CN108573875A - The electronic chip module of two-sided placing part - Google Patents
The electronic chip module of two-sided placing part Download PDFInfo
- Publication number
- CN108573875A CN108573875A CN201710155028.6A CN201710155028A CN108573875A CN 108573875 A CN108573875 A CN 108573875A CN 201710155028 A CN201710155028 A CN 201710155028A CN 108573875 A CN108573875 A CN 108573875A
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- CN
- China
- Prior art keywords
- support plate
- fluting
- chip module
- electronic chip
- placing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000009434 installation Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000005530 etching Methods 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 241001074085 Scophthalmus aquosus Species 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000003628 erosive effect Effects 0.000 claims 1
- 239000011469 building brick Substances 0.000 description 21
- 239000010410 layer Substances 0.000 description 9
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
A kind of electronic chip module of two-sided placing part, including：One support plate, the top of the support plate is for installing an at least first assembly；The lower section of the support plate is used to be fixed to a substrate；Wherein, the lower section of the support plate has at least one installation fluting of recess, and the groove bottom of at least one installation fluting is for installing at least one second component；Wherein, the fluting that installation fluting is open outwardly for a bottom surface on the support plate, wherein be installed on the bottom surface of at least one second component in installation fluting towards the outside of the support plate, and form the structure of non-embedded type.
Description
Technical field
The present invention relates to electronic chip module, especially a kind of electronic chip module of two-sided placing part.
Background technology
Chipset encapsulating structure in the prior art is that required electronic building brick is installed on substrate, then in electronics
Conducting wire is pulled out on component, to be used as connecting external module.When encapsulation, ester conduct is moulded in the top additional layer of electronic building brick
Protection packaging layer, to protect electronic building brick, conducting wire and relevant chipset component.
But above-mentioned chipset encapsulating structure in the prior art, electronic building brick are all mounted in above substrate, therefore, work as institute
When the electronic building brick that need to be installed is more, then need to occupy sizable mounting area, therefore, it is also desirable to the substrate of large area is used,
And the area of whole chipset feature is also increased, it is unfavorable for utilization spatially, also, also improve whole be manufactured into
This.The making of electronic component now is to want cube smaller and smaller mostly, so the overall volume of its opposite circuit board is also necessary
It reduces, it is light and short to achieve the purpose that.But the more electronic component of weight is often dispersed in large area by traditional circuit board
On substrate, with the increase of number of components, the area of entire substrate is also with increase.And above-mentioned part used in the prior art
The attainable volume-diminished of layout type institute is fairly limited, so inventor is wished based on its experience in circuit field for many years
Prestige can find out a kind of effective mode so that the area of circuit board greatly reduces, and reaches the mesh of electronic building brick product body
's.
Invention content
So the purpose of the present invention is to solve the problem in the above-mentioned prior art, a kind of two-sided load is proposed in the present invention
The electronic chip module for putting part, the carrying board structure of electronic building brick can be installed using upper and lower surface, can make same
The more electronic building bricks of carrier for bearing, reduce the area of support plate on the whole, because can carry electronic building brick in upper and lower surface,
So volume can reduce about half, also, the length of entire conducting wire can also shorten, and conducting wire can be by blind among support plate
Through-hole is connected to the electronic building brick of the other side, and the wire laying mode of conducting wire can be become three-dimensional by original two-dimentional wire laying mode
Wire laying mode, so increasing the elasticity of bigger in the space configuration of part.Also, also save manufacturing cost.Under because
The electronic building brick on surface is implanted in inside the fluting below support plate, so the increase to whole thickness is fairly limited.
In order to achieve the above objectives, a kind of electronic chip module of two-sided placing part is proposed in the present invention, including：One carries
Plate, the top of the support plate is for installing an at least first assembly；The lower section of the support plate is used to be fixed to a substrate；Wherein, should
The lower section of support plate has at least one installation fluting of recess, and the groove bottom of at least one installation fluting is for installing at least one second
Component；Wherein, the fluting that installation fluting is open outwardly for a bottom surface on the support plate, wherein be installed on installation fluting
In at least one second component bottom surface towards the outside of the support plate, and form the structure of non-embedded type.Wherein, which is
One multilayer support plate.Wherein, it is not formed below the support plate at installation fluting and configures connector, which is fixed by the connector
Onto the substrate.Wherein, installation fluting is by the bottom at least one layer hollow out of the multilayer support plate, and forms the fluting of recess.Its
In, which is that multiple installations are slotted, to install at least one second component.Wherein, the upper table of the support plate
Face further includes at least one positioning fluting, wherein an at least first assembly is installed in the positioning fluting of the top of the support plate；
Wherein, the fluting that positioning fluting is open outwardly for a bottom surface on the support plate, wherein be installed on being somebody's turn to do in positioning fluting
At least the bottom surface of a first assembly is towards the outside of the support plate, and forms the structure of non-embedded type.
The invention also includes an encapsulating structures, and the support plate and part are encapsulated using encapsulating material；The connector extends this
Except encapsulating structure, so that the encapsulating structure can be mounted on the substrate or the other components of connection.Wherein, in the load
Multiple blind via holes are formed on plate, are used using being connected as conducting wire.Wherein, which is copper post, tin ball or weld pad.Wherein, should
The contact of first assembly and second component connects conductor assembly and extends to formation one below the support plate by the blind via hole and lead
Power path is used using the transmission as signal or electricity, is then attached on the substrate.
Wherein, the applied chemistry etching of installation fluting, laser drilling, machinery depthkeeping brill, electric paste etching, in multi-layer board technique
In be initially formed trepanning row press the combinations of at least one mode therein or above-listed various ways and formed again.
Wherein, the applied chemistry etching of positioning fluting, laser drilling, machinery depthkeeping brill, electric paste etching, in multi-layer board technique
In be initially formed trepanning row press the combinations of at least one mode therein or above-listed various ways and formed again.
Beneficial effects of the present invention are：It can make the same more electronic building bricks of carrier for bearing, reduce on the whole
The area of support plate, also saves manufacturing cost.
Description of the drawings
Fig. 1 shows the diagrammatic cross-section of one embodiment of the invention；
Fig. 2 shows that one embodiment of the invention is installed on the diagrammatic cross-section of substrate；
The stereogram that the multilayer support plate of Fig. 3 display present invention is regarded by antapical view；
One embodiment of the encapsulating structure of Fig. 4 display present invention；
Fig. 5 shows another embodiment of the present invention.
Reference sign
1 support plate
10 multilayer support plates
11 blind via holes
15 installation flutings
17 positioning flutings
20 substrates
30 connectors
70 conductive structures
100 first assemblies
101 first assemblies
102 first assemblies
110 conductor assemblies
200 second components
201 second components
202 second components
203 second components
510 tin balls
600 encapsulating structures.
Specific implementation mode
The now careful just structure composition of the present invention and the effect of can be generated and advantage, coordinates attached drawing, and according to the present invention one
Detailed description are as follows for preferred embodiment.
It please refers to Fig.1 to the electronic chip module for the two-sided placing part for shown in Fig. 5, showing the present invention, including following group
Part：
One support plate 1, the top of the support plate 1 is for installing various electronic building brick.The lower section of the support plate 1 is for being attached to a substrate 20
On.Wherein, the lower section of the support plate 1 has at least one installation fluting 15 of recess, and the groove bottom of installation fluting 15 is for installing
Various electronic building brick.Wherein, the fluting that installation fluting 15 is open outwardly for a bottom surface on the support plate 1, wherein be installed on
The bottom surface of electronic building brick in installation fluting 15 forms the structure of non-embedded type towards the outside of the support plate 1.
Wherein, appropriate multiple blind via holes 11 can be formed on the support plate 1, is used using being connected as conducting wire.
Preferably, the support plate 1 can be a multilayer support plate 10.
Fig. 1 shows one embodiment of the invention.Its structure includes：
The lower section of one multilayer support plate 10, the multilayer support plate 10 forms installation fluting 15.It can be formed on the multilayer support plate 10 multiple
Blind via hole 11 is used using being connected as conducting wire.
Installation fluting 15 is shown in Fig. 1 by the bottom at least one layer hollow out of the multilayer support plate 10, and forms opening for recess
Slot.Show installation fluting 15 by the bottom two layers hollow out of the multilayer support plate 10 in Fig. 1.But the scope of the present invention is not limited to
Fluting is formed on multilayer support plate, every technology that fluting is formed on single layer support plate is still within the scope of the invention.
Wherein, the installation slot 15 applied chemistry etchings, laser drilling, machinery depthkeeping brill, electric paste etching, in multi-layer board work
Trepanning is initially formed in skill, and row presses at least one mode therein again or the combination of above-listed various ways is formed.
At least a first assembly 100,101,102 is installed to the top of the multilayer support plate 10.Wherein, the first assembly 100,
101 paste the top of the multilayer support plate 10 with tin cream 500；And the first assembly 102 pastes the multilayer support plate with tin ball 510
10 top.The above-mentioned method pasted is not intended to limit the scope of the present invention, used various differences on semiconductor technology
Connection type within the scope of the present invention.
At least one second component 200,201,202 is installed in the installation fluting 15 of the lower section of the multilayer support plate 10.Wherein,
At least one second component 200,201,202 is pasted with tin cream 500 in the installation fluting 15 of the lower section of the multilayer support plate 10.
As shown in Fig. 2, when the multilayer support plate 10 is installed on a substrate 20, peace is not formed below the multilayer support plate 10
Connector 30 is configured at dress fluting 15, then is attached on the substrate 20 with the connector 30, as shown in the figure.Wherein, the connector
30 can be copper post, tin ball or weld pad.Wherein, when the connector 30 is copper post, which is configured at by plating mode
10 lower section of support plate is not formed at installation fluting 15；Wherein, when the connector 30 is tin ball, this is configured at by implantation
10 lower section of multilayer support plate is not formed at installation fluting 15；Wherein, it when the connector 30 is weld pad, is configured by etching mode
It is not formed at installation fluting 15 in 10 lower section of multilayer support plate.
So the structure of the application present invention, can be respectively mounted various different electronic building brick at the both ends of the support plate 1 simultaneously,
Increase the availability of entire support plate 1, and saves whole manufacturing cost and product space.
The stereochemical structure of Fig. 3 display present invention, for the stereogram that is regarded by antapical view of multilayer support plate 10 of the present invention, in figure
Display is as needed that multiple installation flutings 15 can be formed in the bottom surface of the multilayer support plate 10, to install at least one second component
203。
Another embodiment of the present invention is shown in Fig. 5, it, can also be in the support plate 1 in order not to lead to the increase of integral thickness
Upper and lower surface be respectively formed fluting.In the present embodiment, the structure of chip module is identical as a upper embodiment, therefore identical group
For part with identical symbolic indication, function is also identical, so its fine structure will be no longer illustrated.In the 5 embodiment of figure 5,
The upper surface of the multilayer support plate 10 further includes at least one positioning fluting 17, wherein an at least first assembly 100,101,102 is pacified
It is attached in the positioning fluting 17 of the top of the multilayer support plate 10.Wherein, which is pasted with tin cream 500
In the positioning fluting 17 of the top of the multilayer support plate 10；And the first assembly 102 pastes the multilayer support plate 10 with tin ball 510
Top the positioning fluting 17 in.
Wherein, the fluting that positioning fluting 17 is open outwardly for a bottom surface on the multilayer support plate 10, wherein be installed on
The bottom surface of an at least first assembly 100,101,102 in positioning fluting 17 is towards the outside of the multilayer support plate 10, and shape
At the structure of non-embedded type.
Wherein, the positioning slot 17 applied chemistry etchings, laser drilling, machinery depthkeeping brill, electric paste etching, in multi-layer board work
Trepanning is initially formed in skill, and row presses at least one mode therein again or the combination of above-listed various ways is formed.
So the structure of the application present invention, although the upper and lower of the multilayer support plate 10 is mounted on electronic building brick, simultaneously
Whole thickness will not be increased.
The present invention is suitable for use of the chip module structure encapsulated in needs.The one of the encapsulating structure of Fig. 4 display present invention
Embodiment.Encapsulating structure is added i.e. in the chip module structure of above-described embodiment to form integrated structure.In this implementation
In example, the structure of chip module is identical as a upper embodiment, so identical component is with identical symbolic indication, and its is subtle
Structure will be no longer illustrated.Wherein, the first assembly 102 and second component 202 are respectively a chip.
In the present embodiment, further include an encapsulating structure 600, using encapsulating material encapsulate the multilayer support plate 10 and this second
Component 202 and the first assembly 102；The connector 30 extends except the encapsulating structure 600, so that the encapsulating structure 600
It can be mounted on the substrate 20 or connect other components.
Wherein, when packaged, upper required encapsulation is coated with around the first assembly 102 and second component 202
Structure 600, and the connector 30 is extended except the encapsulating structure 600, so that the encapsulating structure 600 can be mounted
On to the substrate 20 or the other components of connection.The present embodiment is suitable for a variety of different encapsulating structures, and encapsulating structure is existing
Known person's so details are not described herein in technology.
Wherein, various conductive structures 70 can be formed in the blind via hole 11, to be used as conducting.As shown in fig. 1,
The conductive structure 70 can be the copper of the full blind via hole 11 of plating or fill up the ink of the blind via hole 11.
As shown in Figure 4, wherein the contact of the first assembly 102 and second component 202 can connect conductor assembly 110 and
10 lower section of multilayer support plate is extended to by the blind via hole 11 and forms a conductive path, is used using the transmission as signal or electricity,
It is then attached on the substrate 20.
The carrying board structure that electronic building brick can be installed using upper and lower surface of the present invention can make same carrier for bearing
More electronic building bricks reduce the area of support plate on the whole, because can carry electronic building brick, volume in upper and lower surface
About half can be reduced, also, the length of entire conducting wire can also shorten, conducting wire can be connected by the blind via hole among support plate
Wire laying mode to the electronic building brick of the other side, and conducting wire can be become three-dimensional wiring side by original two-dimentional wire laying mode
Formula, so increasing the elasticity of bigger in the space configuration of part.Also, also save manufacturing cost.Because of the electricity of lower surface
Sub-component is implanted in inside the fluting below support plate, so the increase to whole thickness is fairly limited.
In conclusion the design of consideration of hommization of the present invention, quite meets actual demand.Its specific improvement prior art
Disadvantage obviously has the advantages that breakthrough progress compared to the prior art, the enhancement that has effects that really, and non-is easy to reach.
The present invention be not disclosed in domestic and external document in the market, had met patent statute.
Above-mentioned detailed description is illustrating for a possible embodiments of the invention, but the embodiment is not to limit
The scope of patent protection of the present invention is made, it is all without departing from equivalence enforcement made by technical spirit of the present invention or change, this should all be belonged to
In the scope of the claims of invention.
Claims (10)
1. a kind of electronic chip module of two-sided placing part, which is characterized in that including：
One support plate, the top of the support plate is for installing an at least first assembly；The lower section of the support plate is used to be fixed to a substrate；
Wherein, the lower section of the support plate has at least one installation fluting of recess, and the groove bottom of at least one installation fluting is for installing extremely
Few one second component；And
Wherein, the fluting that installation fluting is open outwardly for a bottom surface on the support plate, wherein be installed in installation fluting
At least one second component bottom surface towards the outside of the support plate, and form the structure of non-embedded type.
2. the electronic chip module of two-sided placing part as claimed in claim 1, which is characterized in that the support plate is a multilayer support plate.
3. the electronic chip module of two-sided placing part as claimed in claim 1, which is characterized in that do not form peace below the support plate
It fills and configures connector at fluting, which is fixed to by the connector on the substrate.
4. the electronic chip module of two-sided placing part as claimed in claim 2, which is characterized in that installation fluting carries the multilayer
The bottom at least one layer hollow out of plate, and form the fluting of recess.
5. the electronic chip module of two-sided placing part as claimed in claim 1, which is characterized in that the upper surface of the support plate further includes
At least one positioning fluting, wherein an at least first assembly is installed in the positioning fluting of the top of the support plate；
Wherein, the fluting that positioning fluting is open outwardly for a bottom surface on the support plate, wherein be installed in positioning fluting
An at least first assembly bottom surface towards the outside of the support plate, and form the structure of non-embedded type.
6. the electronic chip module of two-sided placing part as claimed in claim 3, which is characterized in that further include an encapsulating structure, answer
The support plate and second component and the first assembly are encapsulated with encapsulating material；The connector extends except the encapsulating structure, with
So that the encapsulating structure can be mounted on the substrate or the other components of connection.
7. the electronic chip module of two-sided placing part as claimed in claim 3, which is characterized in that the connector is copper post, tin ball
Or weld pad.
8. the electronic chip module of two-sided placing part as claimed in claim 1, which is characterized in that formed on the support plate multiple blind
Through-hole is used using being connected as conducting wire；The contact of the first assembly and second component connects conductor assembly and blind logical by this
Hole, which extends to, forms a conductive path below the support plate, be used, be then attached on the substrate using the transmission as signal or electricity.
9. the electronic chip module of two-sided placing part as claimed in claim 1, which is characterized in that installation fluting applied chemistry erosion
Laser drilling, mechanical depthkeeping brill, electric paste etching, trepanning row pressing therein at least one again is initially formed in multi-layer board technique at quarter
The combination of kind mode or above-listed various ways is formed.
10. the electronic chip module of two-sided placing part as claimed in claim 5, which is characterized in that positioning fluting applied chemistry
Etching, laser drilling, mechanical depthkeeping brills, electric paste etching, be initially formed in multi-layer board technique trepanning again row press it is therein at least
The combination of a kind of mode or above-listed various ways is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710155028.6A CN108573875A (en) | 2017-03-14 | 2017-03-14 | The electronic chip module of two-sided placing part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710155028.6A CN108573875A (en) | 2017-03-14 | 2017-03-14 | The electronic chip module of two-sided placing part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108573875A true CN108573875A (en) | 2018-09-25 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710155028.6A Pending CN108573875A (en) | 2017-03-14 | 2017-03-14 | The electronic chip module of two-sided placing part |
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2017
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|---|---|---|---|---|
| CN1085891C (en) * | 1996-03-19 | 2002-05-29 | 松下电器产业株式会社 | Chip carrier and semiconductor device with it |
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| US6678167B1 (en) * | 2000-02-04 | 2004-01-13 | Agere Systems Inc | High performance multi-chip IC package |
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Application publication date: 20180925 |