CN108597987A - The cleaning method of semiconductor crystal wafer - Google Patents
The cleaning method of semiconductor crystal wafer Download PDFInfo
- Publication number
- CN108597987A CN108597987A CN201810431454.2A CN201810431454A CN108597987A CN 108597987 A CN108597987 A CN 108597987A CN 201810431454 A CN201810431454 A CN 201810431454A CN 108597987 A CN108597987 A CN 108597987A
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- Prior art keywords
- semiconductor crystal
- control system
- crystal wafer
- cleaning
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
This application discloses a kind of cleaning methods of semiconductor crystal wafer, including purge chamber, arrange soon soon rush room, drying room, transmission system, acid adding case, control system and touch panel, transmission system respectively with control system, purge chamber, arrange soon soon rush room and drying room is connect, acid adding case is connect with purge chamber, and control system is connect with touch panel.The cleaning device is integrated with the required nearly all function of cleaning of semiconductor crystal wafer, reduce the frequency participated in by hand, maximumlly realize automation cleaning, it effectively solves the problems, such as to clean at present existing various, and, cleaning yields height good to the cleaning performance of semiconductor crystal wafer, there is good application prospect.
Description
Technical field
The invention belongs to semiconductor chip manufacturing technology fields, and in particular to a kind of cleaning method of semiconductor crystal wafer.
Background technology
Main four fundamental technologies to be invented after the 1950s of semiconducter IC processing procedure（It is ion implanting, diffusion, outer
Epitaxial growth and photoetching）Based on have gradually developed, since each element and line are quite fine in integrated circuit, manufactured
Cheng Zhong, if polluted by grit, metal, it is easy to the damage of circuit function in chip is caused, short circuit or open circuit etc. are formed,
Lead to the failure of integrated circuit and influences the formation of geometric properties.Therefore in the production process in addition to exclude extraneous pollution
Outside source, it is required to carry out wet-cleaning or dry method cleaning before IC manufacturing step such as High temperature diffusion, ion implantation.
Dry, wet-cleaning work is that chemical solution or gas is efficiently used under the premise of not destroying crystal column surface characteristic and electrical characteristics
Body removes the impurity of the micronic dust, metal ion and organic matter that remain on wafer.
Automatic cleaning equipment has high degree of automation, easy-to-operate, process consistency compared with Manual-cleaning machine
The advantages that guarantee, system reliability is good.But automatic equipment is after cleaning, and the removal effect of pollutant is not fine.
Invention content
The purpose of the application is to provide a kind of cleaning method of semiconductor crystal wafer, improves the pollution to semiconductor wafer surface
The cleaning performance of object has preferable market application prospect.
The invention is realized in this way：
A kind of cleaning method of semiconductor crystal wafer, cleans semiconductor crystal wafer using semiconductor crystal wafer cleaning equipment, partly leads
Body wafer cleaning equipment includes purge chamber, arranges soon soon rush room, drying room, transmission system, acid adding case, control system, touch panel
And film magazine, transmission system respectively with film magazine, control system, purge chamber, arrange soon soon rush room and drying room is connect, acid adding case and cleaning
Room connects, and control system is connect with touch panel；
Heater, temperature sensor, liquid level sensor and sour water discharge tube are equipped in purge chamber, heater is placed in purge chamber bottom
Portion, sour water discharge tube be equipped with sour water drain valve, heater, temperature sensor, liquid level sensor and sour water drain valve respectively with
Control system connects；
It soon arranges and rush soon interior to be equipped with water tank, intersect spray pipeline and drainpipe, drainpipe is equipped with water discharging valve, intersects spray tube
The water outlet on road is equipped with atomizer, and atomizer and water discharging valve are connect with control system；Water tank stores deionized water,
During the spray of deionized water, control system can control atomizer and make tune to washing pressure, water, direction and angle
Whole test pollutes few optimum efficiency to reach particle.Spray range covers whole semiconductor crystal wafers and film magazine.
It dries indoor top and is equipped with wind turbine, bottom is air outlet, and tail portion is equipped with outlet, and wind turbine is connect with control system；
The outlet of acid adding case is equipped with flow valve, and flow valve is connect with control system；
Cleaning method includes the following steps：
（1）According to the type of semiconductor crystal wafer, control system parameter is set in touch panel, semiconductor crystal wafer is put into film magazine,
Start semiconductor crystal wafer cleaning equipment；
（2）Film magazine is sent to purge chamber by transmission system, and control system opens the flow valve of acid adding case, in purge chamber to semiconductor
Wafer is cleaned；
（3）Cleaning finishes, and control system closes the flow valve of acid adding case, and the sour water drain valve for opening purge chamber arranges spent acid
Go out, and sends out signal control transmission system and will clean complete semiconductor crystal wafer and be sent to and rush soon soon arrange room；
（4）Control system is according to step（1）Parameter setting, control atomizer semiconductor crystal wafer is rinsed, rinsed
Bi Hou, control system close atomizer work, open simultaneously the water discharging valve on drainpipe, and send out signal control power train
System will clean complete semiconductor crystal wafer and be sent to drying room；
（5）Control system controls blower fan work, film magazine and interior semiconductor crystal wafer is dried up, and the film magazine after drying is transmitted to
The outlet of drying room, control system are stopped.
Preferably, when semiconductor crystal wafer cleaning equipment breaks down, control system is alarmed, and is shown on touch panel
Show error message, at this moment control system control everything stops；After debugging, touch panel is equipped with reset button, presses
It can restPose after lower.
Preferably, touch panel is man-machine interface, is a kind of induction type liquid crystal of receivable contact input signal
Display device.
Preferably, control system is integrated circuit, PLC controller or microcontroller.
Preferably, control system is equipped with work light and malfunction indicator lamp.
Preferably, control system is equipped with buzzer.
Preferably, cleaning chamber internal surface is quartz body.
Preferably, all heater strips of heater and its conducting wire are wrapped up with PFA.Heating temperature is maintained at
Between 70-80 DEG C.
Preferably, transmission system includes variable-frequency motor, retarder, guide rail and rack-and-pinion, variable-frequency motor and is subtracted
Fast device is connect with control system.
The advantages of the application, is as follows：
1, the cleaning method of the application semiconductor crystal wafer is integrated with the required nearly all function of cleaning of semiconductor crystal wafer, drop
The low frequency participated in by hand maximumlly realizes automation cleaning, effectively solves the problems, such as to clean at present existing various；
2, the cleaning method of the application semiconductor crystal wafer can start the cleaning processing wafer, and the degree of automation is big, and production efficiency is high,
, cleaning yields height good to the cleaning performance of semiconductor crystal wafer, there is good application prospect；
3, the cleaning method of the application semiconductor crystal wafer realizes the automation of wafer process cleaning under control system control,
Transmission system uses variable-frequency motor, retarder, guide rail and rack-and-pinion, increases cleaning device whole work efficiency and work
Stability, reliability；
4, it is quartz body that chamber internal surface is cleaned in the cleaning method of the application semiconductor crystal wafer, can not only be acidproof, moreover it is possible to high temperature resistant.
Description of the drawings
Fig. 1 is the structural schematic diagram of the cleaning method of the application semiconductor crystal wafer；
The opposite component names of serial number in figure：1, purge chamber；2, arrange soon soon rush room；3, drying room；4, acid adding case；5, control system
System；6, touch panel；7, film magazine；8, liquid level sensor；9, temperature sensor；10, heater；11, sour water discharge tube；12、
Sour water drain valve；13, intersect spray pipeline；14, drainpipe；15, water discharging valve；16, wind turbine；17, flow valve；18, power train
System；19, water tank；20, atomizer.
Specific implementation mode
The cleaning method of the application semiconductor crystal wafer is further described below in conjunction with attached drawing.
As shown in Figure 1, a kind of cleaning method of semiconductor crystal wafer, using semiconductor crystal wafer cleaning equipment to semiconductor crystal wafer
It is cleaned, semiconductor crystal wafer cleaning equipment includes purge chamber, arranges soon soon rush room, drying room, transmission system, acid adding case, controls
System, touch panel and film magazine, transmission system respectively with film magazine, control system, purge chamber, arrange soon soon rush room and drying room and connect
It connects, acid adding case is connect with purge chamber, and control system is connect with touch panel；
Heater, temperature sensor, liquid level sensor and sour water discharge tube are equipped in purge chamber, heater is placed in purge chamber bottom
Portion, sour water discharge tube be equipped with sour water drain valve, heater, temperature sensor, liquid level sensor and sour water drain valve respectively with
Control system connects；
It soon arranges and rush soon interior to be equipped with water tank, intersect spray pipeline and drainpipe, drainpipe is equipped with water discharging valve, intersects spray tube
The water outlet on road is equipped with atomizer, and atomizer and water discharging valve are connect with control system；Water tank stores deionized water,
During the spray of deionized water, control system can control atomizer and make tune to washing pressure, water, direction and angle
Whole test pollutes few optimum efficiency to reach particle.Spray range covers whole semiconductor crystal wafers and film magazine.
It dries indoor top and is equipped with wind turbine, bottom is air outlet, and tail portion is equipped with outlet, and wind turbine is connect with control system；
The outlet of acid adding case is equipped with flow valve, and flow valve is connect with control system；
Cleaning method includes the following steps：
（1）According to the type of semiconductor crystal wafer, control system parameter is set in touch panel, semiconductor crystal wafer is put into film magazine,
Start semiconductor crystal wafer cleaning equipment；
（2）Film magazine is sent to purge chamber by transmission system, and control system opens the flow valve of acid adding case, in purge chamber to semiconductor
Wafer is cleaned；
（3）Cleaning finishes, and control system closes the flow valve of acid adding case, and the sour water drain valve for opening purge chamber arranges spent acid
Go out, and sends out signal control transmission system and will clean complete semiconductor crystal wafer and be sent to and rush soon soon arrange room；
（4）Control system is according to step（1）Parameter setting, control atomizer semiconductor crystal wafer is rinsed, rinsed
Bi Hou, control system close atomizer work, open simultaneously the water discharging valve on drainpipe, and send out signal control power train
System will clean complete semiconductor crystal wafer and be sent to drying room；
（5）Control system controls blower fan work, film magazine and interior semiconductor crystal wafer is dried up, and the film magazine after drying is transmitted to
The outlet of drying room, control system are stopped.
Preferably, when semiconductor crystal wafer cleaning equipment breaks down, control system is alarmed, and is shown on touch panel
Show error message, at this moment control system control everything stops；After debugging, touch panel is equipped with reset button, presses
It can restPose after lower.
Preferably, touch panel is man-machine interface, is a kind of induction type liquid crystal of receivable contact input signal
Display device.
Preferably, control system is integrated circuit, PLC controller or microcontroller.
Preferably, control system is equipped with work light and malfunction indicator lamp.
Preferably, control system is equipped with buzzer.
Preferably, cleaning chamber internal surface is quartz body.
Preferably, all heater strips of heater and its conducting wire are wrapped up with PFA.Heating temperature is maintained at
Between 70-80 DEG C.
Preferably, transmission system includes variable-frequency motor, retarder, guide rail and rack-and-pinion, variable-frequency motor and is subtracted
Fast device is connect with control system.
Although the embodiments of the present invention have been disclosed as above, but its is not only in the description and the implementation listed
With it can be fully applied to various fields suitable for the present invention, for those skilled in the art, can be easily
Realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is simultaneously unlimited
In specific details and legend shown and described herein.
Claims (9)
1. a kind of cleaning method of semiconductor crystal wafer, it is characterised in that：Using semiconductor crystal wafer cleaning equipment to semiconductor crystal wafer
It is cleaned, semiconductor crystal wafer cleaning equipment includes purge chamber, arranges soon soon rush room, drying room, transmission system, acid adding case, controls
System, touch panel and film magazine, transmission system respectively with film magazine, control system, purge chamber, arrange soon soon rush room and drying room and connect
It connects, acid adding case is connect with purge chamber, and control system is connect with touch panel；
Heater, temperature sensor, liquid level sensor and sour water discharge tube are equipped in purge chamber, heater is placed in purge chamber bottom
Portion, sour water discharge tube be equipped with sour water drain valve, heater, temperature sensor, liquid level sensor and sour water drain valve respectively with
Control system connects；
It soon arranges and rush soon interior to be equipped with water tank, intersect spray pipeline and drainpipe, drainpipe is equipped with water discharging valve, intersects spray tube
The water outlet on road is equipped with atomizer, and atomizer and water discharging valve are connect with control system；
It dries indoor top and is equipped with wind turbine, bottom is air outlet, and tail portion is equipped with outlet, and wind turbine is connect with control system；
The outlet of acid adding case is equipped with flow valve, and flow valve is connect with control system；
Cleaning method includes the following steps：
（1）According to the type of semiconductor crystal wafer, control system parameter is set in touch panel, semiconductor crystal wafer is put into film magazine,
Start semiconductor crystal wafer cleaning equipment；
（2）Film magazine is sent to purge chamber by transmission system, and control system opens the flow valve of acid adding case, in purge chamber to semiconductor
Wafer is cleaned；
（3）Cleaning finishes, and control system closes the flow valve of acid adding case, and the sour water drain valve for opening purge chamber arranges spent acid
Go out, and sends out signal control transmission system and will clean complete semiconductor crystal wafer and be sent to and rush soon soon arrange room；
（4）Control system is according to step（1）Parameter setting, control atomizer semiconductor crystal wafer is rinsed, rinsed
Bi Hou, control system close atomizer work, open simultaneously the water discharging valve on drainpipe, and send out signal control power train
System will clean complete semiconductor crystal wafer and be sent to drying room；
（5）Control system controls blower fan work, film magazine and interior semiconductor crystal wafer is dried up, and the film magazine after drying is transmitted to
The outlet of drying room, control system are stopped.
2. the cleaning method of semiconductor crystal wafer according to claim 1, it is characterised in that：When semiconductor crystal wafer cleaning equipment
When breaking down, control system is alarmed, and error message is shown on touch panel, and at this moment control system control everything stops；
After debugging, touch panel is equipped with reset button, can restPose after pressing.
3. the cleaning method of semiconductor crystal wafer according to claim 1, it is characterised in that：The touch panel is man-machine boundary
Face is a kind of induction type liquid crystal display device of receivable contact input signal.
4. the cleaning method of semiconductor crystal wafer according to claim 1, it is characterised in that：The control system is integrated electricity
Road, PLC controller or microcontroller.
5. the cleaning method of semiconductor crystal wafer according to claim 1, it is characterised in that：The control system is equipped with work
Indicator light and malfunction indicator lamp.
6. the cleaning method of semiconductor crystal wafer according to claim 1, it is characterised in that：The control system is equipped with buzzing
Device.
7. the cleaning method of semiconductor crystal wafer according to claim 1, it is characterised in that：The cleaning chamber internal surface is stone
Ying Ti.
8. the cleaning method of semiconductor crystal wafer according to claim 1, it is characterised in that：All heating of the heater
Silk and its conducting wire are wrapped up with PFA.
9. the cleaning method of semiconductor crystal wafer according to claim 1, it is characterised in that：The transmission system includes frequency conversion
Motor, retarder, guide rail and rack-and-pinion, variable-frequency motor and retarder are connect with control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810431454.2A CN108597987A (en) | 2018-05-08 | 2018-05-08 | The cleaning method of semiconductor crystal wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810431454.2A CN108597987A (en) | 2018-05-08 | 2018-05-08 | The cleaning method of semiconductor crystal wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108597987A true CN108597987A (en) | 2018-09-28 |
Family
ID=63636053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810431454.2A Pending CN108597987A (en) | 2018-05-08 | 2018-05-08 | The cleaning method of semiconductor crystal wafer |
Country Status (1)
| Country | Link |
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| CN (1) | CN108597987A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110299313A (en) * | 2019-07-04 | 2019-10-01 | 北京北方华创微电子装备有限公司 | Cleaning device and cleaning method |
| CN114199045A (en) * | 2021-12-10 | 2022-03-18 | 富芯微电子有限公司 | Waste acid treatment device in semiconductor silicon wafer cleaning |
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| CN204866740U (en) * | 2015-07-17 | 2015-12-16 | 安徽三安光电有限公司 | Fully automatic cleaning machine |
| CN105489475A (en) * | 2015-12-09 | 2016-04-13 | 武汉华星光电技术有限公司 | Wet processing device and TFT (thin film transistor) substrate drying method |
| CN106206381A (en) * | 2016-08-30 | 2016-12-07 | 苏州聚晶科技有限公司 | A kind of monocrystalline etching cleaning machine and process thereof |
| CN107221508A (en) * | 2016-03-22 | 2017-09-29 | 细美事有限公司 | A kind of apparatus and method for handling substrate |
| CN107706131A (en) * | 2016-08-08 | 2018-02-16 | 东京毅力科创株式会社 | Liquid processing method, substrate board treatment and storage medium |
-
2018
- 2018-05-08 CN CN201810431454.2A patent/CN108597987A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204866740U (en) * | 2015-07-17 | 2015-12-16 | 安徽三安光电有限公司 | Fully automatic cleaning machine |
| CN105489475A (en) * | 2015-12-09 | 2016-04-13 | 武汉华星光电技术有限公司 | Wet processing device and TFT (thin film transistor) substrate drying method |
| CN107221508A (en) * | 2016-03-22 | 2017-09-29 | 细美事有限公司 | A kind of apparatus and method for handling substrate |
| CN107706131A (en) * | 2016-08-08 | 2018-02-16 | 东京毅力科创株式会社 | Liquid processing method, substrate board treatment and storage medium |
| CN106206381A (en) * | 2016-08-30 | 2016-12-07 | 苏州聚晶科技有限公司 | A kind of monocrystalline etching cleaning machine and process thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110299313A (en) * | 2019-07-04 | 2019-10-01 | 北京北方华创微电子装备有限公司 | Cleaning device and cleaning method |
| CN114199045A (en) * | 2021-12-10 | 2022-03-18 | 富芯微电子有限公司 | Waste acid treatment device in semiconductor silicon wafer cleaning |
| CN114199045B (en) * | 2021-12-10 | 2023-12-29 | 富芯微电子有限公司 | Waste acid treatment device in semiconductor silicon wafer cleaning |
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| PB01 | Publication | ||
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Application publication date: 20180928 |