CN108582529B - Cutting method of optical window - Google Patents
Cutting method of optical window Download PDFInfo
- Publication number
- CN108582529B CN108582529B CN201810328161.1A CN201810328161A CN108582529B CN 108582529 B CN108582529 B CN 108582529B CN 201810328161 A CN201810328161 A CN 201810328161A CN 108582529 B CN108582529 B CN 108582529B
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- Prior art keywords
- cutting
- metal film
- film layer
- optical window
- sapphire substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a cutting method of an optical window, and belongs to the technical field of optical window production. The method comprises the following steps: one surface of the sapphire substrate is used as a pre-cutting surface, and pre-cutting is carried out; plating a metal film layer on the pre-cut surface; attaching a UV film on the metal film layer; performing final cutting on the surface without being plated with the metal film layer; and (4) splitting the finally cut product through ultraviolet photolysis of the UV film. The metal film layer of the product after cutting is prevented from being damaged, the metal film layer of the product cut by the cutting method is free of any damage, and the problems of low efficiency and low yield of single piece production of small-size products are effectively solved.
Description
Technical Field
The invention relates to the technical field of optical window production, in particular to a cutting method of an optical window.
Background
At present, the sapphire bare chip cutting technology basically adopts laser cutting, but because the temperature is very high during the laser cutting, and after the metal film is plated on the surface of the sapphire, the metal film is damaged by the laser cutting, and the product is easily scrapped. If the method of cutting the sapphire into small pieces and plating the metal film layer is adopted, the efficiency is very low, and the method is not suitable for mass production. Therefore, the development of a novel sapphire cutting method after metal film plating is a technical problem which needs to be solved urgently.
Disclosure of Invention
The invention aims to provide a cutting method of an optical window, which aims to solve the problem of low cutting efficiency in the prior art.
In order to solve the above technical problem, the present invention provides a method for cutting an optical window, comprising the following steps:
one surface of the sapphire substrate is used as a pre-cutting surface, and pre-cutting is carried out;
plating a metal film layer on the pre-cut surface;
attaching a UV film on the metal film layer;
performing final cutting on the surface without being plated with the metal film layer;
and (4) splitting the finally cut product through ultraviolet photolysis of the UV film.
Optionally, the sapphire substrate is double-side polished prior to pre-cutting.
Optionally, the cutting depth is controlled to be 20% -80% of the thickness of the sapphire substrate during pre-cutting.
Optionally, before the metal film layer is plated, the sapphire substrate is subjected to ultrasonic cleaning, and residues on the surface are washed away.
Optionally, the metal film layer is made of one or more of Ti, Cr, Ni, Sn, Cu, Pt, and Au.
Optionally, the cutting traces of the final cut coincide with the pre-cutting traces.
Optionally, the sum of the pre-cut depth and the final cut depth is 120% to 150% of the thickness of the sapphire substrate.
The invention provides a cutting method of an optical window, wherein one surface of a sapphire substrate is used as a pre-cutting surface for pre-cutting; plating a metal film layer on the pre-cut surface; attaching a UV film on the metal film layer; performing final cutting on the surface without being plated with the metal film layer; and (4) splitting the finally cut product through ultraviolet photolysis of the UV film. The metal film layer of the product after cutting is prevented from being damaged, the metal film layer of the product cut by the cutting method is free of any damage, and the problems of low efficiency and low yield of single piece production of small-size products are effectively solved.
Drawings
Fig. 1 is a schematic flow chart of a cutting method of an optical window provided by the present invention.
Detailed Description
The following describes an optical window cutting method according to the present invention in further detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
The invention provides a cutting method of an optical window, a flow schematic diagram is shown in fig. 1, and the method comprises the following steps:
step S11: one surface of the sapphire substrate is used as a pre-cutting surface, and pre-cutting is carried out;
step S21: plating a metal film layer on the pre-cut surface;
step S31: attaching a UV film on the metal film layer;
step S41: performing final cutting on the surface without being plated with the metal film layer;
step S51: and (4) splitting the finally cut product through ultraviolet photolysis of the UV film.
Specifically, firstly, double-side polishing is carried out on a sapphire substrate, one side of the sapphire substrate is used as a pre-cut surface, pre-cutting is carried out by using laser, and the cutting depth is 20% -80% of the thickness of the sapphire substrate; then, carrying out ultrasonic cleaning on the pre-cut sapphire substrate, and washing off residues left after surface cutting; plating a metal film layer on the precut surface, wherein the metal film layer is one or more of Ti, Cr, Ni, Sn, Cu, Pt and Au; sticking a UV film on the metal film layer to protect the outermost metal film layer from being scratched or polluted by cutting residues; finally cutting the surface without being plated with the metal film layer, wherein the final cutting trace is completely overlapped with the pre-cutting trace, and the sum of the pre-cutting depth and the final cutting depth is 120-150% of the thickness of the sapphire substrate; and finally, performing ultraviolet photolysis on the UV film and performing conventional splitting to obtain the optical window.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (7)
1. A method for cutting an optical window is characterized by comprising the following steps:
one surface of the sapphire substrate is used as a pre-cutting surface, and pre-cutting is carried out;
plating a metal film layer on the pre-cut surface;
attaching a UV film on the metal film layer;
performing final cutting on the surface without being plated with the metal film layer;
and (4) splitting the finally cut product through ultraviolet photolysis of the UV film.
2. The method for cutting an optical window of claim 1, wherein the sapphire substrate is double-side polished prior to pre-cutting.
3. The method for cutting an optical window according to claim 1, wherein a cutting depth is controlled to be 20% to 80% of a thickness of the sapphire substrate at the time of precutting.
4. The method for cutting an optical window according to claim 1, wherein the sapphire substrate is subjected to ultrasonic cleaning before the metal film layer is plated, and residues on the surface are washed away.
5. The method for cutting an optical window according to claim 1, wherein the metal film is made of one or more of Ti, Cr, Ni, Sn, Cu, Pt, and Au.
6. The method for cutting an optical window according to claim 1, wherein the cutting traces of the final cut coincide with the pre-cutting traces.
7. The method of cutting an optical window of claim 1, wherein the pre-cut depth and the final cut depth add up to 120% to 150% of the sapphire substrate thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810328161.1A CN108582529B (en) | 2018-04-13 | 2018-04-13 | Cutting method of optical window |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810328161.1A CN108582529B (en) | 2018-04-13 | 2018-04-13 | Cutting method of optical window |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108582529A CN108582529A (en) | 2018-09-28 |
| CN108582529B true CN108582529B (en) | 2020-05-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810328161.1A Active CN108582529B (en) | 2018-04-13 | 2018-04-13 | Cutting method of optical window |
Country Status (1)
| Country | Link |
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| CN (1) | CN108582529B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101042444A (en) * | 2006-03-22 | 2007-09-26 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing coated optics element |
| TW201103104A (en) * | 2009-07-14 | 2011-01-16 | Syn Mate Co Ltd | Semiconductor wafer cutting method |
| CN103441104A (en) * | 2013-08-29 | 2013-12-11 | 华进半导体封装先导技术研发中心有限公司 | Wafer cutting method |
| CN103612015A (en) * | 2013-05-20 | 2014-03-05 | 湘能华磊光电股份有限公司 | LED wafer cutting method |
| JP2014060290A (en) * | 2012-09-18 | 2014-04-03 | Disco Abrasive Syst Ltd | Wafer processing method |
| CN103872187A (en) * | 2012-12-12 | 2014-06-18 | 烟台史密得机电设备制造有限公司 | Splitting method of LED chip needing back metalizing |
| CN105226143A (en) * | 2015-09-29 | 2016-01-06 | 山东浪潮华光光电子股份有限公司 | A kind of cutting method of GaAs base LED chip |
-
2018
- 2018-04-13 CN CN201810328161.1A patent/CN108582529B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101042444A (en) * | 2006-03-22 | 2007-09-26 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing coated optics element |
| TW201103104A (en) * | 2009-07-14 | 2011-01-16 | Syn Mate Co Ltd | Semiconductor wafer cutting method |
| JP2014060290A (en) * | 2012-09-18 | 2014-04-03 | Disco Abrasive Syst Ltd | Wafer processing method |
| CN103872187A (en) * | 2012-12-12 | 2014-06-18 | 烟台史密得机电设备制造有限公司 | Splitting method of LED chip needing back metalizing |
| CN103612015A (en) * | 2013-05-20 | 2014-03-05 | 湘能华磊光电股份有限公司 | LED wafer cutting method |
| CN103441104A (en) * | 2013-08-29 | 2013-12-11 | 华进半导体封装先导技术研发中心有限公司 | Wafer cutting method |
| CN105226143A (en) * | 2015-09-29 | 2016-01-06 | 山东浪潮华光光电子股份有限公司 | A kind of cutting method of GaAs base LED chip |
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| Publication number | Publication date |
|---|---|
| CN108582529A (en) | 2018-09-28 |
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