR1020187024131A patent/KR20180111858A/en not_active Application Discontinuation
- 2017-01-23 TW TW106102287A patent/TWI750149B/en active
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| TW200525004A (en) * | 2004-01-15 | 2005-08-01 | Sony Chemicals Corp | Adhesive films and method for manufacturing adhesive film |
| CN101421886A (en) * | 2006-04-12 | 2009-04-29 | 日立化成工业株式会社 | Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| WO2009078409A1 (en) * | 2007-12-17 | 2009-06-25 | Hitachi Chemical Company, Ltd. | Circuit connecting material and structure for connecting circuit member |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20180111858A (en) | 2018-10-11 |
| JPWO2017130789A1 (en) | 2018-11-22 |
| TW201739864A (en) | 2017-11-16 |
| CN114196334A (en) | 2022-03-18 |
| CN114262577A (en) | 2022-04-01 |
| TWI750149B (en) | 2021-12-21 |
| WO2017130789A1 (en) | 2017-08-03 |
| JP6988482B2 (en) | 2022-01-05 |
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