CN105694657A - Electroplating protection glue and electroplating method of workpiece - Google Patents
Electroplating protection glue and electroplating method of workpiece Download PDFInfo
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- CN105694657A CN105694657A CN201410696428.4A CN201410696428A CN105694657A CN 105694657 A CN105694657 A CN 105694657A CN 201410696428 A CN201410696428 A CN 201410696428A CN 105694657 A CN105694657 A CN 105694657A
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- protection glue
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Abstract
The invention discloses an electroplating protection glue, comprising 1-70 wt.% of phenolic resin and 30-99 wt.% of a solvent. In various embodiments of the present invention, the electroplating protection glue consumes a short time of 4-12 s for heating and curing, so as to greatly improve the production efficiency of the selective electroplating.
Description
Technical field
The present invention relates to a kind of plating protection glue and workpiece is carried out electric plating method。
Background technology
Plating protection glue is a kind of resist that can resist electroplate liquid corrosion。Before plating, this plating protection glue covers on the region that need not electroplate of workpiece (such as, the electric product of circuit substrate, electric contact terminal or other needs plating) of electroplated。When plating, this plating protection glue can protect the region that need not electroplate of this workpiece。After plating, it is necessary to from workpiece, remove these plating protection glue。
Due to noble metal, for instance, gold, silver etc., there is good electrical conductance and low resistance, it is often plated on workpiece, to realize good electrical connection。But, noble metal costly, this promotes in electroplating technology the only regional area needing plating at workpiece to carry out selective electroplating。
This selective electroplating technical process generally comprises following steps:
First, coating plating protection glue on workpiece, then heats this plating protection glue, so as to solidify；
Then, by the mode of laser lift-off, the plating protection glue on the region needing plating covering workpiece is removed, thus making the plating protection glue mask pattern of needs on the surface of workpiece；
Then, being immersed in electroplate liquid by workpiece, on the region needing plating of workpiece, plating forms one layer of noble metal, and other region that need not electroplate of workpiece is then plated protection glue mask and is protected, and will not be subject to the impact of electroplate liquid；With
Finally, the workpiece after plating is immersed in Alkaline solubilization liquid, removes remaining plating protection glue on workpiece。
This selective electroplating technique can accurately control plating area and the size of noble metal, thus saving substantial amounts of noble metal。This selective electroplating technique has had the developing history of decades, but, up to now, existing plating protection glue all there is problems in that
1. existing plating protection adhesive curing speed is slow, it is necessary to through the very long passage that is heating and curing, and usually time is long, at least needs 30 seconds whole hardening time, and this has become as a technical bottleneck of restriction plating productivity ratio；
2. the existing plating protection glue removal time is long, and after plating, removing remaining plating protection glue on workpiece with Alkaline solubilization liquid at least needs 30 seconds, and this also becomes restriction and electroplates a technical bottleneck of productivity ratio；
3. existing plating protection glue corrosion resistance is poor, can only tolerate 1 minute in the electroplate liquid of 60 DEG C, if the time being immersed in electroplate liquid was more than 1 minute, the plating protection glue on workpiece will come off from workpiece, loses defencive function。
Therefore, in view of the aforementioned technical problem of existing plating protection glue, it is necessary to developing and a kind of have faster curing rate and the new plating protection glue that can peel off rapidly, this is of great significance for improving selective electroplating productivity ratio tool。
Summary of the invention
The purpose of the present invention aims to solve the problem that at least one aspect of the above-mentioned problems in the prior art and defect。
It is an object of the present invention to provide a kind of plating protection glue, its time that is heating and curing is short。
Further object is that offer one plating protection glue, it is fast that it removes speed in Alkaline solubilization liquid。
Further object is that offer one plating protection glue, it has the performance of stronger anti-plate corrosion。
According to an aspect of the present invention, it is provided that a kind of plating protection glue, comprise: the phenolic resin of 1%～70% by weight；The solvent of 30%～99% by weight。
Embodiment according to an example of the present invention, described solvent is propylene glycol methyl ether acetate。
The embodiment of another exemplary according to the present invention, described plating protection glue also comprises the additive of by weight 0～5%。
The embodiment of another exemplary according to the present invention, described additive includes photosensitizer and firming agent。
The embodiment of another exemplary according to the present invention, described photosensitizer is diazo naphthoquinone, and described firming agent is hexamethylenetetramine。
The embodiment of another exemplary according to the present invention, the time that described plating protection glue is heating and curing is within the scope of 4 seconds to 12 seconds。
The embodiment of another exemplary according to the present invention, the time that described plating protection glue is dissolved by Alkaline solubilization liquid is within the scope of 2 seconds to 8 seconds。
The embodiment of another exemplary according to the present invention, described plating protection glue meets following corrosion stability condition: in the electroplate liquid more than 60 DEG C, experience will not be plated corrosion in more than 3 minutes。
According to another aspect of the present invention, it is provided that workpiece is carried out electric plating method by one, comprises the following steps:
S110: aforementioned plating protection glue is provided；
S120: described plating protection glue is coated on workpiece, and heat the plating protection glue of coating, so as to solidify, thus forming one layer of electroplating film on workpiece；
S130: with the plating protection glue on the region needing plating on laser ablation workpiece, thus forming the plating protection glue mask with predetermined pattern on workpiece；
S140: workpiece is immersed in electroplate liquid, in order to plating forms one layer of noble metal on the region needing plating of workpiece；With
S150: the workpiece being electroplate with one layer of noble metal is immersed in Alkaline solubilization liquid, in order to remove remaining plating protection glue on workpiece。
Embodiment according to an example of the present invention, in described step S120, utilizes the technique of dip-coating, brushing, spraying or coil coating to be coated with on the workpiece by described plating protection glue。
The embodiment of another exemplary according to the present invention, in described step S120, the thickness of formation electroplating film on the workpiece is less than 40 microns。
The embodiment of another exemplary according to the present invention, it is possible to change the viscosity of described plating protection glue by changing the content of each component of described plating protection glue。
The embodiment of another exemplary according to the present invention, described workpiece is circuit substrate, electric contact terminal or electronic chip。
In each embodiment above-mentioned of the present invention, the plating protection glue comprising phenolic resin has that the time of being heating and curing is short, remove speed soon and the performance of stronger anti-plate corrosion in Alkaline solubilization liquid, therefore, drastically increases the productivity ratio of selective electroplating。
By below with reference to accompanying drawing description made for the present invention, other purpose of the present invention and advantage will be apparent to, and can help the present invention is fully understood by。
Accompanying drawing explanation
Figure 1A shows the schematic diagram of the workpiece of electroplated according to an embodiment of the invention；
Figure 1B is shown on the workpiece shown in Figure 1A and is coated with one layer of plating protection glue, and heats so as to solidify；
Fig. 1 C shows that the workpiece that being coated with shown in Figure 1B is electroplated protection glue carries out laser treatment, and glue is protected in the plating removing the region needing plating on workpiece；
Fig. 1 D shows that the workpiece by the plating protection glue on region shown in Fig. 1 C, needs plating has been removed is immersed in the electroplate liquid of electrolyzer, in order on the region needing plating of workpiece, plating forms one layer of noble metal；
The schematic diagram of the workpiece that Fig. 1 E display noble metal has been electroplated onto on the region needing plating；
Fig. 1 F shows and is immersed in Alkaline solubilization liquid by the workpiece being electroplate with noble metal shown in Fig. 1 E, to remove remaining plating protection glue on workpiece；With
The schematic diagram of the workpiece after remaining plating protection glue is removed in Fig. 1 G display。
Detailed description of the invention
By the examples below, and in conjunction with accompanying drawing, technical scheme is described in further detail。In the description, same or analogous drawing reference numeral indicates same or analogous parts。Following it is intended to the explanation of embodiment of the present invention with reference to accompanying drawing the present general inventive concept of the present invention is made an explanation, and is not construed as a kind of restriction to the present invention。
It addition, in the following detailed description, for ease of explaining, elaborate that many concrete details are to provide the comprehensive understanding to present disclosure embodiment。It should be apparent, however, that one or more embodiments can also be implemented when not having these details。In other cases, known construction and device diagrammatically embodies to simplify accompanying drawing。
A general technical design according to the present invention, it is provided that a kind of plating protection glue, comprises: the phenolic resin of 1%～70% by weight；The solvent of 30%～99% by weight。
In the embodiment of an example of the present invention, plating protection glue comprise by weight 1% phenolic resin and by weight 99% solvent。
In the embodiment of another exemplary of the present invention, plating protection glue comprise by weight 70% phenolic resin and by weight 30% solvent。
In the embodiment of another exemplary of the present invention, plating protection glue comprise by weight 40% phenolic resin and by weight 60% solvent。
In the embodiment of another exemplary of the present invention, aforementioned solvents can be propylene glycol methyl ether acetate (Propyleneglycolmonomethyletheracetate (PGMEA)), but, the present invention is not limited to this, can also be the solvent that other is suitable, as long as phenolic resin can be completely dissolved wherein。
In the embodiment of another exemplary of the present invention, plating protection glue comprises: the phenolic resin of 1%～70% by weight；The solvent of 30%～99% by weight；The additive of 0～5% by weight。
In the embodiment of an example of the present invention, plating protection glue comprises: the phenolic resin of 10% by weight；The solvent of 85% by weight；The additive of 5% by weight。
In the embodiment of another exemplary of the present invention, plating protection glue comprises: the phenolic resin of 25% by weight；The solvent of 70% by weight；The additive of 5% by weight。
In the embodiment of another exemplary of the present invention, plating protection glue comprises: the phenolic resin of 37.5% by weight；The solvent of 60% by weight；The additive of 2.5% by weight。
In the embodiment of another exemplary of the present invention, aforementioned additive includes photosensitizer and firming agent, such as, foregoing photo sensitizers can be diazo naphthoquinone (Diazonaphthoquinone (DNQ)), and aforementioned curing agent can be hexamethylenetetramine (Hexamethylenetetramine (HMTA))。But, the present invention is not limited to this, and photosensitizer and firming agent can also be photosensitizer and the firming agent of other suitable type。
The process utilizing aforementioned plating protection glue that workpiece is electroplated is described in detail below with reference to Figure 1A to Fig. 1 G。
First, as shown in Figure 1A, it is provided that the workpiece 100 of an electroplated, such as, in the illustrated embodiment, workpiece is an electric contact terminal, but, the present invention is not limited to this, and the workpiece of electroplated can be the electronic product of circuit substrate, electronic chip or the plating of other any needs。
Secondly, as shown in Figure 1B, aforementioned plating protection glue 200 is coated on the workpiece 100 shown in Figure 1A, and heats the plating protection glue 200 of coating, so as to solidify, thus forming one layer of electroplating film on workpiece 100。
Then, as shown in Figure 1 C, the plating protection glue 200 on the region needing plating on workpiece 100 is removed with laser 300, thus forming the plating protection glue mask with predetermined pattern on workpiece 100。
Then; as shown in figures 1 d and 1e; workpiece 100 is immersed in the electroplate liquid in electrolyzer 400; so that plating forms one layer of noble metal 500 on the region needing plating of workpiece 100; other region that need not electroplate of workpiece 100 is then plated protection glue mask and is protected, and will not be subject to the impact of electroplate liquid。
Finally, as shown in Fig. 1 F and Fig. 1 G, the workpiece 100 being electroplate with one layer of noble metal 500 is immersed in the Alkaline solubilization liquid in alkali liquor pond 600, in order to remove remaining plating protection glue 200 on workpiece 100。
So, after aforementioned selective electroplating, electroplating parts as shown in Figure 1 G can be obtained, as shown in Figure 1 G, noble metal 500 is only formed on the regional area (such as, the contact region of electric contact terminal) needing plating of workpiece 100, without being formed on the whole region of workpiece 100, thus saving the amount of noble metal 500, save cost。
In the embodiment of an example of the present invention, it is possible to use plating is protected glue 200 to be coated on workpiece 100 by the technique of dip-coating, brushing, spraying or coil coating。
In the embodiment of another exemplary of the present invention, it is possible to change the viscosity of plating protection glue 200 by changing the content of plating protection each component of glue 200。In this manner it is possible to accurately control the thickness of the plating protection glue 200 being coated on workpiece 100。In one embodiment of the invention, the thickness of the plating protection glue being coated on workpiece 100 is less than 40 microns。
In previously described embodiments of the present invention, the time that plating protection glue is heating and curing is within the scope of 4 seconds to 12 seconds。Therefore, the plating protection glue of the present invention is heating and curing very short, is greatly enhanced the production efficiency of selective electroplating。
In previously described embodiments of the present invention, the time that plating protection glue is completely dissolved in Alkaline solubilization liquid and removes is within the scope of 2 seconds to 8 seconds。Therefore, the plating protection glue removal speed in Alkaline solubilization liquid of the present invention is fast, and this is also greatly enhanced the production efficiency of selective electroplating。
In previously described embodiments of the present invention, plating protection glue electroplate liquid more than 60 DEG C is capable of withstanding by more than 3 minutes。Therefore, the plating protection glue of the present invention has stronger anti-plate corrosion, improves the electroplating quality to workpiece and drastically increases the qualification rate of electroplated product。
Although describing the present invention in conjunction with accompanying drawing, but the embodiment disclosed in accompanying drawing is intended to embodiments of the present invention illustrative, and it is not intended that a kind of of the present invention is limited。
Although some embodiments of this present general inventive concept are shown and explanation, those skilled in the art will appreciate that, when without departing substantially from the principle of this present general inventive concept and spirit, can these embodiments being made a change, the scope of the present invention limits with claim and their equivalent。
It should be noted that in this article, word " includes " being not excluded for other element or step, and word "a" or "an" is not excluded for multiple。It addition, any element numbers of claim should not be construed as restriction the scope of the present invention。
Claims (13)
1. a plating protection glue, it is characterised in that comprise:
The phenolic resin of 1%～70% by weight；With
The solvent of 30%～99% by weight。
2. plating protection glue according to claim 1, it is characterised in that: described solvent is propylene glycol methyl ether acetate。
3. plating protection glue according to claim 1 and 2, it is characterised in that: also comprise the additive of by weight 0～5%。
4. plating protection glue according to claim 3, it is characterised in that: described additive includes photosensitizer and firming agent。
5. plating protection glue according to claim 4, it is characterised in that: described photosensitizer is diazo naphthoquinone, and described firming agent is hexamethylenetetramine。
6. the plating protection glue according to any one of claim 1-5, it is characterised in that: the time that described plating protection glue is heating and curing is within the scope of 4 seconds to 12 seconds。
7. the plating protection glue according to any one of claim 1-5, it is characterised in that: the time that described plating protection glue is dissolved by Alkaline solubilization liquid is within the scope of 2 seconds to 8 seconds。
8. the plating protection glue according to any one of claim 1-5, it is characterised in that
Described plating protection glue meets following corrosion stability condition: in the electroplate liquid more than 60 DEG C, experience will not be plated corrosion in more than 3 minutes。
9. workpiece is carried out an electric plating method, comprises the following steps:
S110: the plating protection glue as according to any one of claim 1-8 is provided；
S120: described plating protection glue (200) is coated on workpiece (100), and heat plating protection glue (200) of coating, so as to solidify, thus at workpiece (100) one layer of electroplating film of upper formation；
S130: with plating protection glue (200) on the region needing plating on laser (300) removal workpiece (100), thus have the plating protection glue mask of predetermined pattern in the upper formation of workpiece (100)；
S140: workpiece (100) is immersed in electroplate liquid, in order to plating forms one layer of noble metal (500) on the region needing plating of workpiece (100)；With
S150: the workpiece (100) being electroplate with one layer of noble metal (500) is immersed in Alkaline solubilization liquid, in order to remove upper remaining plating protection glue (200) of workpiece (100)。
10. method according to claim 9, it is characterised in that:
In described step S120, the technique of dip-coating, brushing, spraying or coil coating is utilized described plating protection glue (200) to be coated on described workpiece (100)。
11. method according to claim 9, it is characterised in that:
In described step S120, the thickness of formation electroplating film on described workpiece (100) is less than 40 microns。
12. method according to claim 9, it is characterised in that:
The viscosity of described plating protection glue (200) can be changed by changing the content of described plating protection glue (200) each component。
13. method according to claim 9, it is characterised in that: described workpiece is circuit substrate, electric contact terminal or electronic chip。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410696428.4A CN105694657A (en) | 2014-11-26 | 2014-11-26 | Electroplating protection glue and electroplating method of workpiece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410696428.4A CN105694657A (en) | 2014-11-26 | 2014-11-26 | Electroplating protection glue and electroplating method of workpiece |
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| Publication Number | Publication Date |
|---|---|
| CN105694657A true CN105694657A (en) | 2016-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410696428.4A Pending CN105694657A (en) | 2014-11-26 | 2014-11-26 | Electroplating protection glue and electroplating method of workpiece |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106637321A (en) * | 2017-01-06 | 2017-05-10 | 深圳市常兴技术股份有限公司 | Electroplating shielding process |
| CN112593265A (en) * | 2020-11-26 | 2021-04-02 | 中国电子科技集团公司第四十三研究所 | Local electroplating method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4199415A (en) * | 1978-04-11 | 1980-04-22 | Itt Industries, Incorporated | Selective plating process |
| US4305975A (en) * | 1979-12-17 | 1981-12-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of forming printed circuit |
| CN101691468A (en) * | 2009-09-21 | 2010-04-07 | 哈尔滨化研化工有限责任公司 | Method of preparing chemical milling protective colloid |
-
2014
- 2014-11-26 CN CN201410696428.4A patent/CN105694657A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4199415A (en) * | 1978-04-11 | 1980-04-22 | Itt Industries, Incorporated | Selective plating process |
| US4305975A (en) * | 1979-12-17 | 1981-12-15 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of forming printed circuit |
| CN101691468A (en) * | 2009-09-21 | 2010-04-07 | 哈尔滨化研化工有限责任公司 | Method of preparing chemical milling protective colloid |
Non-Patent Citations (1)
| Title |
|---|
| 张宝华等: "《精细高分子合成与性能》", 31 July 2005 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106637321A (en) * | 2017-01-06 | 2017-05-10 | 深圳市常兴技术股份有限公司 | Electroplating shielding process |
| CN112593265A (en) * | 2020-11-26 | 2021-04-02 | 中国电子科技集团公司第四十三研究所 | Local electroplating method |
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Application publication date: 20160622 |
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