CN108550559A - Cooling fin, chip assembly and circuit board - Google Patents
Cooling fin, chip assembly and circuit board Download PDFInfo
- Publication number
- CN108550559A CN108550559A CN201810521214.1A CN201810521214A CN108550559A CN 108550559 A CN108550559 A CN 108550559A CN 201810521214 A CN201810521214 A CN 201810521214A CN 108550559 A CN108550559 A CN 108550559A
- Authority
- CN
- China
- Prior art keywords
- chip
- accommodating chamber
- cooling fin
- glue accommodating
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 70
- 239000003292 glue Substances 0.000 claims abstract description 80
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- 238000007711 solidification Methods 0.000 abstract description 9
- 230000008023 solidification Effects 0.000 abstract description 9
- 239000000084 colloidal system Substances 0.000 abstract description 8
- 238000005516 engineering process Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 238000013473 artificial intelligence Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of cooling fin of proposition of the embodiment of the present invention, chip assembly and circuit board, are provided with glue accommodating chamber in the adhesive surface of cooling fin and chip respectively.In terms of existing technologies, the embodiment of the present invention by the bottom surface of cooling fin using heat-conducting glue when being bonded in the upper surface of chip, extra glue can be imported in glue accommodating chamber during glue cools down, extruding of the extra solidification colloid to chip dies is avoided, the damage caused by chip dies is avoided.
Description
Technical field
The present invention relates to cooling integrated technical fields, in particular to a kind of cooling fin, chip assembly and circuit
Plate.
Background technology
In existing artificial intelligence (AI) solution, in order to meet the acceleration process demand of large-scale data operation, skill
Art personnel form cascaded structure using multiple processing chips and accelerate board to build AI operations, greatly improve towards artificial intelligence
The calculation processing power of energy.
In the prior art, for this multi-chip cascaded structure, in order to enable each chip can radiate in time, ensure
Heat dissipation effect, Chinese invention patent application CN201710936285.3 propose a kind of chip cooling scheme, as shown in Figure 1, its
Being sticked on every piece of chip in the first face of pcb board 3, there are one cooling fins 4, can be independent to every piece of chip on pcb board
It radiates, so that every piece of chip can be fully bonded with cooling fin, improve heat dissipation effect.The program also on pcb board with
The second opposite face of first face is also connected with cooling fin, and cooling fin is corresponded with the chip position on the first face of pcb board,
The part being bonded with chip in the egative film of cooling fin 4 can be connected by tin with the second face of pcb board, with further by
Heat on the pin of the layers of copper of pcb board or chip is conducted to cooling fin by the passage of heat being arranged on pcb board.As can be seen that
It is respectively connected with cooling fin in the first face of pcb board and the second face, further improves the heat dissipation effect of chip and circuit board.
As shown in Fig. 2, in the prior art, chip 5 generally includes three parts, i.e. substrate 51,52 He of chip dies (die)
The plastic packaging-cover 53 formed by compression molding material, chip dies 52 are mounted in substrate 51, by 53 plastic packaging of plastic packaging-cover in closed space.
In order to radiate to every piece of chip, the prior art radiates in the upper surface of the plastic packaging-cover 53 of chip 5 connection cooling fin 4,
Cooling fin 4 includes egative film 41 and connects several risers 42 of the top surface of egative film 41, and the bottom surface 410 of egative film 41 connects the modeling of chip 5
The upper surface of capping 53, the heat when chip 5 work by chip generation are conducted to riser 42 and radiate.But due to core
Piece causes the heat that chip dies (die) generate not distribute directly by plastic packaging-cover plastic packaging, to affect dissipating for chip
Thermal effect.
Invention content
To solve the above-mentioned problems, according to an aspect of the invention, it is proposed that a kind of cooling fin, is used for chip cooling, including：
Egative film and multiple risers, wherein the multiple riser connects the top surface of the egative film, the bottom surface of the egative film is provided with glue receiving
Chamber.
In some embodiments, the egative film includes positioned at intermediate first part and from the two of the first part
The second part and Part III that side tilts upward respectively.
In some embodiments, the glue accommodating chamber is arranged in the bottom surface of the first part.
In some embodiments, the glue accommodating chamber includes the gap or channel for the recess being set on the bottom surface.
In some embodiments, the glue accommodating chamber includes multiple.
According to another aspect of the invention, it is proposed that a kind of chip assembly, including：Chip and the upper table for being pasted on the chip
The cooling fin in face, wherein the chip includes the chip dies and plastic packaging-cover positioned at the chip dies surrounding that top is exposed,
The upper surface of the plastic packaging-cover is provided with the first glue accommodating chamber.
In some embodiments, the upper surface of the plastic packaging-cover is additionally provided with back-shaped in the surrounding of the chip dies
Second glue accommodating chamber.
In some embodiments, the cooling fin includes egative film and multiple risers, wherein the multiple riser connects institute
The top surface of egative film is stated, the bottom surface of the egative film is provided with third glue accommodating chamber.
In some embodiments, the egative film includes positioned at intermediate first part and from the two of the first part
The second part and Part III that side tilts upward respectively.
In some embodiments, the third glue accommodating chamber is arranged in the bottom surface of the first part.
In some embodiments, the first glue accommodating chamber includes the recess for the upper surface for being set to the plastic packaging-cover
Gap or channel.
In some embodiments, the first glue accommodating chamber includes multiple.
In some embodiments, the second glue accommodating chamber includes around the chip dies in close-shaped recessed
Sunken gap or channel.
In some embodiments, the third glue accommodating chamber includes the gap or logical for the recess for being set to the bottom surface
Road.
In some embodiments, the third glue accommodating chamber includes multiple.
According to another aspect of the invention, it is proposed that a kind of circuit board, including：Pcb board and it is installed on the of the pcb board
The chip assembly as described in aforementioned any embodiment on one side.
In some embodiments, the chip assembly includes multiple.
According to another aspect of the present invention, it is also proposed that a kind of circuit board, including：Pcb board and it is installed on the pcb board
Second face opposite with the first face of the chip assembly as described in aforementioned any embodiment in the first face, the pcb board is connected with
Second cooling fin.
In some embodiments, the chip assembly includes multiple, and second cooling fin includes multiple, and described more
The position of a second cooling fin and the multiple chip assembly corresponds.
Cooling fin, chip assembly and the circuit board that the embodiment of the present invention proposes, respectively in the sticky table of cooling fin and chip
Glue accommodating chamber is arranged in face, in terms of existing technologies, in the upper table that the bottom surface of cooling fin is bonded in chip using heat-conducting glue
When face, extra glue can be imported in glue accommodating chamber during glue cools down, avoid extra solidification colloid to chip
The extruding of bare die avoids the damage caused by chip dies.
Description of the drawings
Fig. 1 is the side cross sectional views of the circuit board of multi-chip connection cooling fin in the prior art；
Fig. 2 is the side cross sectional views for connecting gelled chip assembly in the prior art；
Fig. 3 is the side cross sectional views of the gelled chip assembly of connection according to an embodiment of the invention；
Fig. 4 is the elevational schematic view of the bottom of cooling fin according to an embodiment of the invention；
Fig. 5 is the side cross sectional views of cooling fin according to another embodiment of the present invention；
Fig. 6 is the schematic top plan view of chip according to an embodiment of the invention；
Fig. 7 is the schematic top plan view of chip according to another embodiment of the present invention；
Fig. 8 is the side cross sectional views of the gelled chip assembly of connection according to another embodiment of the present invention；
Fig. 9 is the side cross sectional views of the gelled chip assembly of connection according to another embodiment of the present invention；
Figure 10 is the side cross sectional views of the circuit board of multi-chip connection cooling fin according to an embodiment of the invention.
Specific implementation mode
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Attached drawing, the present invention is described in more detail.
Fig. 3 is the side cross sectional views of the gelled chip assembly of connection according to an embodiment of the invention.Such as Fig. 3
Shown, in the prior art basis of Fig. 2, in the embodiment of the present invention, the plastic packaging-cover 53 that the compression molding material of chip 5 is formed protects cores
The top of chip dies 52 is exposed, the egative film of cooling fin 4 is directly connected in the upper surface of chip body by the surrounding of piece bare die 52
41。
By being directly connected to the egative film of cooling fin in the upper surface of chip body, heat dissipation is imitated in the sealing for avoiding plastic packaging-cover
The influence of rate.But this mode that cooling fin is directly connected on chip dies may also bring new problem, because of heat dissipation
It is usually necessary to use heat-conducting glues to be bonded for the connection of the egative film and chip body of piece, since glue is in high-temperature heating solidification process
In, chip dies may be caused to oppress so that chip dies damage, to can not work normally.In order to solve this problem,
The embodiment of the present invention improves the bottom of cooling fin in the prior art.
Fig. 4 is the elevational schematic view of the bottom of cooling fin according to an embodiment of the invention.As shown in figure 4, the present invention is real
Example is applied in prior art basis, glue accommodating chamber 44 is provided on the bottom surface 410 of cooling fin 4.
In some embodiments, glue accommodating chamber 44 include be set to recess on the bottom surface 410 of cooling fin 4 gap or
Channel.
In some embodiments, glue accommodating chamber 44 includes multiple, and is uniformly distributed in the bottom surface 410 of cooling fin.
The embodiment of the present invention by the way that glue accommodating chamber is arranged in the bottom surface of cooling fin, to using heat-conducting glue by cooling fin
When bottom surface is bonded in the upper surface of chip, extra glue can be imported in glue accommodating chamber, be avoided during glue cools down
Extruding of the extra solidification colloid to chip dies avoids the damage caused by chip dies.
Fig. 5 is the side cross sectional views of cooling fin according to another embodiment of the present invention.As shown in figure 5, the present invention is real
It applies in example, the egative film 41 of cooling fin 4 includes dividing positioned at intermediate first part 411 and from the both sides of the first part 411
The second part 412 and Part III 413 not tilted upward, the bottom surface 410 of first part 411 is for the upper surface with chip 5
It is fitted and connected.Wherein, the bottom surface 410 of first part 411 is provided with glue accommodating chamber 44.
In some embodiments, glue accommodating chamber 44 includes the seam for the recess being set on the bottom surface 410 of first part 411
Gap or channel.
In some embodiments, glue accommodating chamber 44 includes multiple, and is uniformly distributed in the bottom surface 410 of first part 411.
Cooling fin 4 further include be separately connected first part 411, second part 412, Part III 413 multiple risers 42,
Multiple risers 42 are connected with the top surface of the first part of egative film 41 411, second part 412, Part III 413 respectively.It is multiple
Riser 42 can be arranged in parallel, can also spaced set.
When installation, the bottom surface 410 of the first part 411 of egative film 41 is fitted with chip upper surface, chip operation process
The heat of middle generation is transmitted to the second part 412 and Part III 413 and riser 42 of egative film 41 by first part 411
On, and then radiate to chip.
In some embodiments, for the ease of machine or manually to the lifting of cooling fin, can also wherein one it is perpendicular
Handgrip 43 is arranged in the top of piece 42.Handgrip 43 can be connected to sheet or the ring bodies on 42 top of riser etc..Preferably, exist
The top for being connected to one of first part 411 riser 42 is provided with handle 43.
In the embodiment of the present invention, in order to increase the structural stability of cooling fin, the thickness of the first part 411 of egative film may be used also
With the thickness more than second part 412 and Part III 413.
Fig. 6 is the schematic top plan view of chip according to an embodiment of the invention.As shown in fig. 6, the core of the embodiment of the present invention
It is improved on the basis of 5 embodiment shown in Fig. 3 of piece, is set in the upper surface of the plastic packaging-cover 53 positioned at 52 surrounding of chip dies
Set glue accommodating chamber 54.
In some embodiments, glue accommodating chamber 54 includes the upper surface for the plastic packaging-cover 53 for being set to chip dies surrounding
The gap or channel of recess.
In some embodiments, glue accommodating chamber 54 includes multiple, and is uniformly distributed in the upper surface of plastic packaging-cover 53.
Glue accommodating chamber is arranged by the upper surface of the plastic packaging-cover in chip dies surrounding in the embodiment of the present invention, to use
When the bottom surface of cooling fin is bonded in the upper surface of chip by heat-conducting glue, extra glue glue can be imported during glue cools down
In accommodating chamber, extruding of the extra solidification colloid to chip dies is avoided, avoids the damage caused by chip dies.
Fig. 7 is the schematic top plan view of chip according to another embodiment of the present invention.As shown in fig. 7, the embodiment of the present invention
It is improved on the basis of 5 embodiment shown in Fig. 6 of chip, back-shaped glue, which is further arranged, in the surrounding of chip dies 52 holds
Chamber 55 of receiving further avoids extruding of the extra solidification colloid to chip dies to form close-shaped glue accommodating chamber.
In some embodiments, glue accommodating chamber 55 includes the gap or channel for the recess for being centered around chip dies surrounding.
Fig. 8 is the side cross sectional views of the gelled chip assembly of connection according to another embodiment of the present invention.Such as
Shown in Fig. 8, the chip assembly includes chip 5 and is connected to the cooling fin 4 of the upper surface of chip 5.Wherein, the implementation of chip 5
Mode is identical as aforementioned embodiment illustrated in fig. 6, and chip 5 includes substrate 51, the chip dies 52 being installed in substrate 51 and is located at
The plastic packaging-cover 53 of 52 surrounding of chip dies is provided with glue accommodating chamber positioned at the upper surface of the plastic packaging-cover 53 of 52 surrounding of chip dies
54。
In some embodiments, 52 surrounding of chip dies is further provided with back-shaped glue accommodating chamber 55, is closed with being formed
Close the glue accommodating chamber of shape.
Glue accommodating chamber is arranged by the upper surface of the plastic packaging-cover in chip dies surrounding in the chip assembly of the embodiment of the present invention,
It, can will be extra during glue cools down to when the bottom surface of cooling fin is bonded in the upper surface of chip using heat-conducting glue
Glue import glue accommodating chamber in, avoid extruding of the extra solidification colloid to chip dies, avoid and chip dies are caused
Damage.
Fig. 9 is the side cross sectional views of the gelled chip assembly of connection according to another embodiment of the present invention.Such as
Shown in Fig. 9, described in Fig. 8 on the basis of embodiment, the embodiment of the present invention further is used to connect the bottom surface of chip 5 in cooling fin 4
On be also equipped with glue accommodating chamber 44.
In other embodiments, cooling fin 4 can also use Fig. 5 illustrated embodiments, and details are not described herein.
Glue accommodating chamber is arranged in the upper surface of the plastic packaging-cover of chip dies surrounding in the chip assembly of the embodiment of the present invention, simultaneously
Also it is also provided with glue accommodating chamber in the bottom surface of the cooling fin of connection chip, to be bonded in the bottom surface of cooling fin using heat-conducting glue
When the upper surface of chip, extra glue can be imported in glue accommodating chamber during glue cools down, avoid extra solidification
Extruding of the colloid to chip dies avoids the damage caused by chip dies.
Figure 10 is the side cross sectional views of the circuit board of multi-chip connection cooling fin according to an embodiment of the invention.Such as
Shown in Figure 10, the circuit board of the embodiment of the present invention includes pcb board 3 and is installed on multiple chips in the first face of the pcb board
5, the upper surface of each chip is correspondingly connected with that there are one discrete piece 4.Wherein, the combination of chip 5 and cooling fin 4 may be used aforementioned
The chip assembly structure of one embodiment description, details are not described herein for the present embodiment.
In other embodiments, the circuit board can also be as shown in fig. 1, opposite with the first face in pcb board 3
The second face be also connected with multiple cooling fins 4, and cooling fin 4 and multiple chip positions one on the first face of pcb board are a pair of
It answers.This embodiment is respectively connected with cooling fin in the first face of pcb board and the second face, can further increase heat dissipation effect.
The circuit board of the embodiment of the present invention, each chip assembly are accommodated in the adhesive surface of chip and cooling fin setting glue
Chamber when the bottom surface of cooling fin is bonded in the upper surface of chip using heat-conducting glue, cools down in terms of existing technologies in glue
During can by extra glue import glue accommodating chamber in, avoid extruding of the extra solidification colloid to chip dies, keep away
The damage caused by chip dies is exempted from.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical solution and advantageous effect
It describes in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the present invention
Within the scope of shield.
Claims (19)
1. a kind of cooling fin is used for chip cooling, which is characterized in that including：Egative film and multiple risers, wherein the multiple riser
The top surface of the egative film is connected, the bottom surface of the egative film is provided with glue accommodating chamber.
2. cooling fin according to claim 1, which is characterized in that the egative film include positioned at intermediate first part and
The second part and Part III tilted upward respectively from the both sides of the first part.
3. cooling fin according to claim 2, which is characterized in that the glue accommodating chamber is arranged at the bottom of the first part
Face.
4. cooling fin according to claim 1 or 3, which is characterized in that the glue accommodating chamber includes being set to the bottom surface
On recess gap or channel.
5. cooling fin according to claim 1 or 3, which is characterized in that the glue accommodating chamber includes multiple.
6. a kind of chip assembly, which is characterized in that including：The cooling fin of chip and the upper surface for being pasted on the chip, wherein
The chip includes the chip dies that top is exposed and the plastic packaging-cover positioned at the chip dies surrounding, the upper table of the plastic packaging-cover
Face is provided with the first glue accommodating chamber.
7. chip assembly according to claim 6, which is characterized in that the upper surface of the plastic packaging-cover is in the chip dies
Surrounding be additionally provided with the second back-shaped glue accommodating chamber.
8. the chip assembly described according to claim 6 or 7, which is characterized in that the cooling fin includes egative film and multiple risers,
Wherein the multiple riser connects the top surface of the egative film, and the bottom surface of the egative film is provided with third glue accommodating chamber.
9. chip assembly according to claim 8, which is characterized in that the egative film include positioned at intermediate first part with
And the second part and Part III tilted upward respectively from the both sides of the first part.
10. chip assembly according to claim 9, which is characterized in that the third glue accommodating chamber is arranged described first
Partial bottom surface.
11. chip assembly according to claim 6, which is characterized in that the first glue accommodating chamber is described including being set to
The gap or channel of the recess of the upper surface of plastic packaging-cover.
12. chip assembly according to claim 6, which is characterized in that the first glue accommodating chamber includes multiple.
13. chip assembly according to claim 7, which is characterized in that the second glue accommodating chamber includes surrounding the core
The gap or channel in close-shaped recess of piece bare die.
14. the chip assembly according to claim 8 or 10, which is characterized in that the third glue accommodating chamber includes being set to
The gap or channel of the recess of the bottom surface.
15. the chip assembly according to claim 8 or 10, which is characterized in that the third glue accommodating chamber includes multiple.
16. a kind of circuit board, which is characterized in that including：Pcb board and be installed on the pcb board the first face as right is wanted
Seek 6-15 any one of them chip assemblies.
17. circuit board according to claim 16, which is characterized in that the chip assembly includes multiple.
18. a kind of circuit board, which is characterized in that including：Pcb board and be installed on the pcb board the first face as right is wanted
6-15 any one of them chip assemblies, second face opposite with the first face of the pcb board is asked to be connected with the second cooling fin.
19. circuit board according to claim 18, which is characterized in that the chip assembly includes multiple, and described second dissipates
Backing includes multiple, and the position of the multiple second cooling fin and the multiple chip assembly corresponds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810521214.1A CN108550559B (en) | 2018-05-28 | Heat sink, chip assembly and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810521214.1A CN108550559B (en) | 2018-05-28 | Heat sink, chip assembly and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108550559A true CN108550559A (en) | 2018-09-18 |
| CN108550559B CN108550559B (en) | 2024-07-30 |
Family
ID=
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109644554A (en) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
| WO2019072161A1 (en) * | 2017-10-10 | 2019-04-18 | Bitmain Technologies Inc. | Heat sink, integrated circuit chip and circuit board |
| WO2024007605A1 (en) * | 2022-07-04 | 2024-01-11 | 深圳比特微电子科技有限公司 | Heat sink, heat dissipation units and server |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1321337A (en) * | 1999-09-10 | 2001-11-07 | 索尼电脑娱乐公司 | Heat sink including heat receiving surface with protruding portion |
| US6320754B1 (en) * | 1999-08-06 | 2001-11-20 | Agilent Technologies, Inc. | Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package |
| JP2003152152A (en) * | 2002-11-07 | 2003-05-23 | Fujitsu Ltd | Mounting method of heat sink |
| CN201629315U (en) * | 2010-01-28 | 2010-11-10 | 江苏长电科技股份有限公司 | Projection packaging structure of surface of heat-dissipation block with inversion locking hole of chip with exposed internal foot |
| CN107507813A (en) * | 2017-10-10 | 2017-12-22 | 北京比特大陆科技有限公司 | Fin, chip and circuit board |
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6320754B1 (en) * | 1999-08-06 | 2001-11-20 | Agilent Technologies, Inc. | Apparatus for the reduction of interfacial stress caused by differential thermal expansion in an integrated circuit package |
| CN1321337A (en) * | 1999-09-10 | 2001-11-07 | 索尼电脑娱乐公司 | Heat sink including heat receiving surface with protruding portion |
| JP2003152152A (en) * | 2002-11-07 | 2003-05-23 | Fujitsu Ltd | Mounting method of heat sink |
| CN201629315U (en) * | 2010-01-28 | 2010-11-10 | 江苏长电科技股份有限公司 | Projection packaging structure of surface of heat-dissipation block with inversion locking hole of chip with exposed internal foot |
| CN107507813A (en) * | 2017-10-10 | 2017-12-22 | 北京比特大陆科技有限公司 | Fin, chip and circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019072161A1 (en) * | 2017-10-10 | 2019-04-18 | Bitmain Technologies Inc. | Heat sink, integrated circuit chip and circuit board |
| US11152278B2 (en) | 2017-10-10 | 2021-10-19 | Bitmain Technologies Inc. | Heat sink, integrated circuit chip and circuit board |
| CN109644554A (en) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
| WO2024007605A1 (en) * | 2022-07-04 | 2024-01-11 | 深圳比特微电子科技有限公司 | Heat sink, heat dissipation units and server |
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